ERB-RG2R50V

Micro Chip Fuse Micro Chip Fuse Type: ERBRD ERBRE ERBRG Features ● Small size ● Fast-acting ● RoHS and withstanding in-rush current characteristics compliant Approved Safety Standards UL248-14 : File No.E194052 c-UL C22.2 No.248-14 : File No.E194052 Explanation of Part Numbers Product Code Micro Chip Fuse 1 2 3 4 5 6 7 8 9 10 E R B R D 1 R 0 0 X Structure R Rectangular type D Product shape 0402 inch size (1.0 mm×0.5 mm) E 0603 inch size (1.6 mm×0.8 mm) G 1206 inch size (3.2 mm×1.6 mm) Construction Code Rated Current (A) 0R25 0.25 A 1R40 1.4 A 0R31 0.315 A 1R50 1.5 A 0R37 0.375 A 2R00 2.0 A 0R50 0.50 A 2R50 2.5 A 0R63 0.63 A 3R00 3.0 A 0R75 0.75 A 3R15 3.15 A 1R00 1.0 A 4R00 4.0 A 1R25 1.25 A 5R00 5.0 A X V Packaging Pressed Carrier Taping 2 mm pitch, 10,000 pcs. Punched Carrier Taping 4 mm pitch, 5,000 pcs. Part No. ERBRD ERBRE ERBRG Dimensions in mm (not to scale) L a Protective Coating W Electrode (Base) t b Fusing Element Almina Substrate Electrode (Outer) Part No. (inch size) ERBRD (0402) ERBRE (0603) ERBRG (1206) Mass (Weight) (g/1000 pcs.) Dimensions (mm) L W a ±0.10 0.50 –0.05 0.15 ±0.15 0.80 –0.05 0.24 ±0.20 1.60 1.00 1.60 3.20 b +0.10 ±0.10 0.25 +0.15 ±0.15 0.30 ±0.20 0.55 ±0.15 0.30 t ±0.10 0.39 ±0.10 0.7 ±0.15 0.54 ±0.10 2.2 ±0.20 0.65 ±0.10 10 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 Micro Chip Fuse Ratings ● 0402 inch /1005 mm size : Type ERBRD Part No. Rated Current (A) Marking Code Internal R (mΩ) at 25 °C max. ERBRD□R□□X 0R25 0R31 0R37 0R50 0R63 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00 5R00 0.25 0.315 0.375 0.5 0.63 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 5.0 V X Y F 6 G H J K N O P S T 700 520 440 310 220 190 125 82 70 53 42 37 24 19.5 Rated Current ×100 % / 4 hours min. Fusing Current/Fusing Time (at 25 °C) Rated Current ×200 % / 5 seconds max. Rated Current ×300 % / 0.2 seconds max. Rated Voltage (Open Circuit Voltage) (V) DC Interrupting Rating at Rated Voltage (A) 32 35 Category Temp. Range (°C) ● −40 to +125 0603 inch / 1608 mm size : Type ERBRE Part No. Rated Current (A) Marking Code Internal R (mΩ) at 25 °C max. ERBRE□R□□V 0R50 0R75 1R00 1R25 1R40 1R50 2R00 2R50 3R00 3R15 4R00 5R00 0.5 0.75 1.0 1.25 1.4 1.5 2.0 2.5 3.0 3.15 4.0 5.0 F G H J 14 K N O P 31 S T 330 190 125 94 85 72 51 40 33 32 22 19 Rated Current ×100 % / 4 hours min. Fusing Current/Fusing Time (at 25 °C) Rated Current ×200 % / 5 seconds max. Rated Current ×300 % / 0.2 seconds max. Rated Voltage (Open Circuit Voltage) (V) DC Interrupting Rating at Rated Voltage (A) 32 50 Category Temp. Range (°C) ● −40 to +125 1206 inch / 3216 mm size : Type ERBRG Part No. Rated Current (A) Marking Code Internal R (mΩ) at 25 °C max. Fusing Current/Fusing Time (at 25 °C) Rated Voltage (Open Circuit Voltage) (V) DC Interrupting Rating at Rated Voltage (A) ERBRG□R□□V 0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 F G H J K N O P S 560 340 210 175 115 85 65 45 35 Rated Current ×100 % / 4 hours min. Rated Current ×200 % / 5 seconds max. Rated Current ×300 % / 0.2 seconds max. 63 Category Temp. Range (°C) 32 50 −40 to +125 ✽ The thin type is available about 1005 (0402 inch) size. Please contact us for details. ✽ Please contact us when another rated current is needed. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 Micro Chip Fuse 10 10 1 Fusing Time (s) 1 Fusing Time (s) 0.5 A ● 0603 inch / 1608 mm size (Type ERBRE) 0.25 A 0.315 A 0.375 A 0.5 A 0.63 A 0.75 A 1.0 A 1.25 A 1.5 A 2.0 A 2.5 A 3.0 A 4.0 A 5.0 A ● 0402 inch / 1005 mm size (Type ERBRD) 0.75 A 1.0 A 1.25 A 1.4 A 1.5 A 2.0 A 2.5 A 3.0 A 3.15 A 4.0 A 5.0 A Fusing Characteristics (25 °C typical) 0.1 0.01 0.1 0.01 0.001 0.001 ✽ Reference Only ✽ Reference Only 1 0.5 A ● 1206 inch /3216 mm size (Type ERBRG) 10 10 Fusing Current (A) 0.0001 0.1 100 1 100 10 Fusing Current (A) 0.75 A 1.0 A 1.25 A 1.5 A 2.0 A 2.5 A 3.0 A 4.0 A 0.0001 0.1 Fusing Time (s) 1 0.1 0.01 0.001 ✽ Reference Only 0.0001 0.1 1 Fusing Current (A) 10 100 Perfomance Resistance to Soldering Heat Performance Requirements Within Specified Tolerance ±10 % Rapid Change of Temperature ±10 % –40 °C (30 min.) / +125 °C (30 min.), 5 cycles Damp Heat, Steady State ±10 % 60 °C, 90 % to 95 %RH, 1000 h (no load) Load Life in Humidity ±10 % 60 °C, 90 % to 95 %RH, Load: 70 % rated current, 1000 h Endurance at 70 °C ±10 % 70 °C , Load: 70 % rated current, 1000 h Test Item Resistance Test Conditions 25 °C 260 °C±5 °C, 10 s Recommended Soldering Conditions Dimensions (mm) Part No. (inch size) A B C ERBRD(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 A ERBRE(0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 B ERBRG(1206) 2.0 to 2.4 4.4 to 5.0 1.2 to 1.8 C Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 Micro Chip Fuse Packaging Methods ● Standard Quantity Part No. ERBRD ERBRE ERBRG Kind of Taping Pressed Carrier Taping Pitch (P1) 2 mm Quantity 10,000 pcs./ reel Punched Carrier Taping 4 mm 5,000 pcs./ reel (Unit : mm) Carrier Taping Pressed Carrier Punched Carrier T T P1 fD0 P2 ● (Unit : mm) Taping Reel P0 fC B fN W F E ● inch size 0402 0603 1206 W1 P1 (2 mm pitch) A fA Part No. A ERBRD 0.68 ERBRE ERBRG 1.20 1.10 ±0.10 1.90 2.00 ±0.15 3.60 Part No. P1 ERBRD 2.00 ERBRE ERBRG B ±0.10 W ±0.10 8.00 ±0.20 ±0.05 3.50 P2 P0 Part No. ERBRD ERBRE ERBRG ±0.10 1.75 0D0 ±0.10 ±0.10 E ±0.20 2.00 4.00 ±0.10 +0.10 0 1.50 0A 0N 0 180.0–1.5 60 +1.0 0 0C 13.0 ±0.2 W1 9.0 +1.0 0 W2 ±1.0 11.4 T 0.67 ±0.05 4.00 F ±0.10 W2 ±0.07 ±0.07 0.78 ±0.07 0.84 Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 5 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Preheating Heating Preheating Main heating Peak Temperature 150 °C to 180 °C Above 230 °C max. 260 °C Time 60 s to 120 s 30 s to 40 s max. 10 s Time ● Recommended Preheating Soldering soldering conditions for flow For soldering Temperature Time 140 °C to 180 °C 60 s to 120 s 245 ± 5 °C 20 s to 30 s For lead-free soldering Temperature Time 150 °C to 180 °C 60 s to 120 s max. 260 °C max. 10 s ● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. ● Never touch this product with the tip of a soldering iron. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 *XLGHOLQHVDQGSUHFDXWLRQVUHJDUGLQJWKH WHFKQLFDOLQIRUPDWLRQDQGXVHRIRXUSURGXFWV GHVFULEHGLQWKLVRQOLQHFDWDORJ ‫ٹ‬,I\RXZDQWWRXVHRXUSURGXFWVGHVFULEHGLQWKLVRQOLQHFDWDORJIRUDSSOLFDWLRQVUHTXLULQJ VSHFLDOTXDOLWLHVRUUHOLDELOLW\RUIRUDSSOLFDWLRQVZKHUHWKHIDLOXUHRUPDOIXQFWLRQRIWKH SURGXFWVPD\GLUHFWO\MHRSDUGL]HKXPDQOLIHRUSRWHQWLDOO\FDXVHSHUVRQDOLQMXU\ HJDLUFUDIWDQGDHURVSDFHHTXLSPHQWWUDIILFDQGWUDQVSRUWDWLRQHTXLSPHQWFRPEXVWLRQ HTXLSPHQWPHGLFDOHTXLSPHQWDFFLGHQWSUHYHQWLRQDQWLFULPHHTXLSPHQWDQGRUVDIHW\ HTXLSPHQWLWLVQHFHVVDU\WRYHULI\ZKHWKHUWKHVSHFLILFDWLRQVRIRXUSURGXFWVILWWRVXFK DSSOLFDWLRQV3OHDVHHQVXUHWKDW\RXZLOODVNDQGFKHFNZLWKRXULQTXLU\GHVNDVWRZKHWKHU WKHVSHFLILFDWLRQVRIRXUSURGXFWVILWWRVXFKDSSOLFDWLRQVXVHEHIRUH\RXXVHRXUSURGXFWV ‫ٹ‬7KHTXDOLW\DQGSHUIRUPDQFHRIRXUSURGXFWVDVGHVFULEHGLQWKLVRQOLQHFDWDORJRQO\DSSO\ WRRXUSURGXFWVZKHQXVHGLQLVRODWLRQ7KHUHIRUHSOHDVHHQVXUH\RXHYDOXDWHDQGYHULI\ RXUSURGXFWVXQGHUWKHVSHFLILFFLUFXPVWDQFHVLQZKLFKRXUSURGXFWVDUHDVVHPEOHGLQ\RXU RZQSURGXFWVDQGLQZKLFKRXUSURGXFWVZLOODFWXDOO\EHXVHG ‫ٹ‬,I\RXXVHRXUSURGXFWVLQHTXLSPHQWWKDWUHTXLUHVDKLJKGHJUHHRIUHOLDELOLW\UHJDUGOHVV RIWKHDSSOLFDWLRQLWLVUHFRPPHQGHGWKDW\RXVHWXSSURWHFWLRQFLUFXLWVDQGUHGXQGDQF\ FLUFXLWVLQRUGHUWRHQVXUHVDIHW\RI\RXUHTXLSPHQW ‫ٹ‬7KHSURGXFWVDQGSURGXFWVSHFLILFDWLRQVGHVFULEHGLQWKLVRQOLQHFDWDORJDUHVXEMHFWWR FKDQJHIRULPSURYHPHQWZLWKRXWSULRUQRWLFH7KHUHIRUHSOHDVHEHVXUHWRUHTXHVWDQG FRQILUPWKHODWHVWSURGXFWVSHFLILFDWLRQVZKLFKH[SODLQWKHVSHFLILFDWLRQVRIRXUSURGXFWVLQ GHWDLOEHIRUH\RXILQDOL]HWKHGHVLJQRI\RXUDSSOLFDWLRQVSXUFKDVHRUXVHRXUSURGXFWV ‫ٹ‬7KHWHFKQLFDOLQIRUPDWLRQLQWKLVRQOLQHFDWDORJSURYLGHVH[DPSOHVRIRXUSURGXFWV  W\SLFDORSHUDWLRQVDQGDSSOLFDWLRQFLUFXLWV:HGRQRWJXDUDQWHHWKHQRQLQIULQJHPHQWRI WKLUGSDUW\ VLQWHOOHFWXDOSURSHUW\ULJKWVDQGZHGRQRWJUDQWDQ\OLFHQVHULJKWRULQWHUHVW LQRXULQWHOOHFWXDOSURSHUW\ ‫ٹ‬,IDQ\RIRXUSURGXFWVSURGXFWVSHFLILFDWLRQVDQGRUWHFKQLFDOLQIRUPDWLRQLQWKLVRQOLQH FDWDORJLVWREHH[SRUWHGRUSURYLGHGWRQRQUHVLGHQWVWKHODZVDQGUHJXODWLRQVRIWKH H[SRUWLQJFRXQWU\HVSHFLDOO\ZLWKUHJDUGWRVHFXULW\DQGH[SRUWFRQWUROVKDOOEHREVHUYHG 5HJDUGLQJWKH&HUWLILFDWHRI&RPSOLDQFHZLWK WKH(85R+6'LUHFWLYH5($&+5HJXODWLRQV! ‫ٹ‬7KHVZLWFKRYHUGDWHIRUFRPSOLDQFHZLWKWKH5R+6'LUHFWLYH5($&+5HJXODWLRQVYDULHV GHSHQGLQJRQWKHSDUWQXPEHURUVHULHVRIRXUSURGXFWV ‫ٹ‬:KHQ\RXXVHWKHLQYHQWRU\RIRXUSURGXFWVIRUZKLFKLWLVXQFOHDUZKHWKHUWKRVHSURGXFWV DUHFRPSOLDQWZLWKWKH5R+6'LUHFWLYH5($&+5HJXODWLRQSOHDVHVHOHFW6DOHV,QTXLU\LQWKH ZHEVLWHLQTXLU\IRUPDQGFRQWDFWXV :HGRQRWWDNHDQ\UHVSRQVLELOLW\IRUWKHXVHRIRXUSURGXFWVRXWVLGHWKHVFRSHRIWKH VSHFLILFDWLRQVGHVFULSWLRQVJXLGHOLQHVDQGSUHFDXWLRQVGHVFULEHGLQWKLVRQOLQHFDWDORJ $SU Micro Chip Fuse Safety Precautions The following are precautions for individual products. Please also refer to the common precautions for fuses in this catalog. 1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses) under normal conditions is within 70% of the rated current. 2. Do not continuously pass a current exceeding the rated current through the fuses. 3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take care not to cause unwanted fusing. Calculate the I2t value of the pulse and check the tolerance to the number of pulses according to the I2t-t characteristic curve before deciding to use the fuses. Before checking the tolerance, consult our sales staff in advance. 4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure that the abnormal current generated when a circuit abnormality occurs in your product is at least double or greater than the rated current of the fuses. In addition, ensure that the abnormal current of your product does not exceed the maximum interrupting current of the fuses. 5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary side. 6. Ensure that the voltage applied to the fuses are within their rated voltage. 7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses on your products and carefully check and evaluate their category temperature range. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 Fuses Safety Precautions (Common precautions for Fuses) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products under the actual conditions for use. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device. ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault. ✽ Systems equipped with an arresting the spread of fire or preventing glitch. (1) Precautions for use • These products are designed and manufactured for general and standard use in general elec tron ic equipment. (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) For applications in which special quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or cause threat of personal injury (such as for aircraft and aerospace equipment, traffic and transport equipment, combustion equipment, medical equipment, accident prevention and anti-theft devices, and safety equipment), please be sure to consult with our sales representative in advance and to exchange product specifications which conform to such applications. • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent. 2. In direct sunlight, outdoors, or in dust. 3. In salty air or air with a high concentration of corrosive gas, such as Cl2，H2S，NH3，SO2，or NO3 . 4. Electric Static Discharge (ESD) Environment. These components are sensitive to static electricity and can be damaged under static shock (ESD). 　　 Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic and Radioactive Environment. Avoid any environment where strong electromagnetic waves and radiation exist. 6. In an environment where these products cause dew condensation. 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials. • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products. • Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. • Do not apply flux to these products after soldering. The activity of flux may be a cause of failures in these products. • Refer to the recommended soldering conditions and set the soldering condition. High peak temperature or long heating time may impair the performance or the reliability of these products. • Recommended soldering condition is for the guideline for ensuring the basic characteristics of the products, not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual conditions. 01. Oct. 2019 Fuses • Do not reuse any products after removal from mounting boards. • Do not drop these products. If these products are dropped, do not use them. Such products may have received mechanical or electrical damage. • If any doubt or concern to the safety on these products arise, make sure to inform us immediately and conduct technical examinations at your side. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. The performance of Thermal Cutoffs is guaranteed for a year after our delivery, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2，H2S，NH3，SO2，or NO2 . 2. In direct sunlight. ＜Package markings＞ Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 01. Oct. 2019