DMG56302
Silicon NPN epitaxial planar type (Tr1)
Silicon PNP epitaxial planar type (Tr2)
Unit: mm
For digital circuits
DMG26302 in SMini5 type package
Features
Low collector-emitter saturation voltage VCE(sat)
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
Marking Symbol: F6
Basic Part Number
DRC2124E + DRA2124E (Collector-base connection)
Packaging
DMG563020R Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25°C
Parameter
Tr1
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
50
V
Collector-emitter voltage (Base open)
VCEO
50
V
IC
100
mA
Collector-base voltage (Emitter open)
VCBO
–50
V
Collector-emitter voltage (Base open)
VCEO
–50
V
Collector current
IC
–100
mA
Total power dissipation
PT
150
mW
Junction temperature
Tj
150
°C
Operating ambient temperature
Topr
–40 to +85
°C
Storage temperature
Tstg
–55 to +150
°C
Collector current
Tr2
Overall
Publication date: November 2013
Ver. DED
4: Collecter (Tr2)
5: Base (Tr2)
Collecter (Tr1)
SMini5-F3-B
SC-113CB
SOT-353
1: Emitter (Tr1)
2: Base (Tr1)
3: Emitter (Tr2)
Panasonic
JEITA
Code
(B2, C1)
5
(C2)
4
R1
Tr1
R2
1
(E1)
Resistance
value
Tr1
Tr2
R1
Tr2
R2
2
(B1)
3
(E2)
R1
22
kΩ
R2
22
kΩ
R1
22
kΩ
R2
22
kΩ
1
DMG56302
Electrical Characteristics Ta = 25°C±3°C
Tr1
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
50
V
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
50
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 50 V, IE = 0
0.1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = 50 V, IB = 0
0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 6 V, IC = 0
0.2
mA
Forward current transfer ratio
hFE
VCE = 10 V, IC = 5 mA
VCE(sat)
IC = 10 mA, IB = 0.5 mA
Input voltage (ON)
VI(on)
VCE = 0.2 V, IC = 5 mA
Input voltage (OFF)
VI(off)
VCE = 5 V, IC = 100 µA
Collector-emitter saturation voltage
60
0.25
2.6
V
V
0.8
V
Input resistance
R1
–30%
22
+30%
kΩ
Resistance ratio
R1 / R2
0.8
1.0
1.2
Max
Unit
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Tr2
Parameter
Symbol
Conditions
Min
Typ
Collector-base voltage (Emitter open)
VCBO
IC = –10 µA, IE = 0
–50
V
Collector-emitter voltage (Base open)
VCEO
IC = –2 mA, IB = 0
–50
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = –50 V, IE = 0
– 0.1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = –50 V, IB = 0
– 0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = –6 V, IC = 0
– 0.2
mA
Forward current transfer ratio
hFE
VCE = –10 V, IC = –5 mA
VCE(sat)
IC = –10 mA, IB = – 0.5 mA
Input voltage (ON)
VI(on)
VCE = – 0.2 V, IC = –5 mA
Input voltage (OFF)
VI(off)
VCE = –5 V, IC = –100 µA
Collector-emitter saturation voltage
60
– 0.25
–2.6
V
V
– 0.8
V
Input resistance
R1
–30%
22
+30%
kΩ
Resistance ratio
R1 / R2
0.8
1.0
1.2
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Ver. DED
2
DMG56302
Common characteristics
chart
DMG56302_PT-Ta
PT Ta
Total power dissipation PT (mW)
200
150
100
50
0
0
40
80
120
160
200
Ambient temperature Ta (°C)
Characteristics
charts of Tr1
DMG56302(Tr1)_IC-VCE
DMG56302(Tr1)_hFE-IC
120
IB = 350 µA
Collector current IC (mA)
100
300 µA
250 µA
80
200 µA
60
150 µA
40
100 µA
20
0
50 µA
0
2
4
6
8
10
Forward current transfer ratio hFE
500
Ta = 25°C
400
Ta = 85°C
300
25°C
−40°C
200
100
0
0.1
12
1
100
Collector current IC (mA)
DMG56302(Tr1)_IO-VIN
DMG56302(Tr1)_VIN-IO
IC / IB = 20
1
0.1
Ta = 85°C
−40°C
25°C
0.01
0.1
1
10
100
Collector current IC (mA)
VIN IO
VO = 5 V
VO = 0.2 V
Ta = 85°C
25°C
10−1
−40°C
10−2
0
10
100
Input voltage VIN (V)
Output current IO (mA)
10
Collector-emitter voltage VCE (V)
1
10−3
VCE(sat) IC
VCE = 10 V
IO VIN
10
DMG56302(Tr1)_VCEsat-IC
hFE IC
Collector-emitter saturation voltage VCE(sat) (V)
IC VCE
0.5
1.0
1.5
Input voltage VIN (V)
2.0
10
Ta = −40°C
25°C
85°C
1
0.1
0.1
1
10
100
Output current IO (mA)
Ver. DED
3
DMG56302
Characteristics
charts of Tr2
DMG56302(Tr2)_IC-VCE
DMG56302(Tr2)_hFE-IC
−120
300
−500 µA
−80
−400 µA
−60
−300 µA
−40
−200 µA
−20
−100 µA
0
0
−2
−4
−6
−8
−10
Forward current transfer ratio hFE
Collector current IC (mA)
IB = −600 µA
250
Ta = 85°C
200
50
−10
DMG56302(Tr2)_IO-VIN
DMG56302(Tr2)_VIN-IO
−1
Ta = 85°C
−100
− 0.01
− 0.1
−40°C
25°C
−1
−10
−100
Collector current IC (mA)
−100
VO = −5 V
VO = − 0.2 V
Ta = 85°C
25°C
−40°C
−10−2
0
IC / IB = 20
VIN IO
Input voltage VIN (V)
Output current IO (mA)
−1
Collector current IC (mA)
−10−1
−10
− 0.1
Collector-emitter voltage VCE (V)
−1
−10−3
−40°C
100
IO VIN
−10
25°C
150
0
− 0.1
−12
VCE(sat) IC
VCE = −10 V
Ta = 25°C
−100
DMG56302(Tr2)_VCEsat-IC
hFE IC
Collector-emitter saturation voltage VCE(sat) (V)
IC VCE
− 0.5
−1.0
−1.5
Input voltage VIN (V)
−2.0
−10
Ta = −40°C
25°C
85°C
−1
− 0.1
− 0.1
−1
−10
−100
Output current IO (mA)
Ver. DED
4
DMG56302
SMini5-F3-B
Unit: mm
Land Pattern (Reference) (Unit: mm)
Ver. DED
5
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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