ERA-6YEB511V

Metal Film Chip Resistors Metal Film Chip Resistors 0603, 0805 Type: ERA 3Y, 6Y ■ Features ● Small size and lightweight ● High reliability Low T.C.R. & current noise, excellent non-linearity ● Suitable for both reflow and flow soldering ● Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2133A ● RoHS compliant ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E R A 3 Y E B 1 0 2 V Product Code Metal Film Chip Resistors Size, Power Rating Type: inches Power Rating 0.1 W 3Y : 0603 0.125 W 6Y : 0805 Temperature Coefficient T.C.R. Code ±25
10–6/°C (ppm/°C) E ±50
10–6/°C (ppm/°C) H ±100
10–6/°C (ppm/°C) K Resistance Tolerance Code Tolerance B ±0.1 % D ±0.5 % Code V Packaging Methods Packaging Punched Carrier Taping 4 mm pitch Type ERA3Y ERA6Y Resistance Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. ■ Construction ■ Dimensions in mm (not to scale) L Protective coating a Alumina substrate Electrode (Inner) W t b Electrode (Between) Type (inches) High reliability metal film Electrode (Outer) Dimensions (mm) L ERA3Y (0603) 1.60 ERA6Y (0805) 2.00 W ±0.20 0.80 ±0.20 1.25 a b ±0.20 0.30 ±0.20 0.30 ±0.10 0.40 ±0.25 0.40 Mass (Weight) [g/1000 pcs.] t ±0.20 0.45 ±0.25 0.50 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. ±0.10 2 ±0.10 4 Aug. 2008 Metal Film Chip Resistors ■ Ratings Type (inches) Limiting Element Maximum Overload Resistance Power Rating (2) Voltage (Maximum Voltage Tolerance at 70 °C (W) (1) RCWV) (V) (V) (%) ERA3Y 0.1 (0603) 75 150 10 100 36 k 100 10 100 110 k 100 ±0.5 ±0.1 ERA6Y 0.125 (0805) 100 200 Resistance (3) Range () ±0.5 ±0.1 to 91 (E24) to 33 k (E24) to 330 k (E24) to 33 k (E24) to 91 (E24) to 100 k (E24) to 1 M (E24) to 100 k (E24) T.C.R. Category Temperature [
10 –6 /°C Range (Operating Temperature Range) (ppm/°C)] (°C) ± 50 ± 25 ±100 ± 25 –55 to +125 ± 50 ± 25 ±100 ± 25 (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Rated Power
Resistance Values, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5
Power Rating or max. Overload Voltage listed above whichever less. (3) E96 series resistance values are also available. Please contact us for details. Part Number of E96 series is shown ERA3E. , ERA6E. –55 °C 100 Rated Load (%) Power Derating Curve For resistors operated in ambient temperatures above 70 °C, power rating shall be derated in accordance with the figure on the right. 70 °C 80 60 40 20 125 °C 0 –60 –40 –20 0 20 40 60 80 100 120 140 160 180 Ambient Temperature (°C) ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping ERA3Y Punched Carrier Taping ERA6Y ● Punched Carrier Taping Pitch (P1) Quantity 4 mm 5000 pcs./reel ● Taping Reel T Compartment φC E Sprocket hole φD0 B F W φB A T Chip component P1 P2 P0 Tape running direction φA Dimensions (mm) Dimensions (mm) Type A B W F E 3Y 1.10 ±0.10 1.90 ±0.10 8.00 ±0.20 3.50 ±0.05 1.75 ±0.10 6Y 1.65 ±0.15 2.50 ±0.20 Type P1 P2 P0 T φD 0 ±0.05 3Y 0.70 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 1.50 +0.10 –0 6Y 0.84±0.05 Dimensions (mm) Dimensions (mm) Type 3Y 6Y Type 3Y 6Y W φA 180.0 +0 –3.0 φB φC 60 min. 13.0 ±1.0 W T 9.0 ±1.0 11.4±1.0 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aug. 2008 Metal Film Chip Resistors ■ Recommended Land Pattern In case of flow soldering, the land width must be smaller than the Chip Resistor width to properly control the solder amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). Type (inches) c Chip Resistor a b a Dimensions (mm) b c ERA3Y (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERA6Y (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 5 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ● Recommended soldering conditions for flow Preheating Soldering For soldering Temperature Time 140 °C to 180 °C 60 s to 120 s 245 ± 5 °C 20 s to 30 s For lead-free soldering Temperature Time 150 °C to 180 °C 60 s to 120 s max. 260 °C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Keep the rated power and ambient temperature within the specified derating curve. * When positioning and mounting Metal Film Chip Resistors (hereafter called the resistors), make allowance for the effect of heat generated through close contact between the resistors and neighboring components and for the temperature rise of adjacent heat-generating components. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. When applying pulses to the resistors, keep the pulse peak within the rated voltage. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006