Multilayer Ceramic Capacitors(For General Usage)
Multilayer Ceramic Capacitors
(For General Electronic Equipment)
Series:
ECJ
■ Features
■ Recommended Applications
Small size and wide capacitance range
High humidity resistance and long life
Excellent solderability and resistance to soldering heat
Low inductance (ESL) and excellent frequency
characteristics
● RoHS compliant
● Class 1 (T.C. Type)
Tuned circuits, and filter circuitry, where low loss and
high stability of capacitance and high insulation
resistance is required
● Class 2 (Hi-K Type)
Coupling and By-passing
■ Handling Precautions
■ Packaging Specifications
●
●
●
●
See Page 48 to 53
See Page 45, 46, 56
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
C
J
Z
E
B
1
A
1
0
3
K
Packaging
Rated Voltage Code
Style Code
Temperature
Size Code
Characteristic Code
Product Code
(ECJ:Multilayer Ceramic
Chip Capacitors)
(Example)
Capacitance
Tolerance Code
Nominal Capacitance
■ Construction
3
4
No
Name
1
Ceramic dielectric
2
Internal electrode
3
5
2
Substrate electrode
Terminal
electrode
4
1
5
Intermediate electrode
External electrode
■ Dimensions in mm (not to scale)
Size Code Size (EIA)
L
L
W
T
L1, L 2
0201
0.60±0.03
0.30±0.03
0.30±0.03
0.15±0.05
0
0402
1.00±0.05
0.50±0.05
0.50±0.05
0.2±0.1
1
0603
1.6±0.1
0.8±0.1
0.8±0.1
0.3±0.2
2.0±0.1
1.25±0.10
0.85±0.10
Z
W
0.6±0.1
T
L1
L2
2
0805
1.25±0.10
2.00±0.15
1.25±0.15
1.25±0.15
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC8 –
0.50±0.25
00 Sep. 2008
Multilayer Ceramic Capacitors(For General Usage)
■ Packaging Styles and Standard Packaging Quantities
Packaging
Size
Style
Thickness (mm)
Code Packaging Styles
Paper taping
E
(Pitch: 2 mm)
Paper taping
φ180
V
(Pitch: 4 mm)
reel
Embossed taping
F
(Pitch: 4 mm)
Quantity (Taping: pcs./reel)
0201
0402
0603
0805
T=0.3
T=0.5
T=0.8
T=0.6
T=0.85
T=1.25
15,000
10,000
—
—
—
—
—
—
4,000
5,000
4,000
—
—
—
—
—
—
3,000
φ330 reel and bulk case type : Please contact us
■ Temperature Characteristics
● Class 1
Temperature
Characteristic
Code
C
Temperature
Characteristics
Temp. Coeff.
(ppm/°C)
>10 pF
>4 pF
3 pF
1000 pF
Measuring frequency 1 MHz ± 10 % 1 kHz ± 10 %
Measuring voltage 0.5 to 5 Vrms 0.5 to 5 Vrms
Class 2:
Preconditioning: The capacitors shall be kept
in temperature of 150 +0/–10 °C for 1 hour
and subjected to standard condition ✽ 48±4
hours before initial measurement.
Nominal capacitance
C < 1 µF
Measuring frequency 1 kHz ± 10 %
Measuring voltage 1.0 ± 0.2 Vrms
Temperature
Temp. Char.
Characteristics
CG : 0± 30 ppm/ °C
CH : 0± 60 ppm/ °C
CJ : 0±120 ppm/ °C
CK : 0±250 ppm/ °C
SL : +350 to –1000 ppm/ °C
Adhesion
Temp.
B
X7R
X5R
F
Y5V
Char.
: ±10 %
: ±15 %
: ±15 %
: +30, –80 %
: +22, –82 %
Terminal electrodes shall be free from peeling or signs of
peeling.
Maximum capacitance change at stage 1 to 5
Temp.
Char.
1
2
3
(Ref. Temp.)
4
5
C∆, SL
X7R X5R Y5V
B, F
20 °C 25 °C 25 °C 25 °C
–25 °C –55 °C –55 °C –30 °C
20 °C 25 °C 25 °C 25 °C
85 °C 125 °C 85 °C 85 °C
20 °C 25 °C 25 °C 25 °C
See the technical specifications for
details such as measuring voltage.
Applied force:
Size: 0201: 2 N
Size: 0402 to 0805: 5N
Duration: 10 s
Size: 0201 to 0402
1.0
0.3/Size:0201
0.5/Size:0402
0.5R
PC board
Sample
1.0
Size: 0603 to 0805
Sample
Unit : mm
✽Standard conditions : Temperature 15 to 35 °C, Relative humidity 45 to 75 %
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC10 –
00 Sep. 2008
Multilayer Ceramic Capacitors(For General Usage)
Bending
Strength
Specification
Class 1
Appearance:
No mechanical damage
Capacitance change:
Within ±5 % or ±0.5 pF
whichever is larger.
Test Method
Class 2
Appearance:
Bending value:1 mm
No mechanical damage
Bending speed:1 mm/
Capacitance change:
Temp. Char.
20
B, X7R, X5R : within ±12.5 %
R340
F ,Y5V
: within ±30 %
45±2
Bending Value
Item
45±2
Unit : mm
Vibration
Proof
Appearance: No mechanical damage.
Capacitance: within the specified tolerance
Q, tan δ: Initial standard value
Resistance
to Soldering
Heat
Appearance:
No mechanical damage
Capacitance change:
Within ±2.5 % or ±0.25 pF
whichever is larger.
Q.tan δ:Initial standard value
IR:Initial standard value
Withstand voltage:
No dielectric breakdown
and/or damage
Appearance:
No mechanical damage
Capacitance change:
Temp. Char.
B, X7R, X5R : within ±7.5 %
F, Y5V
: within ±20 %
tan δ:Initial standard value
IR:Initial standard value
Withstand voltage:
No dielectric breakdown
and/or damage
Total amplitude : 1.5 mm
Vibration frequency : 10 to 55 to 10 Hz
for 1 min.
3 perpendicular directions for 2 hours
each, a total of 6 hours
Soldering bath method
Preconditioning:Heat treatment/Class 2(✽1)
Solder temperature:270±5 °C
Dipping period:3.0±0.5 s
Preheat condition:
Order Temp. (°C) Size 0805 max.
1
2
80 to 100
150 to 200
120 to 180 s
120 to 180 s
Recovery (Standard condition):
Class 1:24±2 h
Class 2:48±4 h
Solderability More than 95 % of the soldered area of both terminal
Soldering bath method
electrodes should be covered with fresh solder.
Solder temperature:230±5 °C
Dipping period:4±1 s
Solder:H63A (JIS Z 3282)
Appearance:
Temperature Appearance:
Preconditioning:Heat treatment
No mechanical damage
Cycle
No mechanical damage
(150 °C, 1h) /Class 2
Capacitance change:
Capacitance change:
Condition of one cycle
Temp. Char.
Within ±2.5 % or ±0.25 pF
Step 1:Minimum operationing temp.
whichever is larger.
30±3 min
B, X7R, X5R : within ±7.5 %
Q.tan δ:Initial standard value
Step 2:Room temp.
3 min max.
F, Y5V
: within ±20 %
IR:Initial standard value
Step 3:Maximum operationing temp.
tan δ:Initial standard value
Withstand voltage:
30±3 min
IR:Initial standard value
No dielectric breakdown
Step 4:Room temp.
3 min max.
Withstand voltage:
and/or damage
Number of cycles:5 cycles
No dielectric breakdown
Recovery (Standard condition)
and/or damage
Class 1:24±2 h
Class 2:48±4 h
Damp Heat
Appearance:
Preconditioning:Heat treatment/Class 2(✽1)
Appearance:
(Steady state)
No mechanical damage
No mechanical damage
Temperature:40±2 °C
Capacitance change:
Capacitance change:
Relative humidity:90 to 95 %
Within ±5 % or ±0.5 pF
Temp. Char.
Test period:500+24/0 h
whichever is larger.
B, X7R, X5R: Within ±20 % Recovery (Standard condition)
Q:
F, Y5V: Within ±30 %
Class 1:24±2 h
C200+10C
tan δ:
Class 2:48±4 h
Temp. Char.
10 pF1 mm: Avoid flow soldering.
For capacitance 1 µF or more, see page 6 and 7 for High Capacitance.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EC19 –
00 Sep. 2008
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