Metal Film Thermosensitive Chip Resistors
Metal Film Thermosensitive Chip Resistors
Discontinued
0402, 0603, 0805
Type:
ERAW, V, S
・Planed final production: March.2018
■ Features
● Suitable for temperature correction circuits
–6
● Temperature coefficient value 1500 to 3900 10 /°C
● High performance
Quick response to temperature change
● Linearity
Excellent linear resistance value change in wide temperature range (–40 °C to +125 °C)
● High reliability, High density placing
● Small size and lightweight for PWB size reduction and lightweight products
● Suitable for both reflow and flow soldering
● Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2145
● RoHS compliant
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
R
A
S
1
5
J
1
0
3
V
Product Code
Metal Film
Chip Resistors
Size, Power Rating
Type: inches Power Rating
W : 0402
0.031 W
V : 0603
0.063 W
S : 0805
0.1 W
Temperature Coefficient of Resistance
Code
Type
(10–6/°C)
15
ERAV, ERAS
1500
27
ERAW, ERAV, ERAS
2700
33
ERAW, ERAV, ERAS
3300
39
ERAV, ERAS
3900
■ Construction
Resistance Tolerance
Code
J
Packaging Methods
Packaging
Type
Punched Carrier Taping
ERAW
2 mm pitch, 10,000 pcs.
Code
Tol.
±5%
X
Punched Carrier Taping ERAV
4 mm pitch, 5,000 pcs. ERAS
V
Resistance Value
The first two digits are significant figures of
resistance and the third one denotes number of
zeros following. Decimal point is expressed by “R ”.
(ex.) 103 : 10 k
6R8 : 6.8
■ Dimensions in mm (not to scale)
L
a
Protective coating
Alumina substrate
Electrode (Inner)
W
(1)
t
b
Electrode
(Between)
Thermosensitive
element
L
ERAW
(0402)
1.00
ERAV
(0603)
ERAS
(0805)
Electrode (Outer)
Dimensions (mm)
Type
(inches)
W
±0.07
0.50
1.60
±0.20
2.00
±0.20
a
±0.05
0.15
0.80
±0.20
0.30
1.25
±0.10
b
±0.10
0.25
±0.20
0.30
±0.25
0.40
Mass (Weight)
[g/1000 pcs.]
t
±0.07
0.35
±0.20
0.45
±0.25
0.40
±0.05
0.6
±0.10
2
±0.10
4
0.50
1) Marking Temperture Coefficient value :
–6
2 significant figure 100 10 /°C
ERAW type is no marking.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Oct. 2010
Metal Film Thermosensitive Chip Resistors
■ Ratings
Type
(inched)
Power Rating
at 70 °C
(W)
ERAW
(0402)
0.031
ERAV
(0603)
Standard Specification
T.C.R.
(2)
(10 –6 /°C)
Resistance
Range ()
2700
3300
43 to 1 k
22 to 390
1500
2700
3300
3900
1500
2700
3300
3900
10 to 10 k
43 to 3.3 k
22 to 1.2 k
7.5 to 390
10 to 10 k
43 to 5.1 k
22 to 1.8 k
6.2 to 470
0.063
ERAS
(0805)
(1)
0.1
T.C.R.
Tolerance
Resistance
Tolerance
(%)
Standard
Resistance
Values
±10 %
±5
E12
±5
E12
±5
E12
±200 10 -6 / °C
±10 %
±200 10 -6 / °C
±10 %
(1) Please ask us when resistors other than standard specification shown in the above table are needed.
(2) T.C.R.=
{ R R-R
75
25
25
6
–6
1
10 10 / ° C R25: Resistance value at reference temperature 25 °C
75–25
R75: Resistance value at temperature 75 °C
}
Power Derating Curve
For resistors operated in ambient
tem per a tures above 70 °C, power rating
shall be derated in accordance with the
figure on the right.
Rated Load (%)
120
Category Temperature Range
–40 °C to +125 °C
70 °C
100
80
60
40
125 °C
20
0
–40
–20
0
20
40
60
80
100
120
140
Ambient Temperature(°C)
■ Typical Linearity of Resistance Change
Resistance Change (%)
60
50
40
390010–6/°C (ppm/°C)
30
270010–6/°C (ppm/°C)
20
150010–6/°C (ppm/°C)
10
0
–10
–20
–30
–40
–25
0
25
50
75
100
125
Ambient Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2010
Metal Film Thermosensitive Chip Resistors
■ Packaging Methods (Taping)
● Standard Quantity
Type
Kind of Taping
Pitch (P1)
Quantity
2 mm
10000 pcs./reel
4 mm
5000 pcs./reel
ERAW
Punched Carrier Taping
ERAV
ERAS
● Carrier Tape
(Unit : mm)
Punched Carrier
P1
P2
P0
B
W
F
E
φD0
Type
A
B
ERAW
0.67±0.05
1.17±0.05
ERAV
1.10 ±0.10
1.19 ±0.10
ERAS
±0.15
±0.20
1.65
P1 (2 mm pitch)
A
T
2.50
W
F
E
P1
P2
φD 0
P0
T
2.00 ±0.10
8.00 ±0.20
3.50 ±0.05
1.75 ±0.10
4.00 ±0.10
0.52±0.05
2.00 ±0.05
4.00 ±0.10
1.50 +0.10
–0
0.70 ±0.05
0.84±0.05
● Taping Reel
(Unit : mm)
Type
ERAW
ERAV
ERAS
φN
φC
W1
W2
180.0 +0
–1.5
60 +1.0
–0
13.0 ±0.2
9.0 +1.0
–0
11.4±1.0
φN
φC
φA
W1
φA
W2
■ Attention
This product has high temperature coefficient. When measuring resistance, the resistance value can change due
to Joule Heating. Therefore, the measuring current shall be very small in order to prevent the resistance value from
changing. (For example, when the resistor is used at RCWV, temperature of the resistor rise about 15 °C and the
resistance value rise a few percents.) Resistance value may also change due to the ambient temperature. Resistance
value is measured at 25 °C.
■ Recommended Land Pattern
Anexample of a land pattern to Metal Film Thermosensitive Chip Resistors is shown below.
Example
c
Chip Resistor
a
Type
(inch size)
ERAW
(0402)
ERAV
(0603)
ERAS
(0805)
Dimensions (mm)
a
b
c
0.5 to 0.6
1.4 to 1.6
0.4 to 0.6
0.7 to 0.9
2.0 to 2.2
0.8 to 1.0
1.0 to 1.4
3.2 to 3.8
0.9 to 1.4
b
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2010
Metal Film Thermosensitive Chip Resistors
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
● Recommended soldering conditions for flow
Preheating
Soldering
For soldering
Temperature
Time
140 °C to 180 °C
60 s to 120 s
245 ± 5 °C
20 s to 30 s
For lead-free soldering
Temperature
Time
150 °C to 180 °C
60 s to 120 s
max. 260 °C
max. 10 s
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Keep the rated power and ambient temperature within the specified derating curve.
* When positioning and mounting Metal Film Thermosensitive Chip Resistors (hereafter called the resistors), make
allowance for the effect of heat generated through close contact between the resistors and neighboring components
and for the temperature rise of adjacent heat-generating components.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
When applying pulses to the resistors, keep the pulse peak within the rated voltage.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be
impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during
handling of the boards with the resistors mounted.
7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Sep. 2010
Safety Precautions (Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products.
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
01 Aug. 2012
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