Doc No. TT4-EA-15062
Revision. 1
Product Standards
TVS Diode
DY2L5A0C0L1
DY2L5A0C0L1
Silicon epitaxial planar type
Unit: mm
For bidirectional ESD protection and transient voltage suppressor
0.3
2
IEC 61000-4-2 (ESD) ±15kV (air and contact)
Low clamping voltage
Low capacitance
Low leak current
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
1
0.0425
0.215 0.115
0.4
0.6
Features
Marking Symbol: F4
2
0.115
1
0.1
Packaging
0.215
Embossed type (Thermo-compression sealing) : 1 000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25 C
Parameter
Symbol
Total power dissipation *1
Electrostatic discharge *2
Peak pulse power *3
Peak pulse current *3
Junction temperature
Operating ambient temperature
Storage temperature
PT
ESD
Ppp
Ipp
Tj
Topr
Tstg
Rating
Unit
100
±15
20
1.8
150
-40 to +85
-55 to +150
mW
kV
W
A
°C
°C
°C
1. Anode
2. Anode
Panasonic
JEITA
Code
DCSP0603010-N2
―
―
Internal Connection
2
Note: *1 Mounted on FR4 board. (25.4 mm x 25.4 mm x 1.0 mm)
*2 Test method:IEC61000-4-2
(C = 150 pF, R = 330 W, Contact and Air discharge:10 times)
*3 Test method:IEC61000-4-5 (tp = 8/20ms, Unrepeated)
Electrical Characteristics Ta = 25 C 3 C
Parameter
Symbol
Reverse stand-off voltage
Reverse breakdown voltage
Reverse current
Clamping voltage *3
Terminal capacitance
*1, *2
VRWM
VBR
IR
Vc
Ct
1
Conditions
Min
―
IR = 5 mA
VR = 5 V
Ipp = 1.8 A, tp = 8/20 ms
VR = 0 V, f = 1 MHz
7.0
Typ
7.5
Max
Unit
5.0
8.0
50
13
V
V
nA
V
pF
6.0
Percent of Ipp
Note: 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031
8ms/20ms Pulse Waveform
measuring methods for diodes.
Front time:
2. Absolute frequency of input and output is 5 MHz.
100
T1 = 1.25 × T = 8ms±20%
90
Time to half value:
3. *1 The temperature must be controlled 25°C for VBR mesurement.
T2 = 20ms±20%
T2
VBR value measured at other temperature must be adjusted to VBR (25°C).
50
*2 VBR guaranted 20 ms after current flow.
*3 8ms/20ms Pulse Waveform
10
T
T1
t
Page 1 of 3
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15062
Revision. 1
Product Standards
TVS Diode
DY2L5A0C0L1
Technical Data (Reference)
PT - Ta
IR - VBR
1.0E-01
Ta = 25 ℃
Mounted on FR4 board.
Board size : 25.4 mm x 25.4 mm x 1.0 mm
Reverse current IR (A)
Total power dissipation PT (mW)
150
100
1.0E-02
50
1.0E-03
0
0
20
40
60 80 100 120 140 160 180 200
Ambient temperature Ta (℃)
4
5
6
7
8
9
10
11
12
Reverse breakdown voltage VBR (V)
Ct - VR
IR - VR
1.0E-08
1.0E-04
12
Ta = 25 ℃
Ta = 25 ℃
f = 1 MHz
Terminal capacitance Ct (pF)
10
Reverse current IR (A)
1.0E-09
1.0E-10
1.0E-11
1.0E-12
8
6
4
2
0
1
2
3
4
Reverse voltage VR (V)
5
0
1
2
3
4
5
Reverse voltage VR (V)
Page 2 of 3
Established : 2015-10-13
Revised
: ####-##-##
Doc No. TT4-EA-15062
Revision. 1
Product Standards
TVS Diode
DY2L5A0C0L1
DCSP0603010-N2
Unit: mm
0.30±0.03
1
0.215±0.030
0.115±0.030
0.4
0.10±0.02
0.0425±0.0300
2
0.115±0.030
0.60±0.03
2
1
Land Pattern (Reference)
0.215±0.030
Unit: mm
0.215
0.4
0.215
0.3
Page 3 of 3
Established : 2015-10-13
Revised
: ####-##-##
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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