ERJP06F1002V

Anti-Surge Thick Film Chip Resistors Anti-Surge Thick Film Chip Resistors Type: ERJ PA2, P03, PA3, P06, P08, P14 Features ● ESD surge characteristics superior to standard metal film resistors reliability Metal glaze thick film resistive element and three layers of electrodes ● Suitable for both reflow and flow soldering ● High power … 0.20 W : 0402 inch / 1005 mm size (ERJPA2), 0603 inch / 1608 mm size (ERJP03) 0.25 W : 0603 inch / 1608 mm size (ERJPA3) 0.50 W : 0805 inch / 2012 mm size (ERJP06), 1210 inch / 3225 mm size (ERJP14) 0.66 W : 1206 inch / 3216 mm size (ERJP08) ● Reference Standards… IEC 60115-8, JIS C 5201-8, JEITA RC-2134C ● AEC-Q200 qualified ● RoHS compliant ● High ■ As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R J P 0 6 D 1 0 0 2 V Size, Power Rating Product Code Thick Film Code Inch Power R. Chip Resistors PA2 0402 0.20 W P03 0603 0.20 W PA3 0603 0.25 W P06 0805 0.50 W P08 1206 0.66 W P14 1210 0.50 W Resistance Tolerance Resistance Value Code Tolerance D ± 0.5 % F ±1% J ±5% The first two or three digits are significant figures of resistance and the third or 4th one denotes number of zeros following. Three digit type (±5 %), four digit type (±1 %, ±0.5 %) Example: 222→2.2 kΩ, 1002→10 kΩ Construction Packaging Methods Packaging Punched Carrier Taping 2 mm pitch, 10,000 pcs. Code X Part No. ERJPA2 ERJP03 ERJPA3 ERJP06 ERJP08 V Punched Carrier Taping 4 mm pitch, 5,000 pcs. U Embossed Carrier Taping ERJP14 4 mm pitch, 5,000 pcs. Dimensions in mm (not to scale) L a Protective coating Electrode (Inner) W Alumina substrate t b Electrode (Between) Part No. ERJPA2 ERJP03 Electrode (Outer) W a b Mass (Weight) [g/1000 pcs.] t 1.00±0.05 0.50±0.05 0.20±0.15 0.25±0.05 0.35±0.05 1.60 1.60 ±0.15 ERJP06 2.00 ±0.20 ERJP08 3.20 –0.20 1.60 –0.15 0.40±0.20 0.50±0.20 0.60±0.10 10 ERJP14 3.20±0.20 2.50±0.20 0.35±0.20 0.50±0.20 0.60±0.10 16 +0.05 +0.15 –0.05 0.80 +0.15 –0.05 0.80 ±0.10 1.25 +0.15 –0.10 0.15 +0.15 –0.10 0.15 ±0.20 0.25 ±0.15 0.8 ±0.15 ERJPA3 Thick film resistive element Dimensions (mm) L 0.30 ±0.10 0.25 0.40 ±0.20 ±0.10 2 ±0.10 2 0.45 0.45 ±0.10 0.60 +0.05 4 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 13 May. 2019 Anti-Surge Thick Film Chip Resistors Ratings Part No. (inch size) Power (3) Rating at 70 °C (W) Limiting Element (1) Voltage (V) Maximum Overload (2) Voltage (V) ERJPA2 (0402) 0.20 50 100 ERJP03 (0603) 0.20 150 200 Resistance Tolerance (%) Resistance Range (Ω) T.C.R. –6 (×10 /°C) ±0.5, ±1 10 to 1M (E24, E96) ±100 10 to 1M (E24) ±200 ±0.5 10 to 1M (E24, E96) ±150 ±1 10 to 1M (E24, E96) ±5 ±5 ERJPA3 (0603) 0.25 (105 °C) 150 200 ±0.5, ±1 ±5 ±0.5, ±1 ERJP06 (0805) 0.50 ERJP08 (1206) 0.66 500 1000 ERJP14 (1210) 0.50 200 400 400 1 to 1M (E24) 10 to 1M (E24, E96) 1 to 1.5M (E24) 10 to 1M (E24, E96) 600 ±5 ±0.5, ±1 ±5 ±0.5, ±1 ±5 1 to 3.3M (E24) 10 to 1M (E24, E96) 1 to 10M (E24) 10 to 1M (E24, E96) 1 to 1M (E24) Category AEC-Q200 Temperature Grade Range (°C) –55 to +155 Grade 0 ±200 –55 to +155 R < 10 Ω : –150 to +400 10 Ω ≤ R : ±200 ±100 –55 to +155 ±200 R < 33 Ω : ±300 33 Ω ≤ R : ±100 R < 10 Ω : –100 to +600 –55 to +155 10 Ω ≤ R < 33 Ω : ±300 33 Ω ≤ R : ±200 ±100 R < 10 Ω : –100 to +600 –55 to +155 10 Ω ≤ R : ±200 ±100 R < 10 Ω : –100 to +600 –55 to +155 10 Ω ≤ R : ±200 Grade 0 Grade 0 Grade 0 Grade 0 Grade 0 (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=√Power Rating × Resistance Values, or Limiting Element Voltage listed above, whichever less. (2) Overload Test Voltage (OTV) shall be determined from OTV=Specified Magnification (refer to performance) × RCWV or Maximum Overload Voltage listed above, whichever less. (3) Use it on the condition that the case temperature is below the upper category temperature. –55 °C 100 Rated Load (%) Power Derating Curve For resistors operated in rated temperatures above 70 °C or 105 °C, power rating shall be derated in accordance with the figure on the right. ✽ When the temperature of ERJP14 is 155 °C or less, the derating start temperature can be changed to 125 °C. (See the dotted line) 70 °C 105 °C 125 °C 80 60 40 20 0 –60 –40 –20 ERJ PA3 ERJ P06, P08 ERJ PA2, P03, P14 155 °C 0 20 40 60 80 100 120 140 160 180 Ambient Temperature (°C) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 13 May. 2019 Anti-Surge Thick Film Chip Resistors ESD Characteristic R=0 Ω(≤ 1.5 kΩ)/150 Ω(> 1.5 kΩ) E C=15 pF Sample Change Ratio of Resistance Value (%) Anti-Surge Thick Film Chip Resistors(ERJP Series) Thick Film Chip Resistors(ERJ Series) ERJPA2 0 -5 ERJ2G -10 -15 -20 -25 -30 10 Ω 100 Ω 1 kΩ 10 kΩ 100 kΩ 1 MΩ ERJP06 (0805 inch / 2012 mm size) 5 0 ERJP06 -5 -10 ERJ6G -15 -20 -25 -30 Change Ratio of Resistance Value (%) ERJPA2 (0402 inch /1005 mm size) 5 10 Ω 100 Ω 1 kΩ 10 kΩ 100 kΩ Change Ratio of Resistance Value (%) Change Ratio of Resistance Value (%) Change Ratio of Resistance Value (%) 0402 inch size : E=±1 kV 0603, 0805, 1206, 1210 inch size : E=±3 kV 1 MΩ ERJP03, PA3 (0603 inch /1608 mm size) 5 ERJPA3 0 ERJP03 -5 -10 -15 -20 -25 -30 ERJ3G 10 Ω 100 Ω 1 kΩ 10 kΩ 100 kΩ 1 MΩ ERJP08 (1206 inch / 3216 mm size) 5 ERJP08 0 -5 ERJ8G -10 -15 -20 -25 -30 10 Ω 100 Ω 1 kΩ 10 kΩ 100 kΩ 1 MΩ ERJP14 (1210 inch / 3225 mm size) 5 ERJP14 0 -5 ERJ14 -10 -15 -20 -25 -30 10 Ω 100 Ω 1 kΩ 10 kΩ 100 kΩ 1 MΩ Performance Test Item Resistance T. C. R. Overload Resistance to Soldering Heat Rapid Change of Temperature High Temperature Exposure Damp Heat, Steady State Load Life in Humidity Endurance at 70 °C (ERJPA3 : 105 °C) Performance Requirements Within Specified Tolerance Test Conditions 20 °C Within Specified T. C. R. +25 °C/+155 °C (ERJPA2 : +125 °C) ERJP06 : Rated Voltag×1.77, 5 s ±2 % ERJPA2, ERJPA3, ERJP08 : Rated Voltag×2.0, 5 s Only when it is ERJP03 (D), P14 (D) : ±0.5 % ERJP03, ERJP14 : Rated Voltag×2.5, 5 s D : ±0.5 %, F, J : ±1 % 270 °C, 10 s ±1 % –55 °C (30min.) / +155 °C (30min.) , 100 cycles ±1 % +155 °C, 1000 h ±1 % 60 °C, 90 % to 95 %RH, 1000 h 60 °C, 90 % to 95 %RH, ±3 % Only when it is ERJP03 (D), P14 (D) : ±1 % Rated Voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h 70 °C (ERJPA3 : 105 °C), Rated Voltage, ±3 % Only when it is ERJP03 (D), P14 (D) : ±1 % 1.5 h ON / 0.5 h OFF cycle, 1000 h Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. 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The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products under the actual conditions for use. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device. ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault. ✽ Systems equipped with an arresting the spread of fire or preventing glitch. (1) Precautions for use • These products are designed and manufactured for general and standard use in general elec tron ic equipment. (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) For applications in which special quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or cause threat of personal injury (such as for aircraft and aerospace equipment, traffic and transport equipment, combustion equipment, medical equipment, accident prevention and anti-theft devices, and safety equipment), please be sure to consult with our sales representative in advance and to exchange product specifications which conform to such applications. • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent. 2. In direct sunlight, outdoors, or in dust. 3. In salty air or air with a high concentration of corrosive gas, such as Cl2，H2S，NH3，SO2，or NOX . 4. Electric Static Discharge (ESD) Environment. These components are sensitive to static electricity and can be damaged under static shock (ESD). 　　 Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic and Radioactive Environment. Avoid any environment where strong electromagnetic waves and radiation exist. 6. In an environment where these products cause dew condensation. 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials. • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products. • Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. • Do not apply flux to these products after soldering. The activity of flux may be a cause of failures in these products. • Refer to the recommended soldering conditions and set the soldering condition. High peak temperature or long heating time may impair the performance or the reliability of these products. • Recommended soldering condition is for the guideline for ensuring the basic characteristics of the products, not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual conditions. 01. Oct. 2019 Fixed Resistors • Do not reuse any products after removal from mounting boards. • Do not drop these products. If these products are dropped, do not use them. Such products may have received mechanical or electrical damage. • If any doubt or concern to the safety on these products arise, make sure to inform us immediately and conduct technical examinations at your side. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2，H2S，NH3，SO2，or NOX . 2. In direct sunlight. ＜Package markings＞ Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 01. Oct. 2019 Surface Mount Resistors Safety Precautions (Common precautions for Surface Mount Resistors) The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors in this catalog. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Take measures against mechanical stress during and after mounting of Surface Mount Resistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur. Keep the rated power and ambient temperature within the specified derating curve. Some circuit boards, wiring patterns, temperatures of heat generated by adjacent components, or ambient temper a tures can become factors in the rise of the temperature of the resistors, regardless of the level of power applied. Therefore, check the conditions before use and op timize them so as not to damage the boards and peripheral components. Make sure to contact us before using the resistors under special conditions. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. Transient voltage If there is a possibility that the transient phenomenon (significantly high voltage applied in a short time) may occur or that a high voltage pulse may be applied, make sure to evaluate and check the characteristics of resistors mounted on your product rather than only depending on the calculated power limit or steady-state conditions. If the resistors are to be used in high frequency circuits, carefully check the operation before use. Such circuits change the electrical characteristics of the resistors. Before using halogen-based or other high-activity flux, check the possible effects of the flux residues on the performance and reliability of the resistors. When soldering with a soldering iron, never touch the resistors'bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.). Mounting of the resistors with excessive or insufficient wetting amount of solder may affect the connection reliability or the performance of the resistors. Carefully check the effects and apply a proper amount of solder for use. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion. Do not apply excessive tension to the terminals. 01. Oct. 2019