DZ2W03000L

Doc No. TT4-EA-13105 Revision. 4 Product Standards Zener Diode DZ2W03000L DZ2W03000L Silicon epitaxial planar type Unit: mm For constant voltage / For surge absorption circuit DZ24030 in Mini2 type package 1.6 0.13 2  Features 2.6 3.5  Excellent rising characteristics of zener current Iz  Low zener operating resistance Rz  Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL:Level 1 compliant) 1  Marking Symbol: 3J 0.9 0.8  Packaging Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)  Absolute Maximum Ratings Ta = 25 C Parameter Symbol Repetitive peak forward current Forward current Total power dissipation *1 Non-repetitive reverse power surge Electrostatic discharge *3 Junction temperature Operating ambient temperature Storage temperature Note: IFRM IF PT PZSM ESD Tj Topr Tstg *2 Rating Unit 500 200 1 100 ±30 150 -40 to +85 -55 to +150 mA mA W W kV °C °C °C 1. Cathode 2. Anode Panasonic JEITA Code Internal Connection 2 *1 Mounted on ceramics print circuit board. Board size: 50 mm × 50 mm Board thickness: 0.8 mm Soldering size: 2 mm × 2 mm *2 t = 0.1ms *3 Test method:IEC61000_4_2(C = 150 pF,R = 330 , Contact discharge:10 times)  Electrical Characteristics Ta = 25 C  3 C Parameter Symbol Forward voltage Zener voltage *1, *2 Zener operating resistance Reverse current Temperature coefficient of zener voltage *3 VF VZ RZ IR SZ Conditions IF = 200 mA IZ = 20 mA IZ = 20 mA VR = 1 V IZ = 20 mA Mini2-F3-B SC-109B ― 1 Min 2.85 Typ 3.00 Max Unit 1.2 3.15 120 150 V V  μA mV/°C -1.7 Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes. 2. Absolute frequency of input and output is 5 MHz. 3. *1 The temperature must be controlled 25°C for VZ mesurement. VZ value measured at other temperature must be adjusted to VZ (25°C) *2 VZ guaranted 20 ms after current flow. *3 Tj = 25°C to 150°C Page 1 of 4 Established : 2011-03-11 Revised : 2013-05-08 Doc No. TT4-EA-13105 Revision. 4 Product Standards Zener Diode DZ2W03000L Technical Data ( reference ) PT - Ta IF - VF 1.E+00 Mounted on ceramics print board. Board size : 50 mm × 50 mm × 0.8 mm Solder in : 2 mm x 2 mm 1 Forward current IF (A) Total power dissipation PT (W) 1.25 0.75 0.5 0.25 20 40 60 1.E-02 1.E-03 1.E-04 1.E-05 1.E-06 0.0 0 0 Ta = 25 °C 1.E-01 80 100 120 140 160 180 200 0.2 0.6 0.8 1.0 1.2 IR - VR IZ - VZ 1.E-03 1.E-01 Ta = 25 °C 1.E-04 Ta = 125 °C 1.E-02 Reverse current IR (A) Zener current IZ (A) 0.4 Forward voltage VF (V) Ambient temperature Ta (°C) 85 °C 1.E-03 25 °C 1.E-04 -40 °C 1.E-05 1.E-05 1.E-06 1.E-07 1.E-08 1.E-09 1.E-10 1.E-11 1.E-06 1.E-12 0 1 2 3 4 0 0.2 Zener voltage VZ (V) 0.8 1 16 20 SZ - IZ RZ - IZ 5 Ta = 25 °C Temparature coefficient of zener voltage SZ (mV/°C) Zener operating resistance RZ ) 0.6 Reverse voltage VR (V) 1000 100 10 1 0.0001 0.4 4 3 2 1 0 -1 -2 -3 -4 -5 0.001 0.01 Zener current IZ (A) 0.1 0 4 8 12 Zener current IZ (mA) Page 2 of 4 Established : 2011-03-11 Revised : 2013-05-08 Doc No. TT4-EA-13105 Revision. 4 Product Standards Zener Diode DZ2W03000L Technical Data ( reference ) Rth - t Ct - VR 1000 Ta = 25 °C f = 1 MHz 3000 2500 Thermal resistance Rth (°C/W) Terminal capacitance Ct (pF) 3500 2000 1500 1000 500 0 0 0.5 1 1.5 Reverse voltage VR (V) 2 (2) 100 (1) (3) Rth(j-l) = 15 °C/W 10 1 0.001 (1) Non-heat sink (2) Mounted on glass epoxy print board. (3) Mounted on alumina print board. Board size : 50 mm × 50 mm x 0.8 mm Solder in : 2 mm x 2 mm 0.01 0.1 1 10 Time t (s) 100 1000 PZSM - tw Non-repetitive reverse surge power dissipation PZSM (W) 10000 Ta = 25 °C 1000 100 10 1 100 1000 10000 100000 Pulse width tw (μs) Page 3 of 4 Established : 2011-03-11 Revised : 2013-05-08 Doc No. TT4-EA-13105 Revision. 4 Product Standards Zener Diode DZ2W03000L Mini2-F3-B Unit: mm 1.6±0.1 +0.05 0.13-0.02 (7°) 3.5±0.1 2.6±0.1 2 0 to 0.1 (7°) 0 to 0.3 0.80±0.05 0.9±0.1 0.45±0.10 1  Land Pattern (Reference) (Unit: mm) 0.85 3.05 0.85 1.2 Page 4 of 4 Established : 2011-03-11 Revised : 2013-05-08 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. 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