ENW89852AXKF

PAN1740A Bluetooth® Low Energy Module Product Specification Rev. 0.1 Wireless Modules  Overview The PAN1740A is an optimized version of the PAN1740, offering a reduced boot time and supporting up to eight connections. It has a fully integrated radio transceiver and baseband ® processor for Bluetooth 5.0 Low Energy (LE). It can be used as a stand-alone application processor or as a data pump in hosted systems. The device is optimized for remote control units (RCU) requiring support for voice commands and motion/gesture recognition. Its integrated Audio Unit (AU) offers easy interface for MEMS microphones over PDM, 2 external codecs over PCM/I S, and a Sample Rate Converter unit. The Bluetooth LE firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The transceiver interfaces directly to the antenna and is fully compliant with the Bluetooth 5.0 standard. The PAN1740A has dedicated hardware for the Link Layer implementation of Bluetooth LE and interface controllers for enhanced connectivity capabilities. PAN1740A Bluetooth Module Features • Pre-programmed Bluetooth/MAC address • Includes 16 MHz and 32 768 kHz crystal calibrated up to 1 ppm • • • • • • • • Single mode Bluetooth 5.0 System-on-Chip ® ® Programmable ARM Cortex -M0 CPU Autonomous Bluetooth LE stand-alone operation Bluetooth 5.0 (LE) embedded GATT profile (LE single mode) Dimensions: 9 mm x 9.5 mm x 1.8 mm (SMD package with antenna) Less than a few µA in low power modes Integrated shielding to resist EMI No external components needed Characteristics • Peak power consumption: 4.9 mA (Rx and Tx) • Link budget: 93 dBm (Rx sensitivity: -93  dBm, Tx sensitivity 0 dBm) • Operating temperature range -40 °C to +85 °C Block Diagram Product Specification Rev. 0.1 Page 2  PAN1740A Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2019. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by:  The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer,  Deviation or lapse in function of the Engineering Sample,  Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Specification Rev. 0.1 Page 3  PAN1740A Bluetooth Module Table of Contents 1 2 3 4 5 About This Document......................................................................................................................... 5 1.1 Purpose and Audience .............................................................................................................. 5 1.2 Revision History ......................................................................................................................... 5 1.3 Use of Symbols ......................................................................................................................... 5 1.4 Related Documents ................................................................................................................... 5 Overview .............................................................................................................................................. 6 2.1 Block Diagram ........................................................................................................................... 7 2.2 Bluetooth IC ............................................................................................................................... 8 2.3 System Overview ....................................................................................................................... 8 2.4 Pin Configuration ..................................................................................................................... 11 2.5 Interfaces ................................................................................................................................. 13 Detailed Description ......................................................................................................................... 17 3.1 Dimensions .............................................................................................................................. 17 3.2 Footprint .................................................................................................................................. 18 3.3 Packaging ................................................................................................................................ 19 3.4 Case Marking .......................................................................................................................... 22 Specification ..................................................................................................................................... 23 4.1 Default Test Conditions ........................................................................................................... 23 4.2 Absolute Maximum Ratings ..................................................................................................... 23 4.3 Recommended Operating Conditions ...................................................................................... 24 4.4 DC Characteristics ................................................................................................................... 24 4.5 16 MHz Crystal Oscillator: Timing Characteristics ................................................................... 25 4.6 32 kHz Crystal Oscillator: Timing Characteristics .................................................................... 25 4.7 DC-DC Converter: DC Characteristics..................................................................................... 26 4.8 Reliability Tests ....................................................................................................................... 26 4.9 Recommended Soldering Profile ............................................................................................. 27 Cautions ............................................................................................................................................ 28 5.1 Design Notes ........................................................................................................................... 28 5.2 Installation Notes ..................................................................................................................... 28 5.3 Usage Condition Notes ............................................................................................................ 29 5.4 Storage Notes .......................................................................................................................... 29 5.5 Safety Cautions ....................................................................................................................... 29 5.6 Other Cautions ........................................................................................................................ 30 5.7 Restricted Use ......................................................................................................................... 31 6 Regulatory and Certification Information ....................................................................................... 32 7 Appendix ........................................................................................................................................... 33 7.1 Ordering Information ................................................................................................................ 33 7.2 Contact Details ........................................................................................................................ 34 Product Specification Rev. 0.1 Page 4  PAN1740A Bluetooth Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1740A module. It is intended for hardware design, application, and Original Equipment Manufacturer (OEM) engineers. The product is referred to as “the PAN1740A” or “the module” within this document. 1.2 1.3 Revision History Revision Date Modifications/Remarks 0.1 2019-10-18 Preliminary version Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk.  [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document  1.3 Use of Symbols. 1.4 Related Documents Please refer to the Panasonic website for related documents  7.2.2 Product Information. Product Specification Rev. 0.1 Page 5  PAN1740A Bluetooth Module 2 Overview 2 Overview The PAN1740A is an optimized version of the PAN1740, offering a reduced boot time and supporting up to eight connections. It has a fully integrated radio transceiver and baseband processor for Bluetooth 5.0 LE. It can be used as a stand-alone application processor or as a data pump in hosted systems. The device is optimized for remote control units (RCU) requiring support for voice commands and motion/gesture recognition. Its integrated Audio Unit (AU) offers easy interface for MEMS microphones over PDM, external codecs over PCM/I2S, and a Sample Rate Converter unit. The Bluetooth LE firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The transceiver interfaces directly to the antenna and is fully compliant with the Bluetooth 5.0 standard. The PAN1740A has dedicated hardware for the Link Layer implementation of Bluetooth LE and interface controllers for enhanced connectivity capabilities. For related documents please refer to  7.2.2 Product Information. For further information on the variants and versions please refer to  7.1 Ordering Information. Product Specification Rev. 0.1 Page 6  PAN1740A Bluetooth Module 2 Overview 2.1 Block Diagram Total capacity shall not exceed 2.5 µF. The total inductance shall not exceed 2.5 µH. There is no resistor value in this design. Product Specification Rev. 0.1 Page 7  PAN1740A Bluetooth Module 2 Overview 2.2 Bluetooth IC 2.3 System Overview 2.3.1 ARM Cortex-M0 CPU The Cortex-M0 processor is a 32 bit Reduced Instruction Set Computing (RISC) processor with a “von-Neumann-architecture” (single bus interface). It uses an instruction set called “Thumb”, which was first supported in the processor ARM7TDMI. Several newer instructions from the architecture ARMv6 and a few instructions from the Thumb-2 technology are also included. Thumb-2 technology extended the previous Thumb instruction set to allow all operations to be carried out in one CPU state. The instruction set in Thumb-2 includes 16 bit and 32 bit instructions. Most instructions generated by the C compiler use the 16 bit instructions, and the 32 bit instructions are used when the 16 bit version cannot carry out the required operations. This results in high code density and avoids the overhead of switching between two instruction sets. In total, the Cortex-M0 processor supports 56 base instructions, although some instructions can have more than one form. While the instruction set is small, the Cortex-M0 processor is highly capable because the Thumb instruction set is highly optimized. Product Specification Rev. 0.1 Page 8  PAN1740A Bluetooth Module 2 Overview 2.3.2 Bluetooth Bluetooth LE Core The Bluetooth LE core is a qualified Bluetooth 5.0 baseband controller compatible with Bluetooth 5.0 specification and it is in charge of packet encoding, decoding, and frame scheduling. • Bluetooth 5.0 specifications compliant according to the specification of the Bluetooth 5.0 System Bluetooth SIG. • • • • • • • • • • • • All device classes are supported (Broadcast, Central, Observer, Peripheral) All packet types (Advertising/Data/Control) Encryption (AES/CCM) Bit stream processing (CRC, Whitening) FDMA/TDMA/events formatting and synchronization Frequency Hopping calculation Operating clock with internal 16 MHz Low power modes with internal 32.678 kHz Supports power down of the baseband during the protocol’s idle periods Advanced High-Performance Bus (AHB) Slave interface for register file access AHB Slave interface for exchange memory access of CPU via Bluetooth LE core AHB Master interface for direct access of Bluetooth LE core to exchange memory space Memory The following memories are part of the PAN1740A’s internal blocks: • ROM This is a 128 kB ROM containing the Bluetooth 5.0 protocol stack as well as the boot code sequence. • OTP This is a 64 kB One-Time-Programmable (OTP) memory array, used to store the application code as well as Bluetooth 5.0 profiles. It also contains the system configuration and calibration data. • System SRAM These are four special low leakage SRAM cells, 96 kB in total, which is used for mirroring the program code from the OTP – When the system wakes up, powers up, or mirroring from an external flash, – When the system powers up as well as to store various data of the Bluetooth LE protocol like the system’s global variables, – And processor stack when the system goes into extended sleep mode. Storage of this data ensures secure and quick configuration of the Bluetooth LE Core after the system wakes up. Every cell can be powered on or off according to the application needs for retention area when in extended sleep mode. Product Specification Rev. 0.1 Page 9  PAN1740A Bluetooth Module 2 Overview Functional Modes The PAN1740A is optimized for embedded applications such as health monitoring, sports measuring, human interaction devices, etc. Customers are able to develop and test their own applications. Upon completion of development, the application code can be programmed into the OTP. In general, the system has three functional modes of operation: • Development Mode During this phase application code is developed using the ARM Cortex-M0 SW environment. The compiled code is downloaded into the System RAM or any retention RAMs by means of SWD (JTAG) or any serial interface (e.g. UART). Address 0x00 is remapped to the physical memory that contains the code and the CPU is configured to reset and execute code from the remapped device. This mode enables application development, debugging and on-the-fly testing. • Normal Mode After the application is completed and verified, the code can be burned into the OTP. When the system boots/wakes up, the DMA of the OTP controller will automatically copy the program code from the OTP into the system RAM. Next, a SW reset will remap address 0x00 to the System RAM and code execution is started. Hence, in this mode, the system is autonomous, contains the required SW in OTP and is ready for integration into the final product. • Calibration Mode Programming the Bluetooth device address is completed in Calibration mode. Power Modes There are four different power modes in the PAN1740A: • Active Mode System is active and operates at full speed. • Sleep Mode No power gating has been programmed, the ARM CPU is idle, waiting for an interrupt. PD_SYS is on. PD_PER and PED_RAD depending on the programmed enabled value. • Extended Sleep Mode All power domains are off except for the PD_AON, the programmed PD_RRx and the PD_SR. Since the SysRAM retains its data, no OTP mirroring is required upon waking up the system. • Deep Sleep Mode All power domains are off except for the PD_AON and the programmed PD_RRx. This mode dissipates the minimum leakage power. Since the SysRAM has not retained its data, an OTP mirror action is required upon waking up the system. Product Specification Rev. 0.1 Page 10  PAN1740A Bluetooth Module 2 Overview 2.4 Pin Configuration Pin Assignment C D A B 6 20 17 18 15 16 13 12 14 21 11 Top View 22 10 23 9 2 24 4 6 1 3 5 Pin Type Description I INPUT 8 7 Pin Functions No Pin Name 1 GND 2 RST Reset signal (active high) 3 P0.7 I/O General purpose I/O port bit or alternate function nodes 4 P0.6 I/O General purpose I/O port bit or alternate function nodes 5 P0.5 I/O General purpose I/O port bit or alternate function nodes UART Rx 6 P0.4 I/O 1 General purpose I/O port bit or alternate function nodes 1 UART Tx 1 Dependent on the software configuration the UART can be set also to any other I/O. Product Specification Rev. 0.1 Page 11  PAN1740A Bluetooth Module 2 Overview No Pin Name Pin Type Description 8 VBAT3V AI Power supply 9 P0.3 I/O General purpose I/O port bit or alternate function nodes 7 GND UART CTS 10 P0.2 I/O 1 General purpose I/O port bit or alternate function nodes UART RTS 1 11 P0.1 I/O General purpose I/O port bit or alternate function nodes 12 P0.0 I/O General purpose I/O port bit or alternate function nodes AI INPUT 13 n.c. 14 VDD This pin is used for testing purposes only. Normal operation: leave VDD floating 15 GND 16 P1_4/SWCLK I/O INPUT JTAG clock signal I/O INPUT/OUTPUT 17 GND 18 P1_5/SW_DIO JTAG Data input/output 19 GND 20 GND 21 P1.3 I/O General purpose I/O port bit or alternate function nodes 22 P1.2 I/O General purpose I/O port bit or alternate function nodes 23 P1.1 I/O General purpose I/O port bit or alternate function nodes 24 P1.0 I/O General purpose I/O port bit or alternate function nodes A GND B GND C GND D GND For a more detailed description of the alternate function nodes please refer to the Dialog datasheet  7.2.2 Product Information. Product Specification Rev. 0.1 Page 12  PAN1740A Bluetooth Module 2 Overview 2.5 2.5.1 Interfaces UART The UART is compliant to the industry-standard “16550” and is used for serial communication with a peripheral, modem (data carrier equipment [DCE]) or data set. Data is written from a master (CPU) over the APB bus to the UART and it is converted to serial form and transmitted to the destination device. Serial data is also received by the UART and stored for the master (CPU) to read back. There is no DMA support on the UART block since its contains internal FIFOs. Both UARTs support hardware flow control signals (RTS, CTS, DTR, DSR). Features • • • 16 bytes Transmit and receive FIFOs • • Transmitter Holding Register Empty (THRE) interrupt mode Hardware flow control support (CTS/RTS) Shadow registers to reduce software overhead and also include a software programmable reset IrDA 1.0 SIR mode supporting low power mode Functionality based on the industry standard “16550” 2.5.2 • Programmable character properties, such as number of data bits per character (5, 8), optional • • • • Parity bit (with odd or even select) and number of stop bits (1, 1.5, or 2) Line break generation and detection Prioritized interrupt identification Programmable serial data baud rate as calculated by the following: baud rate = (serial clock frequency)/(divisor). Serial Peripheral Interface (SPI+) This interface supports a subset of the Serial Peripheral Interface SPI™. The serial interface can transmit and receive, 16 bit or 32 bit in master/slave mode and transmit 9 bit in master mode. The SPI+ interface has enhanced functionality with bidirectional 2x 16 it word FIFOs. SPI is a trademark of Motorola Inc™. Features • • • Master/slave mode • • • • • Supports SPI mode 0, 1, 2, 3 (clock edge and phase) 8 bit, 9 bit, 16 bit or 32 bit operation Clock speeds up to 16 MHz. Programmable output frequencies of SPI source clock divided by 1, 2, 4, 8 Programmable SPI_DO idle level Maskable Interrupt generation Bus load reduction by unidirectional writes-only and reads-only modes Built-in Rx/Tx FIFOs for continuous SPI bursts Product Specification Rev. 0.1 Page 13  PAN1740A Bluetooth Module 2 Overview 2.5.3 I2C 2 The I C is a programmable control bus that provides support for the communications link between integrated circuits in a system. It is a simple two-wire bus with a software-defined protocol for system control, which is used in temperature sensors and voltage level translators to EEPROMs, general-purpose converters: I/O, A/D, and D/A. Features • • 2 Two-wire I C serial interface consists of a serial data line (SDA) and a serial clock (SCL) Two speeds are supported: – Standard mode (0 Kb/s to 100 Kb/s) – • • • • • • • • • • 2.5.4 Fast mode (