Multilayer NTC Thermistors (Automotive Grade)
Multilayer NTC Thermistors (Automotive Grade)
Series: ERTJ-M
Features
●Surface Mount Device(0402・0603)
●Highly reliable multilayer / monolithic structure
●Wide temperature operating range(-40 to 150 ℃)
●Environmentally-friendly lead-free
●AEC-Q200 compliant
●RoHS compliant
Recommended Applications
●For
●For
●For
●For
●For
●For
car audio system
ECUs
electric pumps and compressors
LED lights
batteries
temperature detection of various circuits
Explanation of Part Numbers
1T ERJS02 ~ ERJS1Tシリーズ
1
2
3
4
5
6
7
8
9
10
E
R
T
J
0
E
G
1
0
3
Common Code
Product Code
ERT
NTC
Thermistors
Type Code
J Chip Type
(SMD)
Multilayer
Type
Size Code
(inch size)
0
0402
1
0603
11
F
12
M
Example
Packaging
Style Code
B Value Class Code
Nominal Resistance
A 2701 to 2800
R25 (Ω)
Resistance
Tolerance Code
0402
Punched
E
Carrier Taping
(Pitch : 2 mm)
G 3301 to 3400
The first two digits
are significant
figures of resistance
and the third one
denotes the number
of zeros following
them.
Narrow
Tolerance
G ±2 % Type
0603
Punched
V
Carrier Taping
(Pitch : 4 mm)
M 3801 to 3900
P 4001 to 4100
R 4201 to 4300
S 4301 to 4400
T
4401 to 4500
M
Automotive
component
F ±1 %
H ±3 % Standard
J ±5 % Type
V 4601 to 4700
Construction
③
①
②
④
➄
No.
Name
①
Semiconductive Ceramics
②
Internal electrode
③
④
➄
Substrate electrode
Terminal electrode
Intermediate electrode
External electrode
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Multilayer NTC Thermistors (Automotive Grade)
Ratings
Size code (inch size)
Operating Temperature Range
Rated Maximum Power Dissipation
Dissipation Factor
0(0402)
✽1
66 mW
Approximately 2 mW / °C
✽2
1(0603)
–40 to 150 °C
100 mW
Approximately 3 mW / °C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
・The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature
exceeds 25 °C, rated power depends on the decreased power dissipation curve.
・Please see “Operating Power” for details.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation
under stable temperatures.
・Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
Part Number List
● 0402 inch size
Part Number
ERTJ0EG202GM
ERTJ0EG202HM
ERTJ0EG202JM
ERTJ0EG103□M
ERTJ0EP473□M
ERTJ0ER104□M
ERTJ0ET104□M
ERTJ0EV104□M
ERTJ0EV474□M
2 kΩ±2 %
B Value
at 25/50(K)
(3380 K)
B Value
at 25/85(K)
3410 K±0.5 %
2 kΩ±3 %
(3380 K)
3410 K±0.5 %
2 kΩ±5 %
(3380 K)
3410 K±0.5 %
10 kΩ
3380 K±1 %
3435 K±1 %
47 kΩ
4050 K±1 %
(4100 K)
100 kΩ
4250 K±1 %
(4300 K)
100 kΩ
4485 K±1 %
(4550 K)
100 kΩ
4700 K±1 %
(4750 K)
470 kΩ
4700 K±1 %
(4750 K)
Nominal Resistance
at 25 °C(Ω)
● 0603 inch size
1 kΩ
B Value
at 25/50(K)
3650 K±1 %
B Value
at 25/85(K)
(3690 K)
10 kΩ
3380 K±1 %
3435 K±1 %
47 kΩ
4100 K±1 %
(4150 K)
100 kΩ
4200 K±1 %
(4250 K)
100 kΩ
4700 K±1 %
(4750 K)
220 kΩ
4485 K±1 %
(4550 K)
Nominal Resistance
at 25 °C(Ω)
Part Number
ERTJ1VK102□M
ERTJ1VG103□M
ERTJ1VP473□M
ERTJ1VR104□M
ERTJ1VV104□M
ERTJ1VT224□M
□ : Resistance Tolerance Code
(F:±1 %,G:±2 %,H:±3 %,J:±5 %)
● Temperature and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
B25/50
B25/85
T(°C)
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
130
135
140
145
150
B25/50=
ln (R25/R50)
1/298.15–1/323.15
ERTJ□□G~
(3380 K)
3435 K
ERTJ1VK~
3650 K
(3690 K)
ERTJ0EP~
4050 K
(4100 K)
ERTJ1VP~
4100 K
(4150 K)
ERTJ0ER~
4250 K
(4300 K)
ERTJ1VR~
4200 K
(4250 K)
ERTJ□□T~
4485 K
(4550 K)
ERTJ□□V~
4700 K
(4750 K)
20.52
15.48
11.79
9.069
7.037
5.507
4.344
3.453
2.764
2.227
1.806
1.474
1.211
1
0.8309
0.6941
0.5828
0.4916
0.4165
0.3543
0.3027
0.2595
0.2233
0.1929
0.1672
0.1451
0.1261
0.1097
0.09563
0.08357
0.07317
0.06421
0.05650
0.04986
0.04413
0.03916
0.03483
0.03105
0.02774
25.77
19.10
14.29
10.79
8.221
6.312
4.883
3.808
2.993
2.372
1.892
1.520
1.229
1
0.8185
0.6738
0.5576
0.4639
0.3879
0.3258
0.2749
0.2330
0.1984
0.1696
0.1456
0.1255
0.1087
0.09440
0.08229
0.07195
0.06311
0.05552
0.04899
0.04336
0.03849
0.03426
0.03058
0.02736
0.02454
33.10
24.03
17.63
13.06
9.761
7.362
5.599
4.291
3.312
2.574
2.013
1.584
1.255
1
0.8016
0.6461
0.5235
0.4266
0.3496
0.2881
0.2386
0.1985
0.1659
0.1393
0.1174
0.09937
0.08442
0.07200
0.06166
0.05306
0.04587
0.03979
0.03460
0.03013
0.02629
0.02298
0.02013
0.01767
0.01553
34.56
24.99
18.26
13.48
10.04
7.546
5.720
4.369
3.362
2.604
2.030
1.593
1.258
1
0.7994
0.6426
0.5194
0.4222
0.3451
0.2837
0.2344
0.1946
0.1623
0.1359
0.1143
0.09658
0.08189
0.06969
0.05957
0.05117
0.04415
0.03823
0.03319
0.02886
0.02513
0.02193
0.01918
0.01680
0.01476
42.40
29.96
21.42
15.50
11.33
8.370
6.244
4.699
3.565
2.725
2.098
1.627
1.271
1
0.7923
0.6318
0.5069
0.4090
0.3320
0.2709
0.2222
0.1831
0.1516
0.1261
0.1054
0.08843
0.07457
0.06316
0.05371
0.04585
0.03929
0.03378
0.02913
0.02519
0.02184
0.01898
0.01654
0.01445
0.01265
40.49
28.81
20.72
15.07
11.06
8.198
6.129
4.622
3.515
2.694
2.080
1.618
1.267
1
0.7944
0.6350
0.5108
0.4132
0.3363
0.2752
0.2263
0.1871
0.1554
0.1297
0.1087
0.09153
0.07738
0.06567
0.05596
0.04786
0.04108
0.03539
0.03059
0.02652
0.02307
0.02013
0.01762
0.01546
0.01361
46.47
32.92
23.55
17.00
12.38
9.091
6.729
5.019
3.772
2.854
2.173
1.666
1.286
1
0.7829
0.6168
0.4888
0.3896
0.3123
0.2516
0.2037
0.1658
0.1357
0.1117
0.09236
0.07675
0.06404
0.05366
0.04518
0.03825
0.03255
0.02781
0.02382
0.02043
0.01755
0.01511
0.01304
0.01127
0.00976
59.76
41.10
28.61
20.14
14.33
10.31
7.482
5.481
4.050
3.015
2.262
1.710
1.303
1
0.7734
0.6023
0.4721
0.3723
0.2954
0.2356
0.1889
0.1523
0.1236
0.1009
0.08284
0.06834
0.05662
0.04712
0.03939
0.03308
0.02791
0.02364
0.02009
0.01712
0.01464
0.01256
0.01080
0.00931
0.00806
ln (R25/R85)
B25/85= 1/298.15–1/358.15
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85= Resistance at 85 0±0 1 °C
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Multilayer NTC Thermistors (Automotive Grade)
Specification and Test Method
Item
Specifications
Rated Zero-power
Resistance (R25)
Within the specified tolerance.
B Value
Shown in each Individual
Specification.
※Individual Specification shall
specify B25/50 or B25/85.
Testing Method
The value is measured at a power that the influence of
self-heat generation can be negligible (0.1 mW or
less), at the rated ambient temperature of 25.0 ± 0.1 ℃.
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (deg.C) T2 (deg.C) .
The B value is calculated by the following equation.
ln (R1)- ln (R2)
BT1/T2=
1/(T1+273.15)–1/(T2+273.15)
T1
25.0 ±0.1 °C
25.0 ±0.1 °C
B25/50
B25/85
Adhesion
The terminal electrode shall be free
from peeling or signs of peeling.
Applied force :
Size 0402,0603
Duration :10 s
T2
50.0 ±0.1 °C
85.0 ±0.1 °C
: 5N
Size : 0402
1.0
0.5/0402
R0.5
Board
Test Sample
Size : 0603
1.0
Unit:mm
Test
Bending distance :2 mm
Bending speed
:1 mm/ s
2.0
R340
45±2
Resistance to
Vibration
There shall be no cracks and other
mechanical damage.
R25 change : within ±2 %
B Value change: within ±1 %
Resistance to Impact
There shall be no cracks and other
mechanical damage.
R25 change : within ±2 %
B Value change: within ±1 %
Sample
distance
There shall be no cracks and other
mechanical damage.
R25 change:within ±5 %
Bending
Bending Strength
45±2
Unit:mm
Solder samples on a testing substrate, then
apply vibration to them.
Acceleration
:5 G
Vibrational frequency
:10 to 2000 Hz
Sweep time
:20 minutes
12 cycles in three directions, which are perpendicular
to each other
Solder samples on a testing substrate, then
apply impacts to them.
:Semisinusoidal wave, 11 ms
Pulse waveform
Impact acceleration :50 G
Impact direction : X-X’, Y-Y’, Z-Z’ In 6 directions,
three times each
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Multilayer NTC Thermistors (Automotive Grade)
Specification and Test Method
Item
Resistance to
Soldering Heat
Specifications
There shall be no cracks and other
mechanical damage.
Testing Method
Soldering bath method
Solder temperature :260 ±5 ℃,270 ±5 ℃
Dipping period
R25 change : within ±2 %
B Value change: within ±1 %
Solderability
Temperature
Cycling
More than 95 % of the soldered
area of both terminal electrodes
shall be covered with fresh solder.
R25 change : within ±2 %
B Value change: within ±1 %
:3.0 ±0.5 s,10.0 ±0.5 s
Preheat condition
Step
Temp(℃)
Period(s)
1
80 to 100
120 to 180
2
150 to 200
120 to 180
Soldering bath method
Solder temperature :230 ±5 ℃
Dipping period
:4 ±1 s
Solder
:Sn-3.0Ag-0.5Cu
Conditions of one cycle
Step 1:‒55±3 ℃, 30±3 min
Step 2:Room temp., 3 min max.
Step 3:125±5 ℃, 30±3 min
Step 4:Room temp., 3 min max.
Number of cycles: 2000 cycles
Humidity
Biased Humidity
R25 change : within ±2 %
Temperature
:85 ±2 ℃
B Value change: within ±1 %
Relative humidity
:85 ±5 %
Test period
:2000 +48/0 h
R25 change : within ±2 %
Temperature
:85 ±2 ℃
B Value change: within ±1 %
Relative humidity
:85 ±5 %
Applied power
:10 mW(D.C.)
Test period
:2000 +48/0 h
Low Temperature
Exposure
R25 change : within ±2 %
Temperature
:-40 ±3 ℃
B Value change: within ±1 %
Test period
:2000 +48/0 h
High Temperature
Exposure 1
R25 change : within ±2 %
Temperature
:125 ± 3 ℃
B Value change: within ±1 %
Test period
:2000 +48/0 h
R25 change : within ±3 %
Temperature
:150 ±3 ℃
R25 change : within ±2 %
Test period
:1000 +48/0 h
High Temperature
Exposure 2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Multilayer NTC Thermistors (Automotive Grade)
Dimensions in mm (not to scale)
L
W
L1L2
L
W
T
0(0402)
1.0±0.1
0.50±0.05
0.50±0.05
0.25±0.15
1(0603)
1.60±0.15
0.8±0.1
0.8±0.1
0.3±0.2
T
L1
(Unit : mm)
Size code (inch size)
L2
Packaging Methods (Taping)
● Standard Packing Quantities
Size code (inch size)
Thickness
0(0402)
0.5
1(0603)
0.8
(Unit : mm)
Kind of Taping
Pitch
Quantity(pcs/reel)
2
10,000
4
4,000
Punched Carrier Taping
● 2 mm Pitch (Punched Carrier Taping) Size 0402
Feeding hole
t1
Chip pocket
B
F
A
W
E
φD0
Chip component
t2
Symbol
Unit
(mm)
A
B
0.62
±0.05
W
1.12
±0.05
F
8.0
±0.2
3.50
±0.05
P1 P2
Tape running direction
P0
P1
E
1.75
±0.10
P2
2.00
±0.05
2.00
±0.05
P0
4.0
±0.1
φ D0
t1
1.5
+0.1/0
0.7
max.
t2
1.0
max.
● 4 mm Pitch (Punched Carrier Taping) Size 0603
Feeding hole
Chip pocket
E
φD0
B
F
A
Chip component
P1
P2
P0
W
t1
Tape running direction
t2
Symbol
Unit
(mm)
A
B
1.0
±0.1
1.8
±0.1
W
F
8.0
±0.2
3.50
±0.05
E
1.75
±0.10
P1
4.0
±0.1
P2
2.00
±0.05
P0
4.0
±0.1
φ D0
t1
1.5
+0.1/0
1.1
max.
t2
1.4
max.
● Reel for Taping
W1
E
Symbol
D
φB
C
Unit
(mm)
W2
φA
φB
C
180+0/-3
60.0+1.0/0
13.0±0.5
2.0±0.5
9.0+1.0/0
11.4±1.0
E
W1
W2
D
21.0±0.8
φA
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Multilayer NTC Thermistors (Automotive Grade)
Packaging Methods (Taping)
● Leader Part and Taped End
Leader part
Taped end
Top cover tape
100 min.
Vacant position
160 min.
Vacant position
400 min.
Unit:mm
Minimum Quantity / Packing Unit
Part Number
(inch size)
ERTJ0 (0402)
Minimum Quantity
/ Packing Unit
10,000
Packing Quantity
in Carton
200,000
ERTJ1 (0603)
4,000
80,000
Carton L×W×H (mm)
250×200×200
250×200×200
Part No., quantity and country of origin are designated on outer packages in English.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
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Multilayer NTC Thermistors (Automotive Grade)
Multilayer NTC Thermistors (Automotive Grade)
Series: ERTJ
Handling Precautions
[Precautions]
・ Do not use the products beyond the descriptions in this product catalog.
・ This product catalog guarantees the quality of the products as individual components.
Before you use the products, please make sure to check and evaluate the products
in the circumstance where they are installed in your product.
Safety Precautions
Multilayer NTC Thermistors for Automotive Grade (hereafter referred to as “Thermistors”) are intended to
be used in general-purpose applications as measures against Temperature detection and Temperature
compensation in automotive Grade equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications,
as noted in the Ratings and Specified Conditions section, the Thermistors’ performance may be degraded,
or become failure mode, such as short circuit mode and open-circuit mode.
If you use under the condition of short-circuit, heat generation of Thermistors will occur by running large current
due to application of voltage. There are possibilities of smoke emission, substrate burn-out, and, in the worst
case, fire. For products which require high safety levels, please carefully consider how a single malfunction can
affect your product. In order to ensure the safety in the case of a single malfunction, please design products
with fail-safe, such as setting up protecting circuits, etc.
We are trying to improve the quality and the reliability, but the durability differs depending on the use
environment and the use conditions. On use, be sure to confirm the actual product under the actual use
conditions.
● For the following applications and conditions, please be sure to consult with our sales representative in
advance and to exchange product specifications which conform to such applications.
・ When your application may have difficulty complying with the safety or handling precautions specified below.
・ High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such
as death or injury (regardless of directly or indirectly), due to failure or malfunction of the product.
① Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
② Submarine Equipment (submarine repeating equipment, etc.)
③ Transportation Equipment (airplanes, trains, ship, traffic signal controllers, etc.)
④ Power Generation Control Equipment
(atomic power, hydroelectric power, thermal power plant control system, etc.)
⑤ Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
⑥ Information Processing Equipment (large scale computer systems, etc.)
⑦ Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
⑧ Rotary Motion Equipment
⑨ Security Systems
⑩ And any similar types of equipment
Strict Observance
1. Confirmation of Rated Performance
The Thermistors shall be operated within the specified rating/performance.
Applications exceeding the specifications may cause deteriorated performance and/or breakdown, resulting in
degradation and/or smoking or ignition of products. The following are strictly observed.
(1) The Thermistors shall not be operated beyond the specified operating temperature range.
(2) The Thermistors shall not be operated in excess of the specified maximum power dissipation.
2. The Thermistors shall not be mounted near flammables.
1-Oct-19
Multilayer NTC Thermistors (Automotive Grade)
Operating Conditions and Circuit Design
1. Circuit Design
【Dissipation factor】
・The constant amount power required to raise the
temperature of the Thermistor 1 °C through self
heat generation under stable temperatures.
Dissipation factor (mW/°C) = Power consumption
of Thermistor / Temperature rise of element.
Maximum power dissipation
【Maximum power dissipation】
・The Maximum power that can be continuously applied
under static air at a certain ambient temperature.
The Maximum power dissipation under an ambient
temperature of 25 ℃ or less is the same with the rated
maximum power dissipation, and Maximum power
dissipation beyond 25 ℃ depends on the Decreased
power dissipation curve below.
/ Rated maximum power dissipation (%)
1.1 Operating Temperature and Storage Temperature
When operating a components-mounted circuit, please be sure to observe the “Operating Temperature Range”,
written in delivery specifications. Storage temperature of PCB after mounting Thermistors, which is not operated,
should be within the specified “Storage Temperature Range” in the delivery specifications. Please remember not
to use the product under the condition that exceeds the specified maximum temperature.
1.2 Operating Power
The electricity applied to between terminals of Thermistors should be under the specified maximum power
dissipation. There are possibilities of breakage and burn-out due to excessive self-heating of Thermistors,
if the power exceeds maximum power dissipation when operating. Please consider installing protection circuit for
your circuit to improve the safety, in case of abnormal voltage application and so on. Thermistors’ performance of
temperature detection would be deteriorated if self-heating occurs, even when you use it under the maximum
power dissipation. Please consider the maximum power dissipation and dissipation factor.
Decreased power dissipation curve
100
50
25
75
125
Ambient temperature (°C)
1.3 Environmental Restrictions
The Thermistors does not take the use under the following special environments into consideration.
Accordingly, the use in the following special environments, and such environmental conditions may affect the
performance of the product; prior to use, verify the performance, reliability, etc. thoroughly.
① Use in liquids such as water, oil, chemical, and organic solvent.
② Use under direct sunlight, in outdoor or in dusty atmospheres.
③ Use in places full of corrosive gases such as sea breeze, Cl2,H2S,NH3,SO2,and NOx.
④ Use in environment with large static electricity or strong electromagnetic waves or strong radial ray.
⑤ Where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride
wire is arranged close to the product.
⑥ Where this product is sealed or coated with resin etc.
⑦ Where solvent, water, or water-soluble detergent is used in flux cleaning after soldering.
(Pay particular attention to water-soluble flux.)
⑧ Use in such a place where the product is wetted due to dew condensation.
⑨ Use the product in a contaminated state.
Ex.) Do not handle the product such as sticking sebum directly by touching the product after mounting
printed circuit board.
⑩ Under severe conditions of vibration or impact beyond the specified conditions found in the Specifications.
1.4 Measurement of Resistance
The resistance of the Thermistors varies depending on ambient temperatures and self-heating. To measure the
resistance value when examining circuit configuration and conducting receiving inspection and so on, the following
points should be taken into consideration:
① Measurement temp : 25±0.1 °C
Measurement in liquid (silicon oil, etc.) is recommended for a stable measurement temperature.
② Power : 0.10 mW max. 4 terminal measurement with a constant-current power supply is recommended.
1-Oct-19
Multilayer NTC Thermistors (Automotive Grade)
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
There is a possibility of performance deterioration by heat shock (temperature cycles), which causes cracks,
from alumina substrate. Please confirm that the substrate you use does not deteriorate the Thermistors’ quality.
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown below. Use the proper amount of solder in order to prevent
cracking. Using too much solder places excessive stress on the Thermistors..
Recommended Land Dimensions(Ex.)
Land
SMD
Solder resist
Size
Code/EIA
Unit (mm)
Component dimensions
a
b
c
0.5
0.4 to 0.5
0.4 to 0.5
0.4 to 0.5
0.8
0.8 to 1.0
0.6 to 0.8
0.6 to 0.8
L
W
T
0(0402)
1.0
0.5
1(0603)
1.6
0.8
(2) The land size shall be designed to have equal space, on both right and left side. If the amount of solder on
both sides is not equal, the component may be cracked by stress since the side with a larger amount of
solder solidifies later during cooling.
Recommended Amount of Solder
(a) Excessive amount
2.3 Utilization of Solder Resist
(1) Solder resist shall be utilized to equalize
the amounts of solder on both sides.
(2) Solder resist shall be used to divide the
pattern for the following cases;
・ Components are arranged closely.
・ The Thermistor is mounted near
a component with lead wires.
・ The Thermistor is placed near a chassis.
Refer to the table below.
(b) Proper amount
(c) Insufficient amount
Prohibited Applications and Recommended Applications
Prohibited
applications
Item
Mixed
mounting
with a
component
with lead
wires
The lead wire of a Component
With lead wires
Chassis
Arrangement
near
chassis
Solder(ground solder)
Improved applications
by pattern division
Solder resist
Solder resist
Electrode pattern
Retro-fitting
of component
with lead
wires
A lead wire of Retrofitted
component
Solderingiron
iron
Portion to be
Lateral
arrangement
Solder resist
Excessively soldered
Solder resist
Land
2.4 Component Layout
To prevent the crack of Thermistors, try to place it place it on the position that could not easily
be affected by the bending stress of substrate while mounting procedures or procedures afterwards.
Placement of the Thermistors near heating elements also requires the great care to be
taken in order to avoid stresses from rapid heating and cooling.
1-Oct-19
Multilayer NTC Thermistors (Automotive Grade)
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Thermistors’ layout below.
Prohibited layout
Recommended layout
Layout the Varistors sideways
against the stressing direction.
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on
the mounting position of the Thermistors.
E
Perforation
D
C
Magnitude of stress
A>B=C>D>E
A
Slit
B
(3) The magnitude of mechanical stress applied to the Thermistors when dividing the circuit board in descending
order is as follows: push back < slit < V-groove < perforation. Also take into account the layout of the
Thermistors and the dividing/breaking method.
(4) When the Thermistors are placed near heating elements such as heater, etc., cracks from thermal stresses
may occur under following situation:
・ Soldering the Thermistors directly to heating elements.
・ Sharing the land with heating elements.
If planning to conduct above-mentioned mounting and/or placement, please contact us in advance.
2.5 Mounting Density and Spaces
Intervals between components should not be too narrow to prevent the influence from solder bridges
and solder balls. The space between components should be carefully determined.
Precautions for Assembly
1. Storage
(1) The Thermistors shall be stored between 5 to 40 °C and 20 to 70 % RH, not under severe conditions of high
temperature and humidity.
(2) If stored in a place where humidity, dust, or corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen
chloride and ammonia, etc.) are contained, the solderability of terminals electrodes will be deteriorated.
In addition, storage in a place where the heat or direct sunlight exposure occurs will causes or direct sunlight
exposure occurs will causes mounting problems due to deformation of tapes and reels and components and
taping/reels sticking together.
(3) Do not store components longer than 6 months. Check the solderability of products that have been stored
for more than 6 months before use.
2. Chip Mounting Consideration
(1) When mounting the Thermistors/components on a PC board, the Thermistor bodies shall be free from
excessive impact loads such as mechanical impact or stress due to the positioning, pushing force and
displacement of vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is too low, the Thermistor will crack from excessive force
during mounting. The following precautions and recommendations are for your reference in use.
(a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board
after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the
bending of the PC board in order to minimize the impact of the vacuum nozzles. Typical examples are
shown in the table below.
(d) Adjust the vacuum nozzles so that their bottom dead center during mounting is not too low.
1-Oct-19
Multilayer NTC Thermistors (Automotive Grade)
Item
Prohibited mounting
Single
surface
mounting
Double
surface
mounting
Recommended mounting
The supporting pin
Crack
does not necessarily
have to be positioned
Separation of
Crack
solder
Supporting
pin
Supporting
pin
(4) The closing dimensions of the positioning chucks shall be controlled. Maintenance and replacement of
positioning chucks shall be performed regularly to prevent chipping or cracking of the Thermistors caused
by mechanical impact during positioning due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not
exceed 0.5 mm at 90 mm span. The PC board shall be supported by an adequate number of supporting pins.
3. Selection of Soldering Flux
Soldering flux may seriously affect the performance of the Thermistors. The following shall be confirmed
before use.
(1) The soldering flux should have a halogen based content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux, wash the Thermistors sufficiently because the soldering flux
residue on the surface of PC boards may deteriorate the insulation resistance on the Thermistors’ surface.
4. Soldering
4.1 Reflow Soldering
The reflow soldering temperature conditions are composed of temperature curves of Preheating, Temp. rise,
Heating, Peak and Gradual cooling. Large temperature difference inside the Thermistors caused by rapid heat
application to the Thermistors may lead to excessive thermal stresses, contributing to the thermal cracks. The
Preheating temperature requires controlling with great care so that tombstone phenomenon may be prevented.
260
220
④Peak
△T
Temperature (˚C)
Recommended profile of Reflow Soldering (Ex.)
Item
②Temp.
③Gradual
cooling
180
140
①Preheating
③Heating
Time
60 ot 120 s
① Preheating
② Temp. rise
③ Heating
④ Peak
⑤ Gradual
cooling
Temperature
140 to 180 ℃
Preheating temp
to Peak temp.
220 ℃ min.
260 ℃ max.
Peak temp.
to 140 ℃
Period or Speed
60 to 120 s
2 to 5 ℃ / s
60 s max.
10 s max.
1 to 4 ℃ / s
60 s max.
△T : Allowable temperature difference △T≦ 150 °C
The rapid cooling (forced cooling) during Gradual cooling part should be avoided, because this may cause defects
such as the thermal cracks, etc. When the Thermistors are immersed into a cleaning solvent, make sure that the
surface temperatures of the devices do not exceed 100 °C. Performing reflow soldering twice under the conditions
shown in the figure above [Recommended profile of Flow soldering (Ex.)] will not cause any problems.
However, pay attention to the possible warp and bending of the PC board.
Recommended soldering condition is for the guideline for ensuring the basic characteristics of the components,
not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual
conditions. The temperature of this product at the time of mounting changes depending on mounting conditions,
therefore, please confirm that Product surface becomes the specified temperature when mounting it on the end
product.
1-Oct-19
Multilayer NTC Thermistors (Automotive Grade)
4.2 Hand Soldering
Hand soldering typically causes significant temperature change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc. In order to prevent any defects, the following should
be observed.
· The temperature of the soldering tips should be controlled with special care.
· The direct contact of soldering tips with the Thermistors and/or terminal electrodes should be avoided.
· Dismounted Thermistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering : Use thread solder (φ 1.0 mm or below) which contains flux with low chlorine, developed for
precision electronic equipment.
(b) Preheating : Conduct sufficient pre-heating, and make sure that the temperature difference between
solder and Thermitors’ surface is 150 °C or less.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be melted in advance on the soldering tip.)
(d) Gradual cooling : After soldering, the Thermitors shall be cooled gradually at room temperature.
Recommended profile of Hand soldering (Ex.)
Gradual
△T
cooling
Preheating
60 ot 120 s
3 s max.
△T : Allowable temperature difference △T ≦ 150 °C
(2) Condition 2 (without preheating)
Hand soldering can be performed without preheating,
by following the conditions below:
(a) Soldering iron tip shall never directly touch the
ceramic and terminal electrodes of the Thermitors.
(b) The lands are sufficiently preheated with a soldering
iron tip before sliding the soldering iron tip to the
terminal electrodes of the Thermitors for soldering.
Conditions of Hand soldering without preheating
Item
Temperature of Iron tip
Wattage
Shape of Iron tip
Soldering time with a
soldering iron
Condition
270 ℃ max.
20 W max.
φ 3 mm max.
3 s max.
5. Post Soldering Cleaning
5.1 Cleaning solvent
Soldering flux residue may remain on the PC board if cleaned with an inappropriate solvent.
This may deteriorate the electrical characteristics and reliability of the Thermistors.
5.2 Cleaning conditions
Inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Thermitors.
(1) Insufficient cleaning can lead to :
(a) The halogen substance found in the residue of the soldering flux may cause the metal of terminal
electrodes to corrode.
(b) The halogen substance found in the residue of the soldering flux on the surface of the Thermitors may
change resistance values.
(c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to
those of rosin soldering flux.
(2) Excessive cleaning can lead to :
(a) When using ultrasonic cleaner, make sure that the output is not too large, so that the substrate will not
resonate. The resonation causes the cracks in Thermitors and/or solders, and deteriorates the strength of
the terminal electrodes. Please follow these conditions for Ultrasonic cleaning:
Ultrasonic wave output : 20 W/L max.
Ultrasonic wave frequency : 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
1-Oct-19
Multilayer NTC Thermistors (Automotive Grade)
5.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may cause the same results as that of insufficient cleaning
due to the high density of liberated halogen.
6. Inspection Process
The pressure from measuring terminal pins might bend the PCB when implementing circuit inspection
after mounting Thermitors on PCB, and as a result, cracking may occur.
(1) Mounted PC boards shall be supported by an adequate number of supporting pins on the back with bend
settings of 90 mm span 0.5 mm max.
(2) Confirm that the measuring pins have the right tip shape, are equal in height, have the right pressure and
are set in the correct positions. The following figures are for your reference to avoid bending the PC board.
Item
Prohibited mounting
Recommended mounting
Check pin
Check pin
Bending of
PC board
Supporting pin
Separated, Crack
7.Protective Coating
Make sure characteristics and reliability when using the resin coating or resin embedding for the purpose of
improvement of humidity resistance or gas resistance, or fixing of parts because failures of a thermistors such
as 1) ,2) and 3) may be occurred.
(1) The solvent which contained in the resin permeate into the Thermitors, and it may deteriorate the
characteristic.
(2) When hardening the resin, chemical reaction heat (curing heat generation) happen and it may occurs the
infection to the Thermistors.
(3) The lead wire might be cut down and the soldering crack might be happen by expansion or contraction of
resin hardening.
8. Dividing/Breaking of PC Boards
(1) Please be careful not to stress the substrate with bending/twisting when dividing, after mounting
components including Thermistors. Abnormal and excessive mechanical stress such as bending or
torsion shown below can cause cracking in the Thermistors.
Bending
Torsion
(2) Dividing/Breaking of the PC boards shall be done carefully at moderate speed by using a jig or apparatus to
prevent the Thermistors on the boards from mechanical damage.
(3) Examples of PCB dividing/breaking jigs: The outline of PC board breaking jig is shown below. When PC board
are broken or divided, loading points should be close to the jig to minimize the extent of the bending.
Also, planes with no parts mounted on should be used as plane of loading, in order to prevent tensile stress
induced by the bending, which may cause cracks of the Thermistors or other parts mounted on the PC boards.
Outline of Jig
Prohibited mounting
Recommended mounting
PC board
V-groove
Loading
Loading direction
V-groove
point
PC
board
PC board
splitting jig
component
PC
board
V-groove
Loading direction
component
Loading point
1-Oct-19
Multilayer NTC Thermistors (Automotive Grade)
10. Mechanical Impact
(1) The Thermistors shall be free from any excessive mechanical impact.
The Thermistor body is made of ceramics and may be damaged or cracked if dropped. Never use a
Thermistor which has been dropped; their quality may already be impaired, and in that case,
failure rate will increase.
(2) When handling PC boards with Thermistors mounted on them, do not allow the Thermistors to collide with
another PC board.
When mounted PC boards are handled or stored in a stacked state, the corner of a PC board might strike
Thermistors, and the impact of the strike may cause damage or cracking and can deteriorate the
withstand voltage and insulation resistance of the Thermistors.
Crack
Mounted
PCB
Crack
Floor
11. Do not reuse this product after removal from the mounting board.
Precautions for discarding
As to the disposal of the Thermistors, check the method of disposal in each country or region where the
modules are incorporated in your products to be used.
Other
The Thermistors precautions described above are typical. For special mounting conditions, please contact us.
The technical information in this catalog provides example of our products’ typical operations and application
circuit.
Applicable laws and regulations , others
1. This product not been manufactured with any ozone depleting chemical controlled under the Montreal
Protocol.
2. This product comply with RoHS(Restriction of the use of certain Hazardous Substance in electrical and
electronic equipment) (DIRECTIVE 2011/65/EU and 2015/863/EU).
3. All the materials used in this part are registered material under the Law Concerning the Examination and
Regulation of Manufacture, etc. of Chemical Substance.
4. If you need the notice by letter of “A preliminary judgement on the Laws of Japan foreign exchange and
Foreign Trade Control”, be sure to let us know.
5. These products are not dangerous goods on the transportation as identified by UN (United nations) numbers
or UN classification.
6. The technical information in this catalog provides example of our products’ typical operations and application
circuit. We do not guarantee the non-infringement of third party’s intellectual property rights and we do not
grant any license, Right or interest in our intellectual property.
AEC-Q200 Compliant
The products are tested based on all or part of the test conditions and methods defined in AEC-Q200.
Please consult with Panasonic for the details of the product specification and specific evaluation test results,
etc., and please review and approve Panasonic's product specification before ordering.
1-Oct-19
Mouser Electronics
Authorized Distributor
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ERT-J0ES104F ERT-J0ES104H ERT-J0EV224F ERT-J0EV474HM ERT-J0EV474JM ERT-J1VV104GM ERTJ0EV104JM ERT-J1VG103HM ERT-J1VT224GM ERT-J0ER104FM ERT-J1VR104FM ERT-J0EP473FM ERTJ0ER104JM ERT-J0EV104HM ERT-J1VV104FM ERT-J1VV104JM ERT-J0EG103GM ERT-J0ET104JM ERTJ1VT224HM ERT-J1VG103GM ERT-J0ET104GM ERT-J0EP473JM ERT-J1VP473FM ERT-J0ER104HM ERTJ0EV474GM ERT-J1VR104JM ERT-J1VG103FM ERT-J1VP473JM ERT-J0EG103JM ERT-J0EV104GM ERTJ1VR104GM ERT-J0EP473HM ERT-J1VT224JM ERT-J1VG103JM ERT-J1VT224FM ERT-J0ER104GM ERTJ0EV474FM ERT-J0EV104FM ERT-J1VR104HM ERT-J1VP473HM ERT-J0ET104FM ERT-J0ET104HM ERTJ1VV104HM ERT-J0EG103HM ERT-J0EP473GM ERT-J1VP473GM ERT-J0EG103FM ERT-J1VK102JM ERTJ0EG202JM ERT-JZET224J ERT-J0EG202GM ERT-JZET154H ERT-J0EG202HM ERT-J0ET473J ERT-JZET154J
ERT-J0ET473H ERT-J1VK102HM ERT-J1VK102FM ERT-J1VK102GM ERT-JZET224H ERT-JZEP473G ERTJZET472H ERT-JZEV104G ERT-J0EP473G ERT-J0ET154H ERT-J0EP104H ERT-J0EP333H ERT-J0ES104G
ERT-J0EP104J ERT-J0EP683G ERT-J1VV104G ERT-JZET104H ERT-J0ER104H ERT-J0EV474G ERT-J0ET333J
ERT-JZEP683H ERT-J0EV474F ERT-JZER104H ERT-JZER683G ERT-J1VR103G ERT-J0EP333G ERTJ0EP683F ERT-JZER683J ERT-J0ER683H ERT-J1VT224J ERT-JZER104G ERT-J0ET333H ERT-J0EV224G
ERT-JZER683F ERT-J0EP683H ERT-J0ER104F ERT-JZEP683F ERT-JZEP683J ERT-J0EM103F ERT-J1VR332G
ERT-J1VV104F ERT-J0ER104G ERT-J0EP333F ERT-JZEP683G ERT-JZER104F