DMG963HC
Silicon NPN epitaxial planar type (Tr1)
Silicon PNP epitaxial planar type (Tr2)
Unit: mm
For digital circuits
Features
Low collector-emitter saturation voltage VCE(sat)
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
Marking Symbol: V0
Basic Part Number
DRC2144E+DRA2152Z (Collector-base connection)
Packaging
DMG963HC0R Embossed type (Thermo-compression sealing): 8 000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25°C
Parameter
Tr1
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
50
V
Collector-emitter voltage (Base open)
VCEO
50
V
IC
100
mA
Collector-base voltage (Emitter open)
VCBO
–50
V
Collector-emitter voltage (Base open)
VCEO
–50
V
Collector current
IC
–100
mA
Total power dissipation
PT
125
mW
Junction temperature
Tj
150
°C
Operating ambient temperature
Topr
–40 to +85
°C
Storage temperature
Tstg
–55 to +150
°C
Collector current
Tr2
Overall
Publication date: November 2013
Ver. DED
4: Collecter (Tr2)
5: Base (Tr2)
Collecter (Tr1)
SSMini5-F4-B
SC-107BB
SOT-665
1: Emitter (Tr1)
2: Base (Tr1)
3: Emitter (Tr2)
Panasonic
JEITA
Code
(B2, C1)
5
(C2)
4
R1
Tr1
R2
1
(E1)
Resistance
value
Tr1
Tr2
R1
Tr2
R2
2
(B1)
3
(E2)
47
kΩ
R2
47
kΩ
R1
0.51
kΩ
R2
5.1
kΩ
R1
1
DMG963HC
Electrical Characteristics Ta = 25°C±3°C
Tr1
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
50
V
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
50
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 50 V, IE = 0
0.1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = 50 V, IB = 0
0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = 6 V, IC = 0
0.1
mA
Forward current transfer ratio
hFE
VCE = 10 V, IC = 5 mA
VCE(sat)
IC = 10 mA, IB = 0.5 mA
Input voltage (ON)
VI(on)
VCE = 0.2 V, IC = 5 mA
Input voltage (OFF)
VI(off)
VCE = 5 V, IC = 100 µA
Collector-emitter saturation voltage
80
0.25
3.6
V
V
0.8
V
Input resistance
R1
–30%
47
+30%
kΩ
Resistance ratio
R1 / R2
0.8
1.0
1.2
Max
Unit
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Tr2
Parameter
Symbol
Conditions
Min
Typ
Collector-base voltage (Emitter open)
VCBO
IC = –10 µA, IE = 0
–50
V
Collector-emitter voltage (Base open)
VCEO
IC = –2 mA, IB = 0
–50
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = –50 V, IE = 0
– 0.1
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = –50 V, IB = 0
– 0.5
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = –6 V, IC = 0
–2.0
mA
Forward current transfer ratio
hFE
VCE = –10 V, IC = –5 mA
VCE(sat)
IC = –10 mA, IB = – 0.5 mA
Input voltage (ON)
VI(on)
VCE = – 0.2 V, IC = –5 mA
Input voltage (OFF)
VI(off)
VCE = –5 V, IC = –100 µA
Collector-emitter saturation voltage
20
– 0.25
–1.0
V
V
– 0.4
V
Input resistance
R1
–30%
0.51
+30%
kΩ
Resistance ratio
R1 / R2
0.08
0.10
0.12
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Ver. DED
2
DMG963HC
Common characteristics
chart
DMG963HC_PT-Ta
PT Ta
Total power dissipation PT (mW)
150
125
100
75
50
25
0
0
40
80
120
160
200
Ambient temperature Ta (°C)
Characteristics
charts of Tr1
DMG963HC(Tr1)_IC-VCE
DMG963HC(Tr1)_hFE-IC
120
IB = 500 µA
450 µA
400 µA
Forward current transfer ratio hFE
Collector current IC (mA)
500
Ta = 25°C
100
350 µA
300 µA
80
250 µA
60
200 µA
150 µA
40
100 µA
20
0
50 µA
0
2
4
6
8
10
400
Ta = 85°C
300
25°C
−40°C
200
100
0
0.1
12
1
100
Collector current IC (mA)
DMG963HC(Tr1)_IO-VIN
DMG963HC(Tr1)_VIN-IO
10
IC / IB = 20
1
0.1
Ta = 85°C
−40°C
25°C
0.01
0.1
1
10
100
Collector current IC (mA)
VIN IO
100
VO = 5 V
VO = 0.2 V
Ta = 85°C
Input voltage VIN (V)
Output current IO (mA)
10
Collector-emitter voltage VCE (V)
1
25°C
10−1
−40°C
10−2
10−3
VCE(sat) IC
VCE = 10 V
IO VIN
10
DMG963HC(Tr1)_VCEsat-IC
hFE IC
Collector-emitter saturation voltage VCE(sat) (V)
IC VCE
0
0.5
1.0
Input voltage VIN
1.5
(V)
2.0
10
Ta = −40°C
25°C
85°C
1
0.1
0.1
1
10
100
Output current IO (mA)
Ver. DED
3
DMG963HC
Characteristics
charts of Tr2
DMG963HC(Tr2)_IC-VCE
DMG963HC(Tr2)_hFE-IC
−120
300
−700 µA
−600 µA
−80
−500 µA
−60
−400 µA
−40
−300 µA
−20
0
−200 µA
Forward current transfer ratio hFE
Collector current IC (mA)
IB = −800 µA
−100 µA
0
−2
−4
−6
−8
−10
250
200
25°C
100
−40°C
−1
Collector current IC (mA)
DMG963HC(Tr2)_IO-VIN
DMG963HC(Tr2)_VIN-IO
IC / IB = 20
−1
Ta = 85°C
−100
− 0.01
− 0.1
−40°C
25°C
−1
−10
−100
Collector current IC (mA)
VIN IO
−100
VO = −5 V
VO = − 0.2 V
Input voltage VIN (V)
Ta = 85°C
−10
25°C
−1
−10−1
−40°C
−10
−1
25°C
Ta = −40°C
85°C
−10−2
−10−3
−10
Collector-emitter voltage VCE (V)
−102
−10
− 0.1
50
IO VIN
Output current IO (mA)
Ta = 85°C
150
0
− 0.1
−12
VCE(sat) IC
VCE = −10 V
Ta = 25°C
−100
DMG963HC(Tr2)_VCEsat-IC
hFE IC
Collector-emitter saturation voltage VCE(sat) (V)
IC VCE
0
− 0.4
− 0.8
Input voltage VIN (V)
−1.2
− 0.1
− 0.1
−1
−10
−100
Input voltage IO (mA)
Ver. DED
4
DMG963HC
SSMini5-F4-B
Unit: mm
Land Pattern (Reference) (Unit: mm)
Ver. DED
5
Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit
examples of the products. No license is granted in and to any intellectual property right or other right owned by
Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the
infringement upon any such right owned by any other company which may arise as a result of the use of technical
information de-scribed in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications, moreover please exchange
documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,
automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly
jeopardize life or harm the human body.
Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book
for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification
and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most upto-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors
(ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do
not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
time since first opening the packages.
(7) When reselling products described in this book to other companies without our permission and receiving any claim of
request from the resale destination, please understand that customers will bear the burden.
(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
company.
No.010618
