PAN1780
Bluetooth® Low Energy Module
Product Specification
Rev. 0.4
Wireless Connectivity
PAN1780 Bluetooth Module
Overview
The PAN1780 is a Bluetooth 5 Low Energy (LE)
module based on the Nordic nRF52840 single chip
controller.
Features
• Surface mount type dimensions:
15.6 mm x 8.7 mm x 2 mm
•
•
•
Same form factor as PAN1026A and PAN1762
but smaller pitch and more pins
®
®
Nordic nRF52840 featuring ARM Cortex -M4F
with 64 MHz
Bluetooth 5 LE including LE 2M and LE Coded
PHY
•
Embedded 1 MB flash memory and 256 kB
internal RAM
•
Includes ARM TrustZone® CryptoCell® 310 and
supports secure boot including Root of
Trust (RoT)
•
•
•
Up to 48 general purpose I/Os (GPIO), which
are shared by up to 4 SPI, 2 I²C, 2 UART,
4 PWM, 8 ADC, 1 NFC-A, 32 kHz IN/OUT,
nRESET
USB 2.0 full-speed device interface
Built in temperature sensor
Bluetooth
• LE 2 Mbps high speed PHY, LE long range
coded PHY
•
•
•
•
•
LE advertising extensions (advertising on 40
channels total)
Channel selection algorithm #2
LE secure connections
Over-the-air update of application software
Qualified Bluetooth mesh profile stack
Characteristics
• Typical sensitivity: -95 dBm @ 1 Mb/s
and -103 dBm @ 125 kb/s
•
Typical max. output power: 8 dBm, configurable
from -20 dBm in 4 dB steps and -40 dBm in
whisper mode
•
Typical current consumption: 4.8 mA in Tx
(@ 0 dBm) and 4.8 mA in Rx mode
•
Typical current consumption: 0.4 µA in System
OFF mode, 1.5 µA with RTC wake up
•
•
•
On-module DC/DC and LDO regulators with
automated low current modes
Voltage range: 1.7 V to 5.5 V
Temperature range: -40 °C to 85 °C
Block Diagram
Product Specification Rev. 0.4
Page 2 of 27
PAN1780 Bluetooth Module
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time
without notification. Please consult the most recently issued Product Specification before initiating or
completing a design.
© Panasonic Industrial Devices Europe GmbH 2020.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Product Specification does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Product Specification and may bear
defects due to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.
Product Specification Rev. 0.4
Page 3 of 27
PAN1780 Bluetooth Module
Table of Contents
1
2
3
4
5
6
About This Document .................................................................................................................. 5
1.1
Purpose and Audience......................................................................................................... 5
1.2
Revision History .................................................................................................................. 5
1.3
Use of Symbols ................................................................................................................... 5
1.4
Related Documents ............................................................................................................. 5
Overview....................................................................................................................................... 6
2.1
Block Diagram ..................................................................................................................... 7
2.2
Pin Configuration ................................................................................................................. 8
2.3
Peripherals ........................................................................................................................ 11
2.4
Bluetooth Features ............................................................................................................ 11
Detailed Description ................................................................................................................... 12
3.1
Dimensions ....................................................................................................................... 12
3.2
Footprint............................................................................................................................ 13
3.3
Packaging ......................................................................................................................... 14
3.4
Case Marking .................................................................................................................... 17
Specification............................................................................................................................... 18
4.1
Default Test Conditions...................................................................................................... 18
4.2
Recommended Operating Conditions ................................................................................. 18
4.3
Current Consumption ......................................................................................................... 19
4.4
Bluetooth........................................................................................................................... 20
4.5
Recommended Soldering Profile ........................................................................................ 21
Cautions ..................................................................................................................................... 22
5.1
Design Notes ..................................................................................................................... 22
5.2
Installation Notes ............................................................................................................... 22
5.3
Usage Condition Notes ...................................................................................................... 23
5.4
Storage Notes ................................................................................................................... 23
5.5
Safety Cautions ................................................................................................................. 23
5.6
Other Cautions .................................................................................................................. 24
5.7
Restricted Use ................................................................................................................... 25
Appendix .................................................................................................................................... 26
6.1
Ordering Information .......................................................................................................... 26
6.2
Contact Details .................................................................................................................. 27
Product Specification Rev. 0.4
Page 4 of 27
PAN1780 Bluetooth Module
1 About This Document
1 About This Document
1.1
Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical
characteristics of the Panasonic module. It is intended for hardware design, application, and
Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the
PAN1780” or “the module” within this document.
1.2
1.3
Revision History
Revision
Date
Modifications/Remarks
0.1
2019-10-30
First preliminary version
0.2
2019-10-30
Updated picture “Block Diagram”. Corrected “Typical sensitivity”. Updated
table in chapter “Pin Configuration”. Updated chapter “Bluetooth”.
0.3
2019-11-20
Corrected chapter “Current Consumption”. Corrected “Typical max. output
power” and “Typical current consumption” in Product Overview.
0.4
2020-01-08
New layout
Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.
1.4
Related Documents
Please refer to the Panasonic website for related documents 6.2.2 Product Information.
Product Specification Rev. 0.4
Page 5 of 27
PAN1780 Bluetooth Module
2 Overview
2 Overview
The PAN1780 is a Bluetooth 5 Low Energy (LE) module based on the Nordic nRF52840
single-chip controller.
The Bluetooth 5 features additionally a higher symbol rate of 2 Mbps using the high-speed LE
2M PHY or a significantly longer range using the LE coded PHY at 500 kb/s or 125 kb/s. The
new channel selection algorithm (CSA#2) improves the performance in high interference
environments. Furthermore, the new LE advertising extensions allow for much larger amounts
of data to be broadcasted in connectionless scenarios.
An output power of up to 8 dBm and the high sensitivity of the nRF52840 in combination with
the LE coded PHY make the module very attractive in applications, where a long range is
required.
In addition the ultra-low current consumption of the PAN1780 makes the module an ideal choice
for battery powered devices.
®
With the Cortex M4F processor, 256 kB RAM and the build-in 1 MB flash memory the
PAN1780 can easily be used in standalone mode, thereby eliminating the need for an external
processor, saving complexity, space, and cost.
The rich set of security features from the ARM TrustZone CryptoCell 310 security subsystem
provide the necessary means for secure device operation in the IoT space.
The PAN1780 also supports Type 2 Near Field Communication (NFC-A) for use in simplified
pairing and payment solutions (external antenna required).
FCC, IC, and CE approval are in preparation.
For related documents please refer to 6.2.2 Product Information.
For further information on the variants and versions please refer to 6.1 Ordering Information.
Product Specification Rev. 0.4
Page 6 of 27
PAN1780 Bluetooth Module
2.1
2 Overview
Block Diagram
Product Specification Rev. 0.4
Page 7 of 27
PAN1780 Bluetooth Module
2.2
2 Overview
Pin Configuration
Pin Assignment
Top View
G1
G2
G3
G4
G5
G6
G7
G8
G9
G10
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
E1
E2
E3
E4
E5
E6
E7
E8
E9
E10
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
G12
G13
A12
A13
Pin Functions
No.
Pin Name
Pin Type
Description
A1 P0.27
Digital BI
GPIO
A2 P0.26
Digital BI
GPIO
A3 P0.04/AIN2
Digital BI/
Analog Input
GPIO/Sensor to ADC
A4 P0.05/AIN3
Digital BI/
Analog Input
GPIO/Sensor to ADC
A5 P0.03/AIN1
Digital BI/
Analog Input
GPIO/Sensor to ADC
A6 P0.02/AIN0
Digital BI/
Analog Input
GPIO/Sensor to ADC
A7 P0.29/AIN5
Digital BI/
Analog Input
GPIO/Sensor to ADC
A8 NFC2
RF NFC BI
Connect to NFC Antenna
A9 NFC1
RF NFC BI
Connect to NFC Antenna
A10 GND
Ground
Connect to Ground
A12 GND
Ground
Connect to Ground
A13 GND
Ground
Connect to Ground
Product Specification Rev. 0.4
Page 8 of 27
PAN1780 Bluetooth Module
No.
Pin Name
2 Overview
Pin Type
Description
B1 P0.06
Digital BI
GPIO
B2 X32k_OUT
32 kHz
Leave open
B3 P0.30/AIN6
Digital BI/
Analog Input
GPIO/Sensor to ADC
B4 P0.31/AIN7
Digital BI/
Analog Input
GPIO/Sensor to ADC
B5 P0.28/AIN4
Digital BI/
Analog Input
GPIO/Sensor to ADC
B6 P1.13
Digital BI
GPIO
B7 P1.10
Digital BI
GPIO
B8 P1.06
Digital BI
GPIO
B9 P1.15
Digital BI
GPIO
Ground
Connect to Ground
C1 P0.08
Digital BI
GPIO
C2 X32k_IN
32 kHz
Leave open
C3 P1.03
Digital BI
GPIO
C4 GND
Ground
Connect to Ground
C5 GND
Ground
Connect to Ground
C6 P1.14
Digital BI
GPIO
C7 P1.11
Digital BI
GPIO
C8 P1.12
Digital BI
GPIO
C9 P1.05
Digital BI
GPIO
C10 GND
Ground
Connect to Ground
D1 GND
Ground
Connect to Ground
D2 P1.08
Digital BI
GPIO
D3 P0.07/TRCCLK
Digital BI
GPIO or Trace IF Clock
D4 GND
Ground
Connect to Ground
D5 GND
Ground
Connect to Ground
D6 P0.24
Digital BI
GPIO
D7 P1.02
Digital BI
GPIO
D8 P1.07
Digital BI
GPIO
D9 GND
Ground
Connect to Ground
D10 GND
Ground
Connect to Ground
Supply
Voltage
1.7 V to 3.6 V
B10 GND
E1 LV Mode
Product Specification Rev. 0.4
Page 9 of 27
PAN1780 Bluetooth Module
No.
Pin Name
2 Overview
Pin Type
Description
E2 P1.09/TRCDAT3
Digital BI
GPIO or Trace IF D3
E3 GND
Ground
Connect to Ground
E4 P0.17
Digital BI
GPIO
E5 P0.23
Digital BI
GPIO
E6 P0.20
Digital BI
GPIO
E7 P0.21
Digital BI
GPIO
E8 SWDCLK
Digital BI
Serial Wire Debug IF Clock
E9 P1.04
Digital BI
GPIO
E10 RF_PIN
Analog BI
Normally leave unconnected
F1 P0.12/TRCDAT1
Digital BI
GPIO or Trace IF D1
F2 P0.11/TRCDAT2
Digital BI
GPIO or Trace IF D2
F3 P0.13
Digital BI
GPIO
F4 P0.14
Digital BI
GPIO
F5 P0.15
Digital BI
GPIO
F6 P0.19
Digital BI
GPIO
F7 P1.01
Digital BI
GPIO
F8 P0.25
Digital BI
GPIO
F9 P0.22
Digital BI
GPIO
Ground
Connect to Ground
G1 P0.16
Digital BI
GPIO
G2 HV Mode
Supply
Voltage
2.5 V to 5.5 V (optional)
G3 GND
Ground
Connect to Ground
G4 USB Mode
Supply
Voltage
4.35 V to 5.5 V
G5 DP
USB D+
Use for USB only
G6 DM
USB D-
Use for USB only
G7 nRESET
Digital I
Reset Signal Low Active
G8 P1.00/TRCDAT0
Digital BI
GPIO or Trace IF D0
G9 SWDIO
Digital BI
Serial Wire Debug IF Data
G10 GND
Ground
Connect to Ground
G12 GND
Ground
Connect to Ground
G13 GND
Ground
Connect to Ground
F10 GND
Product Specification Rev. 0.4
Page 10 of 27
PAN1780 Bluetooth Module
2.3
Peripherals
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
2.4
2 Overview
Full-speed USB 2.0 device controller
2 UART (2 or 4 wire with CTS/RTS, 1 200 up to 1 M baud)
2
2
I C, I S, SPI (32 MHz)
QSPI (32 MHz)
PWM
PDM
AES and CRYPTOCELL
8 channel 12 bit ADC
Comparator
Quadrature decoder
Temperature sensor
Real time counter
Watchdog timer
48 PIOs
Integrated 32 kHz crystal
Bluetooth Features
•
•
Bluetooth LE 5
Supports Bluetooth LE 5 high speed and long range modes
Product Specification Rev. 0.4
Page 11 of 27
PAN1780 Bluetooth Module
3 Detailed Description
3 Detailed Description
3.1
Dimensions
All dimensions are in millimeters.
No.
Item
Dimension
Tolerance
Remark
1 Width
8.70
±0.3
2 Length
15.60
±0.3
3 Height
2.00
Product Specification Rev. 0.4
±0.3 With case
Page 12 of 27
PAN1780 Bluetooth Module
3.2
3 Detailed Description
Footprint
All dimensions are in millimeters.
The outer dimensions have a tolerance of 0.3 mm.
G2
G3
G4
G5
G6
G7
G8
G9
G10
F1
F2
F3
F4
F5
F6
F7
F8
F9
F10
E1
E2
E3
E4
E5
E6
E7
E8
E9
E10
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
G12
G13
A12
A13
1.10
G1
1.05
8.70
1.05
Top View
1.00
1.10
0.60
2.20
1.40
15.60
Product Specification Rev. 0.4
Page 13 of 27
PAN1780 Bluetooth Module
3.3
3 Detailed Description
Packaging
The module is a mass production status product and will be delivered in the package described
below.
3.3.1
Tape Dimensions
3.3.2
Packing in Tape
Direction of unreeling (for customer)
trailer (empty)
1 x circumference /
hub
(min 160mm)
component
packed area
standard
1500pcs
leader (empty)
minimum 10 pitch
Top cover tape more
than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Empty spaces in the component packed area shall be less than two per reel and those spaces
shall not be consecutive.
100730-PAN1720.vsd
The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
Product Specification Rev. 0.4
Page 14 of 27
PAN1780 Bluetooth Module
3.3.3
Component Direction
3.3.4
Reel Dimension
Product Specification Rev. 0.4
3 Detailed Description
Page 15 of 27
PAN1780 Bluetooth Module
3.3.5
3 Detailed Description
Package Label
Example:
3.3.6
(1T)
Lot code
(1P)
Customer order number, if applicable
(2P)
Order number
(9D)
Date code
(Q)
Quantity
(HW/SW)
Hardware/software version
Total Package
Product Specification Rev. 0.4
Page 16 of 27
PAN1780 Bluetooth Module
3.4
3 Detailed Description
Case Marking
Example:
1 Brand name
2 Hardware/software version
3 Order number
4 Lot code
5 Status: ES or empty for MP
6 2D barcode, for internal usage only
7 Marking for Pin 1
Product Specification Rev. 0.4
Page 17 of 27
PAN1780 Bluetooth Module
4 Specification
4 Specification
All specifications are over temperature and process, unless indicated
otherwise.
4.1
Default Test Conditions
Temperature:
Humidity:
Supply Voltage:
4.2
25 °C ± 10 °C
40 % to 85 % RH
3.3 V
Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not
even momentarily or individually, as permanent damage to the module may
result.
Symbol
Parameter
Condition
VDD (LV Mode)
Supply Voltage
tR_ VDD
Supply Rise
Time
0 V to 1.7 V
VDD-POR
Supply Voltage
Power On Reset active
VDDH (HV Mode)
Supply Voltage
VDDH - Optional
tR_VDDH
Supply Rise
Time
0 V to 3.7 V
VBUS
VBUS USB
Supply Voltage
VBUS - Optional
VI/O
Max I/O Pin
Voltage
VDD ≤ 3.6 V
Min.
Typ.
Max.
1.7
3.6
V
60
ms
5.5
V
100
ms
4.35
5.5
V
-0.3
VDD + 0.3
V
1.75
2.5
VDD ≥ 3.6 V
TA
Operating
Temperature
Product Specification Rev. 0.4
Unit
VDD + 3.9
-40
25
85
°C
Page 18 of 27
PAN1780 Bluetooth Module
4.3
4 Specification
Current Consumption
The current consumption depends on the user scenario and on the setup and
timing in the power modes.
Assume VDD=3.3 V, Tamb=25 °C, if nothing else stated, DC/DC enabled
Parameter
Condition
Sleep Mode
No RAM retention, Wake on Reset, SYS OFF
0.4
µA
Full RAM retention, Wake on Reset, SYS OFF
1.86
µA
No RAM retention, Wake on any event,
SYS ON
0.97
µA
Full RAM retention, Wake on any event,
SYS ON
2.35
µA
1.5
µA
CPU executing Running from RAM
CoreMark
Running from Flash
2.8
mA
3.3
mA
Rx Current
4.8
mA
8 dBm
14.8
mA
4 dBm
9.6
mA
0 dBm
4.8
mA
-4 dBm
3.1
mA
-8 dBm
3.3
mA
-12 dBm
3.0
mA
-16 dBm
3.8
mA
-20 dBm
2.7
mA
-40 dBm
2.3
mA
No RAM retention, Wake on RTC, SYS ON
Tx Current
Product Specification Rev. 0.4
Min.
Typ.
Max.
Unit
Page 19 of 27
PAN1780 Bluetooth Module
4.4
4 Specification
Bluetooth
Parameter
Specification
Frequency
2 402 MHz to 2 480 MHz
Data Rate
2 Mbps, 1 Mbps, 500 kbps, 125 kbps
Number of Channels
40: 37 data/3 advertising (0, 12, 39)
Receive Sensitivity
-103 dBm (125 kbps Bluetooth LE Mode), -95 dBm (1 Mbps Bluetooth
LE Mode), -92 (2 Mbps Bluetooth LE Mode)
Output Power
-40 dBm to +8 dBm
Link Budget
Up to 111 dB
Product Specification Rev. 0.4
Page 20 of 27
PAN1780 Bluetooth Module
4.5
4 Specification
Recommended Soldering Profile
•
•
•
•
Reflow permissible cycles: 2
Opposite side reflow is prohibited due to module weight
•
Soldering profile assumes lead-free soldering
More than 75 percent of the soldering area shall be coated by solder
The soldering profiles should be adhered to in order to prevent electrical
or mechanical damage
Product Specification Rev. 0.4
Page 21 of 27
PAN1780 Bluetooth Module
5 Cautions
5 Cautions
Failure to follow the guidelines set forth in this document may result in
degrading of the module functions and damage to the module.
5.1
Design Notes
1. Follow the conditions written in this specification, especially the control signals of this
module.
2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF
directly at the module).
3. This module should not be mechanically stressed when installed.
4. Keep this module away from heat. Heat is the major cause of decreasing the life time of
these modules.
5. Avoid assembly and use of the target equipment in conditions where the module
temperature may exceed the maximum tolerance.
6. Keep this module away from other high frequency circuits.
7. Refer to the recommended pattern when designing a board.
5.2
Installation Notes
1. Reflow soldering is possible twice based on the conditions set forth in
4.5 Recommended Soldering Profile. Set up the temperature at the soldering portion
of this module according to this reflow profile.
2. Carefully position the module so that the heat will not burn into printed circuit boards or
affect other components that are susceptible to heat.
3. Carefully locate the module, to avoid an increased temperature caused by heat
generated by neighboring components.
4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover
and these modules to occur.
5. This module should not be mechanically stressed or vibrated when reflowed.
6. To repair the board by hand soldering, follow the conditions set forth in this chapter.
7. Do not wash this product.
8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage
to the module.
Product Specification Rev. 0.4
Page 22 of 27
PAN1780 Bluetooth Module
5.3
5 Cautions
Usage Condition Notes
1. Take measures to protect the module against static electricity.
If pulses or transient loads (a large load, which is suddenly applied) are applied to the
modules, check and evaluate their operation before assembly of the final products.
2. Do not use dropped modules.
3. Do not touch, damage, or soil the pins.
4. Follow the recommended condition ratings about the power supply applied to this
module.
5. Electrode peeling strength: Do not apply a force of more than 4.9 N in any direction on
the soldered module.
6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
7. These modules are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information, and communication
equipment.
5.4
Storage Notes
1. The module should not be stressed mechanically during storage.
2. Do not store these modules in the following conditions or the performance characteristics
of the module, such as RF performance will be adversely affected:
–
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX,
–
Storage in direct sunlight,
–
Storage in an environment where the temperature may be outside the range of 5 °C to
35 °C, or where the humidity may be outside the 45 % to 85 % range,
–
Storage of the modules for more than one year after the date of delivery storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months
of storage.
3. Keep this module away from water, poisonous gas, and corrosive gas.
4. This module should not be stressed or shocked when transported.
5. Follow the specification when stacking packed crates (max. 10).
5.5
Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a
short circuit occurs, provide the following failsafe functions as a minimum:
Product Specification Rev. 0.4
Page 23 of 27
PAN1780 Bluetooth Module
5 Cautions
1. Ensure the safety of the whole system by installing a protection circuit and a protection
device.
2. Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
5.6
Other Cautions
1. Do not use the module for other purposes than those listed in section 5.3 Usage
Condition Notes.
2. Be sure to provide an appropriate fail-safe function on your product to prevent any
additional damage that may be caused by the abnormal function or the failure of the
module.
3. This module has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
4. These modules are not intended for use under the special conditions shown below.
Before using these modules under such special conditions, carefully check their
performance and reliability under the said special conditions to determine whether or not
they can be used in such a manner:
–
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash,
–
In direct sunlight, outdoors, or in a dusty environment,
–
In an environment where condensation occurs,
–
In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl 2,
SO2, H2S, NH3, and NOX).
5. If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these modules with new modules, because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
Please refer to the Panasonic website for further information 6.2.2 Product
Information.
Product Specification Rev. 0.4
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PAN1780 Bluetooth Module
5.7
5.7.1
5 Cautions
Restricted Use
Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a
significant personal injury to the user, or as a critical component in any life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Panasonic customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any
damages resulting.
5.7.2
Restricted End Use
This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted
activity that supports the development, production, handling usage, maintenance, storage,
inventory or proliferation of any weapons or military use.
Transfer, export, re-export, usage or reselling of this product to any destination, end user or any
end use prohibited by the European Union, United States or any other applicable law is strictly
prohibited.
Product Specification Rev. 0.4
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PAN1780 Bluetooth Module
6 Appendix
6 Appendix
6.1
Ordering Information
Variants and Versions
Order Number
ENW89854A1KF
2
Brand Name
Description
PAN1780
Bluetooth Low Energy Single Mode with Antenna
1
MOQ
1 500
Empty Flash
1
Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces,
fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution
channels.
2
Samples are available on customer demand.
Product Specification Rev. 0.4
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PAN1780 Bluetooth Module
6.2
6.2.1
6 Appendix
Contact Details
Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: wireless@eu.panasonic.com
For Panasonic Sales assistance in North America, visit the Panasonic website
“Sales & Support” to find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
6.2.2
Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules
Product Specification Rev. 0.4
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