Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
151-EXB-28N03DE
Part No.
EXB28N
a
W
B
a’
P
(2)Protective
coating
Resin
(5)Termination
(Between)
(1)Substrate
B
1. Dimension
A1 A2
8-1
Alumina
(4)Termination
(Inner)
Ag or Ag/Pd
Ni Plating
Side:Resin+Metal
(3)Resistive
element
Ruthenium oxide
(6) Termination
(Outer)
Sn Plating
T
G
L
a-a’ sectional plan
G
(1) (2) (3) (4) (5) (6)
Dimension(mm)
L
2.00±0.10
W
1.00±0.10
T
0.35±0.10
Dimension(mm)
B
0.20±0.10
P
(0.50)
G
0.25±0.10
A1
0.45±0.10
A2
0.35±0.10
( ) : Reference
% of rated dissipation
2. Power derating curve
100
80
-55°C
70°C
Category temperature range
60
40
-55°C to +125°C
20
125°C
0
-60 -40 -20
0
20 40
60 80 100 120 140 160
Ambient Temperature(°C)
Fig. 1
3. Ratings
Item
Rated Dissipation
Rated voltage
&
Rated Continuous
Working Voltage
(RCWV)
Rated Value
Explanation
When used at ambient temperature over 70 °C,
0.063 W / element
the rated dissipation should be reduced as
shown in Fig.1
Chip jumper : Rated current 1 A (Resistance is less than 50 mΩ)
The rated voltage of each resistor should be calculated from the
equation below, and when the rated voltage exceeds the limiting
element voltage, the limiting element voltage should the maximum
working voltage.
E= P×R
Limiting element voltage : 50 V
E: Rated voltage(V), P: Rated dissipation(W), R: Rated resistance(Ω))
Panasonic Electronic Devices Co., Ltd.
Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
151-EXB-28N03DE
Part No.
EXB28N
Item
Rated Value
Explanation
Sign
J
0
Resistance
tolerance
Range of rated
resistance for
manufacture
8-2
Tolerance
J
0
Tolerance for resistance
±5%
Chip Jumper
Resistance range
10 Ω to 1.0 MΩ
Less than50 mΩ
Series
E-24
-
4. Explanation of part number
E
X
B
2
8
N
Thick Film
Resistor Networks
1
0
2
J
X
Rated Resistance Tolerance
Taping
Chip Resistor Array
Part No.
R
28N
8
7
6
5
Circuit
1
2
3
4
0
0
0
Chip Jumper
Packaging
Taping
(10,000pcs/reel)
Code
X
5. Appearance & Construction
Item
Appearance &
Construction
Specifications
Explanation
1. The resistive element should be covered with protective coating
that do not fade easily. The surface of coating should avoid
unevenness, flaw, pinhole and discoloration.
2. The electrode should be printed uniformly, as shown in the
dimensions. The plating should not fade easily, and should avoid
unevenness, flaw, pinhole, projection and discoloration.
3. The electrode should be connected electrically, mechanically to
resistive element.
4. Substrate should not have chipping, flaw, flash and crack. Details
of appearance criteria shall be as described in attached sheet
As far as there shall be not designation especially, the following test and measurement shall be
operated under normal temperature(15 °C to 35 °C), normal humidity(25 %RH to 75 %RH),
normal atmospheric pressure(86 kPa to 106 kPa).
Panasonic Electronic Devices Co., Ltd.
Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
151-EXB-28N03DE
Part No.
EXB28N
8-3
6. Performance Specification
Item
DC resistance
Temperature
coefficient
Overload
Dielectric
Withstanding
Insulation
Resistance
Specification
Resistor
DC resistance
value shall be
within the
specified
tolerance
Jumper
Less than
50 mΩ
Resistance
TCR
10Ω to 1MΩ ±200×10-6 / °C
Chip jumper :
Less than 50 mΩ
±(2 %+0.1 Ω)
Less than
50 mΩ
No evidence of flashover,
mechanical damage, arcing or
insulation breakdown.
Min. 1,000 MΩ
Test methods
Measuring voltage: refer to JIS-C5201-1
At 20 °C, 65 %RH
Natural resistance change per temperature
degree centigrade.
R2 - R1
TCR=
R1×(t2 - t1)
R1 : Resistance value at reference
temperature(t1)
R2 : Resistance value at test
temperature(t2)
t2 - t1 = 100 °C, t1 = 25 °C
Resistors shall be applied 2.5 times the rated
voltage for 5 seconds.
However, the upper limit of the voltage in the
test shall be 100V.
In addition, the current applied to the jumper
in the test shall be 2A.
AC 100V between substrate and termination
for 1 minute.
Insulation resistance between substrate and
termination shall be measured at DC 100V.
7. Mechanical characteristic
Item
Bend strength of
the face plating
Solderability
Specification
Resistor
Jumper
No mechanical damage
±(1 %+0.05 Ω)
Less than
50 mΩ
Test methods
Substrate: Glass epoxy(t = 1.0 mm)
Span: 90 mm
Bending distance: 3 mm (10 seconds)
Resistors shall be dipped in the melted solder
Termination should be covered
bath at 235 °C ± 5 °C for 2 s ± 0.5 s. Flux shall
uniformly with solder.
be removed from the surface of termination
(min. 95 % coverage)
with clean organic solvent.
Panasonic Electronic Devices Co., Ltd.
Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
151-EXB-28N03DE
Part No.
EXB28N
Item
Resistance to
soldering heat
Vibration
Solvent resistance
Specification
Resistor
Jumper
Less than
50 mΩ
8-4
Test methods
Resistors shall be dipped in the melted solder
bath at 270 °C ± 5 °C for 10s ± 1s.
Resistors shall be subjected to a single
vibration having as double amplitude of 1.5
mm for 2 hours in each three mutually
Less than
perpendicular directions for total 6 hours.
±(1 %+0.05 Ω)
50 mΩ
The vibration frequency shall be varied
uniformly 10 Hz to 55 Hz and return to 10 Hz
traversing for 1 minute.
Without distinct deformation in Solvent solution: Isopropyl alcohol
appearance
(1) Dipping 10 hours ± 1 hour, dry in room
condition for 30 min ± 10 min.
(2) Ultrasonic wave washing: 5 min ± 1 min
Less than
(0.3 W/cm2,28 kHz)
±(0.5 %+0.05 Ω)
50 mΩ
Dry in room condition for 30 min ± 10
min.
±(1 %+0.05 Ω)
8. Environmental Test
Item
Low temperature
exposure
Endurance at upper
category
temperature
Specification
Resistor
±(1 %+0.05 Ω)
±(1 %+0.05 Ω)
Jumper
Less than
50 mΩ
Less than
50 mΩ
Temperature
cycling
±(1 %+0.05 Ω)
Less than
50 mΩ
Humidity
(Steady state)
±(1 %+0.05 Ω)
Less than
50 mΩ
Endurance at 70 °C
±(3 %+0.1 Ω)
Less than
50 mΩ
Load life in
Humidity
±(3 %+0.1 Ω)
Less than
50 mΩ
Test methods
Resistors shall be exposed at -55 °C ± 3 °C for
+48
1000 hours 0 hours
Resistors shall be exposed at +125 °C±3 °C for
+48
1000 hours 0 hours.
-55 °C ± 3 °C, 30 minutes
↑↓
Nominal temp., 30minutes
25cycles
↑↓
+125 °C ± 3 °C, 30minutes
Resistors shall be exposed at 60 °C ± 2 °C and
90 % to 95 % relative humidity in a humidity
+48
test chamber for 1000 hours 0 hours.
Resistors shall be exposed at 70 °C ± 2 °C for
+48
1000 hours 0 hours. During this time, the
rated voltage shall be applied intermittently
for 1.5 hours ON, 0.5 hour OFF.
Resistor shall be exposed at 60 °C ± 2 °C and
90 % to 95 % relative humidity for 1000 hours
+48
0 hours. During this time, the rated voltage
shall be applied intermittently for 1.5 hours
ON, 0.5 hour OFF.
9. Resistance value marking
No marking.
Panasonic Electronic Devices Co., Ltd.
Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
151-EXB-28N03DE
Part No.
EXB28N
8-5
10. Notice for use
!
Notice for use
(1)This specification shows the quality and performance of the product in a unit component. Before
adoption, be sure to evaluate and verify the product mounting it in your product.
(2)We take no responsibility for troubles caused by the product usage that is not specified in this
specification.
(3)In traffic transportation equipment (trains, cars, traffic signal equipment, etc.), medical
equipment, aerospace equipment, electric heating appliances, combustion and gas equipment,
rotating equipment, disaster and crime preventive equipment, etc. in cases where it is forecast
that the failure of this product gives serious damage to human life and others, use fail-safe design
and ensure safety by studying the following items to
Ensure safety as the system by setting protective circuits and protective equipment.
Ensure safety as the system by setting such redundant circuits as do not cause danger by a
single failure.
(4)When a dogma shall be occurred about safety for this product, be sure to inform us rapidly,
operate your technical examination.
(5) The product is designed to use in general standard applications of general electric equipment
(AV products, household electric appliances, office equipment, information and communication
equipment, etc.); hence, it do not take the use under the following special environments into
consideration.
Accordingly, the use in the following special environments, and such environmental conditions
may affect the performance of the product; prior to use, verify the performance, reliability, etc.
thoroughly.
1) Use in liquids such as water, oil, chemical, and organic solvent.
2) Where the product is close to a heating component, or where an inflammable such as a
polyvinyl chloride wire is arranged close to the product.
3) Where the product is sealed or coated with resin, etc.
4) Where water or a water-soluble detergent is used in cleaning free soldering (Pay particular
attention to soluble flux.)
5) Use in such a place where the product is wetted due to dew condensation.
6) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
7) Use under direct sunlight, in outdoor or in dusty atmospheres.
8) Use in environment with large static electricity or strong electromagnetic waves.
(6)If transient load (heavy load on a short time) like pulse is expected to be applied, carry out
evaluation and confirmation test with resistors actually mounted on your own board. When the
load of more than rated power is applied under the load condition at steady state, it may impair
performance and/or reliability of resistor. Never exceed the rated power.
When the product shall be used under special condition, be sure to ask us in advance.
(7)Halogen type (chlorine type, bromine type, etc.) or other high-activity flux is not recommended as
the residue may affect performance or reliability of resistors.
(8)When soldering with soldering iron, never touch the body of the chip resistor with a tip of the
soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as
short as possible. (Three seconds or less up to 350 °C)
(9)Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or
tweezers) as it may damage protective firm or the body of resistor and may affect resistor’s
performance.
(10)Reflow soldering method shall apply to this product in principle.
Panasonic Electronic Devices Co., Ltd.
Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
151-EXB-28N03DE
Part No.
EXB28N
8-6
11. Storage method
If the product is stored in the following environments and conditions, the performance and
solderability may be badly affected. Avoid the storage in the following environments.
(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.
(2) Storage in places exposed to direct sunlight.
(3) Storage in places outside the temperature range of 5 °C to 35 °C and humidity range of
45 %RH to 85 %RH.
(4) Storage over a year after our delivery (This item also applies to the case where the
storage method specified in item (1) to (3) has been followed.).
12. Laws and Regulations
(1) No ODCs or other ozone-depleting substances that are subject to regulation under the
Montreal Protocol are used in our manufacturing processes, including in the manufacture of
this product.
(2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment (DIRECTIVE 2002/95/EC)).
(3) All materials used in this product are existing chemical substances recognized under "lows
on examination of chemical substances and regulations of manufacturing and others."
(4) None of the materials used in this product contain the designated incombustible bromic
substances, PBBOs and PBBs.
(5) Please contact us to obtain a notice as to whether this product has passed inspection under
review criteria primarily based on Foreign Exchange and Foreign Trade Control Laws, and
appended table in the Export Control Laws.
13. Production Place
Production Country : Japan
Production Plant
: Panasonic Electronic Devices Japan Co., Ltd..
Production Country : China
Production Plant
: Panasonic Electronic Devices (Tianjin) Co., Ltd.(PEDTJ)
Panasonic Electronic Devices Co., Ltd.
Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
151-EXB-28N03DE
Part No.
EXB28N
8-7
14. Tape and Reel Package
14-1. Physical Dimensions
Structure and reel dimensions shall be as shown in the figure below.
Inaccordance with EIAJ ET-7200.
Min. 60.0
13.0 +/- 1.0
Carrier tape
Top tape
180.0 +0 / -3.0
Min. 60.0
9.0 +/- 1.0
11.4 +/- 1.0
Adhesive tape
Unit : mm
14-2. Carrier Tape Dimensions
P0
P2
P1
Sprocket hole
B
W
F
E
φD0
A
T
Chip hole
Chip resistor array
(mm)
(mm)
A
B
W
F
E
1.20±0.10
2.20±0.10
8.00±0.20
3.50±0.05
1.75±0.10
P1
P2
P0
T
φD0
2.00±0.10
2.00±0.05
4.00±0.10
0.52±0.05
+0.10
1.50 0
14-3. Specification
14-3-1. Taping
(1) When the test shall be operated with the below conditions, peel strength should be
0.049N
to 0.49N, should not have flash and tear after peeling.
Carrier Tape
Peeling Direction
10°
Top Tape
(2) Minimum Bending Radius
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip
and no break of carrier tape. However minimum bending radius shall be tested for 1
times.
Panasonic Electronic Devices Co., Ltd.
Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
151-EXB-28N03DE
Part No.
EXB28N
8-8
(3) Resistance to climate
When resistors shall be exposed at 60 °C ± 2 °C, 90 %RH to 95 %RH for 120 hours, no
defection of chip and no break off carrier tape.
When the top tape shall be peeled, tape should not have flash and tear.
14-3-2. Quantity in Taping: 10,000 pcs. / reel
14-3-3. Tape packaging
(1) Resistor side shall be facing upward.
(2) Chip resistor shall not be sticking to top tape and bottom tape.
(3) Chip resistors shall be easy to take out from carrier tape and chip hole or sprocket hole
shall not have flash and break.
14-4. Outer Packaging
Quantity: 20 reels(Max.200,000 pcs.)
Tape
Marking
(1) When packaging quantity does not reach max quantity, the remaining empty space shall
be buried with buffer material.
(2) When quantity shall be few, alternative packaging methods may used. No problem must
occur during the exportation of the product..
14-5. Marking
At last, production country is displayed in English.
• Side of reel (Marking shall be on one side.)
(1)Part name
(2)Part number
(3)Quantity
(4)Lot number
(5)Maker name
(6)Production country
•Packaging box
(1)Customer name
(5)Quantity
(2)Part name (3)Part number
(4)Customer part number
(6)Maker name (7) Production country
Panasonic Electronic Devices Co., Ltd.
Spec. No.
Subject
Chip Resistor Array
PRODUCT SPECIFICATION FOR INFORMATION
APPEARANCE QUALITY CRITERIA
Resin Chipping
Appearance Criteria
1-1
Remark
C
Defect Criteria
B
Item
Attached Sheet
A ≤ W/16
B ≤ C/2
Both side chipping
shall be judged defect
A
W
D
B
B
C
A
A ≤ C/4
B ≤ Top terminal width
D ≥ 3C/4
Terminal Chipping
Oblique
chipping
line
show
This item is applied to
One pin hole /
pin holes which reach
chip resistor
to the resistive
φ ≤ 0.2 mm
materials
Pin Hole
φ
A
A ≤ 100 μm
Flash
A
Panasonic Electronic Devices Co., Ltd.
