ENW89857A1KF

PAN1781 Bluetooth® Low Energy Module Product Specification Rev. 1.2 Wireless Connectivity PAN1781 Bluetooth Module Overview The PAN1781 is a Bluetooth 5.1 Low Energy (LE) module based on the Nordic nRF52820 single chip controller. 15.6 mm × 8.7 mm × 2 mm • • • • • • PHY • • • • Features • Surface mount type dimensions: • • Bluetooth • LE 2 Mbps high speed PHY, LE long range coded LE advertising extensions (advertising on 40 channels total) Channel selection algorithm #2 LE secure connections Angle of arrival (AoA) and angle of departure (AoD) direction finding Drop-in replacement for PAN1026A and PAN1762 Nordic nRF52820 featuring ARM Cortex®-M4 with 64 MHz Bluetooth 5.1 LE including LE 2M and LE Coded PHY Embedded 256 kB flash memory and 32 kB internal RAM 128-bit AES/ECB/CCM/AAR co-processor Up to 16 General Purpose I/O’s (GPIO), which are shared with up to 2× SPI, 2× I²C, UART, COMP, QDEC, nRESET USB 2.0 full-speed device interface Characteristics • Typical sensitivity: -95 dBm at 1 Mb/s and -103 dBm at 125 kb/s • Typical max. output power: 8 dBm, configurable from -20 dBm in 4 dB steps and -40 dBm in whisper mode • Typical current consumption: 4.9 mA in Tx (at 0 dBm) and 4.7 mA in Rx mode • Typical current consumption: 0.3 µA in System OFF mode, 1.2 µA with RTC wake up • Built-in temperature sensor • • On-module DC/DC and LDO regulators with automated low current modes Voltage range: 1.7 V to 5.5 V Temperature range: -40 °C to 85 °C Block Diagram   PAN1781 â Bluetooth Low Energy 5.1 Module 1.7 V to 3.6 V 2.5 V to 5.5 V Reset   GPIOs   Nordic nRF52820 DC-DC Conversion   UART SPI I²C Flash 256 kB Crystal 32.768 kHz  Chip Antenna COMP QDEC RAM 32 kB  Crystal 32 MHz  USB 2.0 Device SWD Product Specification Rev. 1.2 Page 2 of 41 PAN1781 Bluetooth Module By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2021. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Document Acceptance By signing the Product Specification, you acknowledge that you are a legal representative for your company and that you understand and accept the validity of the contents herein. If the signed version of the Product Specification has not been returned to Panasonic within 30 days after receipt of the product, the specification or approval sheet shall be deemed to be accepted by you. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: • The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, • Deviation or lapse in function of the Engineering Sample, • Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. Product Change Notifications (PCNs) and Information Notes (INs) Please consider the following PCNs/INs and contact your local Panasonic Sales office ( 7.2.1 Contact Us) for further details: • IN-034C - APPROTECT vulnerability Product Specification Rev. 1.2 Page 3 of 41 PAN1781 Bluetooth Module Information on Software The PAN1781 module does not contain any software ex works, i.e. software is provided by 3rd party suppliers only. The essential software resources can be found on the partner website of Nordic Semiconductor https://www.nordicsemi.com/. PIDEU provides a factory software programming service for your customized firmware; for further information please reach out to your local sales contact this regarding  7.2.1 Contact Us. Product Specification Rev. 1.2 Page 4 of 41 PAN1781 Bluetooth Module Table of Contents 1 2 3 4 5 6 About This Document.........................................................................................................................7 1.1 Purpose and Audience .............................................................................................................. 7 1.2 Revision History ......................................................................................................................... 7 1.3 Use of Symbols ......................................................................................................................... 7 1.4 Related Documents ................................................................................................................... 7 Overview ..............................................................................................................................................8 2.1 Block Diagram ........................................................................................................................... 9 2.2 Pin Configuration ..................................................................................................................... 10 2.3 Peripherals .............................................................................................................................. 12 2.4 Bluetooth Features .................................................................................................................. 12 Detailed Description ......................................................................................................................... 13 3.1 Dimensions .............................................................................................................................. 13 3.2 Footprint .................................................................................................................................. 14 3.3 Packaging ................................................................................................................................ 15 3.4 Case Marking .......................................................................................................................... 18 Specification ..................................................................................................................................... 19 4.1 Default Test Conditions ........................................................................................................... 19 4.2 Absolute Maximum Ratings ..................................................................................................... 19 4.3 Recommended Operating Conditions ...................................................................................... 20 4.4 Current Consumption............................................................................................................... 20 4.5 Bluetooth ................................................................................................................................. 21 4.6 Reliability Tests ....................................................................................................................... 22 4.7 Recommended Soldering Profile ............................................................................................. 23 Cautions ............................................................................................................................................ 24 5.1 Design Notes ........................................................................................................................... 24 5.2 Installation Notes ..................................................................................................................... 24 5.3 Usage Condition Notes ............................................................................................................ 25 5.4 Storage Notes .......................................................................................................................... 25 5.5 Safety Cautions ....................................................................................................................... 25 5.6 Other Cautions ........................................................................................................................ 26 5.7 Restricted Use ......................................................................................................................... 27 Regulatory and Certification Information ....................................................................................... 28 6.1 General Certification Information ............................................................................................. 28 6.2 Federal Communications Commission (FCC) for US .............................................................. 28 6.3 Innovation, Science, and Economic Development (ISED) for Canada .................................... 31 6.4 European Conformity According to RED (2014/53/EU) ........................................................... 34 6.5 Japanese Radio Law Compliance ........................................................................................... 35 6.6 China (Label Requirements) .................................................................................................... 36 6.7 Korea (Label Requirements).................................................................................................... 37 6.8 Australia and New Zealand Conformity according to RCM ...................................................... 38 6.9 Bluetooth ................................................................................................................................. 39 6.10 RoHS and REACH Declaration ............................................................................................... 39 Product Specification Rev. 1.2 Page 5 of 41 PAN1781 Bluetooth Module 7 Appendix ........................................................................................................................................... 40 7.1 Ordering Information ................................................................................................................ 40 7.2 Contact Details ........................................................................................................................ 41 Product Specification Rev. 1.2 Page 6 of 41  PAN1781 Bluetooth Module 1 About This Document 1 About This Document 1.1 Purpose and Audience This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1781 module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the PAN1781” or “the module” within this document. 1.2 1.3 Revision History Revision Date Modifications/Remarks 1.0 2021-04-20 First version 1.1 2021-11-02 Updated disclaimer. Updated Bluetooth version. Added country certifications information for Japan, Korea, China, New Zealand, Australia. 1.2 2021-11-09 Updated disclaimer Use of Symbols Symbol Description Note Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk.  [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document  1.3 Use of Symbols. 1.4 Related Documents For related documents please refer to the Panasonic website  7.2.2 Product Information. Product Specification Rev. 1.2 Page 7 of 41  PAN1781 Bluetooth Module 2 Overview 2 Overview The PAN1781 is a Bluetooth 5.1 Low Energy (LE) module based on the Nordic nRF52820 single chip controller. The Bluetooth 5.1 features additionally a higher symbol rate of 2 Mbps using the high speed LE 2M PHY or a significantly longer range using the LE coded PHY at 500 kb/s or 125 kb/s. The new channel selection algorithm (CSA#2) improves the performance in high interference environments. Furthermore, the new LE advertising extensions allow for much larger amounts of data to be broadcasted in connectionless scenarios. An output power of up to 8 dBm and the high sensitivity of the nRF52820 in combination with the LE coded PHY make the module very attractive in applications, where a long range is required. In addition, the ultra-low current consumption of the PAN1781 makes the module an ideal choice for battery powered devices. With the Cortex M4 processor, 32 kB RAM, and the built-in 256 kB flash memory, the PAN1781 can easily be used in standalone mode, thereby eliminating the need for an external processor, saving complexity, space, and cost. The PAN1781 also supports angle of arrival (AoA) and angle of departure (AoD) direction finding using Bluetooth. A 128-bit AES/ECB/CCM/AAR co-processor may be used for on-the-fly packet encryption. For related documents please refer to  7.2.2 Product Information. For further information on the variants and versions please refer to  7.1 Ordering Information. Product Specification Rev. 1.2 Page 8 of 41  PAN1781 Bluetooth Module 2.1 2 Overview Block Diagram   PAN1781 â Bluetooth Low Energy 5.1 Module 1.7 V to 3.6 V 2.5 V to 5.5 V Reset   GPIOs   Nordic nRF52820 DC-DC Conversion   UART SPI I²C Flash 256 kB Crystal 32.768 kHz  Chip Antenna COMP QDEC RAM 32 kB  Crystal 32 MHz  USB 2.0 Device SWD Product Specification Rev. 1.2 Page 9 of 41  PAN1781 Bluetooth Module 2.2 2 Overview Pin Configuration Pin Assignment Top View F1 F2 F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F10 F11 F12 A11 A12 Pin Functions No. Pin Name Pin Type Description A1 GND Ground Connect to ground A2 P0.03/AIN1 Digital BI/Analog Input GPIO/Analogue signal to COMP A3 nRESET Digital BI Low active RESET A4 NC NC Do not connect A5 VCC Power Connect 1.7 V to 3.6 V in normal voltage mode Leave open in high voltage mode A6 VDDH Power Connect to VCC (1.7 V to 3.6 V) in normal voltage mode Connect 2.5 V to 5.5 V in high voltage mode A7 GND Ground Connect to ground A8 P0.16 Digital BI GPIO A9 GND Ground Connect to ground A11 GND Ground Connect to ground, necessary for antenna to stay tuned A12 GND Ground Connect to ground, necessary for antenna to stay tuned B1 P0.29 Digital BI GPIO B2 P0.04/AIN2 Digital BI/Analog Input GPIO/Analogue signal to COMP Product Specification Rev. 1.2 Page 10 of 41  PAN1781 Bluetooth Module 2 Overview No. Pin Name Pin Type Description B3 NC NC Do not connect B4 NC NC Do not connect B5 UART_RTS Digital BI GPIO or UART_RTS B6 UART_CTS Digital BI GPIO or UART_CTS B7 NC NC Do not connect B8 NC NC Do not connect B9 NC NC Do not connect C1 NC NC Do not connect C2 NC NC Do not connect C3 P0.05/AIN3 Digital BI Digital BI/Analogue signal to COMP C4 SWDIO Digital BI Serial Wire Data I/O C5 SWDCLK Digital IN Serial Wire Data Clock C6 P0.15 Digital BI GPIO C7 NC NC Do not connect C8 GND Ground Connect to ground C9 GND Ground Connect to ground D1 NC NC Do not connect D2 NC NC Do not connect D3 NC NC Do not connect D4 NC NC Do not connect D5 NC NC Do not connect D6 NC NC Do not connect D7 GND Ground Connect to ground D8 GND Ground Connect to ground D9 GND Ground Connect to ground E1 P0.14 Digital BI GPIO E2 P0.20 Digital BI GPIO E3 VBUS Power USB-Bus Supply Voltage Connect if USB is used E4 NC NC Do not connect E5 NC NC Do not connect E6 UART_RXD Digital BI GPIO or UART_RXD E7 NC NC Do not connect Product Specification Rev. 1.2 Page 11 of 41  PAN1781 Bluetooth Module 2.3 No. Pin Name Pin Type Description E8 GND Ground Connect to ground E9 GND Ground Connect to ground F1 GND Ground Connect to ground F2 NC NC Do not connect F3 DP Digital BI USB differential line with polarity + F4 DM Digital BI USB differential line with polarity - F5 P0.02/AIN0 Digital BI/Analog Input GPIO/Analogue signal to COMP F6 P0.17 Digital BI GPIO F7 UART_TXD Digital BI GPIO or UART_TXD F8 P0.28 Digital BI GPIO F9 GND Ground Connect to ground F10 NC NC Do not connect F11 GND Ground Connect to ground, necessary for antenna to stay tuned F12 GND Ground Connect to ground, necessary for antenna to stay tuned Peripherals • • • • • • • • • • • • • • 2.4 2 Overview Full speed USB 2.0 device controller UART (2 or 4 wire with CTS/RTS, 1 200 up to 1 M baud) 2× I2C (100 kHz or 400 kHz) 2× SPI (125 kbps up to 8 Mbps) master mode and slave Mode PWM 4x 32-bit timer AES CCM mode encryption on-the-fly 4 channel Comparator Quadrature decoder QDEC Temperature sensor 2× Real-time counter RTC Watchdog timer 16 PIOs including RESET, 4-wire UART Integrated 32 kHz crystal Serial wire debug and program interface Bluetooth Features • • • Bluetooth 5.1 LE Supports Bluetooth 5.1 LE high speed and long range modes AoA and AoD direction finding Product Specification Rev. 1.2 Page 12 of 41  PAN1781 Bluetooth Module 3 Detailed Description 3 Detailed Description 3.1 Dimensions All dimensions are in millimeters. 8.70 1.20 2.00 Top View 15.60 No. Item Dimension Tolerance Remark 1 Width 8.70 ±0.30 2 Length 15.60 ±0.30 3 Height 2.00 Product Specification Rev. 1.2 ±0.20 With case Page 13 of 41  PAN1781 Bluetooth Module 3.2 3 Detailed Description Footprint All dimensions are in millimeters. Top View F3 F4 F5 F6 F7 F8 F9 E1 E2 E3 E4 E5 E6 E7 E8 E9 D1 D2 D3 D4 D5 D6 D7 D8 D9 C1 C2 C3 C4 C5 C6 C7 C8 C9 B1 B2 B3 B4 B5 B6 B7 B8 B9 A1 A2 A3 A4 A5 A6 A7 A8 A9 F10 F11 F12 A11 A12 1.85 F2 1.20 5.00 F1 1.35 8.70 1.35 3.00 1.00 1.20 0.60 2.40 5.00 15.60 Product Specification Rev. 1.2 Page 14 of 41  PAN1781 Bluetooth Module 3.3 3 Detailed Description Packaging The module is a mass production status product and will be delivered in the package described below. 3.3.1 Tape Dimensions 3.3.2 Packing in Tape Direction of unreeling (for customer) trailer (empty) 1 x circumference / hub (min 160mm) component packed area standard 1500pcs leader (empty) minimum 10 pitch Top cover tape more than 1 x circumference plus 100mm to avoid fixing of tape end on sealed modules. Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel. Product Specification Rev. 1.2 Page 15 of 41  PAN1781 Bluetooth Module 3.3.3 3 Detailed Description Component Direction Pin 1 Marking (Top Side) Direction of unreeling (for customer) 3.3.4 Reel Dimension Product Specification Rev. 1.2 Page 16 of 41  PAN1781 Bluetooth Module 3.3.5 3 Detailed Description Package Label Example: 3.3.6 (1T) Lot code (1P) Customer order number, if applicable (2P) Order number (9D) Date code (Q) Quantity (HW/SW) Hardware/software version Total Package Product Specification Rev. 1.2 Page 17 of 41  PAN1781 Bluetooth Module 3.4 3 Detailed Description Case Marking Example: 1 Brand name 2 Hardware/software version 3 Order number 4 Lot code 5 Status: ES or empty for MP 6 2D barcode, for internal usage only 7 Marking for Pin 1 8 Bluetooth logo Product Specification Rev. 1.2 Page 18 of 41  PAN1781 Bluetooth Module 4 Specification 4 Specification All specifications are over temperature and process, unless indicated otherwise. 4.1 Default Test Conditions Temperature: Humidity: Supply Voltage: 4.2 25 °C ± 10 °C 40 % to 85 % RH 3.3 V Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter VDD Normal Supply Voltage -0.3 3.9 VDDH High Supply Voltage -0.3 5.8 VBUS USB Bus Voltage -0.3 5.8 I/O Pin Voltage on any Pin VDD ≤ 3.6 V -0.3 VDD + 0.3 VDD > 3.6 V -0.3 3.9 ESD ESD Robustness Condition Min. Typ. HBM 2 Moisture Sensitivity Level PRF RF Input Level TSTOR Storage Temperature Product Specification Rev. 1.2 Unit V ±2 000 CDM MSL Max. 500 3 -40 10 dBm 125 °C Page 19 of 41  PAN1781 Bluetooth Module 4.3 4 Specification Recommended Operating Conditions The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter VDD (LV mode) Supply Voltage tR_ VDD Supply Rise Time 0 V to 1.7 V VDD-POR Supply Voltage Power on Reset active VDDH (HV mode) Supply Voltage VDDH (optional) tR_VDDH Supply Rise Time 0 V to 3.7 V VBUS VBUS USB Supply Voltage VBUS (optional) VI/O Max I/O Pin Voltage VDD ≤ 3.6 V TA 4.4 Condition Min. Typ. Max. Unit 1.7 3.6 V 60 ms 5.5 V 100 ms 4.35 5.5 V -0.3 VDD + 0.3 V 1.75 2.5 VDD ≥ 3.6 V Operating Temperature 3.9 -40 25 85 °C Current Consumption The current consumption depends on the user scenario and on the setup and timing in the power modes. Assume VDD = 3 V, Tamb = 25 °C, if nothing else stated, DC/DC enabled. Parameter Condition Sleep Mode No RAM retention, Wake on Reset, SYS OFF 0.3 µA Full RAM retention, Wake on Reset, SYS OFF 0.5 µA No RAM retention, Wake on any event, SYS ON 0.4 µA Full RAM retention, Wake on any event, SYS ON 0.8 µA No RAM retention, Wake on RTC, SYS ON 1.2 µA CPU executing Running from RAM, DC/DC ON, HFXO CoreMark Running from Flash, DC/DC ON, HFXO 2.1 mA 2.1 mA Rx Current 4.7 mA Rx only 1 Mbps Bluetooth LE mode DC/DC ON, HFXO Product Specification Rev. 1.2 Min. Typ. Max. Unit Page 20 of 41  PAN1781 Bluetooth Module 4.5 4 Specification Parameter Condition Min. Typ. Max. Unit Tx Current 8 dBm Tx only, DC/DC ON 14 mA 4 dBm Tx only, DC/DC ON 9.4 mA 0 dBm Tx only, DC/DC ON 4.9 mA -4 dBm Tx only, DC/DC ON 3.8 mA -8 dBm Tx only, DC/DC ON 3.4 mA -12 dBm Tx only, DC/DC ON 3.1 mA -16 dBm Tx only, DC/DC ON 2.9 mA -20 dBm Tx only, DC/DC ON 2.7 mA -40 dBm Tx only, DC/DC ON 2.3 mA Bluetooth Parameter Specification Frequency 2 402 MHz to 2 480 MHz Data Rate 2 Mbps, 1 Mbps, 500 kbps, 125 kbps Number of Channels 40: 37 data/3 advertising (0, 12, 39) Receive Sensitivity -103 dBm (125 kbps Bluetooth LE mode), -95 dBm (1 Mbps Bluetooth LE Mode), -92dBm (2 Mbps Bluetooth LE mode) Output Power -40 dBm to +8 dBm Link Budget Up to 111 dB Product Specification Rev. 1.2 Page 21 of 41  PAN1781 Bluetooth Module 4.6 4 Specification Reliability Tests The measurement should be done after the test module has been exposed to room temperature and humidity for one hour. No. Item Limit Condition 1 Variable Vibration Test Electrical parameters should be Freq.: 20 Hz~2 000 Hz, Acc.: 17 G to within specification 50 G, Sweep: 8 min, 2 hours, For: XYZ axis 2 Shock Drop Test Drop parts on concrete from a height of 1 m for 3 times 3 Heat-Shock/ Temperature Cycling Test At -40 °C and 85 °C for 1 h/cycle 4 Temperature Humidity Bias Test At 60 °C, 85 % r. H., 300 h 5 Low Temperature Storage Life Test At -40 °C, 300 h 6 High Temperature Storage Life Test At 85 °C, 300 h Product Specification Rev. 1.2 Total = 300 cycles Page 22 of 41  PAN1781 Bluetooth Module 4.7 4 Specification Recommended Soldering Profile • • • • • Reflow permissible cycles: 2 Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Soldering profile assumes lead-free soldering Product Specification Rev. 1.2 Page 23 of 41  PAN1781 Bluetooth Module 5 Cautions 5 Cautions Failure to follow the guidelines set forth in this document may result in degrading of the module functions and damage to the module. 5.1 Design Notes 1. Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage should abide by the maximum ratings ( 4.2 Absolute Maximum Ratings). 3. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF directly at the module). 4. This module should not be mechanically stressed when installed. 5. Keep this module away from heat. Heat is the major cause of decreasing the life time of these modules. 6. Avoid assembly and use of the target equipment in conditions where the module temperature may exceed the maximum tolerance. 7. Keep this module away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board. 5.2 Installation Notes 1. Reflow soldering is possible twice based on the conditions set forth in  4.7 Recommended Soldering Profile. Set up the temperature at the soldering portion of this module according to this reflow profile. 2. Carefully position the module so that the heat will not burn into printed circuit boards or affect other components that are susceptible to heat. 3. Carefully locate the module, to avoid an increased temperature caused by heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the module, the wire cover will melt and generate toxic gas, damaging the insulation. Never allow contact between a vinyl cover and these modules to occur. 5. This module should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the module. Product Specification Rev. 1.2 Page 24 of 41  PAN1781 Bluetooth Module 5.3 5 Cautions Usage Condition Notes 1. Take measures to protect the module against static electricity. If pulses or transient loads (a large load, which is suddenly applied) are applied to the modules, check and evaluate their operation before assembly of the final products. 2. Do not use dropped modules. 3. Do not touch, damage, or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this module. 5. Electrode peeling strength: Do not apply a force of more than 4.9 N in any direction on the soldered module. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These modules are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment. 5.4 Storage Notes 1. The module should not be stressed mechanically during storage. 2. Do not store these modules in the following conditions or the performance characteristics of the module, such as RF performance will be adversely affected: – Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, – Storage in direct sunlight, – Storage in an environment where the temperature may be outside the range of 5 °C to 35 °C, or where the humidity may be outside the 45 % to 85 % range, – Storage of the modules for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. 3. Keep this module away from water, poisonous gas, and corrosive gas. 4. This module should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (max. 10). 5.5 Safety Cautions These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum: Product Specification Rev. 1.2 Page 25 of 41  PAN1781 Bluetooth Module 5 Cautions 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 5.6 Other Cautions 1. Do not use the module for other purposes than those listed in section  5.3 Usage Condition Notes. 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the module. 3. This module has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These modules are not intended for use under the special conditions shown below. Before using these modules under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: – In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, – In direct sunlight, outdoors, or in a dusty environment, – In an environment where condensation occurs, – In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these modules with new modules, because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. For further information please refer to the Panasonic website  7.2.2 Product Information. Product Specification Rev. 1.2 Page 26 of 41  PAN1781 Bluetooth Module 5.7 5.7.1 5 Cautions Restricted Use Life Support Policy This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. 5.7.2 Restricted End Use This Panasonic Industrial Devices Europe GmbH product is not designed for any restricted activity that supports the development, production, handling usage, maintenance, storage, inventory or proliferation of any weapons or military use. Transfer, export, re-export, usage or reselling of this product to any destination, end user or any end use prohibited by the European Union, United States or any other applicable law is strictly prohibited. Product Specification Rev. 1.2 Page 27 of 41  PAN1781 Bluetooth Module 6 Regulatory and Certification Information 6 Regulatory and Certification Information 6.1 General Certification Information Regulatory certifications are valid for the following radio relevant software: • • Nordic Soft Devices S112, S113, or S140 Bluetooth Specification 5 For further certification requests for other radio software please contact Panasonic  7.2 Contact Details. 6.2 6.2.1 Federal Communications Commission (FCC) for US FCC Notice The PAN1781 including the antennas, which are listed in  6.2.5 Approved Antenna List, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. 6.2.2 Caution The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. Product Specification Rev. 1.2 Page 28 of 41  PAN1781 Bluetooth Module 6 Regulatory and Certification Information This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. There is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • 6.2.3 Reorient or relocate the receiving antenna, Increase the separation between the equipment and receiver, Connect the equipment into an outlet on a circuit different from that to which the receiver is connected, Consult the dealer or an experienced radio/TV technician for help. Label Requirements The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V1781. This FCC identifier is valid for the PAN1781. The end product must in any case be labelled on the exterior with: "Contains FCC ID: T7V1781". Due to the PAN1781 model size, the FCC identifier is displayed on the product package and in the installation instruction only. It cannot be displayed readable on the module’s label due to the limited size. 6.2.4 Antenna Warning This antenna warning refers to the test device with the model number PAN1781  7.1 Ordering Information. Product Specification Rev. 1.2 Page 29 of 41  PAN1781 Bluetooth Module 6 Regulatory and Certification Information The device is tested with a standard SMA connector and with the antenna listed below. When integrated into the OEM’s product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in  6.2.5 Approved Antenna List is the same (FCC ID: T7V1781). 6.2.5 Approved Antenna List Item Part Number 1 ANT016008LCS2442MA1 6.2.6 Manufacturer Frequency Band Type TDK 2.4 GHz Chip antenna Max. Gain (dBi) +2 RF Exposure To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed  6.2.5 Approved Antenna List. The preceding statement must be included as a “CAUTION” statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN1781 with a mounted ceramic antenna (FCC ID: T7V1781) is below the FCC radio frequency exposure limits. Nevertheless, the PAN1781 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. Product Specification Rev. 1.2 Page 30 of 41  PAN1781 Bluetooth Module 6.3 6 Regulatory and Certification Information Innovation, Science, and Economic Development (ISED) for Canada English The PAN1781 is licensed to meet the regulatory requirements of ISED. License ID: IC: 216Q-1781 HVIN: ENW89857A1KF, ENW89857A2KF Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in  6.2.5 Approved Antenna List, having a maximum gain of +2 dBi. Antennas not included in this list or having a gain greater than +2 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Due to the model size, the IC identifier is displayed in the installation instruction only and it cannot be displayed on the module’s label due to the limited size. The end customer has to assure that the device has a distance of more than 10 mm from the human body under all circumstances. If the end customer application intends to use the PAN1781 in a distance smaller 10 mm from the human body, SAR evaluation has to be repeated by the OEM. The end customer equipment must meet the actual Safety/Health requirements according to ISED. French PAN1781 est garanti conforme aux dispositions règlementaires d’Industry Canada (ISED). License: IC: 216Q-1781 HVIN: ENW89857A1KF, ENW89857A2KF Il est recommandé aux fabricants d’appareils fixes, mobiles ou portables de consulter la réglementation en vigueur et de vérifier la conformité de leurs produits relativement aux limites d’exposition aux rayonnements radiofréquence ainsi qu’au débit d’absorption spécifique maximum autorisé. Des informations pour les utilisateurs sur la réglementation Canadienne concernant l’exposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Ce produit a été développé pour fonctionner spécifiquement avec les antennes listées dans le tableau  6.2.5 Approved Antenna List, présentant un gain maximum de +2 dBi. Des antennes autres que celles listées ici, ou présentant un gain supérieur à +2 dBi ne doivent en aucune circonstance être utilisées en combinaison avec ce produit. L’impédance des antennes Product Specification Rev. 1.2 Page 31 of 41  PAN1781 Bluetooth Module 6 Regulatory and Certification Information compatibles est 50 Ohm. L’antenne utilisée avec ce produit ne doit ni être située à proximité d’une autre antenne ou d’un autre émetteur, ni être utilisée conjointement avec une autre antenne ou un autre émetteur. En raison de la taille du produit, l’identifiant IC est fourni dans le manuel d’installation. Le client final doit s'assurer que l'appareil se trouve en toutes circonstances à une distance de plus de 10 mm du corps humain. Si le client final envisage une application nécessitant d'utiliser le PAN1781 à une distance inférieure à 10 mm du corps humain, alors le FEO doit répéter l'évaluation DAS. L'équipement du client final doit répondre aux exigences actuelles de sécurité et de santé selon l’ISED. 6.3.1 IC Notice English The device PAN1781 ( 7.1 Ordering Information), including the antennas ( 6.2.5 Approved Antenna List), complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. French Le présent appareil PAN1781 ( 7.1 Ordering Information), les antennes y compris ( 6.2.5 Approved Antenna List), est conforme aux CNR-Gen d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. L'appareil ne doit pas produire de brouillage, et 2. L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Product Specification Rev. 1.2 Page 32 of 41  PAN1781 Bluetooth Module 6.3.2 6 Regulatory and Certification Information Labeling Requirements English Labeling Requirements The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifier is IC: 216Q-1781. This IC identifier is valid for all PAN1781 modules  7.1 Ordering Information. In any case, the end product must be labelled on the exterior with: "Contains IC: 216Q-1781”. French Obligations d’étiquetage Les fabricants d’équipements d’origine (FEO) – en anglais Original Equipment Manufacturer (OEM) – doivent s’assurer que les obligations d’étiquetage IC du produit final sont remplies. Ces obligations incluent une étiquette clairement visible à l’extérieur de l’emballage externe, comportant l’identifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L’ identifiant IC est IC: 216Q-1781. Cet identifiant est valide pour tous les modules PAN1781  7.1 Ordering Information. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante: "Contient IC: 216Q-1781”. Product Specification Rev. 1.2 Page 33 of 41  PAN1781 Bluetooth Module 6.4 6 Regulatory and Certification Information European Conformity According to RED (2014/53/EU) All modules described in this Product Specification comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with RED (2014/53/EU) articles: 3.1a Safety/Health: EN 62368-1: 2014/AC: 2015/A11: 2017/AC:2017 EN 62479: 2010 3.1b EMC: EN 301 489-1 V2.2.3: (2019-11) EN 301 489-17 V3.2.4: (2020-09) 3.2 Radio: • • EN 300 328 V2.2.2: (2019-07) Due to the model size, the CE marking is displayed on the product package and in the installation instruction only. It cannot be displayed conform to regulation (EU) No. 765/2008 in 5 mm height on the module’s label due to the limited space. The RED EU Type Examination Certificate No. T818833N-01-TEC issued by the Notified Body 0682 can be used for the OEM end product conformity assessment. If a Notified Body has been contracted for the end product conformity assessment, it should be noted that this EU Type Examination Certificate should be used for conformance assessment. As a result of the conformity assessment procedure described in 2014/53/EU Directive, the end customer equipment should be labelled as follows: The requirements for CE marking are described in regulation (EC) No. 765/2008 Annex II. The end customer has to assure that the device has a distance of more than 5 mm from the human body under all circumstances. If the end customer application intends to use the PAN1781 in a distance smaller 5 mm from the human body, SAR evaluation has to be repeated by the OEM. The end customer equipment must meet the actual Safety/Health requirements according to RED. PAN1781 and its model versions in the specified reference design can be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States [Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra, and Turkey. Product Specification Rev. 1.2 Page 34 of 41  PAN1781 Bluetooth Module 6.5 6 Regulatory and Certification Information Japanese Radio Law Compliance This device is granted pursuant to the Japanese Radio Law (電波法). This device should not be modified (otherwise the granted designation number will become invalid). The following models are qualified for the Japanese market: MIC ID: [R]202-DGJ063 Since the printable area on the PAN1781 is too small to show the MIC logo and the MIC ID, this information is placed on the package and in the user information. The package label shows the Giteki mark and the Radio Law sign with the MIC ID as depicted below: Any product with the PAN1781 integrated and to be sold on the Japanese market has to display the following statement on the product label: End product Labelling Example Contains MIC ID R 202-DGJ063 Product Specification Rev. 1.2 Page 35 of 41  PAN1781 Bluetooth Module 6.6 6 Regulatory and Certification Information China (Label Requirements) The PAN1781 has a modular CMIIT certification. The OEM must ensure that SRRC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic SRRC identifier for this module. The final Bluetooth product must be marked with an approval code, known as the “China MII ID”, product name, model number, and battery information, place of production, manufacturer name, and CMIIT number. 本设备包含型号核准代码为：CMIIT ID: 2021DJ12938(M) 的无线电发射模块。 Format of the ID is as follows: “CMIIT ID: 2021DJ12938(M)”, where: • • • • CMIIT: Abbreviation for China Ministry of Information Industry 2021: Year of application DJ: Code indicating equipment category 12938(M): Approval serial number issued by SRRC End product Labelling Example: 本设备包含型号核准代码为：CMIIT ID: 2021DJ12938(M) 的无线电发射模块。 Product Specification Rev. 1.2 Page 36 of 41  PAN1781 Bluetooth Module 6.7 6 Regulatory and Certification Information Korea (Label Requirements) Since the printable area on the PAN1781 is too small to show the KC logo and ID, this information is placed on the package and in the user information. The OEM must ensure KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The module is not labeled with its own KC mark. The final product requires the KC mark and MSIP certificate number of the module. Format of the ID is as follows: “MSIP: R-R-Pid-PAN1781”, where • • • • • MSIP: Ministry of Science, ICT & Future Planning R: Indication of Broadcasting Communication Equipment code R: Indication of Basic Registration Information Pid: Indication of Application Information PAN1781: Indication of Product End Product Labelling Example: R-R-Pid-PAN1781 The label of end product should indicate the RF approved module’s certification number as well as the end-device’s certification number. For more details please visit: Korea Communications Commission (KCC) http://www.kcc.go.kr National Radio Research Agency (RRA) http://rra.go.kr Product Specification Rev. 1.2 Page 37 of 41  PAN1781 Bluetooth Module 6.8 6 Regulatory and Certification Information Australia and New Zealand Conformity according to RCM This Suppliers Declaration of Conformity (SDoC) is also valid for Australia. 6.8.1 Supplier’s Details Name Microsystem Support Limited New Zealand (Physical Address) 62 Heathcote Road Castor Bay Auckland 0620 New Zealand (Postal Address) PO Box 31-372 Milford Auckland 0741 (New Zealand) Company Number/GST Number 256648 Supplier Number E7689 New Zealand Contact Information 6.8.2 Telephone + 64 9 4109286 Mobile + 64 27 4928152 Email mikefoxnz@gmail.com Conformity According to Section 134 (1) (g) of the New Zealand Radiocommunications Act 1989 Product Details Brand Name Model Description Panasonic PAN1781 Bluetooth Low Energy Module 2 402 MHz to 2 480 MHz All modules described in this Product Specification comply with the standards according to the following articles: 3.1a Safety/Health: ETSI EN 62368-1: 2014/AC: 2015/A11: 2017/AC:2017 ETSI EN 62479:2010 3.1b EMC: ETSI EN 301 489-1 V2.2.3 ETSI EN 301 489-17 V3.2.4 3.2 Radio: AS/NZS 4268:2017 ETSI EN 300 328 V2.2.2 Product Specification Rev. 1.2 Page 38 of 41  PAN1781 Bluetooth Module 6.9 6 Regulatory and Certification Information Bluetooth The final Bluetooth end product listing needs to be created by using the following IDs: Bluetooth 5.1 Declaration ID QDID End Product (PAN1781 Bluetooth LE LR Module) D054152 164160 Bluetooth Marks According to the Bluetooth SIG, the PAN1781 fulfills the criteria to label your product as a Bluetooth device: For further information please refer to the Bluetooth website www.bluetooth.com. 6.10 RoHS and REACH Declaration The latest declaration of environmental compatibility (Restriction of Hazardous Substances, RoHS and Registration, Evaluation, Authorisation and Restriction of Chemicals, REACH) for supplied products can be found on the Panasonic website in the “Downloads” section of the respective product  7.2.2 Product Information. Product Specification Rev. 1.2 Page 39 of 41  PAN1781 Bluetooth Module 7 Appendix 7 Appendix 7.1 Ordering Information Variants and Versions Order Number Brand Name Description ENW89857A1KF 2 PAN1781 Bluetooth Low Energy Single Mode with Antenna MOQ1 1 500 Empty Flash 1 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. 2 Samples are available on customer demand. Product Specification Rev. 1.2 Page 40 of 41  PAN1781 Bluetooth Module 7.2 7.2.1 7 Appendix Contact Details Contact Us Please contact your local Panasonic Sales office for details on additional product options and services: For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic website “Sales & Support” to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com 7.2.2 Product Information Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules Product Specification Rev. 1.2 Page 41 of 41