ECJ-1VC1H0R5C

Multilayer Ceramic Capacitors(For General Usage) Multilayer Ceramic Capacitors (For General Electronic Equipment) Series: ECJ ■ Features ■ Recommended Applications Small size and wide capacitance range High humidity resistance and long life Excellent solderability and resistance to soldering heat Low inductance (ESL) and excellent frequency characteristics ● RoHS compliant ● Class 1 (T.C. Type) Tuned circuits, and filter circuitry, where low loss and high stability of capacitance and high insulation resistance is required ● Class 2 (Hi-K Type) Coupling and By-passing ■ Handling Precautions ■ Packaging Specifications ● ● ● ● See Page 48 to 53 See Page 45, 46, 56 ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E C J Z E B 1 A 1 0 3 K Packaging Rated Voltage Code Style Code Temperature Size Code Characteristic Code Product Code (ECJ:Multilayer Ceramic Chip Capacitors) (Example) Capacitance Tolerance Code Nominal Capacitance ■ Construction 3 4 No Name 1 Ceramic dielectric 2 Internal electrode 3 5 2 Substrate electrode Terminal electrode 4 1 5 Intermediate electrode External electrode ■ Dimensions in mm (not to scale) Size Code Size (EIA) L L W T L1, L 2 0201 0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05 0 0402 1.00±0.05 0.50±0.05 0.50±0.05 0.2±0.1 1 0603 1.6±0.1 0.8±0.1 0.8±0.1 0.3±0.2 2.0±0.1 1.25±0.10 0.85±0.10 Z W 0.6±0.1 T L1 L2 2 0805 1.25±0.10 2.00±0.15 1.25±0.15 1.25±0.15 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – EC8 – 0.50±0.25 00 Sep. 2008 Multilayer Ceramic Capacitors(For General Usage) ■ Packaging Styles and Standard Packaging Quantities Packaging Size Style Thickness (mm) Code Packaging Styles Paper taping E (Pitch: 2 mm) Paper taping φ180 V (Pitch: 4 mm) reel Embossed taping F (Pitch: 4 mm) Quantity (Taping: pcs./reel) 0201 0402 0603 0805 T=0.3 T=0.5 T=0.8 T=0.6 T=0.85 T=1.25 15,000 10,000 — — — — — — 4,000 5,000 4,000 — — — — — — 3,000 φ330 reel and bulk case type : Please contact us ■ Temperature Characteristics ● Class 1 Temperature Characteristic Code C Temperature Characteristics Temp. Coeff. (ppm/°C) >10 pF >4 pF 3 pF 1000 pF Measuring frequency 1 MHz ± 10 % 1 kHz ± 10 % Measuring voltage 0.5 to 5 Vrms 0.5 to 5 Vrms Class 2: Preconditioning: The capacitors shall be kept in temperature of 150 +0/–10 °C for 1 hour and subjected to standard condition ✽ 48±4 hours before initial measurement. Nominal capacitance C < 1 µF Measuring frequency 1 kHz ± 10 % Measuring voltage 1.0 ± 0.2 Vrms Temperature Temp. Char. Characteristics CG : 0± 30 ppm/ °C CH : 0± 60 ppm/ °C CJ : 0±120 ppm/ °C CK : 0±250 ppm/ °C SL : +350 to –1000 ppm/ °C Adhesion Temp. B X7R X5R F Y5V Char. : ±10 % : ±15 % : ±15 % : +30, –80 % : +22, –82 % Terminal electrodes shall be free from peeling or signs of peeling. Maximum capacitance change at stage 1 to 5 Temp. Char. 1 2 3 (Ref. Temp.) 4 5 C∆, SL X7R X5R Y5V B, F 20 °C 25 °C 25 °C 25 °C –25 °C –55 °C –55 °C –30 °C 20 °C 25 °C 25 °C 25 °C 85 °C 125 °C 85 °C 85 °C 20 °C 25 °C 25 °C 25 °C See the technical specifications for details such as measuring voltage. Applied force: Size: 0201: 2 N Size: 0402 to 0805: 5N Duration: 10 s Size: 0201 to 0402 1.0 0.3/Size:0201 0.5/Size:0402 0.5R PC board Sample 1.0 Size: 0603 to 0805 Sample Unit : mm ✽Standard conditions : Temperature 15 to 35 °C, Relative humidity 45 to 75 % Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – EC10 – 00 Sep. 2008 Multilayer Ceramic Capacitors(For General Usage) Bending Strength Specification Class 1 Appearance: No mechanical damage Capacitance change: Within ±5 % or ±0.5 pF whichever is larger. Test Method Class 2 Appearance: Bending value:1 mm No mechanical damage Bending speed:1 mm/ Capacitance change: Temp. Char. 20 B, X7R, X5R : within ±12.5 % R340 F ,Y5V : within ±30 % 45±2 Bending Value Item 45±2 Unit : mm Vibration Proof Appearance: No mechanical damage. Capacitance: within the specified tolerance Q, tan δ: Initial standard value Resistance to Soldering Heat Appearance: No mechanical damage Capacitance change: Within ±2.5 % or ±0.25 pF whichever is larger. Q.tan δ:Initial standard value IR:Initial standard value Withstand voltage: No dielectric breakdown and/or damage Appearance: No mechanical damage Capacitance change: Temp. Char. B, X7R, X5R : within ±7.5 % F, Y5V : within ±20 % tan δ:Initial standard value IR:Initial standard value Withstand voltage: No dielectric breakdown and/or damage Total amplitude : 1.5 mm Vibration frequency : 10 to 55 to 10 Hz for 1 min. 3 perpendicular directions for 2 hours each, a total of 6 hours Soldering bath method Preconditioning:Heat treatment/Class 2(✽1) Solder temperature:270±5 °C Dipping period:3.0±0.5 s Preheat condition: Order Temp. (°C) Size 0805 max. 1 2 80 to 100 150 to 200 120 to 180 s 120 to 180 s Recovery (Standard condition): Class 1:24±2 h Class 2:48±4 h Solderability More than 95 % of the soldered area of both terminal Soldering bath method electrodes should be covered with fresh solder. Solder temperature:230±5 °C Dipping period:4±1 s Solder:H63A (JIS Z 3282) Appearance: Temperature Appearance: Preconditioning:Heat treatment No mechanical damage Cycle No mechanical damage (150 °C, 1h) /Class 2 Capacitance change: Capacitance change: Condition of one cycle Temp. Char. Within ±2.5 % or ±0.25 pF Step 1:Minimum operationing temp. whichever is larger. 30±3 min B, X7R, X5R : within ±7.5 % Q.tan δ:Initial standard value Step 2:Room temp. 3 min max. F, Y5V : within ±20 % IR:Initial standard value Step 3:Maximum operationing temp. tan δ:Initial standard value Withstand voltage: 30±3 min IR:Initial standard value No dielectric breakdown Step 4:Room temp. 3 min max. Withstand voltage: and/or damage Number of cycles:5 cycles No dielectric breakdown Recovery (Standard condition) and/or damage Class 1:24±2 h Class 2:48±4 h Damp Heat Appearance: Preconditioning:Heat treatment/Class 2(✽1) Appearance: (Steady state) No mechanical damage No mechanical damage Temperature:40±2 °C Capacitance change: Capacitance change: Relative humidity:90 to 95 % Within ±5 % or ±0.5 pF Temp. Char. Test period:500+24/0 h whichever is larger. B, X7R, X5R: Within ±20 % Recovery (Standard condition) Q: F, Y5V: Within ±30 % Class 1:24±2 h C200+10C tan δ: Class 2:48±4 h Temp. Char. 10 pF1 mm: Avoid flow soldering. For capacitance 1 µF or more, see page 6 and 7 for High Capacitance. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – EC19 – 00 Sep. 2008