EXC-CL3216U1

Chip Bead Cores Chip Bead Cores Type: EXCCL EXCML EXC3B Discontinued ■ Features ■ Recommended Applications ● Effective noise suppression for power lines and high speed signal lines ● Easy pattern layout on PC Board ● RoHS compliant ● Digital equipment such as PCs, word processors, printers, HDD, PCC, CD-ROMs, DVD-ROMs. ● Digital audio and video equipment such as VCRs, DVC, CD Players, DVD Players. ● AC adapters, and switching power supplies. ● Electronic musical instruments, and other digital equipment. Type: EXCCL, EXCML ● Low D C Resistance 3 to 8 m Ω t ypical: Rated current (3 and 4 Amperes) (type: EXCML) ● Low impedance Type: EXC3B ● High impedance for high speed signal line noise ● Increased attenuation ● 60 Ω-1 A, 120 Ω-0.5 A are achieved by using 1608 size (type: EXC3BP) ■ Type: EXCCL ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 & 9 $ $ -     6  Type Part kind Size Bead core Code Dimensions (mm) Product Code Noise Filter Chip type 4532 3225 3216 4.5L3.2L1.8 3.2L2.5L1.6 3.2L1.6L1.6 Form 12 Suffix Code Packing U Embossed Carrier Taping Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 Chip Bead Cores ■ Construction Discontinued H ■ Dimensions in mm (not to scale) A A W L Ferrite core Dimensions (mm) W H Type (inch size) Electrode L A EXCCL4532 4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2 (1812) EXCCL3225 3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3 (1210) EXCCL3216 3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3 (1206) Mass (Weight) [mg/pc.] 125.8 60.5 37 ■ Type: EXCML ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 & 9 $ . -   "    6 Type Part kind Product Code Molded Chip type Noise Filter Bead core Material Code Dimensions (mm) 45 32 20 16 ■ Construction Size 4.5L1.6 L1.1 3.2L1.6 L0.9 2.0L1.25L0.9 1.6L0.8 L0.8 Nominal Impedance The first two digits are significant figure of impedance value and the third one denotes the number of zeros following Form Code Packing U Embossed Carrier Taping (EXCML16 to 32) Embossed Carrier Taping (EXCML45) H ■ Dimensions in mm (not to scale) T e Type (inch size) Conductor Electrode W L Ferrite core EXCML16 (0603) EXCML20 (0805) EXCML32 (1206) EXCML45 (1806) L 1.6±0.2 Dimensions (mm) W T 0.8±0.2 e Mass (Weight) [mg/pc.] 0.8±0.2 (0.4) 4.5 2.0±0.2 1.25±0.20 0.9±0.2 (0.5) 10.5 3.2±0.3 1.6±0.3 0.9±0.2 (0.6) 21.5 4.5±0.3 1.6±0.3 1.1±0.2 (0.6) 36.0 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 Chip Bead Cores ■ Type: EXC3B Discontinued ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 & 9 $  # #    ) Product Code Noise Filter Size Code Dimensions (mm) 3 1.6L0.8L0.8 Type Characteristics Multilayer Chip type Bead Core B P Nominal Impedance High frequency High attenuation for signal Lines High frequency High attenuation for Power Lines ■ Construction 11 Form The first two digits are significant figure of impedance value and the third one denotes the number of zeros following 12 Suffix Code Packing H Embossed Carrier Taping ■ Dimensions in mm (not to scale) T e Ferrite core W L Inner Conductor Electrode Type (inch size) EXC3BB (0603) EXC3BP (0603) L Dimensions (mm) W T Mass (Weight) [mg/pc.] e 1.6±0.2 0.8±0.2 0.8±0.2 0.3±0.2 4.5 1.6±0.2 0.8±0.2 0.8±0.2 0.3±0.2 4.5 ■ Ratings Impedance Rated Current (mA DC) DC Resistance (Ω) max. Type Part Number 4532 EXCCL4532U1 115 2000 0.1 3225 EXCCL3225U1 45 2000 0.05 3216 EXCCL3216U1 25 2000 0.05 4516 EXCML45A910H 91 3000 0.016 3216 EXCML32A680U 68 3000 0.012 2012 EXCML20A390U 39 4000 0.008 1608 EXCML16A270U 27 4000 0.006 EXC3BP600H 60 1000 0.07 EXC3BP121H 120 500 0.1 EXC3BB221H 220 200 0.3 EXC3BB601H 600 100 0.8 EXC3BB102H 1000 50 1608 (Ω) at 100 MHz tol.(%) ±25 1 ● Category Temperature Range –25 °C to +85 °C Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 Chip Bead Cores ■ Impedance Characteristics (Reference Data) Discontinued 1Z1, R, X(?) 1Z1, R, X(?) Z R X 1 10 R : Resistance 1000 100 140 120 100 80 60 40 20 0 Z 1 10000 10 Frequency(MHz) Z R X 1 10 1000 100 R X 10 1Z1, R, X(?) 1Z1, R, X(?) 100 1000 Frequency(MHz) 10000 LEXCML32A680U (3216) Z R X 10 10000 Z 1 10000 LEXCCL3216U1 (3216) 1 X 100 1000 Frequency(MHz) 140 120 100 80 60 40 20 0 Frequency(MHz) 140 120 100 80 60 40 20 0 R LEXCML20A390U (2012) 1Z1, R, X(?) 1Z1, R, X(?) LEXCCL3225U1 (3225) 140 120 100 80 60 40 20 0 X : Reactance LEXCML16A270U (1608) LEXCCL4532U1 (4532) 140 120 100 80 60 40 20 0 Measured by HP4291A ∣Z∣ : Impedance 100 1000 140 120 100 80 60 40 20 0 Z R X 1 10000 10 Frequency(MHz) 100 1000 Frequency(MHz) 10000 LEXCML45A910H (4516) 1Z1, R, X(?) 180 160 140 120 100 80 60 40 20 0 Z R X 1 10 100 1000 Frequency(MHz) 10000 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 Chip Bead Cores ■ Impedance Characteristics (Reference Data) Discontinued Measured by HP4291A ∣Z∣ : Impedance 1400 1200 1000 800 600 400 200 0 200 Z 1 R X 100 10 1000 Z 150 R 100 X 50 0 1 10000 10 LEXC3BB601H (1608) 1000 10000 LEXC3BP600H (1608) 200 R 1Z1, R, X(?) 1400 1200 1000 800 600 400 200 0 100 Frequency(MHz) Frequency(MHz) 1Z1, R, X(?) X : Reactance LEXC3BP121H (1608) 1Z1, R, X(?) 1Z1, R, X(?) LEXC3BB221H (1608) R : Resistance Z X 1 10 100 150 Z 100 R 50 X 0 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) 1Z1, R, X(?) LEXC3BB102H (1608) 1400 1200 1000 800 600 400 200 0 Z R X 1 10 100 1000 10000 Frequency(MHz) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 Chip Bead Cores ■ Packaging Methods (Taping) Discontinued ● Standard Quantity Part Number Kind of Taping EXCCL4532U1 Pitch (P1) Quantity 8 mm 1000 pcs./reel EXCCL3225U1 2000 pcs./reel EXCCL3216U1 EXCML45A910H Embossed Carrier Taping EXCML32A680U 3000 pcs./reel 4 mm EXCML20A390U EXCML16A270U 4000 pcs./reel EXC3B□□□□H ● Embossed Carrier Taping ● Taping Reel T Sprocket hole Compartment fD0 fC fB B F W A fD P1 t2 Chip component P2 E P0 Tape running direction fA W Embossed Carrier Dimensions (mm) Part Number A B W F P1 EXCCL4532U1 3.6±0.2 4.9±0.2 12.0±0.2 5.5±0.1 8.0±0.1 EXCCL3225U1 2.9±0.2 3.6±0.2 EXCCL3216U1 2.0±0.2 3.6±0.2 8.0±0.2 3.5±0.1 EXCML45A910H 1.9±0.2 4.8±0.2 12.0±0.2 5.5±0.1 EXCML32A680U 1.9±0.2 3.5±0.2 EXCML20A390U 1.5±0.2 2.3±0.2 EXCML16A270U 1.0±0.2 1.8±0.2 8.0±0.2 3.5±0.1 EXC3B□□□□H 1.0±0.1 1.8±0.1 P2 0D0 P0 t2 2.4 max. 2.1 max. 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 1.8 max. 1.6 max. Standard Reel Dimensions (mm) Part Number 0A 0B 0C 0D E EXCCL4532U1 EXCCL3225U1 EXCCL3216U1 EXCML45A910H 0 180.0–3.0 60.0±1.0 13.0±0.5 21.0±0.8 2.0±0.5 W T 13.0±0.3 16.5 max. 09.0±0.3 13 max. 13.0±0.3 16.5 max. 09.0±0.3 13 max. EXCML32A680U EXCML20A390U EXCML16A270U EXC3B□□□□H Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012 Chip Bead Cores ■ Recommended Land Pattern Dimensions in mm (not to scale) Discontinued (mm) A B C Part Number A B C EXCCL4532U1 3 5.4 2.8 EXCCL3225U1 1.7 4.1 2.1 EXCCL3216U1 1.7 4.1 1.2 EXCML45A910H 2.6 to 3 5.5 to 6.5 1.2 to 1.6 EXCML32A680U 1.6 to 2 4 to 5 1.2 to 1.6 EXCML20A390U 0.8 to 1.2 3 to 4 1 to 1.2 EXCML16A270U 0.6 to 1 2 to 3 0.8 to 1 EXC3B□□□□H 0.8 to 1 2 to 2.6 0.8 to 1 ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn-37Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 10 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/3Ag/0.5Cu) Temperature Time Preheating 150 °C to 170 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ● Flow soldering · Flow soldering may cause this product to come off because the adhesiveness of the product element is low. Please consult our sales representative in advance about flow soldering. ● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. ● Never touch this product with the tip of a soldering iron. Safety Precautions The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression Device shown on this catalog. 1. Use rosin-based flux or halogen-free flux. 2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person in advance. 3. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the bead cores. Handle with care. 4. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 5. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection indicated on the packages. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012