Chip Resistor Networks
Chip Resistor Networks
Type: EXBD
EXBE
EXBA
EXBQ
Features
●
●
●
●
High density placing for digital signal circuits
· Bussed 8 or 15 resistors for pull up/down circuits
EXBD: 3.2 mm × 1.6 mm × 0.55 mm, 0.635 mm pitch
EXBE: 4.0 mm × 2.1 mm × 0.55 mm, 0.8 mm pitch
EXBA: 6.4 mm × 3.1 mm × 0.55 mm, 1.27 mm pitch
EXBQ: 3.8 mm × 1.6 mm × 0.45 mm, 0.5 mm pitch
· Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
(“High density placing” is shown below)
High speed mounting using conventional placing machine
Reference Standard…IEC 60115-9, JIS C 5201-9, EIAJ RC-2130
RoHS compliant
[High density placing]
Pull up resistors
Direct placement on the bus line
VCC
EXBE10C
EXBA10P
VCC
VCC
IC
IC
IC
IC
IC
IC
No through hole
Through holes
0.4 mm pitch
0.635 mm pitch
■ As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions,
Please see Data Files
Explanation of Part Numbers
Product Code
Thick Film
Resistor
Network
1
2
3
4
5
6
7
8
9
10
11
E
X
B
E
1
0
C
1
0
3
J
Dimension Code of
Chip Resistor Network
Code
D
E
A
Q
Inch
1206
1608
2512
1506
Dimensions
3.2 mm×1.6 mm
4.0 mm×2.1 mm
6.4 mm×3.1 mm
3.8 mm×1.6 mm
Number of
Terminals
10(EXBD,E,A)
16(EXBQ)
Circuit Configuration
Code
C
P
P
E
Common Terminal Position
Center common circuit
(EXBD, EXBE)
Diagonal common circuit
(Terminal 5 and Terminal 10)
(EXBA)
One side common circuit
(Terminal 16)
(EXBQ)
Diagonal common circuit
(Terminal 1 and Terminal 6)
(EXBA)
Resistance Value
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Resistance
Tolerance
±5 %
J
12
Suffix for Special
Requirements
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Feb. 2019
Chip Resistor Networks
Construction (Example : EXBD)
Protective coating
Protective coating
Electrode
(Inner)
Alumina substrate
Electrode (Outer)
Thick film
resistive element
Electrode (Between)
Electrode (Inner)
Alumina substrate
Thick film
resistive element
Dimensions in mm (not to scale)
EXBE
0.2±0.1
0.55±0.10
0.35±0.20
0.35±0.15
0.35±0.15
0.40±0.15
0.25±0.10
I03
0.8±0.1
4.0±0.2
0.4±0.2
0.3±0.2
0.55±0.10
0.35±0.20
0.4±0.2
0.4±0.2
0.3±0.1
0.25±0.10
0.5±0.2
0.2±0.1
0.635±0.10
3.20±0.15
f0.3 +0.1
–0.2
0.5±0.2
0.40±0.15
0.2±0.1
1.60±0.15
0.3±0.2
0.5±0.2
2.1±0.2
0.33±0.15
f0.2±0.1
0.2±0.1
0.25±0.20
0.25±0.20
EXBD
Mass (Weight)[1000 pcs.] : 10 g
Mass (Weight)[1000 pcs.] : 16 g
EXBA
EXBQ
0.5±0.2 0.5±0.2
0.5±0.2
472
1.6±0.2
I03
0.15 +0.15
–0.05
0.5±0.1
0.55±0.10
0.45±0.10
3.8±0.2
EXBA10E
0.15 +0.20
–0.05
I03
Mass (Weight)[1000 pcs.] : 40 g
0.30±0.15
1.27±0.10
6.4±0.2
EXBA10P
0.15 +0.15
–0.05
I03
0.3±0.1
3.1±0.2
0.3±0.2 0.3±0.2
f0.3 +0.1
–0.2
0.25±0.15
0.2±0.1
0.7±0.2
Mass (Weight)[1000 pcs.] : 9 g
Circuit Configuration
EXBD, EXBE
EXBA
10
9
8
7
1
EXBQ
EXBA10E
EXBA10P
10
9
8
7
6
10
9
8
7
6
16 15 14 13 12 11 10 9
1
2
3
4
5
1
2
3
4
5
1
6
2
3
4
5
2
3 4
5
6
7
8
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Feb. 2019
Chip Resistor Networks
Ratings
Item
Specifications
Part No.
EXBD
EXBE
Resistance Range (Ω)
EXBA
47 to 1M (E12 series)
Resistance Tolerance (%)
EXBQ
100 to 470k (E6 series)
±5
Number of Terminals
10 terminals
16 terminals
Number of Resistors
8 element
15 element
(3)
Power Rating
at 70 °C (W)
Limiting Element Voltage
(1)
0.05 /element
(V)
Maximum Overload Voltage
(2)
0.063 /element
25
(V)
50
–6
T. C. R. (× 10 / °C)
0.025 /element
50
25
100
50
±200
Category Temperature Range (°C)
–55 to +125
–
AEC-Q200 Grade
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the figure on the right.
Rated Load (%)
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=√Power Rating × Resistance Values, or Limiting Element Voltage listed above, whichever less.
(2) Overload Test Voltage (OTV) shall be determined from OTV=Specified Magnification (refer to performance) × RCWV or Maximum Overload Voltage listed above, whichever less.
(3) Use it on the condition that the case temperature is below the upper category temperature.
100
–55 °C
70 °C
80
60
40
20
125 °C
0
–60 –40 –20 0 20 40 60 80 100120140160180
Ambient Temperature (°C)
Perfomance
Test Item
Resistance
T. C. R.
Overload
Performance
Requirements
Within Specified
Tolerance
Within Specified
T. C. R.
±3 %
Test Conditions
20 °C
+25 °C/+125 °C
Rated Voltage × 2.5, 5 s
Resistance to Soldering Heat
Rapid Change of
Temperature
High Temperature
Exposure
±1 %
260 °C±5 °C, 5 s±1 s
±2 %
–55 °C (30min.) / +125 °C (30min.), 5 cycles
±3 %
+125 °C , 100 h
Load Life in Humidity
±3 %
Endurance at 70 °C
±5 %
60 °C±2 °C, 90 % to 95 %RH, Rated Power × 0.1,
1.5 h ON / 0.5 h OFF cycle, 500 h
70 °C±2 °C, Rated Voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Feb. 2019
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Fixed Resistors
Safety Precautions (Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject to
change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products under the actual conditions for use.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as
damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment,
electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention
equipment.
✽ Systems equipped with a protection circuit and a protection device.
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single
fault.
✽ Systems equipped with an arresting the spread of fire or preventing glitch.
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general elec tron ic equipment.
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
For applications in which special quality and reliability are required, or if the failure or malfunction of the
products may directly jeopardize life or cause threat of personal injury (such as for aircraft and aerospace
equipment, traffic and transport equipment, combustion equipment, medical equipment, accident prevention
and anti-theft devices, and safety equipment), please be sure to consult with our sales representative in
advance and to exchange product specifications which conform to such applications.
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent.
2. In direct sunlight, outdoors, or in dust.
3. In salty air or air with a high concentration of corrosive gas, such as Cl2,H2S,NH3,SO2,or NOX .
4. Electric Static Discharge (ESD) Environment.
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic and Radioactive Environment.
Avoid any environment where strong electromagnetic waves and radiation exist.
6. In an environment where these products cause dew condensation.
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials.
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range
due to the effects of neighboring heat-generating components. Do not mount or place heat-generating
components or inflammables, such as vinyl-coated wires, near these products.
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to
leave water residues. Otherwise, the insulation performance may be deteriorated.
• Do not apply flux to these products after soldering. The activity of flux may be a cause of failures in these
products.
• Refer to the recommended soldering conditions and set the soldering condition. High peak temperature or
long heating time may impair the performance or the reliability of these products.
• Recommended soldering condition is for the guideline for ensuring the basic characteristics of the products,
not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual
conditions.
01. Oct. 2019
Fixed Resistors
• Do not reuse any products after removal from mounting boards.
• Do not drop these products. If these products are dropped, do not use them. Such products may have
received mechanical or electrical damage.
• If any doubt or concern to the safety on these products arise, make sure to inform us immediately and
conduct technical examinations at your side.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of
arrival at your company, provided that they remain packed as they were when delivered and stored at
a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions.
Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging
materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2,H2S,NH3,SO2,or NOX .
2. In direct sunlight.
(3) AEC-Q200 Compliant
The products are tested based on all or part of the test conditions and methods defined in AEC-Q200.
Please consult with Panasonic for the details of the product specification and specific evaluation test results,
etc., and please review and approve Panasonic's product specification before ordering.
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
01. Oct. 2019
Surface Mount Resistors
Safety Precautions (Common precautions for Surface Mount Resistors)
The following are precautions for individual products. Please also refer to the common precautions for Fixed
Resistors in this catalog.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
Take measures against mechanical stress during and after mounting of Surface Mount Resistors
(hereafter called the resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
Keep the rated power and ambient temperature within the specified derating curve.
Some circuit boards, wiring patterns, temperatures of heat generated by adjacent components, or
ambient temper a tures can become factors in the rise of the temperature of the resistors, regardless of
the level of power applied. Therefore, check the conditions before use and op timize them so as not to
damage the boards and peripheral components.
Make sure to contact us before using the resistors under special conditions.
If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate
the operations of the resistors when installed in your products before use. Never exceed the rated power.
Otherwise, the performance and/or reliability of the resistors may be impaired.
Transient voltage
If there is a possibility that the transient phenomenon (significantly high voltage applied in a short time)
may occur or that a high voltage pulse may be applied, make sure to evaluate and check the
characteristics of resistors mounted on your product rather than only depending on the calculated power
limit or steady-state conditions.
If the resistors are to be used in high frequency circuits, carefully check the operation before use.
Such circuits change the electrical characteristics of the resistors.
Before using halogen-based or other high-activity flux, check the possible effects of the flux residues on the
performance and reliability of the resistors.
When soldering with a soldering iron, never touch the resistors'bodies with the tip of the soldering iron.
When using a soldering iron with a high temperature tip, finish soldering as quickly as possible
(within three seconds at 350 °C max.).
Mounting of the resistors with excessive or insufficient wetting amount of solder may affect the
connection reliability or the performance of the resistors. Carefully check the effects and apply a proper
amount of solder for use.
When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the
resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting
or cause damage during handling of the boards with the resistors mounted.
Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise,
the resistors' protective coatings and bodies may be chipped, affecting their performance.
Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Do not immerse the resistors in solvent for a long time.
Before using solvent, carefully check the effects of immersion.
Do not apply excessive tension to the terminals.
01. Oct. 2019