Multilayer Varistor
For ESD pulse
[DC voltage lines/High speed signal lines]
EZJZ, EZJP series
Features
● Excellent ESD suppression due to original advanced material technology
● Having large electrostatic resistance meeting IEC61000-4-2, Level 4 standard
● Having no polarity (bipolar) facilitated replacing Zener Diodes. Capable of replacing 2 Zener Diodes and 1 Capacitor.
● Lead-free plating terminal electrodes enabling great solderability
● Wide range of products is available by adopting multilayer structure, meeting various needs
● Low capacitance versions for DC voltage lines of high speed busses
● Ultra low capacitance for high speed signal line
● Applicable to high-speed signal lines, such as interfaces (e.g. USB2.0, IEEE1394, HDMI, and so on), due to our
original ultra-low capacitance technology.
● RoHS compliant
Explanation of part numbers
1
2
3
4
5
6
7
8
9
10
11
E
Z
J
Z
0
V
2
7
0
E
A
Product code
Code
Z
P
12
Example
Design code
Series
EZJZ
EZJP
Code Packaging style
0402, 0603
V
Paper taping
Code
Z
0
1
Dimensions
(mm) (inch)
0603 (0201)
1005 (0402)
1608 (0603)
Nominal varitor
voltage
The first and second
digits denote the first
2 numbers of the
varistor voltage and
the third digit
indicates the number
of zeros following.
The decimal point
denotes in R.
Code
A
R
D
E
W
F
Cap.
3 pF
20 pF
27 pF
47 pF
56 pF
68 pF
Code
G
H
J
K
M
Cap.
100 pF
150 pF
220 pF
330 pF
680 pF
Code
Nil
B
C
D
K
M
Design code
Cap.Tolerance : max.
Cap.Tolerance : ± 0.1 pF
Cap.Tolerance : ± 0.25 pF
Cap.Tolerance : ± 0.50 pF
Cap.Tolerance : ± 10 %
Cap.Tolerance : ± 20 %
※ Below 3 pF, the 10 or 11th
position of the P/N indicates the
capacitance value as follows : 2.0 pF
…20，1.5 pF…15
Construction
③
No.
①
②
③
④
⑤
④
⑤
②
①
Name
Semiconductive ceramics
Internal electrode
Substrate electrode
Terminal electrode
Intermediate electrode
External electrode
Dimensions in mm (not to scale)
L
W
Size code
T
L1
L2
Z
0
1
Size (inch)
0201
0402
0603
L
0.60 ± 0.03
1.00 ± 0.05
1.6 ± 0.1
W
0.30 ± 0.03
0.50 ± 0.05
0.8 ± 0.1
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
T
0.30 ± 0.03
0.50 ± 0.05
0.8 ± 0.1
Unit : mm
L 1, L 2
0.15 ± 0.05
0.2 ± 0.1
0.3 ± 0.2
26-Jan-24
Multilayer Varistor
Low capacitance type [High speed signal lines]
Features
●Applicable to high-speed signal lines, such as interfaces (e.g. USB 2.0, IEEE1394, HDMI, and so on), due to
our original material technology and multilayer technology.
●Capacitance：0.8 to 2.1 pF typ.
Recommended applications
Mobile phone
DSC,DVC
PC,PDA
TV,DVD
Game console
Antenna circuit, External IF
USB2.0，IEEE1394
USB2.0，IEEE1394，LAN1000BASE
USB2.0，IEEE1394，HDMI
Controller, External IF
Ratings and characteristics
Size(inch)
Part No.
Maximum
allowable voltage
DC (V)
EZJZ0V80010
0402
0603
Nominal varistor
voltage
at 1 mA (V)
Capacitance
at 1 MHz
(pF)
10
80
EZJZ0V80015D
5
80
1.5±0.5
EZJZ0V500AA
5
50
3 max. [2.1 typ.]
EZJZ0V800AA
18
80
3 max. [2.1 typ.]
EZJZ0V171AA
18
170
3 max. [2.1 typ.]
EZJZ1V80010
10
80
1 max. [0.8 typ.]
EZJZ1V500AA
5
50
3 max. [2.1 typ.]
EZJZ1V800AA
18
80
3 max. [2.1 typ.]
EZJZ1V171AA
18
170
3 max. [2.1 typ.]
Maximum ESD
IEC61000-4-2
1 max. [0.8 typ.]
● Operating temperature range : ‒40 to 85 ℃
Contact discharge
: 8 kV
＊Recommend soldering method : Reflow soldering
Voltage vs. Current
Max. leakage current
Max. clamping voltage
Voltage (V)
1000
100
(Typical curve)
10
10–6
10–5
10–4
10–3
10–2
10–1
100
101
Current (A)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
26-Jan-24
Low capacitance type [High speed signal lines] / EZJZ, EZJP series
Capacitance vs. Frequency
Impedance vs. Frequency
10000000
100
1000000
3 pF max. [2.1 pF typ.]
3 pF max. [2.1 pF typ.]
100000
1 pF max. [0.8 pF typ.]
Impedance (Ω)
Capacitance (pF)
1.5 pF typ.
10
1
1.5 pF typ.
1 pF max. [0.8 pF typ.]
10000
1000
100
10
(Typical curve)
0.1
1
10
(Typical curve)
1
100
1000
1
10000
10
100
1000
10000
Frequency (MHz)
Frequency (MHz)
Attenuation vs. Frequency
10
3 pF max. [2.1 pF typ.]
5
1.5 pF typ.
0
1 pF max. [0.8 pF typ.]
Attenuation (dB)
-5
-10
-15
-20
-25
-30
-35
(Typical curve)
-40
1
10
100
1000
10000
Frequency (MHz)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
26-Jan-24
UPDATE
Multilayer Varistor
Low voltage type (Standard type)
[DC voltage lines/Low speed signal lines]
Features
Recommended Applications
Maximum allowable
voltage DC (V)
Wide variety of products is available by adopting multilayer construction,
which achieved wide range of usage, such as application to DC voltage
lines and signal lines.
● Varistor voltage：6.8 to 65 V (at 1 mA)
● Capacitance :8.5 to 420 pF typ. (at 1 MHz)
40
30
26
16
13
11
6.7
5.6
3.7
3
Mobile phone
DSC,DVC
PC,PDA
TV,DVD
Audio
Game console
SW，LCD，LED，Audio terminal,
Battery pack, Memory card, External IF
SW，LCD，LED，USB
SW，LCD，LED，USB
Audio, Video terminal
Audio terminal, Microphone, Receiver
Controller, External IF
5
12
24
40
Circuit voltage DC (V)
Ratings and ｃharacteristics
Size
(inch)
Part No.
0201
0402
NEW
NEW
0603
EZJPZV6R8JA
EZJPZV6R8GA
EZJPZV080GA
EZJPZV120GA
EZJPZV120DA
EZJPZV120RA
EZJPZV150RA
EZJPZV270RA
EZJPZV270BA
EZJP0V6R8MA
EZJP0V6R8GA
EZJP0V080MA
EZJP0V080KA
EZJP0V080GA
EZJP0V080DA
EZJP0V120JA
EZJP0V180HA
EZJZ0V180HA
EZJP0V220HA
EZJZ0V220HA
EZJP0V270EA
EZJP0V270RA
EZJZ0V420WA
EZJZ0V650DA
EZJP1V120KA
EZJZ1V180JA
EZJZ1V220JA
EZJZ1V270GA
EZJZ1V270EA
EZJZ1V270RA
EZJZ1V330GA
EZJZ1V420FA
EZJZ1V650DA
Maximum
allowable
voltage
DC (V)
3.7
3.7
5.6
7.5
7.5
7.5
9
16
16
3.7
3.7
5.6
5.6
5.6
5.6
7.5
11
11
13
13
16
16
30
40
7.5
11
13
16
16
16
26
30
40
●Operating Temperature Range : ‒40 to 85 ℃
Nominal varistor
voltage
at 1 mA (V)
6.8
6.8
8
12
12
12
15
27
27
6.8
6.8
8
8
8
8
12
18
18
22
22
27
27
42
65
12
18
22
27
27
27
33
42
65
Capacitance (pF)
at 1 MHz
220 max. [150 typ.]
100 max. [85 typ.]
100 max. [85 typ.]
100 max. [85 typ.]
27 max. [22 typ.]
20 max. [15 typ.]
20 max. [15 typ.]
20 max. [15 typ.]
10 max. [8.5 typ.]
680 max. [420 typ.]
100 max. [85 typ.]
680 max. [420 typ.]
330 max. [290 typ.]
100 max. [65 typ.]
27 max. [22 typ.]
220 max. [150 typ.]
150 max. [120 typ.]
150 max. [120 typ.]
150 max. [100 typ.]
150 max. [100 typ.]
47 max. [33 typ.]
20 max. [15 typ.]
56 max. [40 typ.]
27 max. [22 typ.]
330 max. [250 typ.]
220 max. [180 typ.]
220 max. [160 typ.]
100 max. [85 typ.]
47 max. [33 typ.]
20 max. [15 typ.]
100 max. [85 typ.]
68 max. [55 typ.]
27 max. [22 typ.]
at 1 kHz
175 typ.
100 typ.
100 typ.
100 typ.
33 typ.
18 typ.
18 typ.
16.5 typ.
10 typ.
650 typ.
100 typ.
650 typ.
480 typ.
100 typ.
33 typ.
175 typ.
140 typ.
140 typ.
116 typ.
116 typ.
37 typ.
16.5 typ.
45 typ.
33 typ.
290 typ.
210 typ.
185 typ.
100 typ.
37 typ.
16.5 typ.
100 typ.
63 typ.
33 typ.
Maximum
peak current
at 8/20 μs,
2 times (A)
5
5
5
5
1
1
1
1
1
20
3
20
15
3
1
10
10
10
10
10
4
1
10
5
20
20
20
20
20
3
20
15
5
Maximum ESD
IEC61000-4-2
Contact
discharge
:8 kV
✽ Recommend soldering method : Reflow soldering
[term]
Maximum allowable voltage Maximum DC Voltage that can be applied continuously within the operating temperature range
Varistor voltage
Varistor starting voltage between terminals at DC 1 mA, also known as Breakdown voltage
Maximum current that can be withstood under the standard pulse 8/20 µs，2 times based
Maximum peak current
Maximum voltage that can be withstood under ESD based on IEC61000-4-2, 10 times
Maximum ESD
(5 times of each positive-negative polarity)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
26-Jan-24
Low voltage type (Standard type) [DC voltage lines/Low speed signal lines] / EZJZ, EZJP series
Voltage vs. Current
●EZJP Series
●EZJZ Series
Max. leakage current
Max. clamping voltage
Max. leakage current
100
300
200
Voltage (V)
EZJP□V27
EZJPZV150
10
100
Voltage (V)
EZJP□V270
EZJPZV150
EZJPZV120
EZJP□V080
EZJP□V6R8
Max. clamping voltage
EZJZ□V650
EZJZ□V420
EZJZ□V330
EZJZ□V270
EZJZ□V220
EZJZ□V180
EZJZ□V120
EZJZ□V650
EZJZ□V420
EZJZ□V330
10
EZJZ□V270
EZJPZV120
EZJP□V080
EZJP□V6R8
EZJZ□V220
EZJZ□V180
EZJZ□V120
(Typical
1
10–6
10–5
10–4
10–3
10–2
10–1
100
(Typical
1
10–6
101
10–5
10–4
Current (A)
10–3
10–2
10–1
100
101
102
Current (A)
Capacitance vs. Frequency
●EZJP Series
●EZJZ Series
10000
10000
680
330
1000
Capacitance (pF)
Capacitance (pF)
1000
100
100
27
20
10
100 pF
47 pF
100
10
1
0.1
330 pF
220 pF
20 pF
10
(Typical
1
10
100
1000
1
0.1
10000
(Typical
1
Frequency (MHz)
10
100
1000
10000
Frequency (MHz)
Attenuation vs. Frequency
●EZJP Series
●EZJZ Series
10
10
27
100
0
Attenuation (dB)
Attenuation (dB)
0
10
20
-10
-20
330
-30
680
-40
-10
-20
100 pF
220 pF
330 pF
-30
-40
-50
-50
-60
20 pF
47 pF
(Typical
0.1
1
10
100
1000
10000
-60
(Typical
0.1
1
Frequency (MHz)
10
100
1000
10000
Frequency (MHz)
■ As for packaging methods, handling precautions please see data files
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
26-Jan-24
Multilayer Varistors EZJZ, EZJP, EZJS series / Characteristics
Varistor characteristics and equivalent circuit
A Multilayer Varistor does not have an electrical polarity like zener diodes and is equivalent to total 3 pcs of 2 zener diodes and 1 capacitor.
［Equivalent Circuit］
Current (A)
Zener diode
Voltage (V)
Capacitor 1 pc
Zener diode
monopolar 2 pcs
Multilayer Varistor
ESD Suppressive effects
［ESD suppressed waveform］
Typical effects of ESD suppression
Test conditions :
1400
IEC61000-4-2✽ Lvel4 Contact discharge，8 kV
1200
Without Varistor
1000
Attenuator : 60 dB
330 Ω
50 Ω
EZJP0V080GA
[V1 mA:8 V, C1 MHz:100 pF max.]
600
400
Oscillo-scope
150 pF
200
0
-200
-20
Multilayer
Varistors(MLCV)
✽IEC61000-4-2 …
800
Voltage (V)
Electrostatic discharger
0
20
40
60
80
100
120
140
160
180
200
Time (ns)
International Standard of the ESD testing method (HBM) for electronic equipment ability to
withstand ESD generated from a human body. It sets 4 levels of severity
Severity
Contact discharge
Air discharge
Level 1
2 kV
2 kV
Level 2
4 kV
4 kV
Level 3
6 kV
8 kV
Level 4
8 kV
15 kV
Replacement of zener diode
Replacing “Zener diode and Capacitor” with Multilayer Varistor saves both the mounting area and number of components used.
1.7
0.3
0.5
Mounting area
Approx 83 %
space saving
2.6
Zener diode
SC-79
MLCC
0402 Size(inch)
1.5
MLCV
0402 Size(inch)
Unit : mm
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Multilayer Varistors EZJZ, EZJP, EZJS series / Applications
Recommended applications
Applications
Circuit
Series
DC
1k
1M
1G (Hz)
DC to GHz
Antenna, RF circuit, LVDS,
USB，IEEE1394，HDMI etc.
DC to tens of Hz
PWR, SW, Audio terminals
LCD，RS232C，etc.
DC to several kHz
PWR, SW,
Audio terminals，etc.
Ultra low capacitance
(Cap. : 3 pF or less)
Smartphone, Tablet, DSC, PC,
HDD, DVD, BD, Game consoles,
AR/VR
EZJZ，EZJP
PWR, Photoelectronic sensors,
SSR, Motors, Pressure sensors,
Proximity switches
EZJS
Low capacitance
(Cap. : 20 to 680 pF)
High capacitance
(Cap. : 1800 to 22000 pF)
Applications
● Smart phone
[Key/SW/LED]
[Condenser microphone]
LED
IC
Low capacitance type：1005 / 27 V / 47 pF
IC
SW
Keyboard
[Audio (Mic, Speaker, Head set)]
Duplex C regulation type：33 to 47 pF
Amp
2MNF
[I/O, USB)
[Battery pack]
Super low capacitance type：1005 / 3 pF or loss
Low capacitance type：1005 / 27 V / 47 pF
USB
controller
lithium ion battery
VDD
D＋
D－
GND
● USB1.1/2.0 lines
+
S
IC
Safety unit
● IEEE1394 lines
VDD
D+
D–
USB
controller
GND
Power
IC
IEEE1394
controller
VDD
GND
TPA+
TPA–
TPB+
TPB–
● HDMI lines
TMDS
HDMI
IC
Ch : 0
Ch : 1
Ch : 2
Connector
Clock
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Multilayer Varistors EZJZ, EZJP, EZJS series / Performance and testing
Performance and testing methods
Characteristics
Specifications
Testing method
Electrical characteristics shall be measured under the following conditions.
Temp.：5 to 35 ℃，Relative humidity：85 % or less
Standard test
conditions
Varistor voltage
To meet the
specified value
The Varistor voltage is the voltage (VC,or VcmA) between both end terminals of a Varistor when
specified current (CmA) is applied to it. The measurement shall be made as quickly as possible to
avoid heating effects.
Maximum
allowable voltage
To meet the
specified value
The maximum DC voltage that can be applied continuously to a varistor.
Capacitance
To meet the
specified value
Capacitance shall be measured at the specified frequency, bias voltage 0 V，and measuring voltage
0.2 to 2.0 Vrms
Maximum peak
current
To meet the
specified value
The maximum current measured (Varistor voltage tolerance is within ±10 %) when a standard
impulse current of 8/20 μ seconds is applied twice with an interval of 5 minutes.
Maximum ESD
To meet the
specified value
The maximum ESD measured (while the varistor voltage is within ±30 % of its nominal value) when
exposed to ESD 10 times
(five times for each positive-negative polarity) based on IEC61000-4-2.
The part shall be immersed into a soldering bath under the conditions below.
Solder ：Sn-3.0Ag-0.5Cu
Solder ability
Resistance to
soldering heat
To meet the
specified value
ΔVc/Vc :
within ±10 %
Soldering flux ：Ethanol solution of rosin (Concentration approx. 25 wt%)
Soldering temp. ：230 ± 5 °C
Period ：4 ± 1 s
：Immerse both terminal electrodes until they are completely into the soldering
Soldering position
bath.
After the immersion, leave the part for 24 ±2 hours under the standard condition, then evaluate its
characteristics. Soldering conditions are specified below:
Soldering
：270 ℃ , 3 s / 260 ℃ , 10 s
conditions
：Immerse both terminal electrodes until they are completely into the soldering
Soldering position
bath.
After repeating the cycles stated below for specified number of times, leave the part for 24±2 hours,
then evaluate its characteristics.
Cycle : 5 cycles
Temperature
cycling
Biased humidity
ΔVc/Vc :
within ±10 %
ΔVc/Vc :
within ±10 %
Step
Temperature
Period
1
Max. Operating Temp.
30±3 min
2
Ordinary temp.
3 min max.
3
Min. Operating Temp.
30±3 min
4
Ordinary temp.
3 min max.
After conducting the test under the conditions specified below, leave the part 24±2 hours, then
evaluate its characteristics.
Temp. ：40 ± 2 °C
Humidity ：90 to 95 %RH
Applied voltage ：Maximum allowable voltage (Individually specified)
High temperature
exposure
(dry heat)
ΔVc/Vc :
within ±10 %
Period ：500+24/0 h
After conducting the test under the conditions specified below, leave the part 24±2 hours, then
evaluate its characteristics.
Temp. ：Maximum operating temperature ±3 °C (Individually specified)
Applied voltage ：Maximum allowable voltage (Individually specified)
Period ：500+24/0 h
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Multilayer Varistors EZJZ, EZJP, EZJS series / Packaging
Packaging methods (Taping)
Size code
(inch size)
Z(0201)
0(0402)
1(0603)
1(0603)
Series
EZJZ, EZJP
EZJS
Thickness
(mm)
0.3
0.5
0.8
0.8
0.8
1.25
2(0805)
Pressed carrier taping
Feeding hole
øD0
15000
10000
4000
4000
5000
2000
4
Embossed carrier taping
● 4 mm pitch (Embossed carrier taping) Size 0805
t1
Chip pocket
Feeding hole
øD0
E
Chip pocket
F
W
A
B
B
F
W
A
Quantity
(pcs/reel)
2
Punched carrier taping
● 2 mm Pitch (Pressed carrier taping) Size 0201
t
Pitch
(mm)
Kind of taping
E
●Standard quantity
K0
Chip component
P1 P2
P0
t2
Tape running direction
P1
Chip component
P2
P0
Tape running direction
Unit : mm
Code
A
B
EZJZ
EZJP
±0.03
0.36
0.66
±0.03
W
8.0
±0.2
F
3.50
±0.05
E
1.75
±0.10
P1
2.00
±0.05
P2
P0
2.00
4.0
±0.05
±0.1
øD0
1.5
+0.1
0
Unit : mm
K0
t
0.55
max
Code
0.36
EZJS
±0.03
● 2 mm Pitch (Punched carrier taping) Size 0402
Feeding hole
øD0
B
1.55
±0.20
W
2.35
±0.20
F
8.0
3.50
±0.2
P1
E
1.75
±0.05
±0.10
4.0
±0.1
P2
2.00
±0.05
P0
øD0
t1
1.5
4.0
0.6
+0.1
0
±0.1
● Reel for taping
t2
1.5
max
max
W1
E
Chip pocket
C
B
E
t1
A
D
B
F
W
A
t2
Chip component
P1 P2
P0
W2
Tape running direction
A
Unit : mm
Code
EZJZ
EZJP
EZJS
A
0.62
±0.05
B
1.12
±0.05
W
8.0
±0.2
F
3.50
±0.05
E
1.75
±0.10
P1
2.00
±0.05
P2
P0
2.00
±0.05
4.0
±0.1
øD0
1.5
+0.1
0
t1
0.7
max
Unit : mm
t2
Code
1.0
max
EZJZ
EZJP
EZJS
● 4 mm Pitch (Punched carrier taping)
Size 0603, 0805, 0504/2 Array
13.0±0.5
21.0±0.8
2.0±0.5
W1
9.0
+1.0
0
W2
11.4±1.0
E
P1
P2
Tape running direction
P0
Chip component
A
1.0
B
±0.1
S
1.18
(0504 2 Array) ±0.10
±0.10
1.65
±0.20
W
F
E
P1
P2
P0
øD0
t1
Tape end
t2
1.8
±0.1
2
(0805)
E
100 min.
Vacant position
400 min.
F
W
B
1
(0603)
+1.0
ø60.0 0
D
Cover tape
Unit : mm
Size code
(insh size)
0
-3
C
● Leader part and taped end
Leader part
A
t2
ø180
B
Chip pocket
Feeding hole
øD0
t1
A
1.63
8.0
±0.2
3.50
±0.05
1.75
±0.10
4.0
±0.1
2.00
±0.05
4.0
±0.1
1.5
+0.1
0
1.1
max
1.4
max
160 min.
Vacant position
2.4
Unit : mm
±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1-Mar-20
Safety and Legal Matters to Be Observed
Safety and Legal Matters to Be Observed
Product specifications and applications
■ Please be advised that this product and product specifications are subject to change without notice for
improvement purposes. Therefore, please request and confirm the latest delivery specifications that explain
the specifications in detail before the final design, or purchase or use of the product, regardless of the
application. In addition, do not use this product in any way that deviates from the contents of the company's
delivery specifications.
■ Unless otherwise specified in this catalog or the product specifications, this product is intended for use in
general electronic equipment (AV products, home appliances, commercial equipment, office equipment,
information and communication equipment, etc.).
When this product is used for the following special cases, the specification document suited to each application
shall be signed/sealed (with Panasonic and the user) in advance..These include applications requiring special
quality and reliability, wherein their failures or malfunctions may directly threaten human life or cause harm to
the human body (e.g.: space/aircraft equipment, transportation/traffic equipment, combustion equipment,
medical equipment, disaster prevention/crime prevention equipment, safety equipment, etc.).
Safety design and product evaluation
■ Please ensure safety through protection circuits, redundant circuits, etc., in the customer's system design so
that a defect in our company's product will not endanger human life or cause other serious damage.
■ This catalog shows the quality and performance of individual parts. The durability of parts varies depending on
the usage environment and conditions. Therefore, please ensure to evaluate and confirm the state of each part
after it has been mounted in your product in the actual operating environment before use.
If you have any doubts about the safety of this product, then please notify us immediately, and be sure to conduct
a technical review including the above protection circuits and redundant circuits at your company.
Laws / Regulations / Intellectual property
■ The transportation of dangerous goods as designated by UN numbers, UN classifications, etc., does not apply
to this product. In addition, when exporting products, product specifications, and technical information described
in this catalog, please comply with the laws and regulations of the countries to which the products are exported,
especially those concerning security export control.
■ Each model of this product complies with the RoHS Directive (Restriction of the use of hazardous substances in
electrical and electronic equipment) (2011/65/EU and (EU) 2015/863). The date of compliance with the RoHS
Directive and REACH Regulation varies depending on the product model.
Further, if you are using product models in stock and are not sure whether or not they comply with the RoHS
Directive or REACH Regulation, please contact us by selecting "Sales Inquiry" from the inquiry form.
■ During the manufacturing process of this product and any of its components and materials to be used,
Panasonic does not intentionally use ozone-depleting substances stipulated in the Montreal Protocol and
specific bromine-based flame retardants such as PBBs (Poly-Brominated Biphenyls) / PBDEs (Poly-Brominated
Diphenyl Ethers). In addition, the materials used in this product are all listed as existing chemical substances
based on the Act on the Regulation of Manufacture and Evaluation of Chemical Substances.
■ With regard to the disposal of this product, please confirm the disposal method in each country and region
where it is incorporated into your company's product and used.
■ The technical information contained in this catalog is intended to show only typical operation and application
circuit examples of this product. This catalog does not guarantee that such information does not infringe upon
the intellectual property rights of Panasonic or any third party, nor imply that the license of such rights has been
granted.
Panasonic Industry will assume no liability whatsoever if the use of our company's
products deviates from the contents of this catalog or does not comply with the
precautions. Please be advised of these restrictions.
01-Dec-23
Matters to Be Observed When Using This Product
Matters to Be Observed When Using This Product
(Chip-type laminated varistor)
Safety measures
■ A chip-type laminated varistor (hereinafter “the product” or “the varistor”) is intended for use in general-purpose and
standard applications, such as electrostatic control/noise suppression, in general electronic equipment (AV products,
household appliances, office equipment, information/communication devices, etc.). The varistor may deteriorate in
performance or fail (short or open mode) when used improperly.
■ If the varistor in short mode is used, applied voltage may cause a large current to flow through the varistor. Consequently,
the varistor heats up and may burn the circuit board. An abnormal state of the varistor that results from a problem with its
service conditions (use environment, design conditions, mounting conditions, etc.) may lead to, in a worst case scenario,
burnout of the circuit board, serious accident, etc. Sufficiently check for what is described below before using the varistor.
Use environments and cleaning conditions
■ This product (varistor) is not designed for use in the specific environments described below. Using the product in such
specific environments or service conditions, therefore, may affect the performance of the product. Please check the
performance and reliability of the product first and then use the product.
(1) Used in liquid, such as water, oil, chemicals, and organic solvents.
(2) Used in a place exposed to direct sunlight, an outdoor place with no shielding, or a dusty place.
(3) Used in a place where the product is heavily exposed to sea breeze or a corrosive gas, such as Cl2, H2S, NH3, SO2,
or NOX.
(4) Used in an environment where electromagnetic waves and radiation are strong.
(5) Located close to a heating component or a flammable material, such as a vinyl cable.
(6) Sealed or coated with a resin, etc.
(7) Solder flux of the soldered product is cleansed with a solvent, water, and a water-soluble cleaner (be careful with solder
flux soluble to water).
(8) Used in a place where dew concentrates on the product.
(9) Used in a contaminated state. (Example) Touching a varistor (with uncovered skin) mounted on a printed board leaves
sebum on the varistor. Do not handle the varistor in this manner.
(10) Used in a place where excessive vibration or impact is applied to the product.
■ Use the varistor within the range of its specified ratings/capabilities. Using the varistor under severe service conditions
that are beyond the specified ratings/capabilities causes degraded performance or destruction of the varistor, which may
lead to scattering of varistor fragments, smoke generation, ignition, etc. Do not use the varistor at a working
temperature or maximum allowable circuit voltage that exceeds the specified working temperature or maximum allowable
circuit voltage. Do not locate the varistor close to combustible materials.
■ In an improper cleaning solution, with which the varistor is cleaned, flux residues or other foreign matter may stick to the
surface of the varistor, which degrades the performance (insulation resistance, etc.) of the varistor. In a polluted cleaning
solution, the concentration of free halogen, etc., is high, and may result in poor/insufficient cleaning.
■ Improper cleaning conditions (insufficient cleaning or excessive cleaning) may impair the performance of the varistor.
(1) Insufficient cleaning
(a) A halogenous substance in flux residues may corrode a metal element, such as a terminal electrode.
(b) A halogenous substance in flux residues may stick to the surface of the varistor and lower its insulation resistance.
(c) Tendencies described in (a) and (b) may be more notable with water-soluble flux than with rosin-based flux.
Be careful about insufficient cleaning.
(2) Excessive cleaning
Ultrasonic waves that are too powerful from an ultrasonic cleaner cause the board to resonate, in which case the
vibration of the board may cause the varistor or a soldered part to crack or reduce the strength of the terminal
electrode. Keep power output from the ultrasonic cleaner at 20 W/L or lower, its ultrasonic frequency at 40 kHz or lower,
and an ultrasonic cleaning time at 5 minutes or less.
30-Jun-23
Matters to Be Observed When Using This Product
Response to anomalies and handling conditions
■ Do not apply excessive mechanical impact to the varistor. Because the varistor body is made of ceramic, drop impact to
the varistor readily damages or cracks the varistor. Once dropped on the floor, etc., the varistor may have lost its sound
quality and become failure-prone. Do not use said varistor.
■ When handling the board carrying the varistor, be careful not to let the varistor hit against another board. Take extra
caution when handling or storing a stack of boards carrying varistors. There are cases where a corner of a board will
hit against a varistor and damage or crack it, which may result in a failure of the varistor, such as a drop in its insulation
resistance. Do not reuse a varistor that has been used on and removed from a board.
Crack
Mounting
board
Crack
Floor
Reliability
A capacitor conforming to "AEC-Q200" refers to a capacitor having passed some or all of evaluation test items defined
in AEC-Q200.
To know the detailed specifications of each capacitor or specific evaluation test scores, please contact us.
We issue a delivery specification sheet for each product ordered. Please confirm the delivery specification sheet when
you place an order with us.
Circuit design and circuit board design
■ A working temperature at which a varistor works in the circuit must be within the working temperature range specified in
the specification sheet. A temperature at which a varistor incorporated in the circuit is kept in storage without operating
must be within the storage temperature range specified in the specification sheet. Do not use the varistor at a higher
temperature than the maximum working temperature.
■ Keep voltage applied across the terminals of the varistor equal to or lower than the maximum allowable circuit voltage.
Applying improper voltage to the terminals may cause the varistor to fail or short-circuit thus generate heat. When using
the varistor in a circuit where high-frequency voltage or pulse voltage of an acute waveform is applied consecutively,
even if the applied voltage is lower than the rated voltage, confirm that the varistor is reliable enough to operate normally
in the circuit.
■ Ensure that the surface temperature of the varistor, which includes a temperature increment resulting from self-heating,
is equal to or lower than the highest working temperature specified in the delivery specification sheet. Check the
temperature of the varistor under the circuit conditions used in the operation state of the device in which the varistor is
incorporated.
■ Using the varistor on an alumina board has an expectation of performance degradation due to thermal impact
(temperature cycle). Before using the varistor, sufficiently confirm that the board does not affect the quality of the varistor.
Mounting conditions
■ The more solder deposited on the varistor, the greater the stress to the varistor, which leads to cracking of the varistor.
When designing a land on the board, determine the shape and dimensions of the land so that a proper volume of solder
is applied in the land. Design the land such that its left and right sides are equal in size. In a case where solder volumes
are different between the left and right sides of the land, a greater volume of solder takes more time to cool and solidify.
As a result, stress acts on one side which may crack the varistor.
(a) Too much solder (b) Proper volume of solder (c) Too little solder
30-Jun-23
Matters to Be Observed When Using This Product
Surface-mounted component
c
Land
b
Solder
resist
a
Shape symbol Component dimensions
(JIS size)
L
W
T
Z (0603)
0.6
0.3
0.3
0 (1005)
1.0
0.5
0.5
1 (1608)
1.6
0.8
0.8
2 (2012)
2.0
0.8
to 1.25
1.25
a
b
c
0.2 to 0.3
0.4 to 0.5
0.8 to 1.0
0.25 to 0.30
0.4 to 0.5
0.6 to 0.8
0.2 to 0.3
0.4 to 0.5
0.6 to 0.8
0.8 to 1.2
0.8 to 1.0
0.8 to 1.0
Unit: mm
・ Use solder resist to evenly distribute solder
volumes on the left and right sides.
・ When a component is located close to the
varistor, the varistor is mounted together with a
lead-attached component, or a chassis is located
close to the varistor, separate solder patterns
from each other using the solder resist.
* Refer to cases to avoid and recommended
examples shown on the right table.
Items
Case recommended
Case to avoid
(Example of improving soldering
by separating solder patterns)
Lead of a leadattached component
Mounting the
varistor
together with a
lead-attached
component
Solder resist
Chassis
Soldering a
lead-attached
component
later
Placing the
products side
by side
Solder resist
Solder (earth solder)
Soldering in
the vicinity of
the chassis
Electrode pattern
Lead of a component
mounted later
Solder iron
Solder resist
Part where too much
solder is applied
Solder resist
Land
・ When the board warps during or after soldering
Case to avoid
of the varistor to the board, the warping of the
board may cause the varistor to crack. Place the
varistor so that stress caused by the warp is
negligible to the varistor.
Case recommended
Set the varistor sidewise relative
to the direction in which stress
acts.
* Refer to the case to avoid and a case
recommended example shown on the right table.
・ Mechanical stresses to the varistor near a breaking
line of the board vary depending on the mounting
position of the varistor. Refer to the figure on the
Stress size
right.
A>B=C>D>E
・ The varistor receives mechanical stresses different
in size when the board is broken by different
methods. The size of the stress the varistor
receives is smaller in the following order: pushing
back
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