ENW89835C1KF

ENW89835C1KF

  • 厂商:

    NAIS(松下)

  • 封装:

  • 描述:

    Bluetooth Class II 3.3V 1Mbps T/R

  • 数据手册
  • 价格&库存
ENW89835C1KF 数据手册
PAN1720/1721 Bluetooth® Low Energy Module Product Specification Rev. 2.4 Wireless Modules  PAN1720/1721 Bluetooth Module Overview The PAN1720/1721 is a Low Energy (LE) module with Texas Instruments CC2540/CC2541 Single Chip Bluetooth LE solution inside. Characteristics • Bluetooth 4.0 • Output power 4 dBm to -24 dBm • High sensitivity (-94 dBm typ.) • Link budget 96 dB • Operating temperature range -40 °C to +85 °C PAN1720 VS PAN1721 The PAN171x are the non antenna version where the PAN172x are the versions with antenna. Features • Surface mount type 15.6 mm x 8.7 mm x 1.8 mm • PAN1720: Up to 4.0 dBm Tx power (typical) with transmit power control • • • • • • • • • • • • • PAN1721: CC2541 has typically 0 dBm Tx power Texas Instrument’s CC2540/CC2541 Single Chip Bluetooth LE solution inside High performance low power 8051 Microcontroller core No external components needed Fast Connection Setup Internal crystal oscillator (32 MHz) Internal 32 kHz crystal oscillator for Sleep Timer Two powerful USARTs UART, USB or I2C interface Powerful five channel DMA Latest Profiles included e.g. battery monitor and temperature sensor Integrated shielding to resist EMI Manufactured in conformance with RoHS Block Diagram Vcc 3.3 V PAN171x Bluetooth 4.0 Module Bluetooth LE Crystal 32.768 kHz UART/SPI USB or I2C Crystal 32 MHz GPIOs ADC/PWM/Timer TI CC254x Reset LPF RF-PAD Product Specification Rev. 2.4 Page 2  PAN1720/1721 Bluetooth Module Vcc 3.3 V PAN172x Bluetooth 4.0 Module Bluetooth LE Crystal 32.768 kHz UART/SPI USB or I2C Crystal 32 MHz Chip Antenna GPIOs ADC/PWM/Timer TI CC254x Reset LPF Product Specification Rev. 2.4 Page 3  PAN1720/1721 Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2019. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:  The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer,  Deviation or lapse in function of the Engineering Sample,  Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 2.4 Page 4  PAN1720/1721 Bluetooth Module Table of Contents 1 2 3 4 5 6 7 About This Document......................................................................................................................... 6 1.1 Purpose and Audience .............................................................................................................. 6 1.2 Revision History ......................................................................................................................... 6 1.3 Use of Symbols ......................................................................................................................... 7 1.4 Related Documents ................................................................................................................... 7 Overview .............................................................................................................................................. 8 2.1 Difference between PAN1720/1721 .......................................................................................... 8 2.2 Block Diagram ......................................................................................................................... 10 2.3 Pin Configuration ..................................................................................................................... 11 2.4 UART Interface ........................................................................................................................ 13 2.5 Bluetooth Features .................................................................................................................. 13 Detailed Description ......................................................................................................................... 14 3.1 Dimensions .............................................................................................................................. 14 3.2 Footprint .................................................................................................................................. 16 3.3 Packaging ................................................................................................................................ 17 3.4 Case Marking .......................................................................................................................... 21 Specification ..................................................................................................................................... 22 4.1 Default Test Conditions ........................................................................................................... 22 4.2 Absolute Maximum Ratings ..................................................................................................... 22 4.3 Recommended Operating Conditions ...................................................................................... 23 4.4 Current Consumption............................................................................................................... 23 4.5 Bluetooth ................................................................................................................................. 24 4.6 Reliability Tests ....................................................................................................................... 25 4.7 Recommended Soldering Profile ............................................................................................. 26 Cautions ............................................................................................................................................ 27 5.1 Design Notes ........................................................................................................................... 27 5.2 Installation Notes ..................................................................................................................... 27 5.3 Usage Condition Notes ............................................................................................................ 28 5.4 Storage Notes .......................................................................................................................... 28 5.5 Safety Cautions ....................................................................................................................... 28 5.6 Other Cautions ........................................................................................................................ 29 5.7 Restricted Use ......................................................................................................................... 30 Regulatory and Certification Information ....................................................................................... 31 6.1 Federal Communications Commission (FCC) for US .............................................................. 31 6.2 Innovation, Science, and Economic Development (ISED) for Canada .................................... 33 6.3 European Conformity According to RED (2014/53/EU) ........................................................... 36 6.4 Bluetooth ................................................................................................................................. 37 6.5 RoHS and REACH Declaration ............................................................................................... 37 Appendix ........................................................................................................................................... 38 7.1 Ordering Information ................................................................................................................ 38 7.2 Contact Details ........................................................................................................................ 39 Product Specification Rev. 2.4 Page 5  PAN1720/1721 Bluetooth Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1720 and PAN1721 module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the PAN172x” or “the module” within this document. 1.2 Revision History Revision Date Modifications/Remarks 1.0 2012-04-01 Released version 1.1 2012-07-01 Added chapter “Information regarding Software Versions”. Link to LGA app note. UART pinning for BR-SW version. I2C pinning for PAN1721 version. FCC, IC, IDs. Corrected FCC ID to T7VPAN17. 1.2 2012-08-01 Change IC text in chapter “IC Notice”. New format for chapter “Related Documents”. 1.3 2012-11-01 Added remarks to PAN1721 version. Added non antenna version part number to “Ordering Information”. 1.4 2012-12-01 Added PAN1711 ES information 1.5 2013-01-01 Added dimensions and pinout for the non-antenna versions PAN171x. Minor changes in chapter “RF Exposure”. Added chapter “European R&TTE Declaration of Conformity” Bluetooth Certificiation. 1.6 2013-05-01 Changed Block Diagram 1.7 2013-08-01 Included cross-reference for GPIOs to BlueRadios Pinout 1.8 2013-12-01 Removed QDID from front page. QDID is described in chapter “Bluetooth Certification”. 1.9 2014-11-01 Added radiation pattern for Antenna. Added DoC. 2.0 2015-04-01 Updated REACH RoHS 2.1 2015-07-01 Correction of PAN1721 description 2.2 2017-06-01 Correction of general description 2.3 2018-08-10 Update layout and structure changes 2.4 2019-05-06 Added Yageo antenna to the approved antenna list. Small formatting update. Updated chapter “European Conformity According to RED (2014/53/EU)”. Product Specification Rev. 2.4 Page 6  PAN1720/1721 Bluetooth Module 1 About This Document 1.3 Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk.  [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document  1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents  7.2.2 Product Information. Product Specification Rev. 2.4 Page 7  PAN1720/1721 Bluetooth Module 2 Overview 2 Overview The PAN172x is a short-range, Class 2, Bluetooth LE single mode module for implementing Bluetooth functionality into various electronic devices. The PAN172x is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth LE applications. It enables robust Bluetooth LE master or slave nodes to be built with very low total bill-of-material costs. The PAN172x combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The PAN172x is suitable for systems where very low power consumption is required. Very low power sleep modes are available. Short transition times between operating modes further enable low power consumption. Panasonic offers Bluetooth low energy protocol stacks and applications from Texas Instruments and BlueRadios. The Bluetooth low energy protocol stack from Texas Instruments, is a flexible and cost-effective single-mode Bluetooth low energy solution. The BlueRadios stack enables rapid and low cost development using an AT command set without the need for a complier. Additional advantages include UART programming, over-the-air-updates, easy integration “C” library framework, serial streaming of data, and smartphone libraries and applications. Please refer to the Panasonic website for related documents  7.2.2 Product Information. Further information on the variants and versions  7.1 Ordering Information. 2.1 Difference between PAN1720/1721 The PAN1721 is pin-compatible with the PAN1720, with the exception that USB is the hardware communication interface on the PAN1720 and I2C is the hardware communication interface on the PAN1721. Compared to the PAN1720, the PAN1721 provides lower RF current consumption. The PAN1721 does not have the USB interface found on the PAN1720, and provides lower maximum output power in TX mode. Both ICs the CC2540 as well as the CC2541 come with an internal 256 KB flash memory. Brand Name Description PAN1720 CLASS 2 Bluetooth single mode Module according Bluetooth 4.0 PAN1720 Same as above including BlueRadios BR-SPP FW version. PAN1721 CLASS 2 Bluetooth single mode Module according Bluetooth 4.0 PAN1721 Same as above including BlueRadios BR-SPP FW version. Product Specification Rev. 2.4 Bluetooth smart device Page 8  PAN1720/1721 Bluetooth Module 2 Overview Brand Name Description PAN1711 CLASS 2 Bluetooth single mode Module according Bluetooth 4.0 PAN1711 Same as above without antenna including BlueRadios Bluetooth smart device without antenna BR-SPP FW version. Product Specification Rev. 2.4 Page 9  PAN1720/1721 Bluetooth Module 2 Overview 2.2 Block Diagram Vcc 3.3 V PAN171x Bluetooth 4.0 Module Bluetooth LE Crystal 32.768 kHz UART/SPI USB or I2C Crystal 32 MHz GPIOs ADC/PWM/Timer TI CC254x Reset LPF RF-PAD Vcc 3.3 V PAN172x Bluetooth 4.0 Module Bluetooth LE Crystal 32.768 kHz UART/SPI USB or I2C Crystal 32 MHz Chip Antenna GPIOs ADC/PWM/Timer TI CC254x Reset LPF Product Specification Rev. 2.4 Page 10  PAN1720/1721 Bluetooth Module 2 Overview 2.3 Pin Configuration Pin Assignment Top View 15.6 mm 5.0 1.2 2.4 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F11 F12 A11 A12 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 Pin Functions No Pin Name Pin Type Description A1 GND Ground Pin Connect to ground A2 P1.0 Digital I/O Port 1.0 – 20 mA drive capability A3 RESET Digital Input Reset, active low A4 VCC Power Analog/digital power supply connection A5 VCC Power Analog/digital power supply connection A6 VCC Power Analog/digital power supply connection A7 GND Ground Pin Connect to ground A8 NC A9 GND Ground Pin Connect to ground A11 GND Ground Pin Connect to ground A12 GND Ground Pin Connect to ground B1 P1.3 Digital I/O Port 1.3 B2 P1.2 Digital I/O Port 1.2 Product Specification Rev. 2.4 Not connected Page 11  PAN1720/1721 Bluetooth Module 2 Overview No Pin Name Pin Type Description B3 P1.1 Digital I/O Port 1.1 – 20 mA drive capability B4 P0.6 Digital I/O Port 0.6 B5 NC B6 P0.1 Digital I/O Port 0.1 B7 P0.0 Digital I/O Port 0.0 B8 NC Not connected B9 NC Not connected, C1 NC Not connected, C2 P1.4 Digital I/O Port 1.4/BR-SW UART CTS C3 P1.5 Digital I/O Port 1.5/BR-SW UART RTS C4 P0.7 Digital I/O Port 0.7 C5 NC Not connected C6 NC Not connected C7 NC Not connected C8 GND Ground Pin Connect to ground C9 GND Ground Pin Connect to Ground D1 DVDD_USB Power (digital) 2 V-3.6 V digital power supply connection D2 USB_N Digital I/O USB N/PAN17x1 I2C SDA Leave floating if not used. D3 USB_P Digital I/O USB P/PAN17x1 I2C SCL Leave floating if not used D4 NC Not connected D5 NC Not connected D6 NC Not connected D7 GND Ground Pin Connect to ground D8 GND Ground Pin Connect to ground D9 NC/RF E1 P2.1/DD Digital I/O Port 2.1/Programming Interface DD E2 P2.2/DC Digital I/O Port 2.2/Programming Interface DC E3 DGND_USB Ground Pin Connect to Ground E4 NC Not connected E5 NC Not connected E6 P0.2/RX/MISO Product Specification Rev. 2.4 Not connected PAN172x not Connected/50 Ω RF_Out PAN171x Digital I/O Port 0.2/TI-SW UART RX/SPI MISO Page 12  PAN1720/1721 Bluetooth Module 2 Overview 2.4 No Pin Name Pin Type Description E7 NC E8 GND Ground Pin Connect to ground E9 GND Ground Pin Connect to ground F1 GND Ground Pin Connect to ground F2 P1.6 Digital I/O Port 1.6/BR-SW UART TX F3 P1.7 Digital I/O Port 1.7/BR-SW UART RX F4 P2.0 Digital I/O Port 2.0 F5 P0.4/CTS/CS Digital I/O Port 0.4/TI-SW UART CTS/SPI CS F6 NC F7 P0.3/TX/MOSI Digital I/O Port 0.3/TI-SW UART TX/SPI MOSI F8 P0.5/RTS/CLK Digital I/O Port 0.5/TI-SW UART RTS/SPI CLK F9 GND Ground Pin Connect to ground F11 GND Ground Pin Connect to ground F12 GND Ground Pin Connect to ground Not connected Not connected UART Interface • Full-duplex 4-wire data transfer: RX, TX, RTS, and CTS • Default baud rate: 115 200 bps • Data format: 8N1 2.5 Bluetooth Features • • • • • • Bluetooth 4.0 single mode low energy technology. Class 2 TX power w/o external PA, improving link robustness. Excellent link budget (up to 96 dB), enabling long-range applications. Accurate digital received signal-strength indicator (RSSI) Integrates the new low power profiles and services Embedded Bluetooth-Stack available Product Specification Rev. 2.4 Page 13  PAN1720/1721 Bluetooth Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. PAN172x No. Item Dimension Tolerance Remark 1 Width 8.70 ±0.20 2 Length 15.60 ±0.20 3 Height 1.80 Product Specification Rev. 2.4 ±0.20 With case Page 14  PAN1720/1721 Bluetooth Module 3 Detailed Description PAN171X No. Item Dimension Tolerance Remark 1 Width 8.70 ±0.20 2 Length 11.60 ±0.20 3 Height 1.80 Product Specification Rev. 2.4 ±0.20 With case Page 15  PAN1720/1721 Bluetooth Module 3 Detailed Description 3.2 Footprint The outer dimensions have a tolerance of 0.2 mm. PAN172x Top View 15.6 mm 5.0 1.2 2.4 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F11 F12 A11 A12 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 PAN171X Top View 11.6 mm 1.2 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 1.35 1.2 F1 8.70 mm 0.6 1.35 1.0 0.6 Product Specification Rev. 2.4 Page 16  PAN1720/1721 Bluetooth Module 3 Detailed Description 3.3 Packaging The product is a mass production status product and will be delivered in the package described below. 3.3.1 Tape Dimensions PAN172x PAN171X Product Specification Rev. 2.4 Page 17  PAN1720/1721 Bluetooth Module 3 Detailed Description 3.3.2 Packing in Tape Direction of unreeling (for customer) trailer (empty) 1 x circumference / hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. 100730-PAN1720.vsd The top cover tape shall not be found on reel holes and it shall not stick out from the reel. 3.3.3 Component Direction Product Specification Rev. 2.4 Page 18  PAN1720/1721 Bluetooth Module 3 Detailed Description 3.3.4 Reel Dimension Product Specification Rev. 2.4 Page 19  PAN1720/1721 Bluetooth Module 3 Detailed Description 3.3.5 Package Label Example 3.3.6 (1T) Lot code (1P) Customer order number, if applicable (2P) Order number (9D) Date code (Q) Quantity (HW/SW) Hardware/software version Total Package Product Specification Rev. 2.4 Page 20  PAN1720/1721 Bluetooth Module 3 Detailed Description 3.4 Case Marking Example 1 MIC ID 2 Brand name 3 Hardware/software version 4 Order number 5 FCC ID 6 Lot code 7 Engineering Sample marking, if applicable 8 Marking for Pin 1 9 2D barcode, for internal usage only Product Specification Rev. 2.4 Page 21  PAN1720/1721 Bluetooth Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature: Humidity: Supply Voltage: 4.2 25±10 °C 40-85 % RH 3.3 V Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter TSTOR Storage Temperature VESD ESD Robustness PRF RF Input Level VDIG Voltage on any Digital Pins Product Specification Rev. 2.4 Condition Min. Typ. -40 Max. Units +125 °C All pads, according to human body model (HBM), JEDEC STD 22, method A114 1 000 V According to charged device model (CDM), JEDEC STD 22, method C101 500 V +10 dBm -0.3 VDD +0.3 V Page 22  PAN1720/1721 Bluetooth Module 4 Specification 4.3 Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. 4.4 Symbol Parameter TA Ambient Operating Temperature Range VDD 3V3 Supply Voltage Condition Min. Typ. Max. -40 2 Units +85 °C 3.6 V 3.3 Current Consumption The current consumption depends on the user scenario and on the setup and timing in the power modes. Assume VDD=3 V, Tamb=25 °C, if nothing else stated. Parameter Condition Icore Power mode 1. Digital regulator on; 16 MHz Core Current Consumption RCOSC and 32 MHz crystal oscillator off; Min. Typ. Max. 235 Units μA 32.768 kHz XOSC, POR, BOD and sleep timer active; RAM and register retention. Power mode 2. Digital regulator off; 16 MHz 0.9 RCOSC and 32 MHz crystal oscillator off; 32.768 kHz XOSC, POR, and sleep timer active; RAM and register retention. Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention 0.4 Low MCU activity: 32 MHz XOSC running. 6.7 mA No radio or peripherals. No flash access, no RAM access. Iperi Timer 1. Timer running, 32 MHz XOSC used 90 μA Peripheral Current Consumption (Add to core current Icore for Timer 2. Timer running, 32 MHz XOSC used 90 μA Timer 3. Timer running, 32 MHz XOSC used 60 μA Timer 4. Timer running, 32 MHz XOSC used 70 μA Sleep timer, including 32.753 kHz RCOSC 0.6 μA Product Specification Rev. 2.4 Page 23  PAN1720/1721 Bluetooth Module 4 Specification Parameter Condition each peripheral unit activated) ADC, when converting Power mode 1 (Active) Digital regulator on, 16 MHz RCOSC and Min. Typ. Max. Units 1.2 mA 4 μs 120 μs 410 μs 160 μs 150 μs 32 MHz crystal oscillator off. Startup of 16 MHz RCOSC Power mode 2 or power mode 3 (Active) Digital regulator off, 16 MHz RCOSC and TX or RX Crystal ESR=16 Ω. Initially running on 32 MHz crystal oscillator off. Startup of regulator and 16 MHz RCOSC 16 MHz RCOSC, with 32 MHz XOSC off With 32 MHz XOSC initially on RX/TX turnaround 4.5 RF frequency range Programmable in 2 MHz steps Data rate and modulation format 1 Mbps, GFSK, 250 kHz deviation 2 402 2 480 MHz Bluetooth PAN1720 Parameter Condition Operation Frequency Range Min. Typ. Max. 2 402 2 480 Units MHz Channel Spacing Bluetooth LE 2 MHz Output Power Maximum setting, measured at single 4 dBm -24 dBm High-gain Mode -93 dBm Standard Mode -92.5 ended 50 Ω. Maximum setting, measured at single ended 50 Ω. Sensitivity Product Specification Rev. 2.4 Page 24  PAN1720/1721 Bluetooth Module 4 Specification PAN1721 Parameter Condition Min. Operation Frequency Range Typ. Max. 2 402 Units 2 480 MHz Channel Spacing Bluetooth LE 2 MHz Output Power Maximum setting, measured at single 0 dBm -24 dBm High-gain Mode -93 dBm Standard Mode -92.5 ended 50 Ω. Maximum setting, measured at single ended 50 Ω. Sensitivity PAN1720/1721 4.6 Symbol Parameter Condition Min. 1 Spurious Emissions Conducted measurement with a Typ. Max.
ENW89835C1KF 价格&库存

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