2020
Thermal Management Solutions
Products Catalog
g
2019.12
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$SU
Thermal Management Solutions CONTENTS
Product Item
Part Number
The NTC Thermistors
Multilayer NTC Thermistors
Multilayer NTC Thermistors
(Automotive Grade)
“PGS” Graphite Sheets
SSM(Semi-Sealing Material)
“NASBIS” Insulating Sheet
“Graphite-PAD” high thermal conductivity in z-direction
“GraphiteTIM (Compressible Type)” PGS
with low thermal resistance
ERT JZ
ERT J0
ERT J1
Handling Precautions
ERT J0 M
ERT J1 M
Handling Precautions
EYG S
EYG A
EYG E
Page
1
2
10
18
23
31
Minimum order
37
Handling Precautions
39
EYG Y
41
Handling Precautions
43
EYG T
45
Handling Precautions
48
EYG S
50
Handling Precautions
54
01 Nov. 2019
NTC Thermistors
The NTC Thermistors
NTC Thermistors is a negative temperature coefficient resistor that significantly reduces its resistance value as the heat/
ambient temperature rises. Thermistors is sintered in high-temperature (1200 °C to 1500 °C), and manufactured in
various shapes. It’s comprised of 2 to 4 kinds of metal oxides: iron, nickel, cobalt, manganese and copper.
Features
Recommended Applications
●
●
Temperature Coefficient of Resistance is negative,
and it’s extremely large (–2.8 to –5.1 [%/°C]).
● Various shapes, especially co mpact size
components are available.
● Selection of resistance vale is comparatively free, it’s
available from several tens Ω to several hundred kΩ.
For temperature measurement or temperature
detection : Thermometer, temperature controller
● For temperature compensation : Transistor, transistor
circuit, quarts oscillation circuit, and measuring
instruments
Physical Characteristics of NTC Thermistors
Thermistor is a resistor sensitive to temperature that is
utilizing the characteristic of metal oxide semiconductor
having large temperature coefficient.
And its temperature dependency of resistance value is
indicated by the following equation :
R=R0 exp
[ (
B
1
T
1
T0
)]
Fig. 1
1000
100
.....................................(1)
10
RT/R25
T0 : Standard Temperature 298.15 K(25 °C)
R0 : Resistance at T0 [K]
B : Thermistor Constant [K]
Temperature coefficient (a) in general meaning is indicated
as follows :
1
2000
3000
400
0
500
0
60
00
0.1
B ....................................................................
(2)
2
T
0.01
Since the change by temperature is considerably large, a is
not appropriate as a constant. Therefore, B value (constant)
is generally used as a coefficient of thermistors.
0.001
a=
B=1000
–40 –20
0
20
40 60
T (˚C)
80
100 120 140
Major Characteristics of NTC Thermistors
The relation between resistance and temperature of a
thermistor is linear as shown in Fig. 2. The resistance
value is shown in vertical direction in a logarithmic scale
and reciprocal of absolute temperature (adding 273.15 to
centigrade) is shown in horizontal direction.
The B value (constant) determines the gradient of these
straight lines. The B value (constant) is calculated by using
following equation.
knR1 – knR2
1
1
T1 T2
700
=4
0
B 25/5
100000
10000
....................................................... (3)
R1: Resistance at T1 K
R2: Resistance at T2 K
When you calculate this equation, you’ll find that B value
is not exactly constant. The resistance is expressed by
the following equation :
R = AT–C exp D/T ............................................................. (4)
In (4), C is a small positive or negative constant and quite
negligible except for use in precision temperature-measuring
device, therefore, the B value can be considered as constant
number.
In Fig. 1, the relation between the resistance ratio
RT/R25 (R25 : Resistance at 25 °C, RT : Resistance at T °C)
and B Value is shown with T °C, in the horizontal direction.
500
44005
=
00=
/55
□
BB2255/
0
□
□
104
4 25
EV EP473
0
0=
J
0
5
T RTJ
5/
2
R
B
E
E
□
5
03
343
R1
5=
E
0
25/8
J
B
T
0
A
5 0
ER
3□
=4
G10
/50
5
E
2
0
B
J
□
ERT
02
T1
E
TJ0
ER
00
=28
B 25/50
□
1
A10
J0E
ERT
1000000
R (Ω)
B=
Fig. 2
10000000
1000
100
10
1
2.4
125
2.9
85
3.4
1
(×10 –3K–1)
T
50
25
T (˚C)
3.9
0
–20
4.4
–40
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 May. 2015
1
Multilayer NTC Thermistors
Multilayer NTC Thermistors
Series:
ERTJ
Features
● Surface Mount Device (0201, 0402, 0603)
● Highly reliable multilayer / monolithic structure
● Wide temperature operating range (–40 to 125
● Environmentally-friendly lead-free
● RoHS compliant
°C)
Recommended Applications
● Mobile
Phone
· Temperature compensation for crystal oscillator
· Temperature compensation for semiconductor devices
● Personal Computer and Peripheral Device
· Temperature detection for CPU and memory device
· Temperature compensation for ink-viscosity (Inkjet Printer)
● Battery Pack (secondary battery)
· Temperature detection of battery cells
● Liquid Crystal Display
· Temperature compensation of display contrast
· Temperature compensation of display backlighting (CCFL)
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
T
J
0
E
G
1
0
3
J
A
Common Code
Product Code
Type Code
ERT NTC
J Chip Type (SMD)
Thermistors
Multilayer Type
Size Code
Z “0201”
0 “0402”
1 “0603”
Packaging
Style Code
E
V
“0201”, “0402”
Pressed Carrier
Taping
Punched Carrier
Taping
(Pitch : 2 mm)
“0603”
Punched Carrier
Taping
(Pitch : 4 mm)
B Value Class Code
2701 to 2800
A
3301 to 3400
G
3801 to 3900
M
4001 to 4100
P
4201 to 4300
R
4301 to 4400
S
4401 to 4500
T
4601 to 4700
V
Nominal Resistance
R25 (Ω)
The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
(Example)
Resistance Tolerance
Code
G
±1% Narrow
Tolerance
±2% Type
H
J
±3% Standard
±5% Type
F
Special
Specification
Construction
3
4
5
1
No.
Name
A
Semiconductive Ceramics
B
Internal electrode
C
2
D
E
Terminal
electrode
Substrate electrode
Intermediate electrode
External electrode
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Dec. 2017
2
Multilayer NTC Thermistors
Ratings
Size code (EIA)
Operating Temperature Range
Rated Maximum Power Dissipation✽1
✽2
Dissipation Factor
Z(0201)
0(0402)
–40 to 125 °C
66 mW
Approximately
2 mW/°C
33 mW
Approximately
1 mW/°C
1(0603)
100 mW
Approximately
3 mW/°C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature exceeds
25 °C, rated power depends on the decreased power dissipation curve.
· Please see “Operating Power” for details.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
Part Number List of Narrow Tolerance Type
(Resistance Tolerance : ±2 %, ±1 %)
● 0201(EIA)
Part Number
ERTJZEG103□A
ERTJZEP473□
ERTJZEP683□
ERTJZER683□
ERTJZER104□
ERTJZET104□
ERTJZEV104□
□ : Resistance Tolerance Code
Nominal Resistance
at 25 °C
10 kΩ
47 kΩ
68 kΩ
68 kΩ
100 kΩ
100 kΩ
100 kΩ
Resistance
Tolerance
Nominal Resistance
at 25 °C
10 kΩ
33 kΩ
47 kΩ
68 kΩ
100 kΩ
100 kΩ
100 kΩ
220 kΩ
Resistance
Tolerance
Nominal Resistance
at 25 °C
10 kΩ
100 kΩ
Resistance
Tolerance
±1 %(F)
or
±2 %(G)
±1 %(F)
or
±2 %(G)
B Value
at 25/50(K)
(3380 K)
4050 K±1 %
4050 K±1 %
4250 K±1 %
4250 K±1 %
4500 K±1 %
4700 K±1 %
B Value
at 25/85(K)
3435 K±1%
(4100 K)
(4100 K)
(4300 K)
(4300 K)
(4550 K)
(4750 K)
B Value
at 25/50(K)
(3380 K)
4050 K±1 %
4050 K±1 %
4050 K±1 %
4250 K±1 %
4330 K±1 %
4700 K±1 %
4700 K±1 %
B Value
at 25/85(K)
3435 K±1 %
(4100 K)
(4100 K)
(4100 K)
(4300 K)
(4390 K)
(4750 K)
(4750 K)
B Value
at 25/50(K)
(3380 K)
(4330 K)
B Value
at 25/85(K)
3435 K±1 %
4390 K±1 %
● 0402(EIA)
Part Number
ERTJ0EG103□A
ERTJ0EP333□
ERTJ0EP473□
ERTJ0EP683□
ERTJ0ER104□
ERTJ0ES104□
ERTJ0EV104□
ERTJ0EV224□
□ : Resistance Tolerance Code
±1 %(F)
or
±2 %(G)
● 0603(EIA)
Part Number
ERTJ1VG103□A
ERTJ1VS104□A
□ : Resistance Tolerance Code
Part Number List of Standard Type
(Resistance Tolerance : ±5 %, ±3 %)
● 0201(EIA)
Part Number
ERTJZET202□
ERTJZET302□
ERTJZET472□
ERTJZEG103□A
ERTJZEP473□
ERTJZEP683□
ERTJZER683□
ERTJZER104□
ERTJZET104□
ERTJZEV104□
ERTJZET154□
ERTJZET224□
Nominal Resistance
at 25 °C
2.0 kΩ
3.0 kΩ
4.7 kΩ
10 kΩ
47 kΩ
68 kΩ
68 kΩ
100 kΩ
100 kΩ
100 kΩ
150 kΩ
220 kΩ
Resistance
Tolerance
±3 %(H)
or
±5 %(J)
B Value
at 25/50(K)
4500 K±2 %
4500 K±2 %
4500 K±2 %
(3380 K)
4050 K±2 %
4050 K±2 %
4250 K±2 %
4250 K±2 %
4500 K±2 %
4700 K±2 %
4500 K±2 %
4500 K±2 %
B Value
at 25/85(K)
(4450 K)
(4450 K)
(4450 K)
3435 K±1 %
(4100 K)
(4100 K)
(4300 K)
(4300 K)
(4550 K)
(4750 K)
(4750 K)
(4750 K)
□ : Resistance Tolerance Code
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Dec. 2017
3
Multilayer NTC Thermistors
● 0402(EIA)
Part Number
ERTJ0EA220□
Nominal Resistance
at 25 °C
22 Ω
Resistance
Tolerance
B Value
at 25/50(K)
2750 K±3 %
B Value
at 25/85(K)
(2700 K)
ERTJ0EA330□
33 Ω
2750 K±3 %
(2700 K)
ERTJ0EA400□
40 Ω
2750 K±3 %
(2700 K)
ERTJ0EA470□
47 Ω
2750 K±3 %
(2700 K)
ERTJ0EA680□
68 Ω
2800 K±3 %
(2750 K)
ERTJ0EA101□
100 Ω
2800 K±3 %
(2750 K)
ERTJ0EA151□
150 Ω
2800 K±3 %
(2750 K)
ERTJ0ET102□
1.0 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET152□
1.5 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET202□
2.0 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET222□
2.2 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET302□
3.0 kΩ
4500 K±2 %
(4450 K)
ERTJ0ER332□
3.3 kΩ
4250 K±2 %
(4300 K)
ERTJ0ET332□
3.3 kΩ
4500 K±2 %
(4450 K)
ERTJ0ET472□
4.7 kΩ
4500 K±2 %
(4450 K)
ERTJ0ER472□
4.7 kΩ
4250 K±2 %
(4300 K)
ERTJ0ER682□
6.8 kΩ
4250 K±2 %
(4300 K)
ERTJ0EG103□A
10 kΩ
(3380 K)
3435 K±1 %
ERTJ0EM103□
10 kΩ
3900 K±2 %
(3970 K)
4250 K±2 %
(4300 K)
4250 K±2 %
(4300 K)
ERTJ0ER103□
10 kΩ
ERTJ0ER153□
15 kΩ
±3 %(H)
or
±5 %(J)
ERTJ0ER223□
22 kΩ
4250 K±2 %
(4300 K)
ERTJ0EP333□
33 kΩ
4050 K±2 %
(4100 K)
ERTJ0ER333□
33 kΩ
4250 K±2 %
(4300 K)
ERTJ0ET333□
33 kΩ
4500 K±2 %
(4580 K)
ERTJ0EP473□
47 kΩ
4050 K±2 %
(4100 K)
ERTJ0ET473□
47 kΩ
4500 K±2 %
(4550 K)
ERTJ0EV473□
47 kΩ
4700 K±2 %
(4750 K)
ERTJ0EP683□
68 kΩ
4050 K±2 %
(4100 K)
ERTJ0ER683□
68 kΩ
4250 K±2 %
(4300 K)
ERTJ0EV683□
68 kΩ
4700 K±2 %
(4750 K)
ERTJ0EP104□
100 kΩ
4050 K±2 %
(4100 K)
ERTJ0ER104□
100 kΩ
4250 K±2 %
(4300 K)
ERTJ0ES104□
100 kΩ
4330 K±2 %
(4390 K)
ERTJ0ET104□
100 kΩ
4500 K±2 %
(4580 K)
ERTJ0EV104□
100 kΩ
4700 K±2 %
(4750 K)
ERTJ0ET154□
150 kΩ
4500 K±2 %
(4580 K)
ERTJ0EV154□
150 kΩ
4700 K±2 %
(4750 K)
ERTJ0EV224□
220 kΩ
4700 K±2 %
(4750 K)
ERTJ0EV334□
330 kΩ
4700 K±2 %
(4750 K)
ERTJ0EV474□
470 kΩ
4700 K±2 %
(4750 K)
□ : Resistance Tolerance Code
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Dec. 2017
4
Multilayer NTC Thermistors
● 0603(EIA)
Part Number
ERTJ1VA220□
Nominal Resistance
at 25 °C
22 Ω
Resistance
Tolerance
B Value
at 25/50(K)
2750 K±3 %
B Value
at 25/85(K)
(2700 K)
ERTJ1VA330□
33 Ω
2750 K±3 %
(2700 K)
ERTJ1VA400□
40 Ω
2800 K±3 %
(2750 K)
ERTJ1VA470□
47 Ω
2800 K±3 %
(2750 K)
ERTJ1VA680□
68 Ω
2800 K±3 %
(2750 K)
ERTJ1VA101□
100 Ω
2800 K±3 %
(2750 K)
ERTJ1VT102□
1.0 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT152□
1.5 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT202□
2.0 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT222□
2.2 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT302□
3.0 kΩ
4500 K±2 %
(4450 K)
ERTJ1VT332□
3.3 kΩ
4500 K±2 %
(4450 K)
ERTJ1VR332□
3.3 kΩ
4250 K±2 %
(4300 K)
ERTJ1VR472□
4.7 kΩ
4250 K±2 %
(4300 K)
ERTJ1VT472□
4.7 kΩ
ERTJ1VR682□
6.8 kΩ
ERTJ1VG103□A
10 kΩ
±3 %(H)
or
±5 %(J)
4500 K±2 %
(4450 K)
4250 K±2 %
(4300 K)
(3380 K)
3435 K±1%
ERTJ1VR103□
10 kΩ
4250 K±2 %
(4300 K)
ERTJ1VR153□
15 kΩ
4250 K±2 %
(4300 K)
ERTJ1VR223□
22 kΩ
4250 K±2 %
(4300 K)
ERTJ1VR333□
33 kΩ
4250 K±2 %
(4300 K)
ERTJ1VP473□
47 kΩ
4100 K±2 %
(4150 K)
ERTJ1VR473□
47 kΩ
4250 K±2 %
(4300 K)
ERTJ1VV473□
47 kΩ
4700 K±2 %
(4750 K)
ERTJ1VR683□
68 kΩ
4250 K±2 %
(4300 K)
ERTJ1VV683□
68 kΩ
4700 K±2 %
(4750 K)
ERTJ1VS104□A
100 kΩ
(4330 K)
4390 K±1%
ERTJ1VV104□
100 kΩ
4700 K±2 %
(4750 K)
ERTJ1VV154□
150 kΩ
4700 K±2 %
(4750 K)
ERTJ1VT224□
220 kΩ
4500 K±2 %
(4580 K)
□ : Resistance Tolerance Code
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Dec. 2017
5
Multilayer NTC Thermistors
● Temperature
and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
ERTJ□□A~
B25/50 2750 K
2800 K
B25/85 (2700 K) (2750 K)
ERTJ□□G~ ERTJ□□M~ ERTJ□□P~ ERTJ□□R~ ERTJ0ES~ ERTJ1VS~ ERTJ□□T~ ERTJ□□T~ ERTJ□□V~
(3375 K)
3435 K
3900 K
4050 K
4250 K
4330 K
(3970 K) (4100 K) (4300 K) (4390 K)
(4330 K)
4390 K
4500 K
4500 K
4700 K
(4450 K) (4580 K) (4750 K)
✽1
T(°C)
✽2
-40 13.05
13.28
20.52
32.11
33.10
43.10
45.67
45.53
63.30
47.07
59.76
-35 10.21
10.40
15.48
23.29
24.03
30.45
32.08
31.99
42.92
33.31
41.10
-30
8.061
8.214
-25
6.427
6.547
11.79
9.069
17.08
17.63
21.76
22.80
22.74
29.50
23.80
28.61
12.65
13.06
15.73
16.39
16.35
20.53
17.16
20.14
-20
5.168
5.261
7.037
9.465
9.761
11.48
11.91
11.89
14.46
12.49
14.33
-15
4.191
4.261
5.507
7.147
7.362
8.466
8.743
8.727
-10
3.424
3.476
4.344
5.444
5.599
6.300
6.479
6.469
7.407
6.772
7.482
-5
2.819
2.856
3.453
4.181
4.291
4.730
4.845
4.839
5.388
5.046
5.481
0
2.336
2.362
2.764
3.237
3.312
3.582
3.654
3.650
3.966
3.789
4.050
5
1.948
1.966
2.227
2.524
2.574
2.734
2.778
2.776
2.953
2.864
3.015
10
1.635
1.646
1.806
1.981
2.013
2.102
2.128
2.126
2.221
2.179
2.262
15
1.380
1.386
1.474
1.567
1.584
1.629
1.642
1.641
1.687
1.669
1.710
20
1.171
1.174
1.211
1.247
1.255
1.272
1.277
1.276
1.293
1.287
1.303
25
1
1
1
1
1
1
1
1
1
1
1
30
0.8585
0.8565
0.8309
0.8072
0.8016
0.7921
0.7888
0.7890
0.7799
0.7823
0.7734
35
0.7407
0.7372
0.6941
0.6556
0.6461
0.6315
0.6263
0.6266
0.6131
0.6158
0.6023
40
0.6422
0.6376
0.5828
0.5356
0.5235
0.5067
0.5004
0.5007
0.4856
0.4876
0.4721
45
0.5595
0.5541
0.4916
0.4401
0.4266
0.4090
0.4022
0.4025
0.3874
0.3884
0.3723
50
0.4899
0.4836
0.4165
0.3635
0.3496
0.3319
0.3251
0.3254
0.3111
0.3111
0.2954
55
0.4309
0.4238
0.3543
0.3018
0.2881
0.2709
0.2642
0.2645
0.2513
0.2504
0.2356
60
0.3806
0.3730
0.3027
0.2518
0.2386
0.2222
0.2158
0.2161
0.2042
0.2026
0.1889
65
0.3376
0.3295
0.2595
0.2111
0.1985
0.1832
0.1772
0.1774
0.1670
0.1648
0.1523
70
0.3008
0.2922
0.2233
0.1777
0.1659
0.1518
0.1463
0.1465
0.1377
0.1348
0.1236
75
0.2691
0.2600
0.1929
0.1504
0.1393
0.1264
0.1213
0.1215
0.1144
0.1108
0.1009
80
0.2417
0.2322
0.1672
0.1278
0.1174
0.1057
0.1011
0.1013
0.09560
0.09162
0.08284
85
0.2180
0.2081
0.1451
0.1090
0.09937
0.08873
0.08469
0.08486
0.08033
0.07609
0.06834
90
0.1974
0.1871
0.1261
0.09310
0.08442
0.07468
0.07122
0.07138
0.06782
0.06345
0.05662
10.30
9.159
10.31
95
0.1793
0.1688
0.1097
0.07980
0.07200
0.06307
0.06014
0.06028
0.05753
0.05314
0.04712
100
0.1636
0.1528
0.09563
0.06871
0.06166
0.05353
0.05099
0.05112
0.04903
0.04472
0.03939
105
0.1498
0.1387
0.08357
0.05947
0.05306
0.04568
0.04340
0.04351
0.04198
0.03784
0.03308
110
0.1377
0.1263
0.07317
0.05170
0.04587
0.03918
0.03708
0.03718
0.03609
0.03218
0.02791
115
0.1270
0.1153
0.06421
0.04512
0.03979
0.03374
0.03179
0.03188
0.03117
0.02748
0.02364
120
0.1175
0.1056
0.05650
0.03951
0.03460
0.02916
0.02734
0.02742
0.02702
0.02352
0.02009
125
0.1091
0.09695
0.04986
0.03470
0.03013
0.02527
0.02359
0.02367
0.02351
0.02017
0.01712
✽1 Apply to products with a B25/50 constant of 4500 K and a resistance value of 25 °C less than 10 kΩ. ✽2 Applied only to ERTJ0ET104□.
✽2 Apply to products with a B25/50 constant of 4500 K and a resistance value of 25 °C of 10 kΩ or more. ✽2 Applied only to ERTJ0ET104□.
B25/50=
kn (R25/R50)
1/298.15–1/323.15
B25/85=
kn (R25/R85)
1/298.15–1/358.15
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85=Resistance at 85.0±0.1 °C
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Dec. 2017
6
Multilayer NTC Thermistors
Specification and Test Method
Item
Specification
Rated Zero-power Within the specified tolerance.
Resistance (R25)
Test Method
The value is measured at a power that the influence
of self-heat generation can be negligible (0.1mW or
less), at the rated ambient temperature of 25.0±0.1°C.
B Value
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (deg.C) and T2 (deg.C).
The B value is calculated by the following equation.
Shown in each Individual Specification.
✽ Individual Specification shall specify B25/50 or
B25/85.
BT1/T2=
T1
25.0 ±0.1 °C
25.0 ±0.1 °C
B25/50
B25/85
Adhesion
kn (R1)–kn (R2)
1/(T1+273.15)–1/(T2+273.15)
T2
50.0 ±0.1 °C
85.0 ±0.1 °C
The terminal electrode shall be free from peeling Applied force :
or signs of peeling.
Size 0201
:2N
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0201, 0402
1.0
0.3/Size:0201
0.5/Size:0402
0.5R
Test Sample
Board
1.0
Size : 0603
Test
Sample
Bending distance : 1 mm
Bending speed : 1 mm/s
20
Bending
distance
Bending Strength There shall be no cracks and other mechanical
damage.
R25 change : within ±5 %
Unit : mm
R340
45±2
45±2
Unit : mm
Resistance to
Soldering Heat
Solderability
There shall be no cracks and other mechanical
damage.
Nallow Tol. type Standard type
R25 change
: within ±2 %
within ±3 %
B Value change : within ±1 %
within ±2 %
Soldering bath method
Solder temperature : 270 ±5 °C
Dipping period
: 4.0 ±1 s
Preheat condition :
More than 95 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period
: 4 ±1 s
Solder
: Sn-3.0Ag-0.5Cu
Step
1
2
Temp (°C)
80 to 100
150 to 200
Period (s)
120 to 180
120 to 180
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Dec. 2017
7
Multilayer NTC Thermistors
Specification and Test Method
Item
Temperature
Cycling
Specification
Test Method
Nallow Tol. type Standard type Conditions of one cycle
R25 change
: within ±2 %
within ±3 %
Step 1 : –40 °C, 30±3 min
B Value change : within ±1 %
within ±2 %
Step 2 : Room temp., 3 min max.
Step 3 : 125 °C, 30±3 min.
Step 4 : Room temp., 3 min max.
Number of cycles: 100 cycles
Humidity
R25 change
:
B Value change :
Biased Humidity
Low Temperature
Exposure
Nallow Tol. type Standard type Temperature
: 85 ±2 °C
within ±2 %
within ±3 % Relative humidity : 85 ±5 %
within ±1 %
within ±2 % Test period
: 1000 +48/0 h
R25 change
:
B Value change :
Nallow Tol. type Standard type Temperature
: 85 ±2 °C
within ±2 %
within ±3 % Relative humidity : 85 ±5 %
within ±1 %
within ±2 % Applied power : 10 mW(D.C.)
Test period
: 500 +48/0 h
R25 change
:
B Value change :
Nallow Tol. type Standard type Specimens are soldered on the testing board
within ±2 %
within ±3 % shown in Fig.2.
within ±1 %
within ±2 % Temperature
: –40 ±3 °C
Test period
: 1000 +48/0 h
High Temperature
Nallow Tol. type Standard type Specimens are soldered on the testing board
Exposure
R25 change
: within ±2 %
within ±3 % shown in Fig.2.
B Value change : within ±1 %
within ±2 % Temperature
: 125 ±3 °C
Test period
: 1000 +48/0 h
Typical Application
● Temperature
Detection
Writing current control of HDD
Vcc
GMR Head
R
R
L
Rth
NTC
AD
converter
CPU
● Temperature
Interface
● Temperature
Compensation (Pseudo-linearization)
Contrast level control of LCD
Compensation (RF circuit)
Temperature compensation of TCXO
Vcc
PMIC
ADC
R
Rth
NTC
R
LCD
NTC
R
Rth
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Dec. 2017
8
Multilayer NTC Thermistors
Dimensions in mm (not to scale)
L
(Unit : mm)
W
Size Code (EIA)
L
W
T
L1, L2
Z(0201)
0.60±0.03
0.30±0.03
0.30±0.03
0.15±0.05
0(0402)
1.0±0.1
0.50±0.05
0.50±0.05
0.25±0.15
1(0603)
1.60±0.15
0.8±0.1
0.8±0.1
0.3±0.2
T
L2
L1
Packaging Methods
Size
Code
Thickness
(mm)
Z(0201)
0(0402)
1(0603)
● Pitch
● Reel
Packing Quantities
0.3
0.5
0.8
Kind of Taping
Pressed Carrier Taping
2
2
4
Punched Carrier Taping
W1
E
15,000
10,000
4,000
C
D
2 mm (Pressed Carrier Taping) : Size 0201
Feeding hole
fD0
W2
Chip pocket
A
E
t
Dim.
(mm)
B
K0
Chip component
A
B
W
P 1 P2
F
E
P2
P0
fD 0
t
±0.03 ±0.03 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
● Pitch
Feeding hole
fD0
C
D
E
13.0±0.5
21.0±0.8
2.0±0.5
W1
9.0
W2
+1.0
0
11.4±1.0
Part and Taped End
Leader part
0
max. ±0.03
Top cover tape
2 mm (Punched Carrier Taping) : Size 0402
100 min.
Vacant position
400 min.
Chip pocket
E
t1
60.0
+1.0
0
● Leader
K0
Dim. 0.36 0.66 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.55 0.36
(mm)
180
fB
0
–3
Tape running direction
P0
P1
fA
Symbol
F
W
A
Symbol
for Taping
Pitch Quantity
(mm) (pcs./reel)
B
● Standard
Taped end
B
F
W
A
t2
Chip component
A
Symbol
B
W
P1 P2
F
E
P0
P1
P2
P0
fD 0
t1
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7
±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
● Pitch
0
1.0
max. max.
Minimum Quantity / Packing Unit
Part Number Minimum Quantity Packing Quantity
Carton
/ Packing Unit
in Carton
L×W×H (mm)
(Size)
4 mm (Punched Carrier Taping) : Size 0603
Feeding hole
fD0
t1
Chip pocket
B
F
W
A
t2
Symbol
A
Dim. 1.0
(mm)
P1
Chip component
±0.1
B
W
F
E
P2
P1
Tape running direction
P0
P2
P0
fD 0
t1
1.8 8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1
±0.1
±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1
0
(Unit : mm)
t2
E
(mm)
160 min.
Vacant position
Tape running direction
ERTJZ
(0201)
15,000
300,000
250×200×200
ERTJ0
(0402)
10,000
200,000
250×200×200
ERTJ1
(0603)
4,000
80,000
250×200×200
Part No., quantity and country of origin are designated
on outer packages in English.
t2
1.4
max. max.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Dec. 2017
9
Multilayer NTC Thermistors
Multilayer NTC Thermistors
Series: ERTJ
Handling Precautions
[Precautions]
・ Do not use the products beyond the descriptions in this product catalog.
・ This product catalog guarantees the quality of the products as individual components.
Before you use the products, please make sure to check and evaluate the products
in the circumstance where they are installed in your product.
Safety Precautions
Multilayer NTC Thermistors for General Applications (hereafter referred to as “Thermistors”) are intended to
be used in general-purpose applications as measures against Temperature detection and Temperature
compensation in consumer electronics (audio/visual, home, office, information & communication) equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications,
as noted in the Ratings and Specified Conditions section, the Thermistors’ performance may be degraded,
or become failure mode, such as short circuit mode and open-circuit mode.
If you use under the condition of short-circuit, heat generation of Thermistors will occur by running large current
due to application of voltage. There are possibilities of smoke emission, substrate burn-out, and, in the worst
case, fire. For products which require high safety levels, please carefully consider how a single malfunction can
affect your product. In order to ensure the safety in the case of a single malfunction, please design products
with fail-safe, such as setting up protecting circuits, etc.
We are trying to improve the quality and the reliability, but the durability differs depending on the use
environment and the use conditions. On use, be sure to confirm the actual product under the actual use
conditions.
● For the following applications and conditions, please be sure to consult with our sales representative in
advance and to exchange product specifications which conform to such applications.
・ When your application may have difficulty complying with the safety or handling precautions specified below.
・ High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such
as death or injury (regardless of directly or indirectly), due to failure or malfunction of the product.
① Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
② Submarine Equipment (submarine repeating equipment, etc.)
③ Transportation Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.)
④ Power Generation Control Equipment
(atomic power, hydroelectric power, thermal power plant control system, etc.)
⑤ Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
⑥ Information Processing Equipment (large scale computer systems, etc.)
⑦ Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
⑧ Rotary Motion Equipment
⑨ Security Systems
⑩ And any similar types of equipment
Strict Observance
1. Confirmation of Rated Performance
The Thermistors shall be operated within the specified rating/performance.
Applications exceeding the specifications may cause deteriorated performance and/or breakdown, resulting in
degradation and/or smoking or ignition of products. The following are strictly observed.
(1) The Thermistors shall not be operated beyond the specified operating temperature range.
(2) The Thermistors shall not be operated in excess of the specified maximum power dissipation.
2. The Thermistors shall not be mounted near flammables.
01. Oct. 2019
10
Multilayer NTC Thermistors
Operating Conditions and Circuit Design
1. Circuit Design
【Dissipation factor】
・The constant amount power required to raise the
temperature of the Thermistor 1 °C through self
heat generation under stable temperatures.
Dissipation factor (mW/°C) = Power consumption
of Thermistor / Temperature rise of element.
Maximum power dissipation
【Maximum power dissipation】
・The Maximum power that can be continuously applied
under static air at a certain ambient temperature.
The Maximum power dissipation under an ambient
temperature of 25 ℃ or less is the same with the rated
maximum power dissipation, and Maximum power
dissipation beyond 25 ℃ depends on the Decreased
power dissipation curve below.
/ Rated maximum power dissipation (%)
1.1 Operating Temperature and Storage Temperature
When operating a components-mounted circuit, please be sure to observe the “Operating Temperature Range”,
written in delivery specifications. Storage temperature of PCB after mounting Thermistors, which is not operated,
should be within the specified “Storage Temperature Range” in the delivery specifications. Please remember not
to use the product under the condition that exceeds the specified maximum temperature.
1.2 Operating Power
The electricity applied to between terminals of Thermistors should be under the specified maximum power
dissipation. There are possibilities of breakage and burn-out due to excessive self-heating of Thermistors,
if the power exceeds maximum power dissipation when operating. Please consider installing protection circuit for
your circuit to improve the safety, in case of abnormal voltage application and so on. Thermistors’ performance of
temperature detection would be deteriorated if self-heating occurs, even when you use it under the maximum
power dissipation. Please consider the maximum power dissipation and dissipation factor.
Decreased power dissipation curve
100
50
25
75
125
Ambient temperature (°C)
1.3 Environmental Restrictions
The Thermistors does not take the use under the following special environments into consideration.
Accordingly, the use in the following special environments, and such environmental conditions may affect the
performance of the product; prior to use, verify the performance, reliability, etc. thoroughly.
① Use in liquids such as water, oil, chemical, and organic solvent.
② Use under direct sunlight, in outdoor or in dusty atmospheres.
③ Use in places full of corrosive gases such as sea breeze, Cl2，H2S，NH3，SO2，and NOx.
④ Use in environment with large static electricity or strong electromagnetic waves or strong radial ray.
⑤ Where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride
wire is arranged close to the product.
⑥ Where this product is sealed or coated with resin etc.
⑦ Where solvent, water, or water-soluble detergent is used in flux cleaning after soldering.
(Pay particular attention to water-soluble flux.)
⑧ Use in such a place where the product is wetted due to dew condensation.
⑨ Use the product in a contaminated state.
Ex.) Do not handle the product such as sticking sebum directly by touching the product after mounting
printed circuit board.
⑩ Under severe conditions of vibration or impact beyond the specified conditions found in the Specifications.
1.4 Measurement of Resistance
The resistance of the Thermistors varies depending on ambient temperatures and self-heating. To measure the
resistance value when examining circuit configuration and conducting receiving inspection and so on, the following
points should be taken into consideration:
① Measurement temp : 25±0.1 °C
Measurement in liquid (silicon oil, etc.) is recommended for a stable measurement temperature.
② Power : 0.10 mW max. 4 terminal measurement with a constant-current power supply is recommended.
11
01. Oct. 2019
Multilayer NTC Thermistors
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
There is a possibility of performance deterioration by heat shock (temperature cycles), which causes cracks,
from alumina substrate. Please confirm that the substrate you use does not deteriorate the Thermistors’ quality.
2.２ Design of Land Pattern
(1) Recommended land dimensions are shown below. Use the proper amount of solder in order to prevent
cracking. Using too much solder places excessive stress on the Thermistors..
Recommended Land Dimensions(Ex.)
Land
SMD
Solder resist
Size
Code/EIA
Unit (mm)
Component dimensions
a
b
c
L
W
T
Z(0201)
0.6
0.3
0.3
0.2 to 0.3 0.25 to 0.30
0.2 to 0.3
0(0402)
1.0
0.5
0.5
0.4 to 0.5
0.4 to 0.5
0.4 to 0.5
1(0603)
1.6
0.8
0.8
0.8 to 1.0
0.6 to 0.8
0.6 to 0.8
(2) The land size shall be designed to have equal space, on both right and left side. If the amount of solder on
both sides is not equal, the component may be cracked by stress since the side with a larger amount of
solder solidifies later during cooling.
Recommended Amount of Solder
(a) Excessive amount
2.3 Utilization of Solder Resist
(1) Solder resist shall be utilized to equalize
the amounts of solder on both sides.
(2) Solder resist shall be used to divide the
pattern for the following cases;
・ Components are arranged closely.
・ The Thermistor is mounted near
a component with lead wires.
・ The Thermistor is placed near a chassis.
Refer to the table below.
(b) Proper amount
(c) Insufficient amount
Prohibited Applications and Recommended Applications
Prohibited
applications
Item
Mixed
mounting
with a
component
with lead
wires
The lead wire of a Component
With lead wires
Chassis
Arrangement
near
chassis
Solder(ground solder)
Improved applications
by pattern division
Solder resist
Solder resist
Electrode pattern
Retro-fitting
of component
with lead
wires
A lead wire of Retrofitted
component
Solderingiron
iron
Portion to be
Lateral
arrangement
Solder resist
Excessively soldered
Solder resist
Land
2.4 Component Layout
To prevent the crack of Thermistors, try to place it place it on the position that could not easily
be affected by the bending stress of substrate while mounting procedures or procedures afterwards.
Placement of the Thermistors near heating elements also requires the great care to be
taken in order to avoid stresses from rapid heating and cooling.
12
01. Oct. 2019
Multilayer NTC Thermistors
Prohibited layout
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Thermistors’ layout below.
Recommended layout
Layout the Varistors sideways
against the stressing direction.
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on
the mounting position of the Thermistors.
E
Perforation
D
C
Magnitude of stress
A>B=C>D>E
A
Slit
B
(3) The magnitude of mechanical stress applied to the Thermistors when dividing the circuit board in descending
order is as follows: push back < slit < V-groove < perforation. Also take into account the layout of the
Thermistors and the dividing/breaking method.
(4) When the Thermistors are placed near heating elements such as heater, etc., cracks from thermal stresses
may occur under following situation:
・ Soldering the Thermistors directly to heating elements.
・ Sharing the land with heating elements.
If planning to conduct above-mentioned mounting and/or placement, please contact us in advance.
2.5 Mounting Density and Spaces
Intervals between components should not be too narrow to prevent the influence from solder bridges
and solder balls. The space between components should be carefully determined.
Precautions for Assembly
1. Storage
(1) The Thermistors shall be stored between 5 to 40 °C and 20 to 70 % RH, not under severe conditions of high
temperature and humidity.
(2) If stored in a place where humidity, dust, or corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen
chloride and ammonia, etc.) are contained, the solderability of terminals electrodes will be deteriorated.
In addition, storage in a place where the heat or direct sunlight exposure occurs will causes or direct sunlight
exposure occurs will causes mounting problems due to deformation of tapes and reels and components and
taping/reels sticking together.
(3) Do not store components longer than 6 months. Check the solderability of products that have been stored
for more than 6 months before use.
2. Chip Mounting Consideration
(1) When mounting the Thermistors/components on a PC board, the Thermistor bodies shall be free from
excessive impact loads such as mechanical impact or stress due to the positioning, pushing force and
displacement of vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is too low, the Thermistor will crack from excessive force
during mounting. The following precautions and recommendations are for your reference in use.
(a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board
after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the
bending of the PC board in order to minimize the impact of the vacuum nozzles. Typical examples are
shown in the table below.
(d) Adjust the vacuum nozzles so that their bottom dead center during mounting is not too low.
01. Oct. 2019
13
Multilayer NTC Thermistors
Item
Prohibited mounting
Single
surface
mounting
Double
surface
mounting
Recommended mounting
The supporting pin
Crack
does not necessarily
have to be positioned
Separation of
Crack
solder
Supporting
pin
Supporting
pin
(4) The closing dimensions of the positioning chucks shall be controlled. Maintenance and replacement of
positioning chucks shall be performed regularly to prevent chipping or cracking of the Thermistors caused
by mechanical impact during positioning due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not
exceed 0.5 mm at 90 mm span. The PC board shall be supported by an adequate number of supporting pins.
3. Selection of Soldering Flux
Soldering flux may seriously affect the performance of the Thermistors. The following shall be confirmed
before use.
(1) The soldering flux should have a halogen based content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux, wash the Thermistors sufficiently because the soldering flux
residue on the surface of PC boards may deteriorate the insulation resistance on the Thermistors’ surface.
4. Soldering
4.1 Reflow Soldering
The reflow soldering temperature conditions are composed of temperature curves of Preheating, Temp. rise,
Heating, Peak and Gradual cooling. Large temperature difference inside the Thermistors caused by rapid heat
application to the Thermistors may lead to excessive thermal stresses, contributing to the thermal cracks. The
Preheating temperature requires controlling with great care so that tombstone phenomenon may be prevented.
260
220
④Peak
△T
Temperature (˚C)
Recommended profile of Reflow Soldering (Ex.)
②Temp.
Item
③Gradual
cooling
180
140
①Preheating
③Heating
Time
60 ot 120 s
① Preheating
② Temp. rise
③ Heating
④ Peak
⑤ Gradual
cooling
Temperature
140 to 180 ℃
Preheating temp
to Peak temp.
220 ℃ min.
260 ℃ max.
Peak temp.
to 140 ℃
Period or Speed
60 to 120 s
2 to 5 ℃ / s
60 s max.
10 s max.
1 to 4 ℃ / s
60 s max.
△T : Allowable temperature difference △T≦ 150 °C
The rapid cooling (forced cooling) during Gradual cooling part should be avoided, because this may cause defects
such as the thermal cracks, etc. When the Thermistors are immersed into a cleaning solvent, make sure that the
surface temperatures of the devices do not exceed 100 °C. Performing reflow soldering twice under the conditions
shown in the figure above [Recommended profile of Flow soldering (Ex.)] will not cause any problems.
However, pay attention to the possible warp and bending of the PC board.
Recommended soldering condition is for the guideline for ensuring the basic characteristics of the components,
not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual
conditions. The temperature of this product at the time of mounting changes depending on mounting conditions,
therefore, please confirm that Product surface becomes the specified temperature when mounting it on the end
product.
01. Oct. 2019
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Multilayer NTC Thermistors
4.2 Hand Soldering
Hand soldering typically causes significant temperature change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc. In order to prevent any defects, the following should
be observed.
· The temperature of the soldering tips should be controlled with special care.
· The direct contact of soldering tips with the Thermistors and/or terminal electrodes should be avoided.
· Dismounted Thermistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering : Use thread solder (φ 1.0 mm or below) which contains flux with low chlorine, developed for
precision electronic equipment.
(b) Preheating : Conduct sufficient pre-heating, and make sure that the temperature difference between
solder and Thermitors’ surface is 150 °C or less.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be melted in advance on the soldering tip.)
(d) Gradual cooling : After soldering, the Thermitors shall be cooled gradually at room temperature.
Recommended profile of Hand soldering (Ex.)
△T
Gradual
cooling
Preheating
60 ot 120 s
3 s max.
△T : Allowable temperature difference △T ≦ 150 °C
(2) Condition 2 (without preheating)
Hand soldering can be performed without preheating,
by following the conditions below:
(a) Soldering iron tip shall never directly touch the
ceramic and terminal electrodes of the Thermitors.
(b) The lands are sufficiently preheated with a soldering
iron tip before sliding the soldering iron tip to the
terminal electrodes of the Thermitors for soldering.
Conditions of Hand soldering without preheating
Item
Temperature of Iron tip
Wattage
Shape of Iron tip
Soldering time with a
soldering iron
Condition
270 ℃ max.
20 W max.
Ф 3 mm max.
3 s max.
5. Post Soldering Cleaning
5.1 Cleaning solvent
Soldering flux residue may remain on the PC board if cleaned with an inappropriate solvent.
This may deteriorate the electrical characteristics and reliability of the Thermistors.
5.2 Cleaning conditions
Inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Thermitors.
(1) Insufficient cleaning can lead to :
(a) The halogen substance found in the residue of the soldering flux may cause the metal of terminal
electrodes to corrode.
(b) The halogen substance found in the residue of the soldering flux on the surface of the Thermitors may
change resistance values.
(c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to
those of rosin soldering flux.
(2) Excessive cleaning can lead to :
(a) When using ultrasonic cleaner, make sure that the output is not too large, so that the substrate will not
resonate. The resonation causes the cracks in Thermitors and/or solders, and deteriorates the strength of
the terminal electrodes. Please follow these conditions for Ultrasonic cleaning:
Ultrasonic wave output : 20 W/L max.
Ultrasonic wave frequency : 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
01. Oct. 2019
15
Multilayer NTC Thermistors
5.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may cause the same results as that of insufficient cleaning
due to the high density of liberated halogen.
6. Inspection Process
The pressure from measuring terminal pins might bend the PCB when implementing circuit inspection
after mounting Thermitors on PCB, and as a result, cracking may occur.
(1) Mounted PC boards shall be supported by an adequate number of supporting pins on the back with bend
settings of 90 mm span 0.5 mm max.
(2) Confirm that the measuring pins have the right tip shape, are equal in height, have the right pressure and
are set in the correct positions. The following figures are for your reference to avoid bending the PC board.
Item
Prohibited mounting
Recommended mounting
Check pin
Check pin
Bending of
PC board
Supporting pin
Separated, Crack
7.Protective Coating
Make sure characteristics and reliability when using the resin coating or resin embedding for the purpose of
improvement of humidity resistance or gas resistance, or fixing of parts because failures of a thermistors such
as 1) ,2) and 3) may be occurred.
(1) The solvent which contained in the resin permeate into the Thermitors, and it may deteriorate the
characteristic.
(2) When hardening the resin, chemical reaction heat (curing heat generation) happen and it may occurs the
infection to the Thermistors.
(3) The lead wire might be cut down and the soldering crack might be happen by expansion or contraction of
resin hardening.
8. Dividing/Breaking of PC Boards
(1) Please be careful not to stress the substrate with bending/twisting when dividing, after mounting
components including Thermistors. Abnormal and excessive mechanical stress such as bending or
torsion shown below can cause cracking in the Thermistors.
Bending
Torsion
(2) Dividing/Breaking of the PC boards shall be done carefully at moderate speed by using a jig or apparatus to
prevent the Thermistors on the boards from mechanical damage.
(3) Examples of PCB dividing/breaking jigs: The outline of PC board breaking jig is shown below. When PC board
are broken or divided, loading points should be close to the jig to minimize the extent of the bending.
Also, planes with no parts mounted on should be used as plane of loading, in order to prevent tensile stress
induced by the bending, which may cause cracks of the Thermistors or other parts mounted on the PC boards.
Outline of Jig
PC board
Prohibited mounting
V-groove
Loading
Recommended mounting
Loading direction
V-groove
point
PC
board
PC board
splitting jig
component
V-groove
PC
board
Loading direction
component
Loading point
01. Oct. 2019
16
Multilayer NTC Thermistors
10. Mechanical Impact
(1) The Thermistors shall be free from any excessive mechanical impact.
The Thermistor body is made of ceramics and may be damaged or cracked if dropped. Never use a
Thermistor which has been dropped; their quality may already be impaired, and in that case,
failure rate will increase.
(2) When handling PC boards with Thermistors mounted on them, do not allow the Thermistors to collide with
another PC board.
When mounted PC boards are handled or stored in a stacked state, the corner of a PC board might strike
Thermistors, and the impact of the strike may cause damage or cracking and can deteriorate the
withstand voltage and insulation resistance of the Thermistors.
Crack
Mounted
PCB
Crack
Floor
11. Do not reuse this product after removal from the mounting board.
Precautions for discarding
As to the disposal of the Thermistors, check the method of disposal in each country or region where the
modules are incorporated in your products to be used.
Other
The Thermistors precautions described above are typical. For special mounting conditions, please contact us.
The technical information in this catalog provides example of our products’ typical operations and application
circuit.
Applicable laws and regulations , others
1. This product not been manufactured with any ozone depleting chemical controlled under the Montreal
Protocol.
2. This product comply with RoHS(Restriction of the use of certain Hazardous Substance in electrical and
electronic equipment) (DIRECTIVE 2011/65/EU and 2015/863/EU).
3. All the materials used in this part are registered material under the Law Concerning the Examination and
Regulation of Manufacture, etc. of Chemical Substance.
4. If you need the notice by letter of “A preliminary judgement on the Laws of Japan foreign exchange and
Foreign Trade Control”, be sure to let us know.
5. These products are not dangerous goods on the transportation as identified by UN (United nations) numbers
or UN classification.
6. The technical information in this catalog provides example of our products’ typical operations and application
circuit. We do not guarantee the non-infringement of third party’s intellectual property rights and we do not
grant any license, Right or interest in our intellectual property.
01. Oct. 2019
17
Multilayer NTC Thermistors (Automotive Grade)
Multilayer NTC Thermistors (Automotive Grade)
ERTJ-M
Series:
Features
● Surface Mount Device (0402, 0603)
● Highly reliable multilayer / monolithic structure
● Wide temperature operating range (–40 to 150
● Environmentally-friendly lead-free
● AEC-Q200 qualified
● RoHS compliant
°C)
Recommended Applications
● For
● For
● For
● For
● For
● For
car audio system
ECUs
electric pumps and compressors
LED lights
batteries
temperature detection of various circuits
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
T
J
0
E
G
1
0
3
F
M
Common Code
Product Code
Type Code
ERT NTC
J Chip Type (SMD)
Thermistors
Multilayer Type
Size Code
0 “0402”
1 “0603”
Packaging
Style Code
E
V
“0402”
Pressed Carrier
Taping
Punched Carrier
Taping
(Pitch : 2 mm)
“0603”
Punched Carrier
Taping
(Pitch : 4 mm)
B Value Class Code
2701 to 2800
A
3301 to 3400
G
3801 to 3900
M
4001 to 4100
P
4201 to 4300
R
4301 to 4400
S
4401 to 4500
T
4601 to 4700
V
Nominal Resistance
R25 (Ω)
The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
(Example)
Resistance Tolerance
Code
G
±1% Narrow
Tolerance
±2% Type
H
J
±3% Standard
±5% Type
F
M
Automotive
component
Construction
3
4
5
1
No.
Name
A
Semiconductive Ceramics
B
Internal electrode
C
2
D
E
Terminal
electrode
Substrate electrode
Intermediate electrode
External electrode
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
04
18
Jan. 2018
Multilayer NTC Thermistors (Automotive Grade)
Ratings
Size code (EIA)
Operating Temperature Range
Rated Maximum Power Dissipation✽1
Dissipation Factor✽2
0(0402)
1(0603)
–40 to 150 °C
66 mW
Approximately 2 mW/°C
100 mW
Approximately 3 mW/°C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature exceeds
25 °C, rated power depends on the decreased power dissipation curve.
· Please see “Operating Power” for details.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
Part Number List
● 0402(EIA)
● 0603(EIA)
Part Number
ERTJ0EG202GM
ERTJ0EG202HM
ERTJ0EG202JM
ERTJ0EG103□M
ERTJ0EP473□M
ERTJ0ER104□M
ERTJ0ET104□M
ERTJ0EV104□M
ERTJ0EV474□M
Nominal Resistance
at 25 °C
2 kΩ±2 %
2 kΩ±3 %
2 kΩ±5 %
10 kΩ
47 kΩ
100 kΩ
100 kΩ
100 kΩ
470 kΩ
B Value
at 25/50(K)
(3380 K)
(3380 K)
(3380 K)
3380 K±1 %
4050 K±1 %
4250 K±1 %
4485 K±1 %
4700 K±1 %
4700 K±1 %
B Value
at 25/85(K)
3410 K±0.5 %
3410 K±0.5 %
3410 K±0.5 %
3435 K±1 %
(4100 K)
(4300 K)
(4550 K)
(4750 K)
(4750 K)
Nominal Resistance
at 25 °C
ERTJ1VK102□M
1 kΩ
ERTJ1VG103□M
10 kΩ
ERTJ1VP473□M
47 kΩ
ERTJ1VR104□M
100 kΩ
ERTJ1VV104□M
100 kΩ
ERTJ1VT224□M
220 kΩ
Part Number
B Value
at 25/50(K)
3650 K±1 %
3380 K±1 %
4100 K±1 %
4200 K±1 %
4700 K±1 %
4485 K±1 %
B Value
at 25/85(K)
(3690 K)
3435 K±1 %
(4150 K)
(4250 K)
(4750 K)
(4550 K)
□ : Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
□ : Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
● Temperature
B25/50
B25/85
T(°C)
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
130
135
140
145
150
B25/50=
and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
ERTJ□□G to
(3380 K)
3435 K
ERTJ1VK to
3650 K
(3690 K)
ERTJ0EP to
4050 K
(4100 K)
ERTJ1VP to
4100 K
(4150 K)
ERTJ0ER to
4250 K
(4300 K)
ERTJ1VR to
4200 K
(4250 K)
20.52
15.48
11.79
9.069
7.037
5.507
4.344
3.453
2.764
2.227
1.806
1.474
1.211
1
0.8309
0.6941
0.5828
0.4916
0.4165
0.3543
0.3027
0.2595
0.2233
0.1929
0.1672
0.1451
0.1261
0.1097
0.09563
0.08357
0.07317
0.06421
0.05650
0.04986
0.04413
0.03916
0.03483
0.03105
0.02774
25.77
19.10
14.29
10.79
8.221
6.312
4.883
3.808
2.993
2.372
1.892
1.520
1.229
1
0.8185
0.6738
0.5576
0.4639
0.3879
0.3258
0.2749
0.2330
0.1984
0.1696
0.1456
0.1255
0.1087
0.09440
0.08229
0.07195
0.06311
0.05552
0.04899
0.04336
0.03849
0.03426
0.03058
0.02736
0.02454
33.10
24.03
17.63
13.06
9.761
7.362
5.599
4.291
3.312
2.574
2.013
1.584
1.255
1
0.8016
0.6461
0.5235
0.4266
0.3496
0.2881
0.2386
0.1985
0.1659
0.1393
0.1174
0.09937
0.08442
0.07200
0.06166
0.05306
0.04587
0.03979
0.03460
0.03013
0.02629
0.02298
0.02013
0.01767
0.01553
34.56
24.99
18.26
13.48
10.04
7.546
5.720
4.369
3.362
2.604
2.030
1.593
1.258
1
0.7994
0.6426
0.5194
0.4222
0.3451
0.2837
0.2344
0.1946
0.1623
0.1359
0.1143
0.09658
0.08189
0.06969
0.05957
0.05117
0.04415
0.03823
0.03319
0.02886
0.02513
0.02193
0.01918
0.01680
0.01476
42.40
29.96
21.42
15.50
11.33
8.370
6.244
4.699
3.565
2.725
2.098
1.627
1.271
1
0.7923
0.6318
0.5069
0.4090
0.3320
0.2709
0.2222
0.1831
0.1516
0.1261
0.1054
0.08843
0.07457
0.06316
0.05371
0.04585
0.03929
0.03378
0.02913
0.02519
0.02184
0.01898
0.01654
0.01445
0.01265
40.49
28.81
20.72
15.07
11.06
8.198
6.129
4.622
3.515
2.694
2.080
1.618
1.267
1
0.7944
0.6350
0.5108
0.4132
0.3363
0.2752
0.2263
0.1871
0.1554
0.1297
0.1087
0.09153
0.07738
0.06567
0.05596
0.04786
0.04108
0.03539
0.03059
0.02652
0.02307
0.02013
0.01762
0.01546
0.01361
kn (R25/R50)
1/298.15–1/323.15
B25/85=
ERTJ□□T to ERTJ□□V to
4485 K
4700 K
(4550 K)
(4750 K)
46.47
32.92
23.55
17.00
12.38
9.091
6.729
5.019
3.772
2.854
2.173
1.666
1.286
1
0.7829
0.6168
0.4888
0.3896
0.3123
0.2516
0.2037
0.1658
0.1357
0.1117
0.09236
0.07675
0.06404
0.05366
0.04518
0.03825
0.03255
0.02781
0.02382
0.02043
0.01755
0.01511
0.01304
0.01127
0.00976
59.76
41.10
28.61
20.14
14.33
10.31
7.482
5.481
4.050
3.015
2.262
1.710
1.303
1
0.7734
0.6023
0.4721
0.3723
0.2954
0.2356
0.1889
0.1523
0.1236
0.1009
0.08284
0.06834
0.05662
0.04712
0.03939
0.03308
0.02791
0.02364
0.02009
0.01712
0.01464
0.01256
0.01080
0.00931
0.00806
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85=Resistance at 85.0±0.1 °C
kn (R25/R85)
1/298.15–1/358.15
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
04
19
Jan. 2018
Multilayer NTC Thermistors (Automotive Grade)
Specification and Test Method
Item
Specification
Rated Zero-power Within the specified tolerance.
Resistance (R25)
Test Method
The value is measured at a power that the influence
of self-heat generation can be negligible (0.1mW or
less), at the rated ambient temperature of 25.0±0.1°C.
B Value
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (deg.C) and T2 (deg.C).
The B value is calculated by the following equation.
Shown in each Individual Specification.
✽ Individual Specification shall specify B25/50 or
B25/85.
BT1/T2=
T1
25.0 ±0.1 °C
25.0 ±0.1 °C
B25/50
B25/85
Adhesion
kn (R1)–kn (R2)
1/(T1+273.15)–1/(T2+273.15)
T2
50.0 ±0.1 °C
85.0 ±0.1 °C
The terminal electrode shall be free from peeling Applied force :
or signs of peeling.
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0402
1.0
0.5
0.5R
Test Sample
Board
1.0
Size : 0603
Test
Sample
Bending distance : 2 mm
Bending speed : 1 mm/s
20
R340
45±2
Bending
distance
Bending Strength There shall be no cracks and other mechanical
damage.
R25 change : within ±5 %
Unit : mm
45±2
Unit : mm
Resistance to
Vibration
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
Resistance to
Impact
within ±2 %
within ±1 %
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
within ±2 %
within ±1 %
Solder samples on a testing substrate, then
apply vibration to them.
Acceleration
:5G
Vibrational frequency : 10 to 2000 Hz
Sweep time
: 20 minutes
12 cycles in three directions,
which are perpendicular to each other
Solder samples on a testing substrate, then apply
impacts to them.
Pulse waveform
: Semisinusoidal wave, 11 ms
Impact acceleration : 50 G
Impact direction
: X-X', Y-Y', Z-Z' In 6 directions,
three times each
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
04
20
Jan. 2018
Multilayer NTC Thermistors (Automotive Grade)
Specification and Test Method
Item
Resistance to
Soldering Heat
Specification
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
within ±2 %
within ±1 %
Test Method
Soldering bath method
Solder temperature : 260 ±5 °C, 270 ±5 °C
Dipping period
: 3.0 ±0.5 s, 10.0 ±0.5 s
Preheat condition :
Step
1
2
Temp (°C)
80 to 100
150 to 200
Period (s)
120 to 180
120 to 180
Solderability
More than 95 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period
: 4 ±1 s
Solder
: Sn-3.0Ag-0.5Cu
Temperature
Cycling
R25 change
:
B Value change :
within ±2 %
within ±1 %
Conditions of one cycle
Step 1 : –55±3 °C, 30±3 min.
Step 2 : Room temp., 3 min. max.
Step 3 : 125±5 °C, 30±3 min.
Step 4 : Room temp., 3 min. max.
Number of cycles: 2000 cycles
Humidity
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
: 85 ±2 °C
Relative humidity : 85 ±5 %
Test period
: 2000 +48/0 h
Biased Humidity
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
: 85 ±2 °C
Relative humidity : 85 ±5 %
Applied power : 10 mW(D.C.)
Test period
: 2000 +48/0 h
Low Temperature
Exposure
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
Test period
: –40 ±3 °C
: 2000 +48/0 h
High Temperature R25 change
:
Exposure 1
B Value change :
within ±2 %
within ±1 %
Temperature
Test period
: 125 ±3 °C
: 2000 +48/0 h
High Temperature R25 change
:
Exposure 2
B Value change :
within ±3 %
within ±2 %
Temperature
Test period
: 150 ±3 °C
: 1000 +48/0 h
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
04
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Jan. 2018
Multilayer NTC Thermistors (Automotive Grade)
Dimensions in mm (not to scale)
L
W
(Unit : mm)
Size Code (EIA)
L
W
T
L1, L2
0 (0402)
1.0±0.1
0.50±0.05
0.50±0.05
0.25±0.15
1 (0603)
1.60±0.15
0.8±0.1
0.8±0.1
0.3±0.2
T
L2
L1
Packaging Methods
● Standard
Size
Code
● Reel
Packing Quantities
Thickness
(mm)
0.5
1 (0603)
0.8
Pitch Quantity
(mm) (pcs./reel)
Kind of Taping
Punched Carrier Taping
2
10,000
4
4,000
W1
E
C
B
0 (0402)
for Taping
D
● Pitch
W2
2 mm (Punched Carrier Taping) : Size 0402
A
Feeding hole
fD0
t1
Chip pocket
E
Symbol
(mm)
fB
fA
180
0
–3
60.0
+1.0
0
C
D
E
13.0±0.5 21.0±0.8 2.0±0.5
W1
9.0
+1.0
0
W2
11.4±1.0
B
F
W
A
Dim.
t2
Chip component
A
Symbol
B
W
P1 P2
F
E
P0
P1
P2
P0
fD 0
t1
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7
±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
● Pitch
0
Part and Taped End
Leader part
t2
Top cover tape
1.0
max. max.
100 min.
Vacant position
400 min.
4 mm (Punched Carrier Taping) : Size 0603
Feeding hole
fD0
t1
Chip pocket
Taped end
E
(mm)
● Leader
Tape running direction
B
F
W
A
t2
Symbol
160 min.
Vacant position
(Unit : mm)
ERTJ0 (0402)
Minimum Quantity/ Packing
Unit
10,000
Packing Quantity
in Carton
200,000
Carton
L×W×H (mm)
250×200×200
ERTJ1 (0603)
4,000
80,000
250×200×200
A
Dim. 1.0
(mm)
P1
Chip component
±0.1
B
1.8
±0.1
W
F
E
P2
Tape running direction
P0
P1
P2
P0
fD 0
t1
t2
8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 1.4
±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1
0 max. max.
Minimum Quantity / Packing Unit
Part Number (Size)
Part No., quantity and country of origin are designated on outer packages in English.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
04
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Jan. 2018
Multilayer NTC Thermistors (Automotive Grade)
Multilayer NTC Thermistors (Automotive Grade)
Series: ERTJ
Handling Precautions
[Precautions]
・ Do not use the products beyond the descriptions in this product catalog.
・ This product catalog guarantees the quality of the products as individual components.
Before you use the products, please make sure to check and evaluate the products
in the circumstance where they are installed in your product.
Safety Precautions
Multilayer NTC Thermistors for Automotive Grade (hereafter referred to as “Thermistors”) are intended to
be used in general-purpose applications as measures against Temperature detection and Temperature
compensation in automotive Grade equipment.
When subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications,
as noted in the Ratings and Specified Conditions section, the Thermistors’ performance may be degraded,
or become failure mode, such as short circuit mode and open-circuit mode.
If you use under the condition of short-circuit, heat generation of Thermistors will occur by running large current
due to application of voltage. There are possibilities of smoke emission, substrate burn-out, and, in the worst
case, fire. For products which require high safety levels, please carefully consider how a single malfunction can
affect your product. In order to ensure the safety in the case of a single malfunction, please design products
with fail-safe, such as setting up protecting circuits, etc.
We are trying to improve the quality and the reliability, but the durability differs depending on the use
environment and the use conditions. On use, be sure to confirm the actual product under the actual use
conditions.
● For the following applications and conditions, please be sure to consult with our sales representative in
advance and to exchange product specifications which conform to such applications.
・ When your application may have difficulty complying with the safety or handling precautions specified below.
・ High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such
as death or injury (regardless of directly or indirectly), due to failure or malfunction of the product.
① Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
② Submarine Equipment (submarine repeating equipment, etc.)
③ Transportation Equipment (airplanes, trains, ship, traffic signal controllers, etc.)
④ Power Generation Control Equipment
(atomic power, hydroelectric power, thermal power plant control system, etc.)
⑤ Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
⑥ Information Processing Equipment (large scale computer systems, etc.)
⑦ Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
⑧ Rotary Motion Equipment
⑨ Security Systems
⑩ And any similar types of equipment
Strict Observance
1. Confirmation of Rated Performance
The Thermistors shall be operated within the specified rating/performance.
Applications exceeding the specifications may cause deteriorated performance and/or breakdown, resulting in
degradation and/or smoking or ignition of products. The following are strictly observed.
(1) The Thermistors shall not be operated beyond the specified operating temperature range.
(2) The Thermistors shall not be operated in excess of the specified maximum power dissipation.
2. The Thermistors shall not be mounted near flammables.
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Multilayer NTC Thermistors (Automotive Grade)
Operating Conditions and Circuit Design
1. Circuit Design
【Dissipation factor】
・The constant amount power required to raise the
temperature of the Thermistor 1 °C through self
heat generation under stable temperatures.
Dissipation factor (mW/°C) = Power consumption
of Thermistor / Temperature rise of element.
Maximum power dissipation
【Maximum power dissipation】
・The Maximum power that can be continuously applied
under static air at a certain ambient temperature.
The Maximum power dissipation under an ambient
temperature of 25 ℃ or less is the same with the rated
maximum power dissipation, and Maximum power
dissipation beyond 25 ℃ depends on the Decreased
power dissipation curve below.
/ Rated maximum power dissipation (%)
1.1 Operating Temperature and Storage Temperature
When operating a components-mounted circuit, please be sure to observe the “Operating Temperature Range”,
written in delivery specifications. Storage temperature of PCB after mounting Thermistors, which is not operated,
should be within the specified “Storage Temperature Range” in the delivery specifications. Please remember not
to use the product under the condition that exceeds the specified maximum temperature.
1.2 Operating Power
The electricity applied to between terminals of Thermistors should be under the specified maximum power
dissipation. There are possibilities of breakage and burn-out due to excessive self-heating of Thermistors,
if the power exceeds maximum power dissipation when operating. Please consider installing protection circuit for
your circuit to improve the safety, in case of abnormal voltage application and so on. Thermistors’ performance of
temperature detection would be deteriorated if self-heating occurs, even when you use it under the maximum
power dissipation. Please consider the maximum power dissipation and dissipation factor.
Decreased power dissipation curve
100
50
25
75
125
Ambient temperature (°C)
1.3 Environmental Restrictions
The Thermistors does not take the use under the following special environments into consideration.
Accordingly, the use in the following special environments, and such environmental conditions may affect the
performance of the product; prior to use, verify the performance, reliability, etc. thoroughly.
① Use in liquids such as water, oil, chemical, and organic solvent.
② Use under direct sunlight, in outdoor or in dusty atmospheres.
③ Use in places full of corrosive gases such as sea breeze, Cl2，H2S，NH3，SO2，and NOx.
④ Use in environment with large static electricity or strong electromagnetic waves or strong radial ray.
⑤ Where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride
wire is arranged close to the product.
⑥ Where this product is sealed or coated with resin etc.
⑦ Where solvent, water, or water-soluble detergent is used in flux cleaning after soldering.
(Pay particular attention to water-soluble flux.)
⑧ Use in such a place where the product is wetted due to dew condensation.
⑨ Use the product in a contaminated state.
Ex.) Do not handle the product such as sticking sebum directly by touching the product after mounting
printed circuit board.
⑩ Under severe conditions of vibration or impact beyond the specified conditions found in the Specifications.
1.4 Measurement of Resistance
The resistance of the Thermistors varies depending on ambient temperatures and self-heating. To measure the
resistance value when examining circuit configuration and conducting receiving inspection and so on, the following
points should be taken into consideration:
① Measurement temp : 25±0.1 °C
Measurement in liquid (silicon oil, etc.) is recommended for a stable measurement temperature.
② Power : 0.10 mW max. 4 terminal measurement with a constant-current power supply is recommended.
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01. Oct. 2019
Multilayer NTC Thermistors (Automotive Grade)
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
There is a possibility of performance deterioration by heat shock (temperature cycles), which causes cracks,
from alumina substrate. Please confirm that the substrate you use does not deteriorate the Thermistors’ quality.
2.２ Design of Land Pattern
(1) Recommended land dimensions are shown below. Use the proper amount of solder in order to prevent
cracking. Using too much solder places excessive stress on the Thermistors..
Recommended Land Dimensions(Ex.)
Land
SMD
Solder resist
Size
Code/EIA
Unit (mm)
Component dimensions
L
W
T
0(0402)
1.0
0.5
0.5
1(0603)
1.6
0.8
0.8
a
b
c
0.4 to 0.5
0.4 to 0.5
0.4 to 0.5
0.8 to 1.0
0.6 to 0.8
0.6 to 0.8
(2) The land size shall be designed to have equal space, on both right and left side. If the amount of solder on
both sides is not equal, the component may be cracked by stress since the side with a larger amount of
solder solidifies later during cooling.
Recommended Amount of Solder
(a) Excessive amount
2.3 Utilization of Solder Resist
(1) Solder resist shall be utilized to equalize
the amounts of solder on both sides.
(2) Solder resist shall be used to divide the
pattern for the following cases;
・ Components are arranged closely.
・ The Thermistor is mounted near
a component with lead wires.
・ The Thermistor is placed near a chassis.
Refer to the table below.
(b) Proper amount
(c) Insufficient amount
Prohibited Applications and Recommended Applications
Prohibited
applications
Item
Mixed
mounting
with a
component
with lead
wires
The lead wire of a Component
With lead wires
Chassis
Arrangement
near
chassis
Solder(ground solder)
Improved applications
by pattern division
Solder resist
Solder resist
Electrode pattern
Retro-fitting
of component
with lead
wires
A lead wire of Retrofitted
component
Solderingiron
iron
Portion to be
Lateral
arrangement
Solder resist
Excessively soldered
Solder resist
Land
2.4 Component Layout
To prevent the crack of Thermistors, try to place it place it on the position that could not easily
be affected by the bending stress of substrate while mounting procedures or procedures afterwards.
Placement of the Thermistors near heating elements also requires the great care to be
taken in order to avoid stresses from rapid heating and cooling.
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01. Oct. 2019
Multilayer NTC Thermistors (Automotive Grade)
Prohibited layout
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Thermistors’ layout below.
Recommended layout
Layout the Varistors sideways
against the stressing direction.
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on
the mounting position of the Thermistors.
E
Perforation
D
C
Magnitude of stress
A>B=C>D>E
A
Slit
B
(3) The magnitude of mechanical stress applied to the Thermistors when dividing the circuit board in descending
order is as follows: push back < slit < V-groove < perforation. Also take into account the layout of the
Thermistors and the dividing/breaking method.
(4) When the Thermistors are placed near heating elements such as heater, etc., cracks from thermal stresses
may occur under following situation:
・ Soldering the Thermistors directly to heating elements.
・ Sharing the land with heating elements.
If planning to conduct above-mentioned mounting and/or placement, please contact us in advance.
2.5 Mounting Density and Spaces
Intervals between components should not be too narrow to prevent the influence from solder bridges
and solder balls. The space between components should be carefully determined.
Precautions for Assembly
1. Storage
(1) The Thermistors shall be stored between 5 to 40 °C and 20 to 70 % RH, not under severe conditions of high
temperature and humidity.
(2) If stored in a place where humidity, dust, or corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen
chloride and ammonia, etc.) are contained, the solderability of terminals electrodes will be deteriorated.
In addition, storage in a place where the heat or direct sunlight exposure occurs will causes or direct sunlight
exposure occurs will causes mounting problems due to deformation of tapes and reels and components and
taping/reels sticking together.
(3) Do not store components longer than 6 months. Check the solderability of products that have been stored
for more than 6 months before use.
2. Chip Mounting Consideration
(1) When mounting the Thermistors/components on a PC board, the Thermistor bodies shall be free from
excessive impact loads such as mechanical impact or stress due to the positioning, pushing force and
displacement of vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is too low, the Thermistor will crack from excessive force
during mounting. The following precautions and recommendations are for your reference in use.
(a) Set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the PC board
after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the
bending of the PC board in order to minimize the impact of the vacuum nozzles. Typical examples are
shown in the table below.
(d) Adjust the vacuum nozzles so that their bottom dead center during mounting is not too low.
01. Oct. 2019
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Multilayer NTC Thermistors (Automotive Grade)
Item
Prohibited mounting
Single
surface
mounting
Double
surface
mounting
Recommended mounting
The supporting pin
Crack
does not necessarily
have to be positioned
Separation of
Crack
solder
Supporting
pin
Supporting
pin
(4) The closing dimensions of the positioning chucks shall be controlled. Maintenance and replacement of
positioning chucks shall be performed regularly to prevent chipping or cracking of the Thermistors caused
by mechanical impact during positioning due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted so that the maximum bending of PC board does not
exceed 0.5 mm at 90 mm span. The PC board shall be supported by an adequate number of supporting pins.
3. Selection of Soldering Flux
Soldering flux may seriously affect the performance of the Thermistors. The following shall be confirmed
before use.
(1) The soldering flux should have a halogen based content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux, wash the Thermistors sufficiently because the soldering flux
residue on the surface of PC boards may deteriorate the insulation resistance on the Thermistors’ surface.
4. Soldering
4.1 Reflow Soldering
The reflow soldering temperature conditions are composed of temperature curves of Preheating, Temp. rise,
Heating, Peak and Gradual cooling. Large temperature difference inside the Thermistors caused by rapid heat
application to the Thermistors may lead to excessive thermal stresses, contributing to the thermal cracks. The
Preheating temperature requires controlling with great care so that tombstone phenomenon may be prevented.
260
220
④Peak
△T
Temperature (˚C)
Recommended profile of Reflow Soldering (Ex.)
②Temp.
Item
③Gradual
cooling
180
140
①Preheating
③Heating
Time
60 ot 120 s
① Preheating
② Temp. rise
③ Heating
④ Peak
⑤ Gradual
cooling
Temperature
140 to 180 ℃
Preheating temp
to Peak temp.
220 ℃ min.
260 ℃ max.
Peak temp.
to 140 ℃
Period or Speed
60 to 120 s
2 to 5 ℃ / s
60 s max.
10 s max.
1 to 4 ℃ / s
60 s max.
△T : Allowable temperature difference △T≦ 150 °C
The rapid cooling (forced cooling) during Gradual cooling part should be avoided, because this may cause defects
such as the thermal cracks, etc. When the Thermistors are immersed into a cleaning solvent, make sure that the
surface temperatures of the devices do not exceed 100 °C. Performing reflow soldering twice under the conditions
shown in the figure above [Recommended profile of Flow soldering (Ex.)] will not cause any problems.
However, pay attention to the possible warp and bending of the PC board.
Recommended soldering condition is for the guideline for ensuring the basic characteristics of the components,
not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual
conditions. The temperature of this product at the time of mounting changes depending on mounting conditions,
therefore, please confirm that Product surface becomes the specified temperature when mounting it on the end
product.
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Multilayer NTC Thermistors (Automotive Grade)
4.2 Hand Soldering
Hand soldering typically causes significant temperature change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc. In order to prevent any defects, the following should
be observed.
· The temperature of the soldering tips should be controlled with special care.
· The direct contact of soldering tips with the Thermistors and/or terminal electrodes should be avoided.
· Dismounted Thermistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering : Use thread solder (φ 1.0 mm or below) which contains flux with low chlorine, developed for
precision electronic equipment.
(b) Preheating : Conduct sufficient pre-heating, and make sure that the temperature difference between
solder and Thermitors’ surface is 150 °C or less.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be melted in advance on the soldering tip.)
(d) Gradual cooling : After soldering, the Thermitors shall be cooled gradually at room temperature.
Recommended profile of Hand soldering (Ex.)
△T
Gradual
cooling
Preheating
60 ot 120 s
3 s max.
△T : Allowable temperature difference △T ≦ 150 °C
(2) Condition 2 (without preheating)
Hand soldering can be performed without preheating,
by following the conditions below:
(a) Soldering iron tip shall never directly touch the
ceramic and terminal electrodes of the Thermitors.
(b) The lands are sufficiently preheated with a soldering
iron tip before sliding the soldering iron tip to the
terminal electrodes of the Thermitors for soldering.
Conditions of Hand soldering without preheating
Item
Temperature of Iron tip
Wattage
Shape of Iron tip
Soldering time with a
soldering iron
Condition
270 ℃ max.
20 W max.
Ф 3 mm max.
3 s max.
5. Post Soldering Cleaning
5.1 Cleaning solvent
Soldering flux residue may remain on the PC board if cleaned with an inappropriate solvent.
This may deteriorate the electrical characteristics and reliability of the Thermistors.
5.2 Cleaning conditions
Inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Thermitors.
(1) Insufficient cleaning can lead to :
(a) The halogen substance found in the residue of the soldering flux may cause the metal of terminal
electrodes to corrode.
(b) The halogen substance found in the residue of the soldering flux on the surface of the Thermitors may
change resistance values.
(c) Water-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to
those of rosin soldering flux.
(2) Excessive cleaning can lead to :
(a) When using ultrasonic cleaner, make sure that the output is not too large, so that the substrate will not
resonate. The resonation causes the cracks in Thermitors and/or solders, and deteriorates the strength of
the terminal electrodes. Please follow these conditions for Ultrasonic cleaning:
Ultrasonic wave output : 20 W/L max.
Ultrasonic wave frequency : 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
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Multilayer NTC Thermistors (Automotive Grade)
5.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may cause the same results as that of insufficient cleaning
due to the high density of liberated halogen.
6. Inspection Process
The pressure from measuring terminal pins might bend the PCB when implementing circuit inspection
after mounting Thermitors on PCB, and as a result, cracking may occur.
(1) Mounted PC boards shall be supported by an adequate number of supporting pins on the back with bend
settings of 90 mm span 0.5 mm max.
(2) Confirm that the measuring pins have the right tip shape, are equal in height, have the right pressure and
are set in the correct positions. The following figures are for your reference to avoid bending the PC board.
Item
Prohibited mounting
Recommended mounting
Check pin
Check pin
Bending of
PC board
Supporting pin
Separated, Crack
7.Protective Coating
Make sure characteristics and reliability when using the resin coating or resin embedding for the purpose of
improvement of humidity resistance or gas resistance, or fixing of parts because failures of a thermistors such
as 1) ,2) and 3) may be occurred.
(1) The solvent which contained in the resin permeate into the Thermitors, and it may deteriorate the
characteristic.
(2) When hardening the resin, chemical reaction heat (curing heat generation) happen and it may occurs the
infection to the Thermistors.
(3) The lead wire might be cut down and the soldering crack might be happen by expansion or contraction of
resin hardening.
8. Dividing/Breaking of PC Boards
(1) Please be careful not to stress the substrate with bending/twisting when dividing, after mounting
components including Thermistors. Abnormal and excessive mechanical stress such as bending or
torsion shown below can cause cracking in the Thermistors.
Bending
Torsion
(2) Dividing/Breaking of the PC boards shall be done carefully at moderate speed by using a jig or apparatus to
prevent the Thermistors on the boards from mechanical damage.
(3) Examples of PCB dividing/breaking jigs: The outline of PC board breaking jig is shown below. When PC board
are broken or divided, loading points should be close to the jig to minimize the extent of the bending.
Also, planes with no parts mounted on should be used as plane of loading, in order to prevent tensile stress
induced by the bending, which may cause cracks of the Thermistors or other parts mounted on the PC boards.
Outline of Jig
Prohibited mounting
Recommended mounting
PC board
V-groove
Loading
Loading direction
V-groove
point
PC
board
PC board
splitting jig
component
V-groove
PC
board
Loading direction
component
Loading point
01. Oct. 2019
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Multilayer NTC Thermistors (Automotive Grade)
10. Mechanical Impact
(1) The Thermistors shall be free from any excessive mechanical impact.
The Thermistor body is made of ceramics and may be damaged or cracked if dropped. Never use a
Thermistor which has been dropped; their quality may already be impaired, and in that case,
failure rate will increase.
(2) When handling PC boards with Thermistors mounted on them, do not allow the Thermistors to collide with
another PC board.
When mounted PC boards are handled or stored in a stacked state, the corner of a PC board might strike
Thermistors, and the impact of the strike may cause damage or cracking and can deteriorate the
withstand voltage and insulation resistance of the Thermistors.
Crack
Mounted
PCB
Crack
Floor
11. Do not reuse this product after removal from the mounting board.
Precautions for discarding
As to the disposal of the Thermistors, check the method of disposal in each country or region where the
modules are incorporated in your products to be used.
Other
The Thermistors precautions described above are typical. For special mounting conditions, please contact us.
The technical information in this catalog provides example of our products’ typical operations and application
circuit.
Applicable laws and regulations , others
1. This product not been manufactured with any ozone depleting chemical controlled under the Montreal
Protocol.
2. This product comply with RoHS(Restriction of the use of certain Hazardous Substance in electrical and
electronic equipment) (DIRECTIVE 2011/65/EU and 2015/863/EU).
3. All the materials used in this part are registered material under the Law Concerning the Examination and
Regulation of Manufacture, etc. of Chemical Substance.
4. If you need the notice by letter of “A preliminary judgement on the Laws of Japan foreign exchange and
Foreign Trade Control”, be sure to let us know.
5. These products are not dangerous goods on the transportation as identified by UN (United nations) numbers
or UN classification.
6. The technical information in this catalog provides example of our products’ typical operations and application
circuit. We do not guarantee the non-infringement of third party’s intellectual property rights and we do not
grant any license, Right or interest in our intellectual property.
AEC-Q200 Compliant
The products are tested based on all or part of the test conditions and methods defined in AEC-Q200.
Please consult with Panasonic for the details of the product specification and specific evaluation test results,
etc., and please review and approve Panasonic's product specification before ordering.
01. Oct. 2019
30
“PGS” Graphite Sheets
“PGS” Graphite Sheets
Type: EYG
“PGS (Pyrolytic Graphite Sheet)” is a ther mal interface
which is very thin, synthetically made, has high thermal
conductivity, and is made from a higly oriented graphite polymer
film. It is ideal for providing thermal management/heat-sinking in
limited spaces or to provide supplemental heat-sinking in addition
to conventional means.
This material is flexible and can be cut into customizable shapes.
SSM(Semi-Sealing Material) is the product which is compounding
PGS Graphite sheet and High thermal conductive Elastomer resin.
It has a function to absorb heat by resin and release the heat by
utilizing high thermal conductivity of PGS Graphite sheet. It also
enables taking better attachment to the component which has
different height on theelectronic board, reducing stress to the
electronic board.
Features
●Excellent thermal conductivity : 700 to 1950 W/(m·K)
(2 to 5 times as high as copper, 3 to 8 time as high as aluminum)
●Lightweight: Specifi c gravity : 0.85 to 2.13 g/cm3
(1/4 to 1/10 of copper, 1/1.3 to 1/3 of aluminum in density)
●Flexible and easy to be cut or trimmed. (withstands repeated bending)
●Low thermal resistance
●Low heat resistance with fl exible Graphite sheet (SSM)
●Low repulsion and easy to keep the product's shape after attaching (SSM)
●Siloxane Free (SSM)
●High dielectric voltage : 17 kVac/mm (SSM)
●RoHS compliant
Recommended applications
●Smart phones, Mobile phones, DSC, DVC, Tablet PCs, PCs and peripherals, LED Devices
●Semiconductor manufacturing equipment (Sputtering, Dry etching, Steppers)
●Optical communications equipment
Explanation of Part Numbers
1T ERJS02 ～ ERJS1Tシリーズ
● PGS only (EYGS✽✽✽✽✽✽)
1
2
3
4
5
6
7
8
9
10
E
Y
G
S
0
9
1
2
1
0
Product Code
PGS
Graphite Sheet
Style
S
PGS単体
PGS thickness✽
Dimension
0912
90 mm × 115 mm
10
1218
115 mm × 180 mm
07
100 μm
70 μm
1823
180 mm × 230 mm
05
50 μm
04
40 μm
03
25 μm
✽PGS thickness of 17 μm, 10 μm does not than those above.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
31
01 Nov. 2019
“PGS” Graphite Sheets
Explanation of Part Numbers
● Taping (EYGA✽✽✽✽✽✽✽✽)
1
2
3
4
5
6
7
8
9
10
11
12
E
Y
G
A
0
9
1
2
0
7
P
A
Style
Product Code
A
PGS
Dimension✽✽
Taping
Graphite Sheet
PGS thickness
0912
90 mm × 115 mm
07
70 μm
1218
115 mm × 180 mm
05
50 μm
04
40 μm
03
25 μm
02
17 μm
01
10 μm
Suffix
A
Lamination type
✽ Please refer to
PA
Composition
PM
example.
M
DM
1
2
3
4
5
6
7
8
9
10
11
12
E
Y
G
A
0
9
1
2
0
4
D
F
Product Code
Style
A
PGS
Dimension✽✽
Taping
Graphite Sheet
PGS thickness
0912
90 mm × 115 mm
04
40 μm
1218
115 mm × 180 mm
03
25 μm
02
17 μm
01
10 μm
Suffix
Lamination type
✽ Please refer to
Composition
DF
example.
F
✽✽ Please contact us for other dimensions other than those above.
● Thermally conductive elastomer processing (EYGE✽✽✽✽✽✽✽✽)
1
2
3
4
5
6
7
8
E
Y
G
E
0
9
1
2
Product Code
PGS
Style
E
Graphite Sheet
Dimension✽✽
0912
Elastomer
90 mm × 115 mm
9
X
10
11
12
B
6
D
SSM
PGS thickness
type
B
70 μm
C
50 μm
5
G
40 μm
6
D
25 μm
E
17 μm
F
10 μm
processing
Elastomer
thickness
Tape thickness
Q
PET tape
0.5 mm
D
PET tape 10 μm
1.0 mm
P
PET tape 30 μm
7
1.5 mm
M Acrylic adhesive tape 10 μm
8
2.0 mm
A Acrylic adhesive tape 30 μm
9
3.0 mm
1
2
3
4
5
6
7
8
9
10
11
12
E
Y
G
E
0
9
1
2
X
G
5
F
Product Code
PGS
Graphite Sheet
Style
E
Elastomer
Dimension✽✽
0912
90 mm × 115 mm
SSM
PGS thickness
type
G 40 μm
processing
Elastomer
thickness
D 25 μm
5
0.5 mm
E 17 μm
6
1.0 mm
F 10 μm
7
1.5 mm
8
2.0 mm
9
3.0 mm
8 μm
Tape thickness
F
Acrylic adhesive tape 6 μm
✽✽ Please contact us for other dimensions other than those above.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
32
01 Nov. 2019
“PGS” Graphite Sheets
Characteristics of PGS Graphite Sheets
100 μm
70 μm
50 μm
40 μm
0.10±0.03 mm
0.07±0.015 mm
0.050±0 .015 mm
0.040±0 .012 mm
a-b plane
700 W/(m·K)
1000 W/(m·K)
1300 W/(m·K)
1350 W/(m·K)
Electrical conductivity
10000 S/cm
10000 S/cm
10000 S/cm
10000 S/cm
Extensional strength
20.0 MPa
20.0 MPa
20.0 MPa
25.0 MPa
Thickness
0.85 g/cm3
Density
Thermal
conductivity
Expansion a-b plane
coefficient c axis
9.3×10
1/K
3.2×10-5 1/K
9.3×10
-7
1.80 g/cm3
9.3×10-7 1/K
1/K
3.2×10-5 1/K
400 °C
3.2×10-5 1/K
25 μm
17 μm
10 μm
0.025±0 .010 mm
0.017±0 .005 mm
0.010±0 .002 mm
1600 W/(m·K)
1850 W/(m·K)
1950 W/(m·K)
20000 S/cm
20000 S/cm
20000 S/cm
1.90 g/cm3
Thermal
conductivity
-7
1.70 g/cm3
10000 cycles
Density
a-b plane
Electrical conductivity
Extensional strength
Expansion a-b plane
coefficient c axis
Heat resistance✽
Bending(angle 180,R5)
✽
9.3×10
1/K
3.2×10-5 1/K
Heat resistance✽
Bending(angle 180,R5)
Thickness
-7
1.21 g/cm3
2.10 g/cm3
30.0 MPa
2.13 g/cm3
40.0 MPa
9.3×10-7 1/K
40.0 MPa
9.3×10-7 1/K
3.2×10-5 1/K
9.3×10-7 1/K
3.2×10-5 1/K
400 °C
3.2×10-5 1/K
10000 cycles
Withstand temperature refers to PGS only. (Lamination material such as PET tape etc. is not included)
✽✽ Values are for reference, not guaranteed.
Characteristics of SSM (Elastomer)
Thickness
1 mm
2 mm
Specifi c heat
1.88 g/cm3
Density
Thermal conductivity
Thermal
resistance
100 kPa
200 kPa
300 kPa
100 kPa
Compressibility
1.6 W/(m·K)✽✽
2
14.82 (C·cm2)/W
7.53 (C·cm )/W
6.71 (C·cm2)/W
13.17 (C·cm2)/W
2
2
5.90 (C·cm )/W
4.93 %
19.48 (C·cm2)/W
16.01 (C·cm2)/W
10.73 (C·cm )/W
4.05 %
11.38 (C·cm2)/W
4.43 %
200 kPa
9.58 %
8.66 %
14.04 %
300 kPa
18.41 %
22.13 %
40.49 %
14
Resistivity
> 10×10 Ω∙cm
> 17 kVac/mm
Dielectric voltage
Hardness (Type E)
Adhesive
force
3 mm
1.4 J/(g∙C)
39
SUS
39 mN/cm
Aluminum
31 mN/cm
Glass
38 mN/cm
✽ Characteristics refer to Elastomer resin only.
✽✽ Values are for reference, not guaranteed.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
33
01 Nov. 2019
“PGS” Graphite Sheets
Comparison of thermal conductivity (a-b plane)
Diamond
PGS 10 μm
1950 W/(m·K)
1850 W/(m·K)
PGS 17 μm
PGS 25 μm
1600 W/(m·K)
PGS 40 μm
1350 W/(m·K)
PGS 50 μm
1300 W/(m·K)
PGS 70 μm
1000 W/(m·K)
PGS 100 μm
700 W/(m·K)
Pure copper
Aluminum
Magnesium alloy
Stainless steel
Heat-conductive sheet
0
200
400
600
800
1000
1200
1400 1600 1800
2000
Coefficient of thermal conductivity (W/(m･k))
Layered structure of PGS
C axis
3.354 to 3.356×10-8cm
a-b plane
C : 99.9 % above
Electric fi eld shield performance
140
130
120
a-b plane (KEC method)
Effect of shield (dB)=–20 log (Vs/V0)
Effect of shield (dB)
110
100
90
Effect of electric field shield
80
70
60
50
40
Effect of magnetic field shield
30
20
10
0
10
1000
100
10000
Frequency (MHz)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
34
01 Nov. 2019
“PGS” Graphite Sheets
Lamination type/Composition example
● Standard series (PGS 100, 70, 50, 40, 25, 17, 10 µm)
Type
Front face
Rear face
PGS Only
Adhesive Type
S type
A － A type
A － M type
A － F type
-
-
-
-
PGS
Graphite Sheet
Insulative adhesive tape 30 μm Insulative adhesive tape 10 μm Insulative adhesive tape 6 μm
PGS
Graphite Sheet
PGS
Graphite Sheet
PGS
Graphite Sheet
Structure
Acrylic Adhesive
Acrylic Adhesive
Acrylic Adhesive
tape 30 μm
Separating paper
tape 10 μm
Separating paper
tape 6 μm
◎High Thermal Conductivity ◎With insulation material
High Flexibility
Features
◎Low Thermal Resistance
◎Available up to 400 °C
◎Conductive Material
on one side
◎With insulation material
on one side
◎With strong adhesive
tape for putting chassis
◎Withstanding Voltage：2 kV
Separating paper
◎With insulation material
on one side
◎Low thermal resistance
comparison with A-A type
◎Low thermal resistance
comparison with A-A type
◎Withstanding Voltage：1 kV
400 °C
100 °C
100 °C
100 °C
Standard size
115 × 180 mm
90 × 115 mm
90 × 115 mm
90 × 115 mm
Maximum size
180 × 230 mm (25 μm ~)
115 × 180 mm
115 × 180 mm
115 × 180 mm
EYGS121810
–
–
–
100 μm
–
–
–
EYGS121807
EYGA091207A
EYGA091207M
–
Withstand temperature
100 μm
70 μm
50 μm
40 μm
25 μm
17 μm
10 μm
Part No.
Thickness
Part No.
Thickness
Part No.
Thickness
Part No.
Thickness
Part No.
Thickness
Part No.
Thickness
Part No.
Thickness
70 μm
100 μm
80 μm
–
EYGS121805
EYGA091205A
EYGA091205M
–
50 μm
80 μm
60 μm
–
EYGS121804
EYGA091204A
EYGA091204M
EYGA091204F
40 μm
70 μm
50 μm
46 μm
EYGS121803
EYGA091203A
EYGA091203M
EYGA091203F
25 μm
55 μm
35 μm
31 μm
–
EYGA091202A
EYGA091202M
EYGA091202F
–
47 μm
27 μm
23 μm
–
EYGA091201A
EYGA091201M
EYGA091201F
–
40 μm
20 μm
16 μm
✽ Please contact us for other lamination type product.
✽✽ Withstanding Voltages are for reference, not guaranteed.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
35
01 Nov. 2019
“PGS” Graphite Sheets
Lamination type/Composition example
● Standard series (PGS 100, 70, 50, 40, 25, 17, 10 µm)
Type
Front face
Rear face
Laminated type (Insulation & Adhesive)
A － PM type
A － DM type
A － PA type
A － DF type
Polyester tape standard type 30 μm Polyester tape standard type 30 μm Polyester tape standard type10 μm Polyester tape standard type 10 μm
Insulative adhesive tape 30 μm Insulative adhesive tape 10 μm Insulative adhesive tape 10 μm Insulative adhesive tape 6 μm
PGS
Graphite Sheet
Polyester(PET)
PGS
Graphite Sheet tape 30 μm
Polyester(PET)
tape 30 μm
PGS
Polyester(PET)
Graphite Sheet tape 10 μm
PGS
Graphite Sheet
Acrylic Adhesive
tape 10 μm
Acrylic Adhesive
tape 6 μm
Polyester(PET)
tape 10 μm
Structure
Acrylic Adhesive
tape 30 μm
Acrylic Adhesive
tape 10 μm
Separating paper
Features
Withstand temperature
Standard size
Maximum size
Part No.
100 μm
Thickness
Part No.
70 μm
Thickness
Part No.
50 μm
Thickness
Part No.
40 μm
Thickness
Part No.
25 μm
Thickness
Part No.
17 μm
Thickness
Part No.
10 μm
Thickness
Separating paper
Separating paper
Separating paper
◎With insulation material
◎With insulation material
◎With insulation material
◎With insulation material
on one side
◎Withstanding Voltage
PET tape：4 kV
Adhesive Tape ：2 kV
on one side
◎Withstanding Voltage
PET tape：4 kV
Adhesive Tape ：1 kV
on one side
◎Withstanding Voltage
PET tape：1 kV
Adhesive Tape ：1 kV
on one side
◎Withstanding Voltage
PET tape：1 kV
100 °C
90 × 115 mm
115 × 180 mm
–
100 °C
90 × 115 mm
115 × 180 mm
–
100 °C
90 × 115 mm
115 × 180 mm
100 °C
90 × 115 mm
115 × 180 mm
–
–
–
–
–
–
EYGA091207PA
EYGA091207PM
EYGA091207DM
–
130 μm
110 μm
90 μm
–
EYGA091205PA
EYGA091205PM
EYGA091205DM
–
110 μm
90 μm
70 μm
–
EYGA091204PA
EYGA091204PM
EYGA091204DM
EYGA091204DF
100 μm
80 μm
60 μm
56 μm
EYGA091203PA
EYGA091203PM
EYGA091203DM
EYGA091203DF
85 μm
65 μm
45 μm
41 μm
EYGA091202PA
EYGA091202PM
EYGA091202DM
EYGA091202DF
77 μm
57 μm
37 μm
33 μm
EYGA091201PA
EYGA091201PM
EYGA091201DM
EYGA091201DF
70 μm
50 μm
30 μm
26 μm
✽ Please contact us for other lamination type product.
✽✽ Withstanding Voltages are for reference, not guaranteed.
● Standard series (SSM)
Type
Elastomer thickness
E-6 type
1.0 mm
PGS
Graphite Sheet
Polyester(PET)
tape 10 μm
E-8 type
2.0 mm
PGS
Graphite Sheet
Polyester(PET)
tape 10 μm
E-9 type
3.0 mm
PGS
Graphite Sheet
Polyester(PET)
tape 10 μm
Structure
Acrylic Adhesive
tape
Features
Withstand temperature
Standard size
Part No.
70 μm
Thickness
Part No.
25 μm
Thickness
Elastomer
1.0 mm
Acrylic Adhesive
tape
Elastomer
2.0 mm
Acrylic Adhesive
tape
Elastomer
3.0 mm
◎Soft and low thermal resistance
(Elastomer)
◎Soft and low thermal resistance
(Elastomer)
◎Soft and low thermal resistance
(Elastomer)
◎Low repulsion
◎Low repulsion
◎Low repulsion
◎Withstanding Voltage：1.7 kV
◎Withstanding Voltage：1.7 kV
◎Withstanding Voltage：1.7 kV
100 °C
90 × 115 mm
100 °C
90 × 115 mm
100 °C
90 × 115 mm
EYGE0912XB6D
EYGE0912XB8D
1.09 mm
2.09 mm
EYGE0912XB9D
3.09 mm
EYGE0912XD6D
EYGE0912XD8D
EYGE0912XD9D
1.05 mm
2.05 mm
3.05 mm
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
36
01 Nov. 2019
“PGS” Graphite Sheets
Minimum order
Item
Type
S type
100 μm
S type
70 μm
PGS Graphite Sheet
Only
S type
50 μm
S type
40 μm
S type
25 μm
PGS 70, 25, 17 μm
Adhesive Type
[Standard series]
PGS 70, 25, 17 μm
Laminated Type
(Insulation & Adhesive)
[Standard series]
Part No.
Size
Minimum order
EYGS091210
90×115 mm
20
EYGS121810
115×180 mm
10
EYGS182310
180×230 mm
10
EYGS091207
90×115 mm
20
EYGS121807
115×180 mm
10
EYGS182307
180×230 mm
10
EYGS091205
90×115 mm
20
EYGS121805
115×180 mm
10
EYGS182305
180×230 mm
10
EYGS091204
90×115 mm
20
EYGS121804
115×180 mm
10
EYGS182304
180×230 mm
10
EYGS091203
90×115 mm
20
EYGS121803
115×180 mm
10
EYGS182303
180×230 mm
10
A ー A type
70 μm
EYGA091207A
90×115 mm
20
EYGA121807A
115×180 mm
10
A ー A type
25 μm
EYGA091203A
90×115 mm
20
EYGA121803A
115×180 mm
10
A ー A type
17 μm
EYGA091202A
90×115 mm
20
EYGA121802A
115×180 mm
10
A ー M type
70 μm
EYGA091207M
90×115 mm
20
EYGA121807M
115×180 mm
10
A ー M type
25 μm
EYGA091203M
90×115 mm
20
EYGA121803M
115×180 mm
10
A ー M type
17 μm
EYGA091202M
90×115 mm
20
EYGA121802M
115×180 mm
10
A ー PA type
70 μm
EYGA091207PA
90×115 mm
20
EYGA121807PA
115×180 mm
10
A ー PA type
25 μm
EYGA091203PA
90×115 mm
20
EYGA121803PA
115×180 mm
10
A ー PA type
17 μm
EYGA091202PA
90×115 mm
20
EYGA121802PA
115×180 mm
10
A ー PM type
70 μm
EYGA091207PM
90×115 mm
20
EYGA121807PM
115×180 mm
10
A ー PM type
25 μm
EYGA091203PM
90×115 mm
20
EYGA121803PM
115×180 mm
10
A ー PM type
17 μm
EYGA091202PM
90×115 mm
20
EYGA121802PM
115×180 mm
10
A ー DM type
70 μm
EYGA091207DM
90×115 mm
20
EYGA121807DM
115×180 mm
10
A ー DM type
25 μm
EYGA091203DM
90×115 mm
20
EYGA121803DM
115×180 mm
10
A ー DM type
17 μm
EYGA091202DM
90×115 mm
20
EYGA121802DM
115×180 mm
10
(1) Only S type supports 180×230 mm size.
(PGS thickness of 17 μm, 10μm does not support as single item)
(2) PGS of 10 μm, 40 μm, 50 μm type is also possible to be made as lamination type.
(3) The above-listed part number is sample part number for testing.
(4) Please contact us about your request of custom part number which will be arranged separately.
(5) Please contact us if quantity is below Minimum Order Quantity.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
37
01 Nov. 2019
“PGS” Graphite Sheets
Minimum order
Item
SSM
Elastomer
3.0, 2.0, 1.0 mm
PGS 70, 25 μm
Type
Part No.
Size
Minimum order
E ー 9 type
Elastomer 3.0 mm,
PGS 70 μm
EYGE0912XB9D
90×115 mm
5
E ー 9 type
Elastomer 3.0 mm,
PGS 25 μm
EYGE0912XD9D
90×115 mm
5
E ー 8 type
Elastomer 2.0 mm,
PGS 70 μm
EYGE0912XD9D
90×115 mm
5
E ー 8 type
Elastomer 2.0 mm,
PGS 25 μm
EYGE0912XD8D
90×115 mm
5
E ー 6 type
Elastomer 1.0 mm,
PGS 70 μm
EYGE0912XB6D
90×115 mm
5
E ー 6 type
Elastomer 1.0 mm,
PGS 25 μm
EYGE0912XD6D
90×115 mm
5
(1) Only S type supports 180×230 mm size.
(PGS thickness of 17 μm, 10μm does not support as single item)
(2) PGS of 10 μm, 40 μm, 50 μm type is also possible to be made as lamination type.
(3) The above-listed part number is sample part number for testing.
(4) Please contact us about your request of custom part number which will be arranged separately.
(5) Please contact us if quantity is below Minimum Order Quantity.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
38
01 Nov. 2019
“PGS” Graphite Sheets
Precautions on the whole
■Do not use the products beyond the descriptions in this catalog.
■This catalog guarantees the quality of the products as individual components.
Before you use the products, please make sure to check and evaluate the products in the
circumstance where they are installed in your product.
■This product was designed and manufactured for standard applications such as general electronics
devices, office equipment, information and communications equipment, measuring instruments,
household appliances and audio-video equipment.
For applications in which special quality and reliability are required, or if the failure or malfunction
of the products may directly jeopardize life or cause threat of personal injury (such as for aircraft
and aerospace equipment, traffic and transport equipment, combustion equipment, medical
equipment, accident prevention and anti-theft devices, and safety equipment), please be sure to
consult with our sales representative in advance and to exchange product catalog which conform
to such applications.
Safety and Design considerations
■We are trying to improve the quality and the reliability, but the durability differs depending on the
use environment and the use conditions. On use, be sure to confirm the actual product under the
actual use conditions.
■Install the following systems for a failsafe design to ensure safety if these products are to be used
in equipment where a defect in these products may cause the loss of human life or other signification
damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment,
aerospace equipment, electric heating appliances, combustion/ gas equipment, rotating equipment,
and disaster/crime prevention equipment.
・The system is equipped with a protection circuit and protection device.
・The system is equipped with a redundant circuit or other system to prevent an unsafe status in
the event of a single fault.
・The system is equipped with an arresting the spread of fire or preventing glitch.
■When a dogma shall be occurred about safety for this product, be sure to inform us rapidly, operate
your technical examination.
■The temperature of this product at the time of use changes depending on mounting conditions and
usage conditions, therefore, please confirm that the temperature of this product is the specified
temperature after mounting it.
■This product does not take the use under the following special environments into consideration.
Accordingly, the use in the following special environments, and such environmental conditions may
affect the performance of the product; prior to use, verify the performance, reliability, etc.
thoroughly.
1) Use in liquids such as water, oil, chemical, and organic solvent.
2) Use under direct sunlight, in outdoor or in dusty atmospheres.
3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
4) Use the product in a contaminated state.
5) Use in acid.
6) Use outside the range defined by the operating temperature range.
7) Use under reduced pressure or vacuum.
39
2019/10/1
“PGS” Graphite Sheets
Precaution of installation
■Do not reuse this product after removal from the mounting board.
■Do not drop this product on the floor. If this product is dropped, it can be damaged mechanically.
Avoid using the dropped product.
■This product is soft, do not rub or touch it with rough materials to avoid scratching it.
■Lines or folds in this product may affect thermal conductivity.
■Never touch a this product during use because it may be extremely hot.
■Use protective materials when handling and/or applying this product, do not use items with sharp
edges as they might tear or puncture this product.
■Do not handle with bare hands as there is a concern about performance degradation.
Precaution on storage conditions
■Storage period is less than one year after our shipping inspection is completed.
Please use within the period.
■If the product is stored in the following environments and conditions, the performance may be
badly affected, avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
(2) Storage in places exposed to ultraviolet light.
*Recommended storage in the dark.
(3) Store at a temperature outside the storage temperature range specified by this catalog.
■In the case of a product configuration that assumes bonding, please use after checking the
adhesiveness of the product when the storage period is over.
Precaution specific to this product
■This product has conductivity. If required, This product should be provided insulation.
■This product can not guarantee the insulation because there is a concern for powder falling off of
conductive materials.
■Thermal conductivity is dependent on the way it is used. Test the adaptability of the product to your
application before use.
Applicable laws and regulations, others
■No ODCs or other ozone-depleting substances which are subject to regulation under the Montreal
Protocol are used in our manufacturing processes, including in the manufacture of this product.
■This product complies with the RoHS Directive （Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment (DIRECTIVE 2011/65/EU and （EU)2015/863）.
■All the materials used in this part are registered material under the Law Concerning the Examination
and Regulation of Manufactures etc. of Chemical substances.
■If you need the notice by letter of "A preliminary judgment on the Laws of Japan foreign exchange
and Foreign Trade control", be sure to let us know.
■These products are not dangerous goods on the transportation as identified by UN(United Nations)
numbers or UN classification.
■As to the disposal of the module, check the method of disposal in each country or region where the
modules are incorporated in your products to be used.
■The technical information in this catalog provides examples of our products typical operations and
application circuits. We do not guarantee the non-infringement of third party's intellectual property
rights and we do not grant any license, right, or interest in our intellectual property.
2019/10/1
40
“NASBIS” Insulating Sheet
“NASBIS” Insulating Sheet
Type: EYGY
“NASBIS” is a heat insulating sheet, which is composed of silica
aerogel and fiber sheet, created through impregnation process. Pore
size of silica aerogel is 10 to 60nm, which means it has smaller
space than the mean free path of the air, 68nm. Air molecules do not
collide against each other inside the pores, and thus the component
shows excellecnt heat insulation performace.
Furthermore, combining NASBIS and PGS Graphite Sheet enables
controlling the direction of heat. Composite type provides greater
heat insulating performance.
Features
●
●
●
●
Low thermal conductivity : 0.020 W/m · K typ.
Created thin-film sheet ; Thickness : 100 μm to 1000 μm
Various proposals are available when combined with PGS Graphite sheet
RoHS compliant
Recommended applications
● Smartphone, Wearable equipment, Digital Still Camera, Notebook PCs, Tablet PCs
Explanation of Part Numbers
1T ERJS02 ～ ERJS1Tシリーズ
● NASBIS Pouch Type (EYGY✽✽✽✽✽✽✽✽)
1
2
3
4
5
6
7
8
9
10
E
Y
G
Y
0
9
1
2
Q
N
Product Code
NASBIS
Dimension
0912
90 mm × 115 mm
Type
Thickness of PGS
Q Normal type
N PGS free type
PET tape
Thickness of
NASBIS
3
1000 μm
4
500 μm
6
100 μm
11
6
12
P
PET + Adhesive
P
PET(30 μm)+Adhesive(10 μm)
✽ Please consult the other configurations separately.
NASBIS
Adhesive tape
Separator
Characteristics of NASBIS
Thickness
Thermal conductivity
(W/(m·K))
Operating temperature limit
(°C)
Size / Laminate pouch (mm)
Heatproof temperature (°C)
100 μm
500 μm
1000 μm
0.018 to 0.026
0.018 to 0.026
0.018 to 0.026
−20 to 100
−20 to 100
−20 to 100
90 × 115
100
90 × 115
100
90 × 115
100
Typical values, not guaranteed.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
41
01 Nov. 2019
“NASBIS” Insulating Sheet
Appearance of silica aerogel and its nanostructure
Pore diameter
10 to 60 nm
Diameter of silica
about 10 nm
Composition example
● NASBIS Pouch Type
Type
Y - P type
PET 30 μm
Structure
NASBIS✽
Adhesive 10 μm
Heatproof temperature
100 μm✽
500 μm✽
1000 μm✽
100 °C
Part No.
EYGY0912QN6P
Thickness (μm)
140
EYGY0912QN4P
Part No.
Thickness (μm)
Part No.
Thickness (μm)
540
EYGY0912QN3P
1040
✽ Above listed Part No. are examples for evaluation and selection, not for mass production.
Customized service available for mass production spec.
■ Minimum order 10 pcs
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
42
01 Nov. 2019
“NASBIS” Insulating Sheet
Precautions on the whole
■Do not use the products beyond the descriptions in this catalog.
■This catalog guarantees the quality of the products as individual components.
Before you use the products, please make sure to check and evaluate the products in the
circumstance where they are installed in your product.
■This product was designed and manufactured for standard applications such as general electronics
devices, office equipment, information and communications equipment, measuring instruments,
household appliances and audio-video equipment.
For applications in which special quality and reliability are required, or if the failure or malfunction
of the products may directly jeopardize life or cause threat of personal injury (such as for aircraft
and aerospace equipment, traffic and transport equipment, combustion equipment, medical
equipment, accident prevention and anti-theft devices, and safety equipment), please be sure to
consult with our sales representative in advance and to exchange product catalog which conform
to such applications.
Safety and Design considerations
■We are trying to improve the quality and the reliability, but the durability differs depending on the
use environment and the use conditions. On use, be sure to confirm the actual product under the
actual use conditions.
■Install the following systems for a failsafe design to ensure safety if these products are to be used
in equipment where a defect in these products may cause the loss of human life or other signification
damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment,
aerospace equipment, electric heating appliances, combustion/ gas equipment, rotating equipment,
and disaster/crime prevention equipment.
・The system is equipped with a protection circuit and protection device.
・The system is equipped with a redundant circuit or other system to prevent an unsafe status in
the event of a single fault.
・The system is equipped with an arresting the spread of fire or preventing glitch.
■When a dogma shall be occurred about safety for this product, be sure to inform us rapidly, operate
your technical examination.
■The temperature of this product at the time of use changes depending on mounting conditions and
usage conditions, therefore, please confirm that the temperature of this product is the specified
temperature after mounting it.
■This product does not take the use under the following special environments into consideration.
Accordingly, the use in the following special environments, and such environmental conditions may
affect the performance of the product; prior to use, verify the performance, reliability, etc.
thoroughly.
1) Use in liquids such as water, oil, chemical, and organic solvent.
2) Use under direct sunlight, in outdoor or in dusty atmospheres.
3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
4) Use the product in a contaminated state.
5) Use in the point being adhered to organic solvent (thinner, alcohol, xylene etc.) or chemical
substances (oils, acids, alkali etc.), or being possible to contact with their.
And use under their gas atmosphere.
6) Use in an environment in contact with silicone resin.
7) Use with ultrasonic and high frequency wave applied.
8) Use under reduced pressure or vacuum.
Precaution of installation
■Do not reuse this product after removal from the mounting board.
■Do not drop this product on the floor. If this product is dropped, it can be damaged mechanically.
Avoid using the dropped product.
■Do not touch this product with bare hands.
■This product is soft, do not rub or touch it with rough and sharp-edged materials to avoid
scratching it.
■Lines or folds in this product may affect thermal insulation.
■Never touch a this product during use because it may be extremely hot.
43
2019/10/1
“NASBIS” Insulating Sheet
■Use protective materials when handling and/or applying this product, do not use items with sharp
edges as they might tear or puncture this product.
■The NASBIS shall not be modified and done additional work such as cutting, drilling, nailing, eyelets,
screwing, pinning, riveting, polishing, embossing, water cleaning, solvent cleaning, ozone cleaning,
plasma exposure, ultraviolet irradiation, plating, painting, printing, deposition, etching, sputtering,
heat treatment, surface treatment.
■The NASBIS shall not be reused, repaired and recycled.
Precaution on storage conditions
■Storage period is less than one year after our shipping inspection is completed.
Please use within the period.
■If the product is stored in the following environments and conditions, the performance may be
badly affected, avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
(2) Storage in places exposed to ultraviolet light. *Recommended storage in the dark.
(3) Store at a temperature outside the storage temperature range specified by this catalog.
(4) Storage under a load.
■In the case of a product configuration that assumes bonding, please use after checking the
adhesiveness of the product when the storage period is over.
Precaution specific to this product
■NASBIS sheet may release silica powder (electric non-conduct).
■The adhesion between laminate film and NASBIS is very weak, so some parts may be un-bonded
depending on the handling.
■The performance of thermal insulation is dependent on the way it is used. Test the adaptability
of NASBIS to your application before use.
■The dimension of NASBIS sheet will change when the humidity changes. If you need a precise
size we suggest that the NASBIS sheet should be controlled at a certain stored condition and
period, and measured at the same conditions.
ex) The dimensions of NASBIS are assured when stored and measured at 23±2 ℃、50±20 %RH.
■The appearance is conducted based on internal standard. When suspicion arises, contact
promptly us.
Applicable laws and regulations, others
■No ODCs or other ozone-depleting substances which are subject to regulation under the Montreal
Protocol are used in our manufacturing processes, including in the manufacture of this product.
■This product complies with the RoHS Directive （Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment (DIRECTIVE 2011/65/EU and （EU)2015/863）.
■All the materials used in this part are registered material under the Law Concerning the Examination
and Regulation of Manufactures etc. of Chemical substances.
■If you need the notice by letter of "A preliminary judgment on the Laws of Japan foreign exchange
and Foreign Trade control", be sure to let us know.
■These products are not dangerous goods on the transportation as identified by UN(United Nations)
numbers or UN classification.
■As to the disposal of the module, check the method of disposal in each country or region where the
modules are incorporated in your products to be used.
■The technical information in this catalog provides examples of our products typical operations and
application circuits. We do not guarantee the non-infringement of third party's intellectual property
rights and we do not grant any license, right, or interest in our intellectual property.
2019/10/1
44
“Graphite-PAD” high thermal conductivity in z-direction
“Graphite-PAD” high thermal conductivity
in z-direction
Type:
EYGT
Graphite-PAD is a thermal interface material (TIM) that compatibly
obtained excellent thermal conductivity in thickness direction (Z-axis
direction) and high flexibility (deformable with a low load). The
properties are greater than that of existing TIMs. The product is
created by filling PGS Graphite Sheet into silicon resin.
Features
● High
thermal conductivity : 13 W/m ∙ K
compressibility : 50 % (t=2 mm, Pressure 300 kPa)
● Thermal resistance: fit into uneven parts and provide excellent thermal resistance with a low load
● High reliability : correspond to −40 to 150 °C and maintains long-term reliability
● Thickness range : 0.5/1.0/1.5/2.0/2.5/3.0 mm
● RoHS compliant
● Excellent
Recommended applications
Cooling of heat generating components, such as electronic devices, semiconductor memory device, etc.
● General-purpose inverter, medical equipment, and DSC
● Car-mounted camera, motor control unit, automotive lighting (LED), car navigation,
luminous source of laser HUD
● Base station, IGBT module
Explanation of Part Numbers
● Graphite-PAD
(EYGT✽✽✽✽✽✽✽✽)
1
2
3
4
5
6
7
8
9
10
11
12
E
Y
G
T
3
5
3
5
A
2
0
A
Product Code
Graphite-PAD
3535
7070
Dimension
35 mm × 35 mm
70 mm × 70 mm
A
Type
Material code
Thickness of PAD
30
3.0 mm
25
2.5 mm
20
2.0 mm
15
1.5 mm
10
1.0 mm
05
0.5 mm
Ex. code
✽ Please confirm other condition separately.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02
45
Oct. 2017
“Graphite-PAD” high thermal conductivity in z-direction
Typical characteristics
Test
equipment/method
Condition
0.5
1.0
1.5
2.0
2.5
3.0
Thermal resistance (K·cm2/W)
TIM Tester
100 kPa
0.96
1.34
1.56
1.93
2.10
2.36
Compressibility (%)
Thermal conductivity of
Graphite-PAD with a unit (W/m·K)
(including contact resistance)
Thermal conductivity of the
Graphite-PAD (W/m·K)
Hardness
TIM Tester
100 kPa (50 °C)
5.78
10.29 17.46
17.8
17.6
17.9
TIM Tester
100 kPa
5.08
7.02
8.60
9.66
10.10
(ASTM D5470)
50 kPa
(ASTM D2240)
TYPE E
Items
Data
Thickness (mm)
7.80
13
25
Adhesive
Adhesive on both faces
Volume resistivity (Ω·cm)
4×105
(ASTM D257)
Operating temperature range (°C)
−40 to 150
Σ (D4-D10)
Siloxane
< 70 ppm
Structure
Embossed separator
Graphite-PAD
Separator
Silicone resin
Filler
Thermal resistance and Compressibility
Thickness 2.0 mm
Thickness 3.0 mm
Thickness 0.5 mm
Thickness 1.0 mm
Thickness 1.5 mm
3.0
70
2.5
60
Compressibility (%)
Thermal resistance (K∙cm2/W)
Thickness 0.5 mm
Thickness 1.0 mm
Thickness 1.5 mm
2.0
1.5
1.0
0.5
0
0
100
200
300
Pressure (kPa)
Thickness 2.0 mm
Thickness 3.0 mm
50
40
30
20
10
0
400
0
100
200
300
Pressure (kPa)
400
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02
46
Oct. 2017
“Graphite-PAD” high thermal conductivity in z-direction
Composition example
Embossed separator
Graphite-PAD
Structure
Separator
Operating temperature range
−40 °C to 150 °C
35 × 35 mm
70 × 70 mm
Standard Part No.
EYGT3535A05A
EYGT7070A05A
Thickness
0.5 mm
0.5 mm
Standard Part No.
EYGT3535A10A
EYGT7070A10A
Thickness
1.0 mm
1.0 mm
Standard Part No.
EYGT3535A15A
EYGT7070A15A
Standard dimension
0.5 mm
1.0 mm
1.5 mm
2.0 mm
2.5 mm
3.0 mm
Thickness
1.5 mm
1.5 mm
Standard Part No.
EYGT3535A20A
EYGT7070A20A
Thickness
2.0 mm
2.0 mm
Standard Part No.
EYGT3535A25A
EYGT7070A25A
Thickness
2.5 mm
2.5 mm
Standard Part No.
EYGT3535A30A
EYGT7070A30A
Thickness
3.0 mm
3.0 mm
✽ Part numbers listed above are all standard samples for your consideration.
✽✽ Contact us for custom-made samples.
We can make samples in various forms and/or dimensions other than standard samples.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02
47
Oct. 2017
“Graphite-PAD” high thermal conductivity in z-direction
Precautions on the whole
■Do not use the products beyond the descriptions in this catalog.
■This catalog guarantees the quality of the products as individual components.
Before you use the products, please make sure to check and evaluate the products in the
circumstance where they are installed in your product.
■This product was designed and manufactured for standard applications such as general electronics
devices, office equipment, information and communications equipment, measuring instruments,
household appliances and audio-video equipment.
For applications in which special quality and reliability are required, or if the failure or malfunction
of the products may directly jeopardize life or cause threat of personal injury (such as for aircraft
and aerospace equipment, traffic and transport equipment, combustion equipment, medical
equipment, accident prevention and anti-theft devices, and safety equipment), please be sure to
consult with our sales representative in advance and to exchange product catalog which conform
to such applications.
Safety and Design considerations
■We are trying to improve the quality and the reliability, but the durability differs depending on the
use environment and the use conditions. On use, be sure to confirm the actual product under the
actual use conditions.
■Install the following systems for a failsafe design to ensure safety if these products are to be used
in equipment where a defect in these products may cause the loss of human life or other signification
damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment,
aerospace equipment, electric heating appliances, combustion/ gas equipment, rotating equipment,
and disaster/crime prevention equipment.
・The system is equipped with a protection circuit and protection device.
・The system is equipped with a redundant circuit or other system to prevent an unsafe status in
the event of a single fault.
・The system is equipped with an arresting the spread of fire or preventing glitch.
■When a dogma shall be occurred about safety for this product, be sure to inform us rapidly, operate
your technical examination.
■The temperature of this product at the time of use changes depending on mounting conditions and
usage conditions, therefore, please confirm that the temperature of this product is the specified
temperature after mounting it.
■This product does not take the use under the following special environments into consideration.
Accordingly, the use in the following special environments, and such environmental conditions may
affect the performance of the product; prior to use, verify the performance, reliability, etc.
thoroughly.
1) Use in liquids such as water, oil, chemical, and organic solvent.
2) Use under direct sunlight, in outdoor or in dusty atmospheres.
3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
4) Use the product in a contaminated state.
5) Use in acid.
6) Use outside the range defined by the operating temperature range.
7) Use under reduced pressure or vacuum.
48
2019/10/1
“Graphite-PAD” high thermal conductivity in z-direction
Precaution of installation
■Do not reuse this product after removal from the mounting board.
■Do not drop this product on the floor. If this product is dropped, it can be damaged mechanically.
Avoid using the dropped product.
■This product is soft, do not rub or touch it with rough materials to avoid scratching it.
■Lines or folds in this product may affect thermal conductivity.
■Never touch a this product during use because it may be extremely hot.
■Use protective materials when handling and/or applying this product, do not use items with sharp
edges as they might tear or puncture this product.
■Do not handle with bare hands as there is a concern about performance degradation.
Precaution on storage conditions
■Storage period is less than one year after our shipping inspection is completed.
Please use within the period.
■If the product is stored in the following environments and conditions, the performance may be
badly affected, avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
(2) Storage in places exposed to ultraviolet light.
*Recommended storage in the dark.
(3) Store at a temperature outside the storage temperature range specified by this catalog.
■In the case of a product configuration that assumes bonding, please use after checking the
adhesiveness of the product when the storage period is over.
Precaution specific to this product
■This product has conductivity. If required, This product should be provided insulation.
■This product can not guarantee the insulation because there is a concern for powder falling off of
conductive materials.
■Thermal conductivity is dependent on the way it is used. Test the adaptability of the product to your
application before use.
Applicable laws and regulations, others
■No ODCs or other ozone-depleting substances which are subject to regulation under the Montreal
Protocol are used in our manufacturing processes, including in the manufacture of this product.
■This product complies with the RoHS Directive （Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment (DIRECTIVE 2011/65/EU and （EU)2015/863）.
■All the materials used in this part are registered material under the Law Concerning the Examination
and Regulation of Manufactures etc. of Chemical substances.
■If you need the notice by letter of "A preliminary judgment on the Laws of Japan foreign exchange
and Foreign Trade control", be sure to let us know.
■These products are not dangerous goods on the transportation as identified by UN(United Nations)
numbers or UN classification.
■As to the disposal of the module, check the method of disposal in each country or region where the
modules are incorporated in your products to be used.
■The technical information in this catalog provides examples of our products typical operations and
application circuits. We do not guarantee the non-infringement of third party's intellectual property
rights and we do not grant any license, right, or interest in our intellectual property.
2019/10/1
49
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance
“GraphiteTIM(Compressible Type)” PGS
with low thermal resistance
Type:
EYGS
GraphiteTIM(Compressible Type) is a graphite sheet that is dedicated for
use as a thermal interface material.
The GraphiteTIM(Compressible Type) has very high compressibility
compared to standard PGS, which enables reducing the thermal
resistance by following gap, warpage, and distortion of targets/substrates.
Excellent heat resistance and reliability of the GraphiteTIM help obtaining
longer service life and higher performance of various components, such
as power modules.
The GraphiteTIM(Compressible Type) is cost-saving, because it may
allow you to reduce your existing processes. Unlike grease, there is no
necessity for printing process , since it is a sheet-type product.
There are no problems that are found in grease and phase change
materials in the GraphiteTIM, which makes it excellent TIM.
Features
● Thermal
resistance : 0.2K∙cm2/W (600 kPa)
To draw a good thermal resistance from sheet, pressure the GraphiteTIM.
A close adherence would make the product fit into the uneven part and
enhance the performance.
● Thermal conductivity : X-Y direction 400W/m∙K, Z direction (28W/m∙K)
● Compressibility : 40 % (600k Pa)
● High and long term reliability : operating temperature range –55 to 400 °C
● RoHs compliant
After pressure
Recommended applications
For cooling/heat transfer of electronic devices that generates heat,
such as power modules.
● Inverters and converters
● Car-mounted camera, motor control unit, automotive LED,
luminous source of laser HUD, medical equipment
● Base station, Server
Install in IGBT module
IGBT module
GraphiteTIM
Heatsink
Explanation of Part Numbers
● GraphiteTIM(EYGS✽✽✽✽ZL✽✽)
1
2
3
4
5
6
7
8
9
10
11
12
E
Y
G
S
0
9
1
8
Z
L
X
2
Suffix
Product Code
PGS Graphite sheet
S
Style
PGS only
0909
0918
1818
Dimension
90 mm × 90 mm
90 mm × 180 mm
180 mm × 180 mm
Thickness of GraphiteTIM
ZL
200 μm
✽ Please contact us for custom-made products.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Sep. 2018
50
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance
Typical characteristics
Items
Test method
Condition
Data
Thermal resistance (K·cm2/W)
TIM Tester
600 kPa
Compressibility (%)
TIM Tester
600 kPa
40
X-Y
400 (300 to 600)
Z
(28)
Thickness (µm)
200
Thermal conductivity (W/m·K)
Laser PIT
Flame resistance
UL-94V
0.2
V-0
Operating temperature range (°C)
−55 to 400
Typical values, not guaranteed.
Thermal resistance and compressibility
60
1.8
50
1.6
Compressibility (%)
Thermal resistance (K∙cm2/W)
2.0
1.4
1.2
1.0
0.8
0.6
0.4
40
30
20
10
0.2
0
0
100
200
300
400
Pressure (kPa)
500
0
600
0
100
200
300 400 500
Pressure (kPa)
600
700
Lamination type/Composition example
● GraphiteTIM(Compressible
Type) standard form
Sheet only
Type
S Type
Process for IGBT mounting
−
b
Front
a
Structure
Side
Operating
Temperature Range
Thickness: c
Standard
Part No.
c
−55 to 400 °C
200 μm
90 × 90 mm
EYGS0909ZLX2
90 ×180 mm
EYGS0918ZLX2
180 ×180 mm
EYGS1818ZLX2
✽ Part numbers listed above are all standard samples for your consideration.
✽✽ Contact us for custom-made samples.
We can make samples in various forms and/or dimensions other than standard samples.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Sep. 2018
51
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance
● PGS
in IGBT forms
Sheet only
S Type
Lamination
Type
Process for IGBT mounting
b
e
a d
Front
Structure
✽ This shape is an example, please
contact us for detailed shape of each
part no.
Side
c
Operating
Temperature Range
Thickness: c
No.
Standard
Part No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
EYGS1431ZLAA
EYGS0925ZLWA
EYGS1419ZLWB
EYGS0917ZLWC
EYGS1316ZLAC
EYGS1216ZLWD
EYGS1116ZLMA
EYGS1315ZLGA
EYGS1314ZLWE
EYGS1014ZLAD
EYGS0714ZLAE
EYGS0714ZLAF
EYGS1113ZLMB
EYGS1313ZLGB
EYGS0713ZLAG
EYGS0813ZLMD
EYGS1212ZLGC
EYGS0912ZLGD
EYGS0612ZLWF
EYGS0512ZLGE
EYGS0811ZLGH
EYGS0811ZLWG
EYGS0611ZLWH
EYGS0411ZLWJ
EYGS0610ZLAH
EYGS0410ZLAJ
EYGS1010ZLME
−55 to 400 °C
200 µm
a : Lateral size
(mm)
140
85
136
85
125
120
108.8
129.5
126
97.8
70
69
106
128
66
71
120
88
60
53
80
78
60
43
59.4
43
98
b : Longitudinal
Hole
Hole
size
diameter
number
(mm)
(0mm)
308
12
6
246
14
6
186
8
7.5
168
10
6
163
8
6.1
160
8
6
158
8
6
150
8
7
136
6
7.5
138
4
6.8
138
4
5.7
136
4
7.2
132
4
5.7
128
4
6.7
126
4
5.7
123
2
4.7
120
4
5.7
120
4
5.7
120
4
5.7
118
2
5.7
113
4
5.7
108
4
6.7
106
4
6.7
105.5
2
5.7
104.4
4
6.7
102.8
2
5.7
6.7
98
4
d : Lateral
hole pitch
(mm)
126
73
124
73
110
110
92.75
118.5
114
86
57
57
95
110
50
Center
110
78
50
Center
70
62
48
Center
48
Center
87
e : Longitudinal
hole pitch
(mm)
290
234
171
156
150
150
144
137.5
124
127
128
124
121
110
116
116
110
110
110
106
103
93
93
93
93
93
87
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Sep. 2018
52
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance
No.
Standard
Part No.
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
EYGS0409ZLGJ
EYGS0509ZLGK
EYGS0309ZLMF
EYGS0409ZLMG
EYGS0309ZLAK
EYGS0509ZLMH
EYGS0508ZLMJ
EYGS0608ZLMK
EYGS0607ZLGL
EYGS0507ZLML
EYGS0407ZLAL
EYGS0506ZLMM
EYGS0404ZLMP
EYGS1018ZLSA
EYGS1516ZLSB
EYGS1116ZLSC
EYGS0715ZLSD
EYGS0613ZLSE
EYGS0612ZLSF
EYGS0612ZLSG
EYGS1012ZLSH
EYGS0410ZLSJ
EYGS0609ZLSK
EYGS0606ZLSL
EYGS0305ZLSM
EYGS0204ZLSN
EYGS0303ZLSP
EYGS0911ZLDA
EYGS1014ZLDB
a : Lateral size
(mm)
44
46
32
41
29.5
51
46.2
55
58
45.3
40
48
36
104.5
148
112
67
61
63.3
61.5
104.5
43
61.5
58
27
24
29
92
98
b : Longitudinal
Hole
Hole
size
diameter
number
(mm)
(0mm)
93
2
6.7
92
2
6.7
92
2
6.7
88
2
5.7
89.5
2
6.6
86
2
4.7
83
2
4.7
78
2
4.5
69.7
4
5.7
66
2
4.7
65.5
1
7.7
55
1
4.5
38
1
4.5
182.5
8
7
158
8
5
158
8
5
153
4
5.6
127.5
4
5.6
124
4
5.6
124
4
5.6
121
4
6.7
103
2
5.7
91
4
5.6
61.5
2
5.6
51
1
4.6
36.5
1
4.6
32
1
4.5
109
4
6
138
4
6.7
d : Lateral
hole pitch
(mm)
Center
Center
Center
Center
Center
–
–
Center
50
–
Center
Center
Center
93
137
101
57
50
50
50
93
Center
50
44
Center
Center
Center
78
86
e : Longitudinal
hole pitch
(mm)
80
80
80
80
80
80
77
40
62
60
Center
Center
Center
171
150
150
143
116
110
110
109.5
93
77
50
Center
Center
Center
93
127
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
05 Sep. 2018
53
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance
Precautions on the whole
■Do not use the products beyond the descriptions in this catalog.
■This catalog guarantees the quality of the products as individual components.
Before you use the products, please make sure to check and evaluate the products in the
circumstance where they are installed in your product.
■This product was designed and manufactured for standard applications such as general electronics
devices, office equipment, information and communications equipment, measuring instruments,
household appliances and audio-video equipment.
For applications in which special quality and reliability are required, or if the failure or malfunction
of the products may directly jeopardize life or cause threat of personal injury (such as for aircraft
and aerospace equipment, traffic and transport equipment, combustion equipment, medical
equipment, accident prevention and anti-theft devices, and safety equipment), please be sure to
consult with our sales representative in advance and to exchange product catalog which conform
to such applications.
Safety and Design considerations
■We are trying to improve the quality and the reliability, but the durability differs depending on the
use environment and the use conditions. On use, be sure to confirm the actual product under the
actual use conditions.
■Install the following systems for a failsafe design to ensure safety if these products are to be used
in equipment where a defect in these products may cause the loss of human life or other signification
damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment,
aerospace equipment, electric heating appliances, combustion/ gas equipment, rotating equipment,
and disaster/crime prevention equipment.
・The system is equipped with a protection circuit and protection device.
・The system is equipped with a redundant circuit or other system to prevent an unsafe status in
the event of a single fault.
・The system is equipped with an arresting the spread of fire or preventing glitch.
■When a dogma shall be occurred about safety for this product, be sure to inform us rapidly, operate
your technical examination.
■The temperature of this product at the time of use changes depending on mounting conditions and
usage conditions, therefore, please confirm that the temperature of this product is the specified
temperature after mounting it.
■This product does not take the use under the following special environments into consideration.
Accordingly, the use in the following special environments, and such environmental conditions may
affect the performance of the product; prior to use, verify the performance, reliability, etc.
thoroughly.
1) Use in liquids such as water, oil, chemical, and organic solvent.
2) Use under direct sunlight, in outdoor or in dusty atmospheres.
3) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
4) Use the product in a contaminated state.
5) Use in acid.
6) Use outside the range defined by the operating temperature range.
7) Use under reduced pressure or vacuum.
54
2019/10/1
“GraphiteTIM (Compressible Type)” PGS with low thermal resistance
Precaution of installation
■Do not reuse this product after removal from the mounting board.
■Do not drop this product on the floor. If this product is dropped, it can be damaged mechanically.
Avoid using the dropped product.
■This product is soft, do not rub or touch it with rough materials to avoid scratching it.
■Lines or folds in this product may affect thermal conductivity.
■Never touch a this product during use because it may be extremely hot.
■Use protective materials when handling and/or applying this product, do not use items with sharp
edges as they might tear or puncture this product.
■Do not handle with bare hands as there is a concern about performance degradation.
Precaution on storage conditions
■Storage period is less than one year after our shipping inspection is completed.
Please use within the period.
■If the product is stored in the following environments and conditions, the performance may be
badly affected, avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
(2) Storage in places exposed to ultraviolet light.
*Recommended storage in the dark.
(3) Store at a temperature outside the storage temperature range specified by this catalog.
■In the case of a product configuration that assumes bonding, please use after checking the
adhesiveness of the product when the storage period is over.
Precaution specific to this product
■This product has conductivity. If required, This product should be provided insulation.
■This product can not guarantee the insulation because there is a concern for powder falling off of
conductive materials.
■Thermal conductivity is dependent on the way it is used. Test the adaptability of the product to your
application before use.
Applicable laws and regulations, others
■No ODCs or other ozone-depleting substances which are subject to regulation under the Montreal
Protocol are used in our manufacturing processes, including in the manufacture of this product.
■This product complies with the RoHS Directive （Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment (DIRECTIVE 2011/65/EU and （EU)2015/863）.
■All the materials used in this part are registered material under the Law Concerning the Examination
and Regulation of Manufactures etc. of Chemical substances.
■If you need the notice by letter of "A preliminary judgment on the Laws of Japan foreign exchange
and Foreign Trade control", be sure to let us know.
■These products are not dangerous goods on the transportation as identified by UN(United Nations)
numbers or UN classification.
■As to the disposal of the module, check the method of disposal in each country or region where the
modules are incorporated in your products to be used.
■The technical information in this catalog provides examples of our products typical operations and
application circuits. We do not guarantee the non-infringement of third party's intellectual property
rights and we do not grant any license, right, or interest in our intellectual property.
2019/10/1
55
CAUTION AND WARNING
1. The electronic components contained in this catalog are designed and produced for use in home electric appliances, office equipment,
information equipment,communications equipment, and other general purpose electronic devices.
Before use of any of these components for equipment that requires a high degree of safety, such as medical instruments, aerospace equipment,
disaster-prevention equipment, security equipment, vehicles (automobile, train, vessel),
please be sure to contact our sales representative corporation.
2. When applying one of these components for equipment requiring a high degree of safety, no matter what sort of application it might be, be sure to
install a protective circuit or redundancy arrangement to enhance the safety of your equipment. In addition, please carry out the safety test on your
own responsibility.
3. When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with
us in advance.
4. Technical information contained in this catalog is intended to convey examples of typical performances and or applications and is not
intended to make any warranty with respect to the intellectual property rights or any other related rights of our company or any third parties nor
grant any license under such rights.
5. In order to export products in this catalog, the exporter may be subject to the export license requirement under the Foreign Exchange and
Foreign Trade Law of Japan.
6. No ozone-depleting substances (ODSs) under the Montreal Protocol are used in the manufacturing processes of Automotive & Industrial Systems
Company, Panasonic Corporation.
Please contact
Factory
Device Solutions Business Division
Industrial Solutions Company
The information in this catalog is valid as of Dicember 2019.
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