CLASSIFICATION
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SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
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DATE
27.06.2011
Datum
Specification for Production
Applicant / Manufacturer
Hardware
Panasonic Electronic Devices Europe GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Software
Supported Bluetooth Profiles
Stollmann Entwicklungs- und Vertriebs-GmbH
Mendelssohnstrasse 15 D
22761 Hamburg
Germany
BlueRS , SPP, HDP, HID, OPP, HDP/SPP
Contents
Approval for Mass Production
Customer
By signing this document, you acknowledge that you are the legal representative for your
company and that you understand and accept the validity of the contents herein .
CHECKED / APPROVED:
DATE:
NAME:
SIGNATURE:
NOTE:
AT LEAST ONE SET OF APPROVED SPECIFICATIONS SHOULD BE RETURNED TO
THE ADDRESS OF THE ISSUING PARTY.
PANASONIC ELECTRONIC DEVICES
EUROPE GMBH
High Frequency Products Business Group
- Wireless Modules -
APPROVED
genehmigt
CHECKED
geprüft
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erstellt
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
2 of 34
DATE
27.06.2011
Datum
TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
Key Features................................................................................................................... 4
Applications for the Module............................................................................................. 4
Description for the Module .............................................................................................. 5
Scope of this Document .................................................................................................. 6
History for this Document................................................................................................ 6
Terminal Layout .............................................................................................................. 7
6.1. General Pin Assignment ........................................................................................ 8
6.2. Application Specific Pin Description ...................................................................... 9
6.2.1. SPP configuration DCE Mode .................................................................. 9
Terminal Specifics......................................................................................................... 10
7.1. RF-Interface - ANT .............................................................................................. 10
7.2. Power Supply....................................................................................................... 10
7.3. Power-On-Reset .................................................................................................. 10
7.4. UART Interface – TXD, RXD, CTS, RTS ............................................................. 11
7.5. 3-wire Serial Interface.......................................................................................... 12
7.6. USB Interface, ...................................................................................................... 12
7.6.1. USB_DP, USB_DN ................................................................................ 12
7.7. GPIO Interface..................................................................................................... 12
7.8. ADC ..................................................................................................................... 12
7.9. DAC ..................................................................................................................... 12
7.10. PCM Interface...................................................................................................... 12
Key Parts List ................................................................................................................ 13
Test Conditions ............................................................................................................. 14
Absolute Maximum Ratings (1)....................................................................................... 14
Electrical Requirements ................................................................................................ 14
I/O Operating Characteristics........................................................................................ 15
USB Interface................................................................................................................ 15
Typical Current Consumption........................................................................................ 16
14.1. SPP Configuration ............................................................................................... 16
14.1.1. Deep Sleep State ................................................................................... 16
14.1.2. Power Down State.................................................................................. 16
14.1.3. Idle State ................................................................................................ 16
14.2. Power Consumption ............................................................................................ 16
14.3. Power-up time...................................................................................................... 17
Electrical RF-Characteristics......................................................................................... 17
Mechanical Requirements............................................................................................. 18
Soldering Temperature-Time Profile (for reflow soldering) ........................................... 19
17.1. For lead solder..................................................................................................... 19
17.2. For leadfree solder............................................................................................... 19
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CUSTOMER’S CODE
PAN1455/1555
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
29.
30.
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
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PAGE
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DATE
27.06.2011
Datum
Module Dimension ........................................................................................................ 20
Recommended Foot Pattern ......................................................................................... 21
Labelling Drawing.......................................................................................................... 23
Software ........................................................................................................................ 24
21.1. SPP Software ...................................................................................................... 24
21.2. HDP Software ...................................................................................................... 24
21.3. HID Software ....................................................................................................... 24
21.4. HDP/SPP Software.............................................................................................. 24
21.5. Other Profiles are available on request. .............................................................. 24
Cautions ........................................................................................................................ 24
22.1. Design Notes ....................................................................................................... 24
22.2. Installation Notes ................................................................................................. 25
22.3. Usage Conditions Notes ...................................................................................... 25
22.4. Storage Notes...................................................................................................... 25
22.5. Safety Cautions ................................................................................................... 26
22.6. Other cautions ..................................................................................................... 27
Packaging ..................................................................................................................... 28
23.1. Embossed tape / Blistergurt................................................................................. 28
23.2. Component direction............................................................................................ 29
23.3. Reel dimension .................................................................................................... 30
23.4. Package............................................................................................................... 30
Ordering Information ..................................................................................................... 31
RoHS Declaration ......................................................................................................... 31
Data Sheet Status ......................................................................................................... 31
Regulatory Information.................................................................................................. 32
27.1. FCC Notice .......................................................................................................... 32
27.2. Caution ................................................................................................................ 32
27.3. Labeling Requirements........................................................................................ 32
27.4. Antenna Warning ................................................................................................. 33
27.5. Approved Antenna List ........................................................................................ 33
27.6. RF Exposure PAN1455/PAN1555 ....................................................................... 33
27.7. Industry Canada Certification .............................................................................. 33
Related Documents....................................................................................................... 34
General Information ...................................................................................................... 34
Life Support Policy ........................................................................................................ 34
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CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
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DATE
27.06.2011
Datum
1. KEY FEATURES
Schlüsseleigenschaften
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Bluetooth specification v2.0 + EDR (Enhanced Data Rate)
CSR BlueCore6-ROM inside
Complete Co-location and Co-existence with IEEE 802.11 (AWMA, AFH and SFH)
Fast Connection Setup
Extended SCO Link
RF output power class 2 with power control
Supply Voltage 3.0V to 3.6V
Internal crystal oscillator (26MHz, 14.7456 MHz and 32 kHz for deep sleep)
Surface mount type
• PAN1455: 13.5 x 18.75 x 2.85 mm
• PAN1555: 13.5 x 22.75 x 2.85 mm
Built-in shielding to be compliant to FCC
Full Bluetooth data rate up to 2178kbps asymmetric
Support for all Bluetooth power saving modes (Park, Sniff, Hold)
Support for very low-power modes (deep sleep and power down)
Otional support for ultra-low-power mode. Standby with Battery-Backup
PCM Interface Master / Slave supporting 13 or 16 bit linear, 8 bit µ-law or A-law Codecs
and CVSD transcoders on up to 3 SCO channels
Full 8- to 128-bit encryption
High sensitivity design (-86 dBm typ.)
3 UART, USB, I2C and SPI Interface
18 GPIO’s for individual usage for your embedded software
3 Channel ADC and 1 Channel DAC
Cortex-M3 ST32F103 core for embedded profiles or application software
Manufactured in conformance with RoHS
2. APPLICATIONS FOR THE MODULE
Applikationen für das Modul
All Embedded Wireless Applications
•
•
Access Points
Printer Adapters
•
•
•
•
•
Printers
Scanners
Wireless Sensors
•
•
•
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
Cable Replacement
Personal Digital Assistants
(PDAs)
Access Points
Computers and Peripherals
Industrial Control Applications
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CLASSIFICATION
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Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
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DATE
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Datum
3. DESCRIPTION FOR THE MODULE
Modulbeschreibung
PAN1455/1555 is a short-range class 2 module for implementing Bluetooth functionality into
various electronic devices. The module consists of three major parts; a baseband controller, a
EEPROM memory and a radio that operates in the license-free 2.45 GHz ISM band.
The module is listed as a Bluetooth End Product (EPL). Customers have to list their product under
the BT QDID: B015522
Communication between the module and the host controller is carried out normally via UART.
Otional via below interfaces. Please contact your local sales office for further details on additional
options.
PAN1555
Antenna
256K EEPROM
GPIO´s
Debug
UART
STM32
SPP-AT
UART
BC06ROM
256kByte Flash
48kByte RAM
BALUN
Filter
Matching
Circuit 50 Ohm
PLL
Optional:
2 x SPI,
USB,
UART,
ADC, JTAG,
PCM,
WLANCoexistence
Optional U.FL
Optional
16MHz
USB
14,7456MHz
Optional
One Crystal
14,75MHz
Temp -25°C to +85°C
26MHz
Optional Low
Power 32KHz
Oscillator
Bottom Pad
PAN1455
Figure 3.1 PAN1455/1555 Block-Diagram
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PAN1455/1555
PRODUCT SPECIFICATION
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CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
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DATE
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4. SCOPE OF THIS DOCUMENT
Umfang dieses Dokumentes
This product specification applies to the class 2 bluetooth module ENW89815CxKF/ENW89815AxKF.
The different characters indicates different versions (refer to chapter 24 Ordering Information)
The used bluetooth chip is the BlueCore6 from the company CSR. (www.csr.com).
Diese Produktionsunterlagen beziehen sich auf das Class 2 Bluetooth Modul
ENW89815CxKF/ENW89815AxKF.
Die unterschiedlichen Zeichen bezeichnen verschiedene Versionen (Erklärung im Kapitel 24
Ordering Information)
Der verwendete Bluetooth Chip ist der BlueCore6 der Firma CSR.
5. HISTORY FOR THIS DOCUMENT
Versionsverwaltung dieses Dokumentes
Revision
Version
Date
Datum
Modification / Remarks
Änderungen / Bemerkungen
0.90
06.03.2009
Preliminary release.
0.91
30.03.2009
Add FCC Notice
0.92
04.05.2009
Include RF-Performance and current consumption
0.93
06.05.2009
Do minor changes in formatting, content links now included.
0.94
29.05.2009
Include final tables and Interface description
0.95
28.08.2009
SW-Status updated
1.00
01.02.2011
Power update for min values, add foot note from CSR, addd CSR datasheet in appendix, add
HDP Partnumbers, add link to Stollmann SW support page. Include BT Listing QDID
information.
1.10
27.06.2011
Updated laser label information in chapter 20 Labelling Drawing.
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CLASSIFICATION
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Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
No.
REV.
DS-1x55-2400-102
1.10
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7 of 34
DATE
27.06.2011
Datum
ENW89815CxKF/ENW89815AxKF
6. TERMINAL LAYOUT
Anschlußbelegung
10
9
8
7
6
5
4
3
2
11
1
1
34
12
33
13
32
14
31
15
30
16
17
18
19
20
21
22
23
24
25
B
A
D
C
29
28
26
27
Figure 6.1 PAN1455/1555 Pin Numbering Bottom View
10
9
8
7
6
5
4
3
2
11
1
1
34
12
33
13
32
14
31
15
30
17
18
19
20
21
22
23
24
25
B
A
D
C
26
29
ANT
16
28
27
Figure 6.2 PAN1455/1555 Pin Numbering Bottom View
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6.1.
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
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DATE
27.06.2011
Datum
GENERAL PIN ASSIGNMENT
No
Pin Name
Type
PU/PD
Active
Description
1
2
3
4
5
6
7
GND1
ANT
UART_RTS#
UART_TXD
UART_RXD
UART_CTS#
GPIO[9]/PCM_CLK
P
I/O
I
I
O
O
I/O
PD
PD
PU
H
L
L
H
L
8
GPIO[10]/PCM_O/TXD3
I/O
PU
L
9
GPIO[7]/PCM_SYNC
I/O
PD
H
10
11
GND2
ATRST/SPI2_MISO
P
I/O
PU
H
12
GPIO[8]/PCM_I/RXD3
I/O
PU
L
13
ATDI/SPI2_CS
I/O
PU
-
14
15
16
17
18
19
ATMS
reserved
VCC
RESET#
GND3
GPIO[14]
I
I
P
I
P
I/O
PU
PD
PU
PU
L
L
20
GPIO[13]
I/O
PD
H
21
GPIO[15]
I/O
PU
L
22
GPIO[6]/ADC
I/O
PD
H
23
24
25
ATDO/SPI2_SCK
ATCK
GPIO[3]/SPI_CLK
O
O
I/O
PU
PD
PD
H
26
GPIO[0]/SPI_MOSI
I/O
PD
H
27
28
GND4
GPIO[2]/SPI_CS
P
I/O
PD
H
29
GPIO[1]/SPI_MISO
I/O
PD
H
30
GPIO[5]/TXD2
I/O
PD
H
31
GPIO[4]/RXD2
I/O
PD
H
32
33
34
USB_DM
USB_DP
GPIO[17]/TAMPER
I/O
I/O
I/O
PD
PD
PD
-
A
GPIO[16]/SPI2_MOSI
I/O
PU
L
B
GPIO[12]/I2C_SCL
I/O
PU
L
C
GPIO[11]/I2C_SDA
I/O
PU
L
D
VBAT
P
-
-
Connect to Ground
Antenna Connector
UART Request To Send (active low)
UART Data Input, weak internal Pull-Down
UART Data Output
UART Clear To Send, internal Pull-Up
General Purpose Input/Output, weak internal PullUp / PCM Data Clock Output
General Purpose Input/Output, weak internal PullUp / PCM Data Output/ UART3 DATA Output
General Purpose Input/Output, weak internal PullDown / PCM Data Sync Output
Connect to Ground
JTAG reset, internal Pull-Up / SPI2 Master In Slave Out
General Purpose Input/Output, weak internal PullUp / PCM Data Input / UART3 DATA Input
JTAG test data input, weak internal Pull-Up / SPI2
Chip Select
JTAG mode select, weak internal Pull-Up
for Debug-Use only, nc
VCC
Reset input
Connect to Ground
General Purpose Input/Output, weak internal PullUp
General Purpose Input/Output, weak internal PullDown
General Purpose Input/Output, weak internal PullUp
General Purpose Input/Output, weak internal PullUp / ADC Input
JTAG test data output
JTAG clock, weak internal Pull-Down
General Purpose Input/Output, weak internal PullDown / SPI Clock
General Purpose Input/Output, weak internal PullDown / SPI Master Out – Slave In
Connect to Ground
General Purpose Input/Output, weak internal PullDown / SPI Chip Select
General Purpose Input/Output, weak internal PullDown / SPI Master In – Slave Out
General Purpose Input/Output, weak internal PullDown / UART2 DATA Output
General Purpose Input/Output, weak internal PullDown / UART2 DATA Input
USB Data Minus Terminal
USB Data Plus Terminal
General Purpose Input/Output, weak internal PullDown, do not use as current source! / TAMPER In
General Purpose Input/Output, weak internal PullUp / SPI2 Master Out – Slave In
General Purpose Input/Output, weak internal PullUp / I2C Serial Clock Line
General Purpose Input/Output, weak internal PullUp / I2C Serial Data Line
Optional Batterie Backup
Type: PU - Pulled up; PD – pulled down; P – Power; I – Input; O – Output; I/O - bidirectional
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6.2.
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
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APPLICATION SPECIFIC PIN DESCRIPTION
6.2.1.
SPP configuration DCE Mode
No
Pin Name
SPP-Function
Type
PU/PD
Active
Description
1
2
3
4
5
6
7
GND1
ANT
UART_RTS#
UART_TXD
UART_RXD
UART_CTS#
GPIO[9]/PCM_CLK
Power
Antenna
/RTS
TXD
RXD
/CTS
/LED2
P
I/O
I
I
O
O
O
PU
PD
L
H
H
L
L
8
9
10
11
12
13
14
15
16
17
GPIO[10]/PCM_O/TXD3
GPIO[7]/PCM_SYNC
GND2
ATRST/SPI2_MISO
GPIO[8]/PCM_I/RXD3
ATDI/SPI2_CS
ATMS
BOOT0
VCC
RESET#
UA2
/LED1
Power
reserved
/UE1
reserved
reserved
reserved
Power
/RESET
O
O
I/O
I
I/O
I
I
I
18
19
GND3
GPIO[14]
Power
/RTC-OUT
O
20
GPIO[13]
/RTC-IN
I
PU
L
21
GPIO[15]
I/O
PU
L
22
GPIO[6]/ADC
/DCD or /DCDDTE
/RI
I/O
PU
L
23
24
25
26
27
28
29
30
31
ATDO/SPI2_SCK
ATCK
GPIO[3]/SPI_CLK
GPIO[0]/SPI_MOSI
GND4
GPIO[2]/SPI_CS
GPIO[1]/SPI_MISO
GPIO[5]/TXD2
GPIO[4]/RXD2
O
O
I/O
I/O
O
I
O
I
PU
PD
PD
PD
H
H
-
PD
H
PD
H
32
33
34
A
B
C
D
USB_DM
USB_DP
GPIO[17]/TAMPER
GPIO[16]/SPI2_MOSI
GPIO[12]/I2C_SCL
GPIO[11]/I2C_SDA
VBAT
reserved
reserved
reserved
reserved
Power
reserved
/UE2
reserved
DTE-/DCE
Select
reserved
reserved
reserved
reserved
reserved
reserved
Power
I/O
I/O
I/O
I/O
I/O
I/O
-
PD
PD
PD
PU
PU
PU
L
L
L
-
Connect to Ground
Antenna Connector
UART Request To Send
UART Data Input
UART Data Output
UART Clear To Send
Bluetooth connected. Active if a
Bluetooth connection exists.
Inactive in idle state. Flashes
during startup.
User Output 2
Device Ready
Connect to Ground
leave open
User Input 1
leave open
leave open
for Debug-Use only, nc
VCC
Reset input (active low for 5 ms);
Schmitt triggered
Connect to Ground
DSR in DCE mode, DTR in DTE
mode
DTR in DCE mode, DSR in DTE
mode
Data Carrier Detect , Input in
DTE mode Output in DCE mode
Ring Indicator, Input in DTE
mode Output in DCE mode
JTAG
JTAG
leave open
leave open
Connect to Ground
leave open
User Input 2, Break Detect (1)
leave open
DTE (high) DCE (low) mode
selector
leave open
leave open
leave open
leave open
leave open
leave open
Optional Batterie Backup
PU
PU
PU
PU
PD
PU
L
H
L
H
L
L
Type: PU - Pulled up; PD – pulled down; P – Power; I – Input; O – Output; I/O - bidirectional
All other pins do not have a dedicated functionality in SPP mode. See 6.1 General Pin
Assignment for all other terminals.
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Bluetooth Modul der Klasse 2
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ENW89815CxKF/ENW89815AxKF
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7. TERMINAL SPECIFICS
Interfacebeschreibungen
7.1.
RF-INTERFACE - ANT
The PAN1455 presents a 50Ω impedance on the antenna pin. If you need antenna support
please e-mail to wireless@ecom.panasonic.de or use the PAN1555 with integrated ceramic
antenna.
7.2.
POWER SUPPLY
PAN1455/1555 require a power supply with the following characteristics:
Typical : 3.3VDC, min.: 3.0VDC – max.: 3.6VDC, low noise (≤10mV), >80mA peak
Due to the technological requirements and the pulsed radio transmission the supply needs to
be fed by an ultra fast (response time ≤20µs) linear regulator placed as close as possible to
the VSUP pin (16). Functionality has been verified with the following types: TOREX:
XC6204x332xx or XC6401xx42xx
It is also recommended to place a low ESR capacitor with at least 10µF as close as possible
to the VSUP pin (16).
NOTE: You must ensure that during operation the supply voltage never drops below 2.8 VDC.
Otherwise the flash contents (firmware and/or configuration data) can get lost.
7.3.
POWER-ON-RESET
PAN1455/1555 are equipped with circuitry for generating Power ON/-OFF Reset from the
internal core voltage. A reset is generated when the core voltage falls below typically 1.88V
and is released when it rises above typically 1.92V.
In case of Power-On, Power-Off, Watchdog, Low-Power or Software, RESET# acts as an
Output by holding RESET# at ≤ 0.3V for min. 1,5ms and max. 3,5ms.
In an application with an external Reset as an Input, for example external Reset-Controller,
we recommend to use Open-Drain-Output for this circuit. An external reset shall be generated
at RESET# ≤ 0.3V for ≥ 5ms after VSUP has stabilized in the recommended voltage range.
The following table shows the pin states of PAN1455/1555 on reset.
Pin Name
State: PAN1455/1555
UART_RTS#
UART_TXD
UART_RXD
UART_CTS#
GPIO[0] – GPIO[13], GPIO[16],
GPIO[17]
GPIO[14]
GPIO[15]
Boot0
ATRST
ATDI
ATMS
ATDO
ATCK
USB_DM
USB_DP
Input Floating
Input Floating
Input Floating
Input Pull-Up
Input Floating
Input Pull-Up
Input Pull-Up
Input Pull-Down
Input Pull-Up
Input Pull-Up
Input Pull-Up
Input Floating
Input Pull-Down
Input Floating
Input Floating
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PRODUCT SPECIFICATION
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UART INTERFACE – TXD, RXD, CTS, RTS
The functionality of the interface corresponds to the V.24 / RS-232 standard on TTL-level.
Transmission speeds:
•
1200 bps
•
2400 bps
•
4800 bps
•
9600 bps
•
19200 bps
•
38400 bps
•
57600 bps
•
115200 bps
•
230400 bps
•
460800 bps
•
921200 bps
Character representation:
• 8 or 9 Bit, even/odd/no Parity, 1or 2 stop bits
• 7 Bit, even/odd Parity, 1 or 2 stop bits
• 7 Bit no Parity, 2 or 3 stop bits
Hardware flow-control with UART_RTS and UART_CTS (active low)
TXD
PAN1x55
DCE
Host
RXD
DTE
RTS
CTS
Figure 7.1 UART Signal Connections
CTS
TXD
0 us
16 bytes max
RTS
RXD
0 uS
2 bytes max
Figure 7.2 UART Timing Diagram
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PRODUCT SPECIFICATION
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3-WIRE SERIAL INTERFACE
When using only GND and UART_Rx, UART_Tx serial lines, you may leave UART_RTS#
and UART_CTS# open.
Note: Not using flow control can result in loss of data.
USB INTERFACE 1,2
7.6.
7.6.1.
USB_DP, USB_DN
PAN1455/1555 contain a full speed USB version 2.0 compliant interface capable of directly
driving an USB cable. The PAN1455/1555 operates as a USB peripheral and responds to
requests from a USB master host controller.
7.7.
GPIO INTERFACE
It is possible to use the programmable digital I/Os GPIO[0:17]. The Current from GPIO[17] is
limited to 3mA max.
For 5V tolerant GPIO´s refer to chapter 6.2.1SPP configuration DCE Mode
ADC 3
7.8.
It is possible to use the programmable I/Os PIO[0:3,6,7,13:15] as ADC.
The 12-bit ADC is a successive approximation analogue-to-digital converter. A/D conversion
can be performed in single, continuous, scan or discontinuous mode.
DAC 4
7.9.
It is possible to use the programmable I/Os PIO[2,3] as ADAC
The DAC module is a 12-bit, voltage output digital-to-analogue converter. The DAC can be
configured in 8- or 12-bit mode and may be used in conjunction with the DMA controller.
7.10.
PCM INTERFACE 5
PCM or Pulse Code Modulation is a sampling technique for digitising analogue signals.
The PCM interface for voice applications is provided via the PCM_OUT, PCM_IN, PCM_CLK
and PCM_SYNC pins.
The PCM interface can act as master or as slave device.
In master mode, clock frequencies of 128kHz, 256kHz or 512kHz can be generated, when
using the internal 4MHz clock. In slave mode, clock frequencies up to 2048kHz are accepted.
The Frame Clock is 8kHz. Long and Short Frame Sync are supported.
PAN1455/1555 interface directly to PCM audio devices including the following:
1
subject to firmware support, contact Stollmann for current status.
2
subject to hardware support, contact Stollmann for availability of variants
3
subject to firmware support, contact Stollmann for current status
4
subject to firmware support, contact Stollmann for current status
5
subject to firmware support, contact Stollmann for current status
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•
•
•
•
•
PRODUCT SPECIFICATION
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Qualcom MSM3000 series and MSM5000 series CDMA base band devices
OKI MSM7705 four channel A-law and µ-law codec
WINBOND W681310 8-bit A-law and µ-law codec
WINBOND W681360 13-bit linear codec
STW 5093 5094 14-bit linear codec
8. KEY PARTS LIST
Liste der Schlüsselkomponenten
Part Name
Teilenummer
Material
Material
P.W.Board
Glass cloth epoxide resin with gold plating
BT-IC part name
BC63B239A04Q (Cambridge Silicon Radio Ltd www.csr.com)
You have to register, before you can download the data sheet.
µ-Controller
ST32F103xxxx (Cortex baseed STMiroelectronics www.stm.com)
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9. TEST CONDITIONS
Meßbedingungen
Measurements shall be made under room temperature and humidity unless otherwise specified.
Messungen unter normalen Bedingungen, Abweichungen sind gesondert notiert.
Temperature
Temperatur
25 ± 10°C
25 ± 10°C
Humidity
Luftfeuchtigkeit
40 to 85%RH
40 to 85%RH
10. ABSOLUTE MAXIMUM RATINGS (1)
Absolute Grenzwerte
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the module will result.
No.
Item
Punkt
Supply voltage
Versorgungsspannung
Voltage on any pin
Spannung an jedem Pin
Storage temperature range
Lagertemperatur
Operating temperature range
Betriebstemperatur
Lead temperature
Löttemperatur
ESD on any pin
ESD Festigkeit
1
2
3
4
6
7
Symbol
Zeichen
Absolute Maximum Ratings
Absolute Grenzwerte
Unit
Einheit
Vcc
-0.4 to +3.7
V
VPin
GND -0.3 to Vcc+0.40
V
Tstg
-40 to +105
°C
Top
-40 to +85
°C
TDeath
See chapter 17.2
°C
VESD
max 2000 V
(CLoad=150pF, RLoad=330Ω)
V
Notes:
(1) ABSOLUTE MAXIMUM RATINGS indicate limits beyond which damage to the device may occur.
11. ELECTRICAL REQUIREMENTS
Vcc = 3.3V, Tamb = 25°C if nothing else stated
No
Item
Condition
Limit / Grenzen
Nr.
Punkt
Bedingung
Min
1
2
3
4
5
Frequency Range
Frequenzbereich
Load impedance
Ausgangsimpedanz
Output return loss
Ausgangsanpassung
Supply voltage
Versorgungsspg.
Ripple on Vcc
AC Anteil auf Vcc
Typ
2400
Measured with network analyzer in the
frequency range at antenna pin
Receive Mode to 50Ω load
Transmit Mode to 50Ω load
The typical voltage is recommended Vcc
at voltage pin
Ripple frequency ≥200kHz
Ripple frequency 10
≥-20
dBm
-20,0
>10
≥-20
dBm
-20,0
>0
≥-20
dBm
-20,0
>0
≥-20
dBm
6
11
≤ 11
dB
Adjacent channel selectivity C/I f = f0 + 1MHz
a)
-5
0
≤0
dB
Adjacent channel selectivity C/I f = f0 - 1MHz
a)
-5
0
≤0
dB
Adjacent channel selectivity C/I f ≥ f0 + 2MHz
a)
-38
-30
≤ -30
dB
Adjacent channel selectivity C/I f ≤ f0 - 2MHz
a)
-22
-20
≤ -20
dB
Adjacent channel selectivity C/I f ≥ f0 + 3MHz
a)
-42
-40
≤ -40
dB
Adjacent channel selectivity C/I f ≤ f0 - 5MHz
a)
-45
-40
≤ -40
dB
-15
-9
≤ -9
dB
Adjacent channel selectivity C/I f = fimage
a)
Notes: a) For BER less then 0,1%. Applies according to BT Test Specification Ver. 1.2/2.0/2.0
+ EDR only for Tamb = 20°C
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Vcc = 3.3V, Tamb = +25°C
Transmitter
RF transmit power
50 Ω load with GFSK
Modulation and default
b)
settings
RF transmit power
50 Ω load with EDR, PI/4
DQPSK Modulation and
b
default settings
RF transmit power
50 Ω load with EDR, 8DPSK
Modulation and default
b
settings
Frequency [GHz]
Limit
Unit
BT
Min
Typ
2.402
2,0
3,9
2.441
2,0
3,2
2.480
2,0
3,0
2.402 GFSK
2,7
2.402 DPSK
1,6
2.441 GFSK
2,7
2.441 DPSK
1,6
2.480 GFSK
2,2
2.480 DPSK
1,0
2.402 GFSK
2,6
2.402 DPSK
1,6
2.441 GFSK
2,7
2.441 DPSK
1,6
2.480 GFSK
2,2
2.480 DPSK
1,0
Max
Spec
dBm
dBm
dBm
RF power control range
-21
-
4,0
dB
RF power range control resolution
3,2
3,9
4,6
2 to 8
dB
20 dB bandwidth for modulated carrier
920
924
1000
≤1000
kHz
Initial carrier frequency tolerance
-75
-10
75
≤ ±75
kHz
Carrier frequency drift (packet DH1)
-25
11
25
≤ ±25
kHz
Drift Rate
-20
0
20
20
kHz/ 50µs
Δf1avg “Maximum Modulation”
140
166
175
≥140 to
≤175
kHz
Δf2avg “Minimum Modulation”
115
155
-
≥ 115
kHz
Notes: b) excluding antenna gain
16. MECHANICAL REQUIREMENTS
Mechanische Anforderungen
No.
Item
Punkt
1
Solderability
Lötfähigkeit
2
Resistance to soldering
heat
Limit
Grenzwerte
More than 75% of the soldering area shall be
coated by solder
Mehr als 75% der Lötfläche soll mit Lötpaste
bedeckt sein.
It shall be satisfied electrical requirements and not
be mechanical damage
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Reflow soldering with
recommendable temperature profile
See chapter 17.2
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17. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
Temperatur-Zeit Profil für die Reflowlötung
17.1.
FOR LEAD SOLDER
10 ±1s
Recommended temp. profile
for reflow soldering
30 +20/-10s
235°C max.
Temp.[°C]
220 ±5°C
200°C
150 ±10°C
90 ±30s
Time [s]
17.2.
FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
30 +20/-10s
230°C -250°C max.
220°C
150°C – 190°C
90 ±30s
Time [s]
Reflow permissible cycle:
2
Opposite side reflow is prohibited due to module weight.
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18. MODULE DIMENSION
Modulabmessungen
+0,10
18,75
18,00
+0,00
-0,10
+0,10
-0,10
+0,10
2,70 -0,10
0,80 -0,10
+0,10
-0,10
12,60
13,50
+0,00
-0,10
Figure 18.1 PAN1455 dimensions
+0,20
5,90 -0,10
+0,20
0,90 -0,10
+0,10
+0,10
2,80 -0,20
+0,00
-0,10
+0,10
18,00 -0,10
0,80 -0,10
+0,10
2,70 -0,10
22,75
12,60
+0,20
+0,10
-0,10
13,50
+0,00
-0,10
+0,20
5,90 -0,20 0,90 -0,20
+0,20
0,60 -0,20
+0,20
2,60 -0,20
Figure 18.2 PAN1555 dimensions
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0,65
19. RECOMMENDED FOOT PATTERN
Empfohlenes Land Pattern
18,75
1,75
2
3
5
4
6
7
8
9
10
11
Fi nger Rnd 1.0x0.8
33
12
32
13
B
31
15
4,75
30
14
29
A
13,5
1,25
1
1,75
1
34
B
16
Round 0.8
C
28
1,25
27
D
26
17
25
24
6,025
23
22
21
20
19
18
0,65
Figure 19.1 PAN1455 Recommended Land pattern
(Top-View not scaled)
Dimensions in mm.
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0, 65
CLASSIFICATION
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PAN1455/1555
22,75
18, 75
1, 75
3
5
4
7
8
9
10
11
Fi nger Rnd 1.0x0. 8
33
12
32
13
B
31
14
15
4, 75
30
ANT
6
29
A
13,5
1, 25
1
2
1, 75
1
34
B
16
Round 0.8
C
28
1,25
27
D
26
17
25
24
23
22
21
6, 025
20
19
18
0, 65
Figure 19.2 PAN1555 Recommended Land pattern
(Top-View not scaled)
Dimensions in mm.
If you have no experience about the land pattern, this figure can guide you, but this information is
given without any legal responsibility.
We recommend the same dimension for the solder paste screen.
The solder screen thickness depends on your production standard, we recommend 120µm to
150µm.
IMPORTANT:
Please be careful with the area under the module to avoid short cuts.
The bottom side from the PAN1455/1555 is fully coated, also the vias!
If you have any questions on this point, we are open to discuss your individual situation.
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20. LABELLING DRAWING
Kennzeichnung des Modules durch Label
The information on the Module are marked by laser.
Information in the 2D-Barcode are in the format
•
BT-address [12 signs, here 123456789ABC].
•
Ordering number [12 signs, please refer also to chapter 24];
•
The identifier for the software release (2 signs, here yy);
•
Datecode: Year-Week-Day-Lotnumber [7 signs, here YYWWDLL].
All items are separated by a semicolon.
As a summary:
Japan Radio Marking
Japan TTE Marking
FCC ID: T7V-BC06 FCC Certification Marking
zz
Identifier for the hardware version
yy
Identifier for the software version
123456789ABC
BT-Address
YYWWDLL
Datecode – Year-Week-Day-Lotnumber
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21. SOFTWARE
Software
Standard platforms of PAN1455/1555 are avaialble with several popular Bluetooth profiles, many
other profiles are availalble on request. Before starting production, be certain to carefully review
that the software meets your requirements.
21.1.
SPP SOFTWARE
Serial Port Profile
Customized variants are available on request.
Please refer to Reference [1] .
21.2.
HDP SOFTWARE
The Health Device Profile
Please refer to Reference [1] .
21.3.
HID SOFTWARE
The Human Inteface Device Software
Please refer to Reference [1] .
21.4.
HDP/SPP SOFTWARE
The combined HDP and SPP Profile enables customers to use both versions (SPP/HDP) in
parallel.
Please refer to Reference [1] .
21.5. OTHER PROFILES ARE AVAILABLE ON REQUEST.
22. CAUTIONS
Warnungen
Failure to do so may result in degrading of the product’s functions and damage to the product.
22.1.
DESIGN NOTES
Designhinweise
(1) Please follow the condition written in this specification, especially the control
signals of this module.
(2) The supply voltage has to be free of ac ripple voltage, as for example from a
battery or a low noise regulator output. For noisy supply voltages provide a
decoupling circuit as for example a ferrite in series connection and a blocking
capacitor to ground of at least 47uF directly at the module.
(3) This product should not be stressed when installed.
(4) Heat is the major cause of shortening the life of these products. Please keep this
product away from heat.
Avoid assembly and use of the target equipment in conditions where the products'
temperature may exceed the maximum allowable.
(5) The supply voltage should not be exceeding or reverse, and should not carry noise
and spike.
(6) Please keep this product away from other high frequency circuits.
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22.2.
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
Reflow soldering is possible for twice on the condition in chapter 15.
Please set up the temperature at the soldering portion of this product according to
this reflow profile.
Carefully position the products so that their heat will not burn into printed circuit
boards or affect the other components that are susceptible to heat.
Carefully locate these products so that their temperatures will not increase due to
the effects of heat generated by neighboring components.
If a vinyl-covered wire comes into contact with the products, then the cover will
melt and generate toxic gas, damaging the insulation. Never allow contact between
the cover and these products to occur.
This product should not be stressed or vibrated when reflowed.
Keep the following conditions when you install this product for reparation by hand
soldering.
Do not wash this product.
Refer to the recommended pattern when designing a board.
Pressing on parts of the metal cover or fastening objects to the metal cover is not
allowed.
USAGE CONDITIONS NOTES
Benutzerhinweise
(1)
(2)
(3)
(4)
(5)
(6)
(7)
22.4.
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INSTALLATION NOTES
Verarbeitungshinweise
(1)
22.3.
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
Take measure against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied
to the products, then before use, check and evaluate their operation when
assembled on your products.
Do not use the fallen product.
Do not put on damage and dirt to the pin , and don't touch the electric components.
Be certain to follow the condition written in the ratings , about the power supply
instruments applied to this product.
Electrode peeling strength: Do not add pressure of more than 4.9N when soldered
on PCB
Pressing on parts of the metal cover or fastening objects to the metal cover is not
allowed.
These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment, information and
communication equipment.
STORAGE NOTES
Lagerhinweise
(1)
(2)
The module may not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected:
• Storage in salty air or in an environment with a high concentration of corrosive
gas, such as Cl2, H2S, NH3, SO2, or NOX
• Storage in direct sunlight
• Storage in an environment where the temperature may be outside the range of
5°C to 35°C range, or where the humidity may be outside the 45 to 85% range.
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•
(3)
(4)
(5)
(6)
22.5.
Storage of the products for more than one year after the date of delivery at your
company if the avoidance all the above conditions (1) to (3) have been met.
Storage period: Please check the adhesive strength of the embossed tape and
soldering after 6 months of storage.
Please keep this product away from water, poisonous gas and corrosive gas.
This product should not be stressed or shocked when transported.
Please follow the specification when piling up the packed crate ( max. 10).
SAFETY CAUTIONS
Sicherheitshinweise
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications, without deviation when using the products. These products may shortcircuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated
when a short circuit occurs, then at least, provide the following failsafe functions, as a
minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
22.6.
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
27 of 34
DATE
27.06.2011
Datum
OTHER CAUTIONS
Weitere Hinweise
(1)
(2)
(3)
(4)
(5)
(6)
(7)
This specification sheet is copyrighted. Please do not open it to the third party.
Do not use this product of our company for another purpose.
Be sure to provide an appropriate fail-safe function on your product to prevent a
second damage that may be caused by the abnormal function or the failure of our
product.
This product has not been manufactured with any ozone chemical controlled under
the Montreal Protocol.
These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special
conditions, check their performance and reliability under the said special conditions
carefully to determine whether or not they can be used in such a manner.
• In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
where liquid may splash.
• In direct sunlight, outdoors, or in a dusty environment
• In an environment where condensation occurs.
• In an environment with a high concentration of harmful gas (e.g. salty air, HCl,
Cl2, SO2, H2S, NH3, and NOX)
If an abnormal voltage is applied due to a problem occurring in other components
or circuits, replace these products with new products because they may not be
able to provide normal performance even if their electronic characteristics and
appearances appear satisfactory.
When you have any question or uncertainty , both of you and Panasonic sincerely
cope with it.
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
28 of 34
DATE
27.06.2011
Datum
23. PACKAGING
Verpackung
23.1.
EMBOSSED TAPE / BLISTERGURT
(1)
Dimension of the tape PAN1555 / Abmessungen des Gurtes (EIAJ-tbd)
(2)
Dimension of the tape PAN1455 / Abmessungen des Gurtes (EIAJ-tbd)
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
(3)
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
29 of 34
DATE
27.06.2011
Datum
ENW89815CxKF/ENW89815AxKF
Cover tape reel strength / Abzugskräfte Blistergurt Deckfolie
Force direction
θ= 10deg
Speed = 300mm/min.
Cover tape reel strength
=0.098～0.68N (10～70g)
(4)
Empty hollow / leere Taschen
Direction of feed
Vorschubrichtung
Empty hollow more
than 10 pitch
Mehr als 10 leere
Taschen
Empty hollow more
Component
packed area than 10pitch
Modulbereich Mehr als 10 leere
Taschen
Top cover tape
more than 200mm
Deckfolie groesser
200mm
als
Empty hollow in component packed area shall be less than two per reel and those hollows shall not
be consecutive.
Es dürfen minimal 2 leere Taschen im Bereich der Komponenten vorhanden sein, diese dürfen
aber nicht aufeinander folgen.
23.2.
COMPONENT DIRECTION
Komponentenanordnung
Top cover tape shall not be found on reel holes and shall not stick out from reel.
Deckfolien darf nicht durch die Löcher der Spule und nicht außerhalb der Spule geführt werden.
Tape running direction
Laufrichtung des Bandes
(top view)
18
Part No.
27
1
10
Component direction
Komponentenrichtung
(See also chapter 21)
Figure 1
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
23.3.
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
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Seite
30 of 34
DATE
27.06.2011
Datum
REEL DIMENSION
Abmaße der Rolle
(1)
(2)
23.4.
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
Quantity per reel : 500 pieces
Anzahl pro Rolle : 500 Stück
Marking : Customer’s part No. / Quantity / Lot No. and Our part# with bar-code
shall be on the reel.
Kennzeichnung : Kundennummer / Anzahl / Losnummer und unsere
Komponentennummer als Barcode wird auf die Rolle gedruckt
Refer to figure 2
Bezugnehmend zur Zeichnung 2
PACKAGE
Umverpackung
(1)
(2)
Package box :
Paketbox.:
Marking :
φ 13 +/-1
2 +/-0.5
φ 80 +/-2
φ 13 +/-0.5
Kennzeichnung :
1 or 2 reel (depends on quantity)
1 oder 2 Rollen (abhängig von der Liefermenge)
Customer’s part No. / Quantity / Lot No. and Our part# with
bar-code shall be on the package box.
Kundennummer / Anzahl / Losnummer und unsere
Komponentennummer als Barcode wird auf die
Verpackung gedruckt
Refer to figure 2 and 3
Bezugnehmend zur Zeichnung 2 und 3
Marking
Figure 3
Marking
?
φ 330
Figure 2
33.5 +/-1.0
2.0 +/-0.2
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
31 of 34
DATE
27.06.2011
Datum
24. ORDERING INFORMATION
Bestellinformationen
Ordering part number
ENW89815C3KF
ENW89815A3KF
ENW89815A4KF
ENW89815A5KF
ENW89815C4KF
ENW89815C5KF
Description
PAN1455 BT 3.0
256kByte Flash Memory, without Antenna
(1)
Software: SPP
PAN1555 BT 3.0
256kByte Flash Memory, with Antenna
(1)
Software: SPP
PAN1555 BT 3.0
256kByte Flash Memory, with Antenna
(1)
Software: HDP
PAN1555 BT 3.0
256kByte Flash Memory, with Antenna
(1)
Software: SPP/HDP
PAN1455 BT 3.0
256kByte Flash Memory, without Antenna
(1)
Software: HDP
PAN1455 BT3.0
256kByte Flash Memory, without Antenna
(1)
Software: SPP/HDP
Notes:
(1) This software is licensed by the company Stollmann please refer to [1] .
25. ROHS DECLARATION
RoHS-Erklärung
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on declaration of our suppliers that this
product do not contain by now the following substances which are banned by Directive 2002/95/EC
(RoHS) or if contain a maximum concentration of 0,1% by weight in homogeneous materials for
•
•
•
•
•
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0,01% by weight in homogeneous materials for
•
Cadmium and cadmium compounds
26. DATA SHEET STATUS
Datenblatt Status
This data sheet contains the final specification (RELEASE).
Panasonic reserves the right to make changes at any time without notice in order to improve
design and supply the best possible product.
Supplementary data will be published at a later date.
Please consult the most recently issued data sheet before initiating or completing a design.
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
32 of 34
DATE
27.06.2011
Datum
27. REGULATORY INFORMATION
27.1.
FCC NOTICE
The device PAN1555, including the ceramic antenna and also the SMD type PAN1455,
including with the antennas, which are listed in 27.5, complies with Part 15 of the FCC Rules.
The device meets the requirements for modular transmitter approval as detailed in FCC
public Notice DA00-1407.transmitter
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.
27.2.
CAUTION
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by Panasonic Electronic Devices Europe GmbH may
void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help
27.3.
LABELING REQUIREMENTS
The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements
are met. This includes a clearly visible label on the outside of the OEM enclosure specifying
the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above.
The FCC identifier are FCC ID: T7V-BC06. This FCC identifier is valid for all versions, for
details, please see the chapter 24. Ordering Information.
In any case end product must be labelled exterior with "Contains FCC ID: T7V-BC06"
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
27.4.
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
33 of 34
DATE
27.06.2011
Datum
ANTENNA WARNING
The related part number for this device is PAN1455 with SMD pad). For details, please see
the chapter 24. Ordering Information. This device are tested with a standard SMA connector
and with the antennas listed below. When integrated in the OEMs product, these fixed
antennas require installation preventing end-users from replacing them with non-approved
antennas. Any antenna exceeding 2dBi not in the following table must be tested to comply
with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions.
The FCC identifier for this device with the antenna listed in item 1 are the same (FCC ID:
T7V-BC06).
27.5.
APPROVED ANTENNA LIST
Note: We are able to qualify your antenna and will add to this list as that process is completed.
27.6.
Item
Part Number
Manufacturer
Frequency Band
Type
Gain (dBi)
1
WIMO17010.10
Wimo
2.4GHz
ROD
+2
2
2450AT42B100
Johanson
2.4GHz
SMD
-1.5
RF EXPOSURE PAN1455/PAN1555
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM)
must ensure that the approved antenna in the previous table must be installed.
The preceding statement must be included as a CAUTION statement in manuals for products
operating with the approved antennas in the previous table to alert users on FCC RF
Exposure compliance.
Any notification to the end user of installation or removal instructions about the integrated
radio module is not allowed.
The radiated output power of PAN1455 with mounted ceramic antenna
(FCC ID: T7V-BC06) is far below the FCC radio frequency exposure limits. Nevertheless, the
PAN1455 shall be used in such a manner that the potential for human contact during normal
operation is minimized.
End users may not be provided with the module installation instructions. OEM integrators and
end users must be provided with transmitter operating conditions for satisfying RF exposure
compliance.
27.7.
INDUSTRY CANADA CERTIFICATION
PAN1455/PAN1555 comply with the regulatory requirements of Industry canada (IC), license:
IC: 216Q-BC06
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits.
Users can obtain Canadian information on RF exposure and compliance from
www.ic.gc.ca
This device has been designed to operate with the antenna listed in section 27.5 above,
having a maximum gain of 2.0 dBi. Antennas not included in this list or having a gain greater
than 2.0 dBi are strictly prohibited for use with this device. The required antenna impedance
is 50 ohms. The antenna used for this transmitter must not be colocated or operating in
conjunction with any other antenna or transmitter.
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
www.pedeu.pansonic.de
CLASSIFICATION
Einstufung
SUBJECT
Thema
CUSTOMER’S CODE
PAN1455/1555
PRODUCT SPECIFICATION
Produktspezifikation
CLASS 2 BLUETOOTH MODULE
Bluetooth Modul der Klasse 2
PANASONIC’S CODE
ENW89815CxKF/ENW89815AxKF
No.
REV.
DS-1x55-2400-102
1.10
PAGE
Seite
34 of 34
DATE
27.06.2011
Datum
28. RELATED DOCUMENTS
Mitgeltende Dokumente
[1] Stollmann Firmware updates/support:
http://www.stollmann.de/de/support/downloads/bluetooth-adapter/bluemod-p2xg2.html
29. GENERAL INFORMATION
Allgemeine Informationen
© Panasonic Electronic Devices Europe GmbH 2009.
All rights reserved.
This product description does not lodge the claim to be complete and free of mistakes.
Please contact the related product manager in every case.
If we deliver ES samples to the customer, these samples have the status Engineering Samples.
This means, the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular,
Panasonic disclaims liability for damages caused by
• the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in an other product to be sold by Customer,
• deviation or lapse in function of Engineering Sample,
• improper use of Engineering Samples.
Panasonic disclaimes any liability for consequential and incidental damages.
In case of any questions, please contact your local sales partner or the related product
manager.
30. LIFE SUPPORT POLICY
Politik für Lebenserhaltungssysteme
This Panasonic product is not designed for use in life support appliances, devices, or systems
where malfunction can reasonably be expected to result in a significant personal injury to the
user, or as a critical component in any life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system, or to affect
its safety or effectiveness. Panasonic customers using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Panasonic for any damages
resulting.
PANASONIC ELECTRONIC DEVICES EUROPE GMBH
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