EXCML32A680U

Chip Bead Cores Chip Bead Cores Type: EXCCL EXCML EXC3B ■ Features ■ Recommended Applications ● Effective noise suppression for power lines and high speed signal lines ● Easy pattern layout on PC Board ● For flow soldering and reflow soldering ● Digital equipment such as PCs, word processors, printers, HDD, PCC, CD-ROMs, DVD-ROMs. ● Digital audio and video equipment such as VCRs, DVC, CD Players, DVD Players. ● AC adapters, and switching power supplies. ● Electronic musical instruments, and other digital equipment. Type: EXCCL, EXCML ● Low DC Resistance 3 to 8 m액 typical: Rated current (3 and 4 Amperes) (type: EXCML) ● Low impedance Type: EXC3B ● High impedance for high speed signal line noise ● Increased attenuation ● 60 액-1 A, 120 액-0.5 A are achieved by using 1608 size (type: EXC3BP) ■ Type: EXCCL ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E X C C L 3 2 1 6 U 1 Type Part kind Size Bead core Code Dimensions (mm) Product Code Noise Filter Chip type 4532 3225 3216 4.5x3.2x1.8 3.2x2.5x1.6 3.2x1.6x1.6 Form 12 Suffix Code Packing U Embossed Carrier Taping Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Bead Cores ■ Construction L ■ Dimensions in mm (not to scale) A A W L Ferrite core Dimensions (mm) W H Type (inches) Electrode L A EXCCL4532 4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2 (1812) EXCCL3225 3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3 (1210) EXCCL3216 3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3 (1206) Mass (Weight) [mg/pc.] 125.8 60.5 37 ■ Type: EXCML ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E X C M L 2 0 A 3 9 0 U Type Part kind Product Code Multilayer Chip type Noise Filter Bead core Material Code Dimensions (mm) 45 32 20 16 ■ Construction Size 4.5x1.6 x1.1 3.2x1.6 x0.9 2.0x1.25x0.9 1.6x0.8 x0.8 Nominal Impedance The first two digits are significant figure of impedance value and the third one denotes the number of zeros following Form Code Packing U Embossed Carrier Taping (EXCML16 to 32) Embossed Carrier Taping (EXCML45) H ■ Dimensions in mm (not to scale) T e Type (inches) Conductor Electrode W L Ferrite core EXCML16 (0603) EXCML20 (0805) EXCML32 (1206) EXCML45 (1806) L 1.6±0.2 Dimensions (mm) W T 0.8±0.2 e Mass (Weight) [mg/pc.] 0.8±0.2 (0.4) 4.5 2.0±0.2 1.25±0.20 0.9±0.2 (0.5) 10.5 3.2±0.3 1.6±0.3 0.9±0.2 (0.6) 21.5 4.5±0.3 1.6±0.3 1.1±0.2 (0.6) 36.0 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Bead Cores ■ Type: EXC3B ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 E X C 3 B B 2 2 1 H Product Code Noise Filter Size Code Dimensions (mm) 3 1.6x0.8x0.8 Type Characteristics Multilayer Chip type Bead Core B P Nominal Impedance High frequency High attenuation for signal Lines High frequency High attenuation for Power Lines ■ Construction 11 Form The first two digits are significant figure of impedance value and the third one denotes the number of zeros following 12 Suffix Code Packing H Embossed Carrier Taping ■ Dimensions in mm (not to scale) T e Ferrite core W L Inner Conductor Electrode Type (inches) EXC3BB (0603) EXC3BP (0603) Dimensions (mm) W T L Mass (Weight) [mg/pc.] e 1.6±0.2 0.8±0.2 0.8±0.2 0.30±0.15 4.5 1.6±0.2 0.8±0.2 0.8±0.2 0.30±0.15 4.5 ■ Ratings Impedance Rated Current (mA DC) DC Resistance (액) max. Type Part Number 4532 EXCCL4532U1 115 2000 0.1 3225 EXCCL3225U1 45 2000 0.05 3216 EXCCL3216U1 25 2000 0.05 4516 EXCML45A910H 91 3000 0.016 3216 EXCML32A680U 68 3000 0.012 2012 EXCML20A390U 39 4000 0.008 1608 EXCML16A270U 27 4000 0.006 EXC3BP600H 60 1000 0.07 EXC3BP121H 120 500 0.1 EXC3BB221H 220 200 0.3 EXC3BB601H 600 100 0.8 EXC3BB102H 1000 50 1608 (액) at 100 MHz tol.(%) ±25 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 1 Feb. 2006 Chip Bead Cores ■ Impedance Characteristics (Reference Data) 훺Z훺, R, X(액) 훺Z훺, R, X(액) Z R X 1 10 R : Resistance 1000 100 140 120 100 80 60 40 20 0 Z 1 10000 10 Frequency(MHz) Z R X 1 10 1000 100 R X 10 훺Z훺, R, X(액) 훺Z훺, R, X(액) 100 1000 Frequency(MHz) 10000 ●EXCML32A680U (3216) Z R X 10 10000 Z 1 10000 ●EXCCL3216U1 (3216) 1 X 100 1000 Frequency(MHz) 140 120 100 80 60 40 20 0 Frequency(MHz) 140 120 100 80 60 40 20 0 R ●EXCML20A390U (2012) 훺Z훺, R, X(액) 훺Z훺, R, X(액) ●EXCCL3225U1 (3225) 140 120 100 80 60 40 20 0 X : Reactance ●EXCML16A270U (1608) ●EXCCL4532U1 (4532) 140 120 100 80 60 40 20 0 Measured by HP4291A 앚Z앚 : Impedance 100 1000 140 120 100 80 60 40 20 0 Z R X 1 10000 10 Frequency(MHz) 100 1000 Frequency(MHz) 10000 ●EXCML45A910H (4516) 훺Z훺, R, X(액) 180 160 140 120 100 80 60 40 20 0 Z R X 1 10 100 1000 Frequency(MHz) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 10000 Feb. 2006 Chip Bead Cores ■ Impedance Characteristics (Reference Data) Measured by HP4291A 앚Z앚 : Impedance 1400 1200 1000 800 600 400 200 0 200 Z 1 R X 100 10 1000 Z 150 R 100 X 50 0 10000 1 10 Frequency(MHz) 10000 ●EXC3BP600H (1608) 200 R 훺Z훺, R, X(액) 1400 1200 1000 800 600 400 200 0 1000 100 Frequency(MHz) ●EXC3BB601H (1608) 훺Z훺, R, X(액) X : Reactance ●EXC3BP121H (1608) 훺Z훺, R, X(액) 훺Z훺, R, X(액) ●EXC3BB221H (1608) R : Resistance Z X 1 10 100 150 Z 100 R 50 X 0 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) 훺Z훺, R, X(액) ●EXC3BB102H (1608) 1400 1200 1000 800 600 400 200 0 Z R X 1 10 100 1000 10000 Frequency(MHz) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Bead Cores ■ Packaging Methods (Taping) ● Standard Quantity Part Number Kind of Taping EXCCL4532U1 Pitch (P1) Quantity 8 mm 1000 pcs./reel EXCCL3225U1 2000 pcs./reel EXCCL3216U1 EXCML45A910H Embossed Carrier Taping EXCML32A680U 3000 pcs./reel 4 mm EXCML20A390U 4000 pcs./reel EXCML16A270U EXC3B첸첸첸첸H ● Embossed Carrier Taping ● Taping Reel T Compartment fD0 fC B F W A P1 t2 Chip component fB Sprocket hole E t1 fD P2 E P0 Tape running direction W fA t Embossed Carrier Dimensions (mm) Part Number A B W F EXCCL4532U1 3.6±0.2 4.9±0.2 12.0±0.2 5.5±0.1 EXCCL3225U1 2.9±0.2 3.6±0.2 EXCCL3216U1 2.0±0.2 3.6±0.2 E P1 P2 P0 fD0 t1 t2 8.0±0.1 2.4 max. 8.0±0.2 3.5±0.1 2.1 max. EXCML45A910H 1.9±0.2 4.8±0.2 12.0±0.2 5.5±0.1 1.75±0.10 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 0.20±0.05 1.8 max. EXCML32A680U 1.9±0.2 3.5±0.2 EXCML20A390U 1.5±0.2 2.3±0.2 EXCML16A270U 1.1±0.2 2.1±0.2 EXC3B첸첸첸첸H 1.0±0.1 1.8±0.1 8.0±0.2 3.5±0.1 1.6 max. 0.25±0.05 Standard Reel Dimensions (mm) Part Number fA fB fC fD E EXCCL4532U1 EXCCL3225U1 EXCCL3216U1 EXCML45A910H 0 180.0–3.0 60.0±1.0 13.0±0.5 21.0±0.8 2.0±0.5 W T 13.0+0.5 –1.0 16.5 max. 09.5+0.5 –1.0 13 max. –1.0 13.0+0.5 16.5 max. 09.5+0.5 –1.0 13 max. t 1.2±0.5 EXCML32A680U EXCML20A390U EXCML16A270U EXC3B첸첸첸첸H Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip Bead Cores ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Please contact us for additional information when used in conditions other than those specified. ● Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. The limit of resistance to reflow soldering heat 270 260 Rising temperature I Preheating Gradual cooling Main Rising temperature II heating Temperature (°C) Temperature of terminals (°C) 250 240 230 220 210 200 Time (min.) Solder Rising temperature I For soldering (Sn-37Pb) The normal time for preheating 30 s to 60 s For lead-free soldering (Sn-3Ag-0.5Cu) The normal time for preheating 30 s to 60 s 0 10 20 30 40 50 60 70 Time (s) Preheating Rising temperature II Main heating Gradual cooling 140 °C to 160 °C Preheating to 200 °C 20 s to 40 s 60 s to 120 s 235±10 °C Peak 200 °C to 100 °C 1 °C to 4 °C/s 150 °C to 170 °C Preheating to 210 °C 20 s to 40 s 60 s to 120 s 250+10 – 5 °C Peak 210 °C to 100 °C 1 °C to 4 °C/s ✽ Reflow soldering shall be performed a maximum of two times. ● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. ● Never touch this product with the tip of a soldering iron. ■ Recommended Land Pattern Dimensions in mm (not to scale) A C B (mm) Part Number A B C EXCCL4532U1 3 5.4 2.8 EXCCL3225U1 1.7 4.1 2.1 EXCCL3216U1 1.7 4.1 1.2 EXCML45A910H 2.6 to 3 5.5 to 6.5 1.2 to 1.6 EXCML32A680U 1.6 to 2 4 to 5 1.2 to 1.6 EXCML20A390U 0.8 to 1.2 3 to 4 1 to 1.2 EXCML16A270U 0.6 to 1 2 to 3 0.8 to 1 EXC3B첸첸첸첸H 0.8 to 1 2 to 2.6 0.8 to 1 Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog. 1. With regard to flow soldering, consult with our sales person in advance. 2. Use rosin-based flux or halogen-free flux. 3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person in advance. 4. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the bead cores. Handle with care. 5. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 6. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection indicated on the packages. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements]) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use • These products are designed and manufactured for general and standard use in general electronic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). • Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Feb. 2006 – EX2 –