ERJ-P08F68R0V

Anti-Surge Thick Film Chip Resistors Anti-Surge Thick Film Chip Resistors 0603, 0805, 1206, 1210 Type: ERJ P03, P06, P08, P14 ■ Features ● Anti-Surge characteristics superior to standard metal film resistors ● High reliability Metal glaze thick film resistive element and three layers of electrodes ● Suitable for both reflow and flow soldering ● High power…0.2 W : 1608(0603) size 0.25 W : 2012(0805) size 0.33 W : 3216(1206) size 0.5 W : 3225(1210) size ● Reference Standards…IEC 60115-8, JIS C 5201-8 ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R J P 0 6 D 1 0 0 2 V Product Code Thick Film Chip Resistors Size, Power Rating Type: inches Power R. P03 : 0603 0.2 W P06 : 0805 0.25 W P08 : 1206 0.33 W P14 : 1210 0.5 W Resistance Tolerance Code D F J Packaging Methods Code Tolerance ± 0.5 % ±1% ±5% Type ERJP03 ERJP06 ERJP08 Packaging V Punched Carrier Taping 4 mm pitch U Embossed Carrier Taping ERJP14 4 mm pitch Resistance Value The first two or three digits are significant figures of resistance and the third one denotes number of zeros following. Example: 222촞2.2 k
1002촞10 k
■ Construction ■ Dimensions in mm (not to scale) L Protective coating Alumina substrate a Electrode (Inner) W t b Electrode (Between) Thick film resistive element Electrode (Outer) Type (inches) Dimensions (mm) L W a b Mass (Weight) [g/1000 pcs.] t ERJP03 (0603) 0.15+0.15 0.30±0.15 0.45±0.10 1.60±0.15 0.80+0.15 –0.05 –0.10 ERJP06 (0805) 2.00 0.25 ±0.20 0.40 ERJP08 (1206) 3.20 –0.20 1.60 –0.15 0.40 ±0.20 0.50 ERJP14 (1210) 3.20 ±0.20 0.50 ±0.20 +0.05 ±0.20 ±0.10 1.25 +0.05 ±0.20 2.50 0.35 2 ±0.20 0.60 ±0.10 4 ±0.20 0.60 ±0.10 10 ±0.20 0.60 ±0.10 16 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2008 Anti-Surge Thick Film Chip Resistors ■ Ratings Limiting Element Power Rating Maximum Overload Resistance Voltage (2) at 70 °C Voltage Tolerance (1) (Maximum RCWV) (W) (V) (%) (V) Type (inches) Resistance Range (
) 10 to 1 M (E24, E96) 10 to 1 M (E24, E96) 1 to 1 M (E24) 10 to 1 M (E24, E96) 1 to 1 M (E24) 10 to 1 M (E24, E96) 1 to 10 M (E24) 10 to 1 M (E24, E96) 1 to 1 M (E24) ±0.5 ERJP03 (0603) 0.2 150 200 ±1 ±5 ±0.5, ±1 ERJP06 (0805) 0.25 ERJP08 (1206) 0.33 ERJP14 (1210) 0.5 150 200 ±5 200 (3) (500) 400 (3) (1000) ±0.5, ±1 ±5 ±0.5, ±1 200 400 ±5 Category Temperature T.C.R. Range (Operating [10 –6/°C (ppm/°C)] Temperature Range) (°C) ±150 ±200 –55 to +155 ±200 Less than 10
: –150 to +400 Less than 33
: ±300 More than 33
: ±100 Less than 33
: ±300 More than 33
: ±200 –55 to +155 ±100 –55 to +155 Less than 10
: –100 to +600 More than 10
: ±200 ±100 –55 to +155 Less than 10
: –100 to +600 More than 10
: ±200 (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=Power Rating  Resistance Values, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5  Power Rating or max. Overload Voltage listed above whichever less. (3) Please contact us when resistors with guaranteed higt voltage are need. –55 °C 100 Rated Load (%) Power Derating Curve For resistors operated in ambient temperatures above 70 °C, power rating shall be derated in accordance with the figure on the right. ✽ When the temperature of ERJP06/08/14 is 155 °C or less, the derating start temperature can be changed to 125 °C. (See the dotted line) 70 °C 125 °C 80 60 40 20 0 –60 –40 –20 ■ ESD Characteristic C=150pF Anti-Surge Thick Film Chip Resistors(ERJP Type) Thick Film Chip Resistors(ERJ Type) ERJP03(1608 (0603) size) ERJP -5% -10% ERJ -15% -20% -25% 10
100
1k
10k
100k
ERJP -5% -10% -15% ERJ -20% -30% 1M
ERJP08(3216 (1206) size) ERJ -10% -15% -20% -25% 10
100
1k
10k
100k
100
1k
1M
10k
100k
1M
ERJP14(3225 (1210) size) ERJP -0% Change Ratio of Resistance Value -5% 10
-5% ERJP -0% Change Ratio of Resistance Value -0% -25% -5% -30% ERJP06(2012 (0805) size) -5% Change Ratio of Resistance Value Change Ratio of Resistance Value Sample -0% -30% 20 40 60 80 100 120 140 160 180 Ambient Temperature (°C) R=0
/150
±3.0kV -5% 155 °C 0 -5% ERJ -10% -15% -20% -25% -30% 10
100
1k
10k
100k
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 1M
Jul. 2008 Anti-Surge Thick Film Chip Resistors ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping Pitch (P1) Quantity 4 mm 5000 pcs./reel ERJP03 Punched Carrier Taping ERJP06 ERJP08 Embossed Carrier Taping ERJP14 ● Carrier Tape (Unit : mm) Embossed Carrier P1 φD0 P2 P0 B W F E Punched Carrier A T T φD1 (Only Emboss) Type ERJP03 A 1.10 B ±0.10 ±0.15 W 1.90 ±0.10 2.50 ±0.20 ERJP06 1.65 ERJP08 2.00 ±0.15 3.60 ±0.20 ERJP14 ±0.20 ±0.20 2.80 3.50 F E P1 P2 φD 0 P0 8.00 ±0.20 3.50 ±0.05 1.75 ±0.10 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 +0.10 1.50−0 8.00 ±0.30 T φD1 0.70 ±0.05 – – 0.84±0.05 1.00 – ±0.10 1.0 +0.10 −0 ● Taping Reel (Unit : mm) Type T φA φB φC W T 9.0 ±1.0 11.4±1.0 ERJP03 ERJP06 ERJP08 φC 180.0 +0 13.0 ±1.0 −3.0 60 min. φB ERJP14 φA W ■ Recommended Land Pattern In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W). c Chip Resistor a b Type (inches) Dimensions (mm) a b c ERJP03 (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1 ERJP06 (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4 ERJP08 (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8 ERJP14 (1210) 2 to 2.4 4.4 to 5 1.8 to 2.8 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Mar. 2008 Anti-Surge Thick Film Chip Resistors ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 5 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ● Recommended soldering conditions for flow Preheating Soldering For soldering Temperature Time 140 °C to 180 °C 60 s to 120 s 245 ± 5 °C 20 s to 30 s For lead-free soldering Temperature Time 150 °C to 180 °C 60 s to 120 s max. 260 °C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Take measures against mechanical stress during and after mounting of Anti-Surge Thick Film Chip Resistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Safety Precautions (Common precautions for Fixed Resistors) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use • These products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. AV equipment, home electric ap plianc es, offi ce equipment, information and com mu ni cation equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . • Note that non- cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. • Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 ° C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Oct. 2007 – ER3 –