CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
1 of 34
DATE
30.05.2016
Product Specification
Applicant / Manufacturer
Hardware
Panasonic Electronic Devices Europe GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Software
Synapse Wireless Inc. SNAP Software
E-Senza Technologies GmbH SN55 AT Command Set
Freescale based SMAC test software for production
your own written software
Software Version
Contents
or
or
or
Approval from customer by signature
Customer
By signing this document, you acknowledge that you are the legal representative for
your company and that you understand and accept the validity of the contents herein.
CHECKED / APPROVED:
DATE:
NAME:
SIGNATURE:
NOTE:
AT LEAST ONE SET OF APPROVED SPECIFICATIONS SHOULD BE RETURNED TO
THE ADDRESS OF THE ISSUING PARTY.
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
2 of 34
DATE
30.05.2016
TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
Key Features ................................................................................................................ 4
Applications for the Module........................................................................................... 4
Description of the Module ............................................................................................. 5
Scope of this Document ................................................................................................ 6
History for this Document.............................................................................................. 6
Terminal Layout ............................................................................................................ 7
Block diagram ............................................................................................................... 9
7.1. Software differences .......................................................................................... 10
7.1.1. Test / Demo software............................................................................ 10
7.1.2. E-Senza software ................................................................................. 10
7.1.3. Synapse software ................................................................................. 10
Key Parts List ............................................................................................................. 11
Test Conditions........................................................................................................... 11
Absolut maximum ratings............................................................................................ 12
Operating Conditions .................................................................................................. 12
DC electrical characeristics......................................................................................... 13
A/D converter Characteristics ..................................................................................... 14
AC Electrical Characteristics ....................................................................................... 14
Soldering Temperature - Time Profile (for reflow soldering) ........................................ 16
15.1. For lead solder .................................................................................................. 16
15.2. For lead free solder ........................................................................................... 16
Module Dimensions .................................................................................................... 17
FootPrint of the Module .............................................................................................. 17
Laser marking ............................................................................................................. 18
Mechanical Requirements .......................................................................................... 18
Recommended Land Pattern ...................................................................................... 19
Reliability Tests .......................................................................................................... 20
Cautions ..................................................................................................................... 20
22.1. Design Notes ..................................................................................................... 20
22.2. Installation Notes ............................................................................................... 20
22.3. Usage Conditions Notes .................................................................................... 21
22.4. Storage Notes ................................................................................................... 22
22.5. Safety Cautions ................................................................................................. 22
22.6. Other cautions ................................................................................................... 22
Packaging ................................................................................................................... 24
23.1. Tape Dimension ................................................................................................ 24
23.2. Packing in Tape ................................................................................................. 24
23.3. Component direction ......................................................................................... 25
23.4. Reel Dimension ................................................................................................. 25
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CLASSIFICATION
SUBJECT
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
24.
25.
26.
27.
28.
29.
30.
PRODUCT SPECIFICATION
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
3 of 34
DATE
30.05.2016
23.5. Label for Package.............................................................................................. 26
23.6. Total Packing Handling ...................................................................................... 27
23.7. Cover tape reel strength .................................................................................... 27
Ordering Information ................................................................................................... 28
24.1. PAN4561H ........................................................................................................ 28
24.2. PAN4561M ........................................................................................................ 29
24.3. PAN4561L ......................................................................................................... 29
RoHS Declaration ....................................................................................................... 30
Data Sheet Status ...................................................................................................... 30
Regulatory Information ............................................................................................... 30
27.1. FCC Notice ........................................................................................................ 30
27.2. Caution .............................................................................................................. 31
27.3. Labeling Requirements ...................................................................................... 31
27.4. Antenna Warning ............................................................................................... 31
27.5. Approved Antenna List ...................................................................................... 32
27.6. RF Exposure PAN4561 ..................................................................................... 32
Related Documents .................................................................................................... 33
General Information .................................................................................................... 34
Life Support Policy ...................................................................................................... 34
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
4 of 34
DATE
30.05.2016
1. KEY FEATURES
Short range 2.4GHz ISM band transceiver with microcontroller and reference oscillator
Provides complete hardware for a wireless node using IEEE802.15.4 packet structure
Compact size (35.0mm x 15.0mm x 3.8mm)
3 antenna options: ceramic antenna onboard, ext. antenna connected to Single port 50Ω or
antenna plug
16 selectable Channels with 250 kbps in the 2.4 GHz band
Low power modes for increased battery life
High sensitivity of -102 dBm typ. at 1% Packet Error Rate (PAN4561H /M)
+20 dBm max. output power (PAN4561H)
Programmable output power over a 30 dB range
Low supply voltage (2.7V to 3.4 V, 3.0 V typ.)
Operating temperature range -40°C to +85°C
Link Quality and Clear Channel Assessment capability
60k Flash and 4k RAM memory
8 channel A/D converter with 10 Bit for fast and easy conversion from analog inputs -such
as temperature, pressure and fluid levels- to digital values.
5 channel 16 Bit timer/pulse width modulation (TPM) outputs
BDM port for direct download programming
In total 39 digital I/O lines most with programmable pull-ups and few with high-current
driver.
Low power modes for increased battery life
Low battery warning
Low voltage detect/reset
Complies to FCC Part 15
2. APPLICATIONS FOR THE MODULE
Wireless sensor and actuator networks
Remote control and wire replacement in industrial systems
Factory and home automation and control
Inventory and logistics management
HID (Human Interface Devices)
Toys
Home gateways
Proprietary networking solutions using IEEE802.15.4
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CLASSIFICATION
SUBJECT
CUSTOMER’S CODE
PAN4561H /M /L
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
5 of 34
DATE
30.05.2016
3. DESCRIPTION OF THE MODULE
The PAN4561with module is a short range, low power, 2.4 GHz ISM band transceiver which
includes a complete 802.15.4 physical layer (PHY) modem, designed for the IEEE 802.15.4
wireless standard and an appropriate microcontroller (MCU) with reference oscillator which
provides a cost effective solution for short-range data links and networks.
There are three versions of PAN4561 available, identified by an H, M or L at the end of series
number i.e. PAN4561H, PAN4561M, PAN4561L. The addional letter stands for High, Mid and
Low range.
All modules in the PAN4561 series are based on the FreeScale MC13213 SOC, fully featured
with 39 I/O lines, interchangeable and share a common footprint and software. Mixed node
networks can be implemented to conserve power while maximizing range. The PAN4561L is a
cost optimized module designed for standard range applications of less than 30 meters. For
medium range applications the PAN4561M, is optimized to deliver longer range and conserve
power consumption, using a low noise amplifier and 10dBm power amplifier. The PAN4561H is
designed for extended range applications, using a low noise amplifier and 20dBm power
amplifier.
In this document when mentioned PAN4561 the information refers to all three module types.
Data which apply only to a specific module (PAN4561 H /M /L) will be marked accordingly.
Software solutions available for the PAN4561 are SNAP software from Synapse Wireless Inc.
and SN55 software from E-Senza Technologies GmbH which are very easy to use. For detailed
information refer to SNAP [9] and and to SN55 [8].
In addition, you are free to develop also your own application on the software package from
Freescale™, e.g. SMAC, for details please refer to [4], [5], [6] and [7].
For the Integrated Development Environment (IDE) the Metrowerks TM CodeWarrior IDE from
www.metrowerks.com is required. For device flash programming via the BDM port of PAN4561
the USB HCS08/HCS12 Multilink from www.pemicro.com is recommended.
P
P
H
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CLASSIFICATION
PRODUCT SPECIFICATION
SUBJECT
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
6 of 34
DATE
30.05.2016
4. SCOPE OF THIS DOCUMENT
This product specification applies to the IEEE 802.15.4 Standard modem ENWC9A22xxEF.
The xx is the indicator for different versions (refer to chapter 25 Ordering Information).
The platform used is the MC13213 from the US company Freescale Semiconductor
www.freescale.com/ [2], [3]
5. HISTORY FOR THIS DOCUMENT
Revision
Date
Modification / Remarks
A
09.03.2009
Initial draft version
B
20.03.2009
Some minor changes, regarding the specification wording
C
29.04.2009
Change chapter 24, ordering code for Synapse software.
Change the crystal value from 26MHz to 16MHz in chapter block diagram, as it
was a mistake in this document.
D
08.09.2009
Change chapter 7, regarding hardware dependent software.
E
06.04.2010
Datasheet updated for 4561 PCB revision C (Prelimenary)
F
31.05.2010
Added chapter 27 Regulatory Information. Minor changes of module parameters.
G
06.08.2010
Added data for PAN4561M and PAN4561L
H
17.09.2010
Changed receive current consumption values.
I
30.05.2016
Add FCC marking, change transmit current consumption for PAN4561M
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
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DATE
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6. TERMINAL LAYOUT
35.0 mm
53
32
Pad 1 = 4 x 1.30mm x 1.30mm
Top View
Antenna
15.0 mm
Pad 2 = 58 x 0.60mm x 1.30mm
Height
3.8 mm
1
22
Please refer also to the MC1321x technical data sheet and reference manual, which is given in
[2] and [3] in the chapter “Related Documents”.
Pin No.
Pin
Pin Type
Description
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
GND
PTD4 / TPM2CH1
PTD5 / TPM2CH2
PTD6 / TPM2CH3
PTD7 / TPM2CH4
PTD2 / TPM1CH2
NC
PTC0 / TXD2
PTC1 / RXD2
PTC2 / SDA1
PTC3 / SCL1
PTB0 / AD1P0
PTB1 / AD1P1
PTB2 / AD1P2
PTB3 / AD1P3
PTB4 / AD1P4
PTB5 / AD1P5
PTB6 / AD1P6
PTB7 / AD1P7
VREFH
VREFL
GND
Vcc
Vcc
PTG1 / XTAL
I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Ground
MCU Port D Bit 4 / TPM2 Channel 1
MCU Port D Bit 5 / TPM2 Channel 2
MCU Port D Bit 6 / TPM2 Channel 3
MCU Port D Bit 7 / TPM2 Channel 4
MCU Port D Bit 2 / TPM1 Channel 2
Not connected – leave open
MCU Port C Bit 0 / SCI2 TX data out (UART2)
MCU Port C Bit 1 / SCI2 RX data in (UART2)
MCU Port C Bit 1/ IIC bus data (I²C)
MCU Port C Bit 1/ IIC bus clock (I²C)
MCU Port B Bit 0 / ATD analog Channel 0
MCU Port B Bit 1 / ATD analog Channel 1
MCU Port B Bit 2 / ATD analog Channel 2
MCU Port B Bit 3 / ATD analog Channel 3
MCU Port B Bit 4 / ATD analog Channel 4
MCU Port B Bit 5 / ATD analog Channel 5
MCU Port B Bit 6 / ATD analog Channel 6
MCU Port B Bit 7 / ATD analog Channel 7
MCU high reference voltage for ATD
MCU low reference voltage for ATD
Ground
Modem voltage regulators’ input
Modem voltage regulators’ input
(2)
MCU Port G Bit 1 / Crystal oscillator output
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
I/O
Power I
Power I
Dig. I/O / O
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
8 of 34
DATE
30.05.2016
Pin No.
Pin
Pin Type
Description
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53 - 54
55
56 - 62
PTG2 / EXTAL
RESET
CLKO
GPIO2
PTG0 / BKGND / MS
GPIO1
GND
VDDA
PTA7 / KBI1P7
PTA6 / KBI1P6
PTA5 / KBI1P5
PTA4 / KBI1P4
PTA3 / KBI1P3
PTA2 / KBI1P2
PTA1 / KBI1P1
PTA0 / KBI1P0
PTC7 / GPIO
PTC6 / GPIO
PTC5 / GPIO
PTC4 / GPIO
PTE0 / TXD1
PTE1 / RXD1
GPIO5
GPIO6
GPIO7
NC
NC
GND
EXANT
GND
Dig. I/O / I
Dig. I
Dig. O
Dig. I/O
Dig. I/O
Dig. I/O
I/O
Power O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
Dig. I/O
MCU Port G Bit 2 / Crystal oscillator input
.
MCU reset. Active low
(3)
Programmable Clock Output (default: 32,768 kHz)
GPIO2 from RF transceiver unit
(1)
MCU Port G Bit 0 / Background / Mode Select
GPIO1 from RF transceiver unit
Ground
Modem analog regulated supply output - leave open
MCU Port A Bit 7 / Keyboard Input Bit 7
MCU Port A Bit 6 / Keyboard Input Bit 6
MCU Port A Bit 5 / Keyboard Input Bit 5
MCU Port A Bit 4 / Keyboard Input Bit 4
MCU Port A Bit 3 / Keyboard Input Bit 3
MCU Port A Bit 2 / Keyboard Input Bit 2
MCU Port A Bit 1 / Keyboard Input Bit 1
MCU Port A Bit 0 / Keyboard Input Bit 0
MCU Port C Bit 7 (GPIO)
MCU Port C Bit 6 (GPIO)
MCU Port C Bit 5 (GPIO)
MCU Port C Bit 4 (GPIO)
MCU Port E Bit 0 / SCI1 TX data out (UART1)
MCU Port E Bit 1/ SCI1 RX data in (UART1)
GPIO5 from RF transceiver unit
GPIO6 from RF transceiver unit
GPIO7 from RF transceiver unit
Not connected – leave open
Not connected – leave open
Ground
I/O
I/O
I/O
(2) (3) (4)
P
P
P
P
P
Pin for external antenna (50 )
Ground
Note:
(1) PTG0 is output only. Pin is I/O when used as BDM function.
(2) Full I/O when not used as clock source. Please refer also to [2].
(3) CLKO (Pin 28) and PTG2/EXTAL (Pin 26) must be connected when the programmable clock derived
from the internal 16 MHz crystal.
Do not connect when the clock derived from Internal Reference Generator in MC13213.
(4) PTG2 / EXTAL is not accessible with E-Senza software
Port PTA, PTB, PTC, PTD, PTE, PTG have internal software controlled pull-up resistors. For detailed
information refer to [3].
All I/O pins of port PTC are high current pins. The maximum current for all pins together must not exceed
60mA. A continuous current of 7mA, and 25mA burst for each port pin must not be exceeded. For detailed
information refer to [3].
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CLASSIFICATION
PRODUCT SPECIFICATION
SUBJECT
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
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DATE
30.05.2016
7. BLOCK DIAGRAM
PAN4561H / PAN4561M
serial
communication
Logic IOs
Actuators
Sensors
Programming
Hirose
Plug
SCI1 & 2
Port A ... E, G
Timer/PWM
A/D
BKGD
MC13213
RF
Transceiver
& µC
CC2591CC2590
RF Frontend
(LNA & PA)
Rx / Tx
Matching
Ceramic
Antenna
HGM
PAEN
EN
RXTX
Reset
BPFilter
Wake Up
RF Transceiver
RF transceiver
GPIOs
GPIO3 LNA H/L gain
GPIO4 PA/LNA Enable
GPIO1,2,5,6,7
Bottom
Pad
CT_Bias RX/TX
Crystal
16 MHz
EXANT
PIN55
The RF frontend IC CC2591 / CC2590 is controlled with GPIO3, GPIO4 and CT_Bias from RF
transceiver unit (see above block diagram).
PAN4561L
serial
communication
Logic IOs
Actuators
Sensors
Programming
Hirose
Plug
SCI1 & 2
Port A ... E, G
Timer/PWM
A/D
BKGD
MC13213
RF
Transceiver
& µC
Balun
Rx / Tx
Matching
Ceramic
Antenna
Reset
Wake Up
RF Transceiver
RF transceiver
GPIOs
Bottom
Pad
GPIO3
GPIO1,2,5,6,7
GPIO4
CT_Bias
Crystal
16 MHz
EXANT
PIN55
The MC13213 is used in single port configuration with its internal Tx/Rx switch.
For more details refer to chapter 7.1.
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
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7.1. SOFTWARE DIFFERENCES
7.1.1.
Test / Demo software
Modules with Test / Demo software are intended for customer writing their own software for
the module. The module contains software but only with a small instruction set.
The front end IC CC2591 / CC2590 is enabled and disabled with RF transceiver GPIO4.
Set high to enable and low to disable the chip. Please refer to appendix [10].
The LNA has two modes, high and low gain. This mode is controlled with RF transceiver
GPIO3. Set it high for high gain and low for low gain mode. Please refer to appendix [10].
The RXTX signal on CC2591 and CC2590 is controlled by CT_Bias pin. Please refer to
appendix [10].
7.1.2.
E-Senza software
Modules with E-Senza software can be used to set up a measurement system easily with a
GUI.
With this software it is not possible to set the modules into energy saving sleep mode.
7.1.3.
Synapse software
With Synapse software the customer writes his own scripts based on easy to learn, Phyton
based, programming language. This software is very flexible and can be used for multiple
applications.
The control of PA/LNA is primary supported from version SNAPv2.2.15 or newer.
The Synapse software on the module provides several initializing parameters called NVparameters. These are already set. For detailed information refer to SNAP Reference
Manual [9].
To comply to FCC regulation the power level has to be reduced to txPwr(14) for
PAN4561H. For detailed information on FCC compliance refer to chapter 27. Regulatory
Information.
Synapse Wireless Inc. probably releases two to three times a year a new SNAP release.
PAN4561 modules will always be shipped with the newest SNAP version.
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PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
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8. KEY PARTS LIST
Part Name
Material
P.W.Board
Casing
Glass cloth epoxide resin with gold plating
Material: BZn15-20, thickness 0.15mm
MC13213 (Freescale www.freescale.com/)
All information are based on [2] chapter 28
CC2591 / CC2590 (Texas Instruments www.ti.com)
All information are based on [10] chapter 27.
IC part name
9. TEST CONDITIONS
Measurements are made under room temperature and humidity unless otherwise specified.
Temperature 25 ± 10°C
Supply voltage 3.0V
Humidity
40 to 85%RH
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MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
10. ABSOLUT MAXIMUM RATINGS
The maximum ratings may not be exceeded under any circumstances (not even momentarily) as
permanent damage to the module will result.
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
Supply voltage
V CC
-0.3 to +3.6
Vdc
B
B
2
Ripple on V CC
Vcc rip
3
Digital input voltages
V in
4
Instantaneous maximum current
Single pin limit for all digital I/O
(1)
pins
5
B
B
B
tbd
B
(2)
(ripple frequency ≥200kHz)
mVpp
-0.3 to V CC +0.3
Vdc
IBDB
25
mAdc
Storage temperature range
T stg
-40 to +105
°C
6
Operating temperature range
T op
-40 to +85
°C
7
RF Input Power
P max
10
dBm
8
ESD on any pin except for pin
32 EXANT.
Human Body Model (HBM)
V THHBM
2
kV
9
Moisture Sensitivity Level
MSL
P
B
B
B
B
P
B
B
B
B
B
B
B
B
3 (168 hours)
Notes:
(1) Input must be current limited to the value specified. Please refer also to [2].
(2) The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise
regulator output). For noisy supply voltages, please provide a decoupling circuit (for example a ferrite
in series connection and a blocking capacitor to ground of at least 47µF directly at the module).
The exact ripple tolerance will be published in a later revision.
11. OPERATING CONDITIONS
No.
Item
1
Supply voltage
2
RF Input Frequency
Condition / Remark
The typical value
is recommended
Symbol
Value
Min
Typ
Max
V CC
2.7
3.0
3.4
Vdc
f in
2400
2483.5
MHz
B
B
Receive/Transmit
Mode to 50Ω reference
load
B
B
3
Return loss of load at pin 55
EXANT
4
Logic Input Voltage Low
V IL
5
Logic Input Voltage High
V IH
6
SPI clock rate
7
Operating temperature range
a
-9.5
B
B
The typical value is
recommended
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0
B
B
f SPI
B
T op
B
dB
0.7xV CC
B
B
-40
V
V CC
V
8.0
MHz
+85
°C
B
B
B
B
0.3xV CC
-
B
B
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
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DATE
30.05.2016
12. DC ELECTRICAL CHARACERISTICS
Assume V CC = 3.0V, T amb = 25°C if nothing else stated
B
No.
B
Item
B
B
Condition / Remark
Symbol
Module type
Value
Min Typ
Unit
Max
(1)
1
Transmit current
consumption
Transmit Mode
2
Receive current
consumption
Receive Mode (8)
(8)
(8)
Off
(2)(4)
(4)
(2)(5)(9)
3
Low power
current
consumption
Sleep
6
B
(2)(3)(6)(9)
B
I CCR
B
B
I leakage
B
I CCH
B
B
Standby
I CCD
(7)
I CCI
Idle (7)
4
I CCT
digital I/O pin characteristics
Low voltage warning/detection
Power on reset re-arm voltage
B
B
B
B
B
PAN4561H @ 20dBm
200 240
PAN4561M @ 10dBm
72
90
mA
PAN4561L @ 0dBm
43
50
PAN4561H
60
70
PAN4561M
60
70
mA
PAN4561L
60
70
PAN4561H
0.55 ‘PAN4561M
0.55 ‘µA
PAN4561L
0.55 ‘PAN4561H
2.2
‘PAN4561M
2.2
‘µA
PAN4561L
2.2
‘PAN4561H
36,3 ‘PAN4561M
36,3 ‘µA
PAN4561L
36,3 ‘PAN4561H
1.6
‘PAN4561M
1.6
‘mA
PAN4561L
1.6
‘Please refer to [2] 6.3.1 MCU DC Characteristics
Please refer to [2] 6.3.1 MCU DC Characteristics
Notes:
(1) SPI Register 12 has a value of 0xDC which sets output power to nominal value.
(2) To attain specified low power current, all GPIOs and other digital IO must be handled properly.
Set all port pins as output low when left open or as input when connected to defined level.
Detailed descriptions can be found at [2] at section 7.2 Low Power Considerations.
(3) CLKO frequency is set to a default value of 32.786 kHz.
(4) Off mode: Stop1 on µC, Modem off [3]. Wakeup by IRQ or Reset
(5) Sleep mode: Stop2 + RTC on µC, Modem Hibernate [3]. Wakeup by IRQ, Reset or Real-TimeInterrupt
(6) Standby mode: Stop3 + RTC on µC, Modem Doze [3]. Wakeup by IRQ, Reset, RTI or Keyboard
Interrupt
(7) Idle mode: µC runs at reduced 2 MHz clock, Modem is in Idle state [3]
(8) µC runs in full speed mode (16 MHz clock)
(9) RTC requires external 32 kHz crystal. Without RTC 300nA less current
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SUBJECT
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
14 of 34
DATE
30.05.2016
13. A/D CONVERTER CHARACTERISTICS
No
Item
Remark
1
ATD characteristics
Please refer to [2] 6.3.3 MCU ATD Characteristics
2
ATD timing/performance
characteristics
Please refer to [2] 6.3.3 MCU ATD Characteristics
The A/D high reference voltage VREFH is connected to pin 20 (VREFH). Connect this signal
primarily to Vcc.
The A/D low reference voltage VREFL is connected to pin 21 (VREFL). Connect this signal
primarily to GND
14. AC ELECTRICAL CHARACTERISTICS
V CC = 3.0V, T amb = 25°C, 50 load at EXANT, for all channel numbers 11,12,..., 26 according to [1]
B
No
1
2
3
4
5
6
8
9
B
B
B
Receiver
Sensitivity for 1% Packet Error Rate (PER),
-85dBm required by [1]
Saturation (maximum input level)
Adjacent Channel Interference for 1% PER
(5MHz; desired signal -82dBm)
Alternate Channel Interference for 1% PER
(10MHz; desired signal -82dBm)
Frequency Error Tolerance
Symbol Rate Error Tolerance
Spurious Emissions 1GHz
Module type
Limit
Min
Unit
Typ
Max
PAN4561H
-85
-102
-105
PAN4561M
PAN4561L
All
-85
-85
-
-102
-92
10
-105
-
All
-
29
-
dB
All
-
40
-
dB
All
All
All
All
-
-
200
80
-57
-47
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
-
dBm
dBm
kHz
ppm
dBm
dBm
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CLASSIFICATION
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MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No Transmitter
Module type
10
0
-
PAN4561H
-
18.5
-
PAN4561M
PAN4561L
-
9.5
0
25
30
250
35
-
dBm
harmonic @ maximum output power
-
-45
-35
dBm
harmonic @ maximum output power
-
-45
-35
dBm
-
< -40
< -40
-36
-30
dBm
dBm
3
4
5
Error Vector Magnitude (EVM)
Power Control Range
Over the Air Data Rate
6
2
7
3
8
9
Spurious Emissions 1GHz
P
rd
P
(2)
No
Stand By
1
2
Spurious Emissions 1GHz
Limit
Min
-
22
(3)
-
Nominal Output Power
20
Max
(3)
PAN4561M
PAN4561L
(1)
2
P
Typ
-
Maximum Output Power
nd
Unit
PAN4561H
1
P
Limit
Min
No.
REV.
DS-4561-2400-102
I
PAGE
15 of 34
DATE
30.05.2016
dBm
%
dB
kbps
Unit
Typ
< -60
< -50
Max
-57
-47
dBm
dBm
Notes:
(1) SPI Register 12 programmed to 0xFF which sets output power to maximum.
Measured at pin EXANT for the SMD pad version.
(2) SPI Register 12 programmed to 0xDC which sets output power to nominal value (maximum
allowed value to comply with FCC regulation).
Measured at pin EXANT for the SMD pad version.
(3) You have to follow your own national regulation, please check before finalizing the max. output
power by setting the right register value.
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MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
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DATE
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15. SOLDERING TEMPERATURE - TIME PROFILE (FOR REFLOW SOLDERING)
15.1.
FOR LEAD SOLDER
10 1s
Recommended temp. profile
for reflow soldering
30 +20/-10s
235°C max.
Temp.[°C]
220 5°C
200°C
150 10°C
90 30s
Time [s]
15.2.
FOR LEAD FREE SOLDER
Our used temp. profile
for reflow soldering
30 +20/-10s
Temp.[°C]
230°C -250°C max.
220°C
150°C – 190°C
90 30s
Time [s]
Reflow permissible cycles:
2
Opposite side reflow is prohibited due to the module weight.
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CUSTOMER’S CODE
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DATE
30.05.2016
16. MODULE DIMENSIONS
No.
Item
Dimension
Tolerance
1
Width
15.00
0.25
2
Lenght
35.00
0.25
3
Height
3.80
0.25
Remark
With case
17. FOOTPRINT OF THE MODULE
28.50
3.45
2.80
2.20
1.55
0.25
53
32
14.75
Pad 1 = 4 x 1.30mm x 1.30mm
Top View
Antenna
1
22
35.00 mm
0.25
1.55
2.20
2.80
3.45
15.00 mm
Pad 2 = 58 x 0.60mm x 1.30mm
All dimensions are in millimeters.
The outer dimensions have a tolerance of 0.25mm.
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MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
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PAGE
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DATE
30.05.2016
18. LASER MARKING
35.0 mm
53
32
15.0 mm
ENWC9A2xxxEF
PAN4561v ES
Antenna
yy
zz
Serial-No.
Date-code
FCC ID: T7V4561HM
1
22
The 2D-Barcode contains the following information separated by a semicolon:
Value
Description
Date-code
Date code in the format Year-Month-Day [YYMMDD]
Serial-No.
Serial number [7 signs, here 0000000]
ENWC9A2xxxEF
Ordering number [8 signs; without ENW and F, please refer also to chapter 24]
v
Module type: H, M or L (for High, Mid and Low power)
yy
The identifier for the hardware release [2 signs, here yy]
zz
The identifier for the software release [2 signs, here zz]
The point on the marking (below left) is the identifier for pin 1 of the module.
19. MECHANICAL REQUIREMENTS
No.
Item
Limit
Condition
1
Solderability
More than 75% of the soldering area shall be
coated by solder
Reflow soldering with
recommendable temperature
profile
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PANASONIC PART NUMBER
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20. RECOMMENDED LAND PATTERN
35.0 mm
53
32
Pad 1 = 4 x 1.40mm x 1.40mm
15.0 mm
14.6
Antenna
Pad 2 = 58 x 0.70mm x 1.40mm
Top View
In comparison to the module, we recommend
to use 50µm bigger pad size to each direction!
1
min. 5.0
When using the ceramic antenna, this minimum
area is restricted, means no ground, no line and in
general no metal, e.g. screws
min. 5.0
22
28.35
Dimensions in millimeters.
The land pattern dimensions above are meant to serve only as a guid. This information is
provided without any legal liability.
For the footprint, it is recommended to incorporate a 50µm bigger size for the pads in each
direction compared to the module footprint. Please refer to chapter 17. Foot Print of the Module.
For the solder paste screen, please use the same screen for the module. Solder paste screen
cutouts (with slightly different dimensions) might be optimum depending on your soldering
process For example, the chosen solder paste screen thickness might havean effect. The solder
screen thickness depends on your production standard. We recommend 120µm to 150µm.
IMPORTANT:
Although the bottom side of PAN4561 is fully coated, no copper such as through hole vias,
planes or tracks on the board component layer should be located below the PAN4561 to avoid
creating a short. In cases where a track or through hole via has to be located under the module,
please make a note that it has to be kept away from PAN4561 bottom pads. The PAN4561
multilayer pcb contains an inner RF shielding plane, therefore no pcb shielding plane below the
module is needed.
When using the antenna pad version, place the antenna on the edge of your carrier board (if
allowable).
If you have any questions on these points, please contact your local Panasonic representative.
Before releasing the layout, we recommend to sent the schematic and layout for final check to
wireless@eu.panasonic.com.
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CLASSIFICATION
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MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
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DATE
30.05.2016
21. RELIABILITY TESTS
The measurement should be done after being exposed to room temperature and humidity for 1
hour.
Die Messungen sollten erst nach einer Stunde Lagerung unter normalen Bedingungen erfolgen.
No.
Item
Limit
1
Vibration test
Electrical parameter should be
in specification
2
Shock test
the same as above
3
Heat cycle test
the same as above
4
5
6
Moisture test
Low temp. test
High temp. test
the same as above
the same as above
the same as above
Condition
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
Dropped onto hard wood from height of 50cm for
3 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
+60°C, 90% RH, 300h
-40°C, 300h
+85°C, 300h
22. CAUTIONS
Failure to do so may result in degrading of the product’s functions and damage to the product.
22.1.
DESIGN NOTES
(1)
(2)
(3)
(4)
(5)
(6)
22.2.
Please follow the conditions written in this specification, especially the control
signals of this module.
The supply voltage has to be free of AC ripple voltage (for example from a
battery or a low noise regulator output). For noisy supply voltages, provide a
decoupling circuit (for example a ferrite in series connection and a blocking
capacitor to ground of at least 47uF directly at the module).
This product should not be mechanically stressed when installed.
Heat is the major cause of shortening the life of these products. Please keep this
product away from heat.
Avoid assembly and use of the target equipment in conditions where the
products' temperature may exceed the maximum tolerance.
The supply voltage should not be exceedingly high or reversed. It should not
carry noise and/or spikes.
Please keep this product away from other high frequency circuits.
INSTALLATION NOTES
(1)
(2)
(3)
Reflow soldering is possible twice based on the conditions in chapter 15.
Please set up the temperature at the soldering portion of this product according
to this reflow profile.
Carefully position the products so that their heat will not burn into printed circuit
boards or affect the other components that are susceptible to heat.
Carefully locate these products so that their temperatures will not increase due
to the effects of heat generated by neighboring components.
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(4)
(5)
(6)
(7)
(8)
(9)
22.3.
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
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DATE
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If a vinyl-covered wire comes into contact with the products, then the cover will
melt and generate toxic gas, damaging the insulation. Never allow contact
between the cover and these products to occur.
This product should not be mechanically stressed or vibrated when reflowed.
If you want to repair your board by hand soldering, please keep the conditions of
this chapter.
Please do not wash this product.
Please refer to the recommended pattern when designing a board.
Pressing on parts of the metal cover or fastening objects to the metal will cause
damage to the unit.
USAGE CONDITIONS NOTES
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Please take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied
to the products, check and evaluate their operation befor assembly on the final
products.
Please do not use dropped products.
Please do not touch, damage or place dirt on the pins.
Please follow the recommended condition ratings about the power supply
applied to this product.
Electrode peeling strength: Do not add pressure of more than 4.9N when
soldered on PCB.
Pressing on parts of the metal cover or fastening objects to the metal cover will
cause damage.
These products are intended for general purpose and standard use in general
electronic equipment, such as home appliances, office equipment, information
and communication equipment.
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22.4.
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
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DATE
30.05.2016
STORAGE NOTES
(1)
(2)
(3)
(4)
(5)
(6)
22.5.
The module may not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely
affected:
Storage in salty air or in an environment with a high concentration of corrosive
gas, such as Cl2, H2S, NH3, SO2, or NOX
Storage in direct sunlight
Storage in an environment where the temperature may be outside the range of
5°C to 35°C range, or where the humidity may be outside the 45 to 85% range.
Storage of the products for more than one year after the date of delivery at your
company if the avoidance all the above conditions (1) to (3) have been met.
Storage period: Please check the adhesive strength of the embossed tape and
soldering after 6 months of storage.
Please keep this product away from water, poisonous gas and corrosive gas.
This product should not be stressed or shocked when transported.
Please follow the specification when stacking packed crates (max. 10).
SAFETY CAUTIONS
These specifications are intended to preserve the quality assurance of products and
individual components.
Before use, check and evaluate the operation when mounted on your products. Abide by
these specifications, without deviation when using the products. These products may shortcircuit. If electrical shocks, smoke, fire, and/or accidents involving human life are
anticipated when a short circuit occurs, then provide the following failsafe functions, as a
minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a
protection device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
22.6.
OTHER CAUTIONS
(1)
(2)
(3)
(4)
(5)
This specification sheet is copyrighted. Please do not disclose it to a third party.
Please do not use the products for other purposes than those listed.
Be sure to provide an appropriate fail-safe function on your product to prevent an
additional damage that may be caused by the abnormal function or the failure of
the product.
This product has not been manufactured with any ozone chemical controlled
under the Montreal Protocol.
These products are not intended for other uses, other than under the special
conditions shown below. Before using these products under such special
conditions, check their performance and reliability under the said special
conditions carefully to determine whether or not they can be used in such a
manner.
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places
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(6)
(7)
PANASONIC PART NUMBER
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No.
REV.
DS-4561-2400-102
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DATE
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where liquid may splash.
In direct sunlight, outdoors, or in a dusty environment
In an environment where condensation occurs.
In an environment with a high concentration of harmful gas (e.g. salty air,
HCl, Cl2, SO2, H2S, NH3, and NOX)
If an abnormal voltage is applied due to a problem occurring in other
components or circuits, replace these products with new products because they
may not be able to provide normal performance even if their electronic
characteristics and appearances appear satisfactory.
When you have any question or uncertainty, both of you and Panasonic
sincerely cope with it.
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23. PACKAGING
23.1.
TAPE DIMENSION
23.2.
PACKING IN TAPE
1 x circumference /hub
(min 160mm)
32
53
22
22
1
1
32
Antenna
trailer (empty)
Antenna
53
Direction of unreeling (for customer)
component
packed area
standard 500pcs
leader (empty)
minimum 10 pitch
Top cover tape
more than 1 x
circumference plus
100mm to avoid
fixing of tape end on
sealed modules.
Empty spaces in component packed area shall be less than two per reel and those spaces
shall not be consecutive.
Top cover tape shall not be found on reel holes and shall not stick out from reel.
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03
05
Pin 1 Marking
(Top Side)
1
ENWC9A22A4EF
Direction of unreeling
(for customer)
000001
081211
COMPONENT DIRECTION
PAN4561 ES
23.3.
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
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PAGE
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DATE
30.05.2016
Pin 1
(Bottom Side)
Antenna
Please refer also to chapter 18. Labeling Drawing
23.4.
REEL DIMENSION
TAPE SIZE
A
MAX
B
MIN
24mm
330.0
1.5
C
13 +0.5
-0.2
D
MIN
±1.0
N
20.2
100.0
All dimensions in millimeters unless otherwise stated
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
W1
25.0 +2.0
-0.0
W2
MAX
30.4
W3
24.4 +3.0
-0.5
Assembly
Method
*Latch
*Latch (2PC)
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23.5.
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
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REV.
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30.05.2016
LABEL FOR PACKAGE
The label below shows only an example.
(3P):PAN4561v
Customer Code
(1T):
(1P)
(2P)
(3P)
(9D)
(Q)
(HW/SW)
[[G]]
ENWC9A22xxEF
Lotcode [YYWWDLL]
YY
year
today 10
WW normal calendar week
today 01
D
day
today 5 (Friday)
L
line identifier, if more as one
actual 1
L
lot identifier per day
e.g. 1, 2, 3…
Customer Order Code, if any, otherwise put company name on it.
Panasonic Part Number
Module type [PAN4561H, PAN4561M or PAN4561L]
Datecode as [2xYear, 2xMonth, 2xDay]
Quantity [XXXX], variable
Hardware /Software Release identifier
Identifier that the product is RoHS conform, please refer to chapter 25.
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23.6.
PRODUCT SPECIFICATION
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
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TOTAL PACKING HANDLING
moisture-sensitive print
(already exist on barrier bag)
barcode
label
barrier bag
sealed
desiccant 1) 2)
moisture indicator
1) quantity of desiccant according
to calculation
2) optional: desiccant placed into
the corner of the barrier bag
barcode
label
inner carton box
size 340 x 340 x 41 mm³
23.7.
COVER TAPE REEL STRENGTH
Force direction
θ = 10deg
Speed = 300mm/min.
Cover tape reel strength
=0.098~0.68N (10~70g)
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.pansonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
28 of 34
DATE
30.05.2016
24. ORDERING INFORMATION
24.1.
No.
PAN4561H
Ordering part number
Description
Engineering Sample PAN4561H
802.15.4 Mesh Network Module, which includes Ceramic Antenna,
Low Noise Amplifier, up to +20dBm Power Amplifier and 60kBit
Flash Memory.
Synapse SNAP software included, please refer also to [9].
Engineering Sample PAN4561H
802.15.4 Mesh Network Module, which includes UFL connector,
Low Noise Amplifier, up to +20dBm Power Amplifier and 60kBit
Flash Memory.
Synapse SNAP software included, please refer also to [9].
Engineering Sample PAN4561H
802.15.4 Mesh Network Module, which includes RF out on SMD
pad, Low Noise Amplifier, up to +20dBm Power Amplifier and
60kBit Flash Memory.
Synapse SNAP software included, please refer also to [9].
Same as number 1, but with Software:
SN55 from E-Senza, please refer also to [8]
Same as number 2, but with Software:
SN55 from E-Senza, please refer also to [8]
Same as number 3, but with Software:
SN55 from E-Senza, please refer also to [8]
1
ENWC9A22A4EF
2
ENWC9A22B4EF
3
ENWC9A22C4EF
4
ENWC9A22A2EF
5
ENWC9A22B2EF
6
ENWC9A22C2EF
7
ENWC9A22A1EF
Same as number 1, but with Freescale based SMAC test software.
8
ENWC9A22B1EF
Same as number 2, but with Freescale based SMAC test software.
9
ENWC9A22C1EF
Same as number 3, but with Freescale based SMAC test software.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.pansonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
24.2.
No.
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
29 of 34
DATE
30.05.2016
PAN4561M
Ordering part number
Description
Engineering Sample PAN4561M
802.15.4 Mesh Network Module, which includes Ceramic Antenna,
Low Noise Amplifier, up to +10dBm Power Amplifier and 60kBit
Flash Memory.
Synapse SNAP software included, please refer also to [9].
Engineering Sample PAN4561M
802.15.4 Mesh Network Module, which includes UFL connector,
Low Noise Amplifier, up to +10dBm Power Amplifier and 60kBit
Flash Memory.
Synapse SNAP software included, please refer also to [9].
Engineering Sample PAN4561M
802.15.4 Mesh Network Module, which includes RF out on SMD
pad, Low Noise Amplifier, up to +10dBm Power Amplifier and
60kBit Flash Memory.
Synapse SNAP software included, please refer also to [9].
Same as number 1, but with Software:
SN55 from E-Senza, please refer also to [8]
Same as number 2, but with Software:
SN55 from E-Senza, please refer also to [8]
Same as number 3, but with Software:
SN55 from E-Senza, please refer also to [8]
1
ENWC9A25A4EF
2
ENWC9A25B4EF
3
ENWC9A25C4EF
4
ENWC9A25A2EF
5
ENWC9A25B2EF
6
ENWC9A25C2EF
7
ENWC9A25A1EF
Same as number 1, but with Freescale based SMAC test software.
8
ENWC9A25B1EF
Same as number 2, but with Freescale based SMAC test software.
9
ENWC9A25C1EF
Same as number 3, but with Freescale based SMAC test software.
24.3.
PAN4561L
No.
Ordering part number
Description
Engineering Sample PAN4561L
802.15.4 Mesh Network Module, which includes Ceramic Antenna,
up to 0dBm output power and 60kBit Flash Memory.
Synapse SNAP software included, please refer also to [9].
Engineering Sample PAN4561L
802.15.4 Mesh Network Module, which includes UFL connector, up
to 0dBm output power and 60kBit Flash Memory.
Synapse SNAP software included, please refer also to [9].
Engineering Sample PAN4561L
802.15.4 Mesh Network Module, which includes RF out on SMD
pad, up to 0dBm output power and 60kBit Flash Memory.
Synapse SNAP software included, please refer also to [9].
Same as number 1, but with Software:
SN55 from E-Senza, please refer also to [8]
Same as number 2, but with Software:
SN55 from E-Senza, please refer also to [8]
Same as number 3, but with Software:
SN55 from E-Senza, please refer also to [8]
1
ENWC9A21A4EF
2
ENWC9A21B4EF
3
ENWC9A21C4EF
4
ENWC9A21A2EF
5
ENWC9A21B2EF
6
ENWC9A21C2EF
7
ENWC9A21A1EF
Same as number 1, but with Freescale based SMAC test software.
8
ENWC9A21B1EF
Same as number 2, but with Freescale based SMAC test software.
9
ENWC9A21C1EF
Same as number 3, but with Freescale based SMAC test software.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.pansonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
30 of 34
DATE
30.05.2016
25. ROHS DECLARATION
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on declaration of our suppliers that this
product does not contain the following substances which are banned by Directive 2002/95/EC
(RoHS) or contains a maximum concentration of 0.1% by weight in homogeneous materials for
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for
Cadmium and cadmium compounds
26. DATA SHEET STATUS
This data sheet contains data from the PRELIMINARY specification. Supplementary data will be
published at a later date. Panasonic Electronic Devices Europe GmbH reserves the right to
change the specification without notice, in order to improve the design and supply the best
possible product.
Please consult the most recently issued data sheet before initiating or completing a design.
If there is an update, please download under: PAN4561 Latest Data Sheet!
27. REGULATORY INFORMATION
27.1. FCC NOTICE
The device PAN4561, including the ceramic antenna (ENWC9A2xAxEF) and also the SMD
type (ENWC9A2xCxEF), including with the antennas, which are listed in 27.5, complies
with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter
approval as detailed in FCC public Notice DA00-1407.transmitter under following
restrictions:
PAN4561H
1) Channel 26, according to [1] IEEE 802.15.4, must not be used
2) Maximum output power of 18.5dBm allowed. This level refers to the value 0xDC in SPI
register 12 of MC13213 (refer to [2] and [3]).
3) Duty cycle of 1% allowed
PAN4561M
1) Channel 26, according to [1] IEEE 802.15.4, must not be used
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.pansonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
31 of 34
DATE
30.05.2016
PAN4561L
No restrictions
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.
27.2. CAUTION
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by Panasonic Electronic Devices Europe GmbH
may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help
27.3. LABELING REQUIREMENTS
The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements
are met. This includes a clearly visible label (laser marking) on the outside of the OEM
enclosure specifying the appropriate Panasonic FCC identifier for this product as well as
the FCC Notice above. The FCC identifier is FCC ID: T7V4561HM.
In any case end product must be labelled exterior with "Contains FCC ID: T7V4561HM"
27.4. ANTENNA WARNING
The related part number for this device is ENWC9A2xBxEF (PAN4561 with U.FL
connector) and ENWC9A2xCxEF (PAN4561 with SMD pad). For details, please see the
chapter 24. Ordering Information. This device is tested with a standard SMA connector and
with the antennas listed below. When integrated in the OEMs product, these fixed antennas
require installation preventing end-users from replacing them with non-approved antennas.
Any antenna not in the following table must be tested to comply with FCC Section 15.203
for unique antenna connectors and Section 15.247 for emissions. The FCC identifier for
this device with the antenna listed in item 1 are the same (FCC ID: T7V4561HM).
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.pansonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
32 of 34
DATE
30.05.2016
27.5. APPROVED ANTENNA LIST
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item
Part Number
Manufacturer
Frequency Band
Type
Gain (dBi)
1
2
27.6. RF EXPOSURE PAN4561
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer
(OEM) must ensure that the approved antenna in the previous table must be installed.
The preceding statement must be included as a CAUTION statement in manuals for
products operating with the approved antennas in the previous table to alert users on FCC
RF Exposure compliance.
Any notification to the end user of installation or removal instructions about the integrated
radio module is not allowed.
The radiated output power of PAN4561 with mounted ceramic antenna
(FCC ID: T7V4561HM) is below the FCC radio frequency exposure limits. Nevertheless,
the PAN4561 shall be used in such a manner that the potential for human contact during
normal operation is minimized.
End users may not be provided with the module installation instructions. OEM integrators
and end users must be provided with transmitter operating conditions for satisfying RF
exposure compliance.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.pansonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
33 of 34
DATE
30.05.2016
28. RELATED DOCUMENTS
For an update, please search in the suitable homepage.
[1]
IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical
Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[2]
Technical Data MC1321x Document Number: MC1321x
Rev. 1.1, 03/2007 Freescale Semiconductor
[3]
MC1321x Reference Manual Document Number: MC1321xRM
Rev. 1.1, 10/2006 Freescale Semiconductor
[4]
Handling MAC Address erasure, AN2825, Rev. 0.0 10/2004, Freescale Semiconductor
[5]
802154MPSUG 802.15.4 MAC/PHY Software User´s Guide, Rev 1.1, Freescale
Semiconductor
[6]
802154EBRM.pdf
802.15.4 Embedded Bootloader Reference Manual Rev. 0.0 09/2004
[7]
AN2771 802.15.4 PHY Protocol Test Client (PTC) Rev. 0.0 Freescale Semiconductor
[8]
Manual to the E-Senza SN55 Programmer Interface Manual [Download]
[9]
Manual to the Evaluation Kit from Synapse, which fits to module hardware from Panasonic
[Downloads: SNAP Reference Manual Updated 10/2/2008; SNAP Hardware Technical
Manual Updated 10/2/2008]
Each new release from Synapse, will be posted here. Be sure to be registered free under
http://forums.synapse-wireless.com.
[10] Technical Data CC2591 (2.4-GHz RF Front End) from Texas Instruments
CC2591 2.4 GHz RF Front End (Rev. A; 10. Juni 2008)
[11] Question and Answer Sheet for CC2590 and CC2591
CC2590 and CC2591 Q&A Sheet (Rev. D; 26. January 2010)
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.pansonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
MODEM FOR 802.15.4 IEEE STANDARD
CUSTOMER’S CODE
PAN4561H /M /L
PANASONIC PART NUMBER
ENWC9A22xxEF / .25xx. / .21xx.
No.
REV.
DS-4561-2400-102
I
PAGE
34 of 34
DATE
30.05.2016
29. GENERAL INFORMATION
© Panasonic Electronic Devices Europe GmbH 2009.
All rights reserved.
This product description does not claim to be complete and free of mistakes.
Please contact the related product manager with any errata inquries.
If we deliver samples to the customer, these samples have the status Engineering Samples.
This means, the design of this product is not yet completed. Engineering Samples may be
partially or fully functional, and there may be differences published in the Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic Electronic Devices Europe GmbH disclaims any liability or product warranty for
Engineering Samples. In particular, Panasonic Electronic Devices Europe GmbH disclaims
liability for damages caused by
the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in an other product to be sold by Customer,
deviation or lapse in function of Engineering Sample,
improper use of Engineering Samples.
Panasonic Electronic Devices Europe GmbH disclaimes any liability for consequential and
incidental damages. In case of any questions, please contact your local sales partner or the
related product manager.
U
30. LIFE SUPPORT POLICY
This Panasonic Electronic Devices Europe GmbH product is not designed for use in life
support appliances, devices, or systems where malfunction can reasonably be expected to
result in a significant personal injury to the user, or as a critical component in any life support
device or system whose failure to perform can be reasonably expected to cause the failure of
the life support device or system, or to affect its safety or effectiveness. Customers using or
selling these products for use in such applications do so at their own risk and agree to fully
indemnify Panasonic Electronic Devices Europe GmbH for any damages resulting.
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