Doc No. TT4-ZZ-02012
Revision. 1
Product Standards
MOS FET
FC4B22270L1
FC4B22270L1
Gate resistor installed Dual N-channel MOS FET
For lithium-ion secondary battery protection circuits
Unit: mm
1.29
3
1
2
1.29
4
Low source-source ON resistance:Rss(on) typ. = 18 m(VGS = 3.8 V)
CSP(Chip Size Package)
Halogen-free / RoHS compliant (EU RoHS / UL-94 V-0 / MSL : Level 1)
0.10
0.11
Features
0.5
φ0.25
Marking Symbol: 2J
Packaging
Embossed type (Thermo-compression sealing) : 1 000 pcs / reel (standard)
(0.395)
0.5
1. Source1 (FET1)
2. Gate1 (FET1)
Absolute Maximum Ratings Ta = 25 C
Parameter
Symbol
Source-source Voltage
Gate-source Voltage
Source Current (DC)
Source Current (Pulsed)
Total Power Dissipation
Channel Temperature
Storage Temperature Range
Thermal Resistance (ch-a)
Note
VSS
VGS
IS *1
IS *2
ISp *2
PD *1
PD *2
Tch
Tstg
Rth *1
Rth *2
Rating
Unit
20
12
4
8
40
0.37
1.5
150
-55 to +150
338
83
V
V
*1 Mounted on FR4 board ( 25.4 mm 25.4 mm t1.0 mm )
using the minimum recommended pad size (36m Copper ).
*2 Mounted on Ceramic substrate (70 mm 70 mm t1.0 mm).
*3 t = 10 s, Duty Cycle 1 %
A
Panasonic
JEITA
Code
(0.395)
3. Gate2 (FET2)
4. Source2 (FET2)
ULGA004-W-1313-RA
―
―
Equivalent circuit
A
W
C
C
4(S2)
3(G2)
1(S1)
2(G1)
FET2
C/W
FET1
Page 1 of 5
Established : 2016-11-09
Revised : ####-##-##
Doc No. TT4-ZZ-02012
Revision. 1
Product Standards
MOS FET
FC4B22270L1
Electrical Characteristics Ta = 25 C 3 C
Parameter
Symbol
Source-source Breakdown Voltage
Zero Gate Voltage Source Current
Gate-source Leakage Current
Gate-source Threshold Voltage
Source-source On-state Resistance
Body Diode Forward Voltage
Input Capacitance *1
Output Capacitance *1
Reverse Transfer Capacitance *1
Turn-on delay Time *1,*2
Rise Time *1,*2
Turn-off delay Time *1,*2
Fall Time *1,*2
Total Gate Charge *1
Gate-source Charge *1
Gate-drain Charge *1
Note
VSSS
ISSS
IGSS
Vth
RSS(on)1
RSS(on)2
RSS(on)3
RSS(on)4
VF(s-s)
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
Conditions
Min
IS = 1 mA, VGS = 0 V
VSS = 20 V, VGS = 0 V
VGS = 8 V, VSS = 0 V
IS = 0.31 mA, VSS = 10 V
IS = 2.0 A, VGS = 4.5 V
IS = 2.0 A, VGS = 3.8 V
IS = 2.0 A, VGS = 3.1 V
IS = 2.0 A, VGS = 2.5 V
IF = 2.0 A, VGS = 0 V
Typ
Max
Unit
20
0.35 0.90
12
17
12.5
18
19
13.5
22
14
0.8
910
105
VSS = 10 V, VGS = 0 V, f = 1 KHz
80
0.25
VDD = 10 V, VGS = 0 to 4.0 V
0.55
IS = 2.0 A
1.65
VDD = 10 V, VGS = 4.0 to 0 V
1.0
IS = 2.0 A
9
VDD = 10 V
2.6
VGS = 0 to 4.0 V,
IS = 2.0 A
2.4
V
A
A
V
1.0
10
1.4
22
23
26.5
37
1.2
m
V
pF
s
s
nC
Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring methods for transistors.
*1 Guaranteed by design, not subject to production testing
*2 Measurement circuit for Turn-on Delay Time / Rise Time / Turn-off Delay Time / Fall Time
Note2:Measurement circuit
VDD = 10 V
IS = 2.0 A
RL = 5.0
Vout
S2
90 %
Vin
10 %
Rg
G2
90 %
G1
Vin
4V
90 %
Vout
Rg
10 %
10 %
0V
PW = 10 s
D.C. 1 %
S1
td(on) tr
td(off)
tf
Page 2 of 5
Established : 2016-11-09
Revised : ####-##-##
Doc No. TT4-ZZ-02012
Revision. 1
Product Standards
MOS FET
FC4B22270L1
Technical Data ( reference )
RSS(on) - IS
Source-source ON-state Resistance
RSS (on) ( m)
IS - VSS
Source Current IS ( A )
5
4
3.8 V
VGS = 4.5 V
3.1 V
3
2.5 V
2
1
※Pulse measurement
0
0
0.05
0.1
0.15
30
25
2.5 V
3.1 V
20
3.8 V
VGS = 4.5 V
15
0.2
※Pulse measurement
1
2
Source Current IS ( A )
1.E+00
※Pulse measurement
Ta = 85 C
1.E‐01
0.4
0.6
0.8
-40 C
1
1.2
1.4
40
※Pulse measurement
30
10
IS = 2.0 A
0
2
25 C
-40 C
0.4
0.6
0.8
1
Body Diode Forward Voltage VF ( V )
1.2
Gate-source Leakage Current IGS ( A )
Diode Forward Current IF ( A )
Ta = 85 C
0.2
6
8
10
IGS - VGS
※Pulse measurement
0.01
4
Gate-source Voltage VGS ( V )
IF - VF
0.1
-40 C
25 C
0
1.6
Ta = 85 C
20
Gate-source Voltage VGS ( V )
1
5
RSS(on) - VGS
Source-source ON-state Resistance
RSS (on) ( m)
IS - VGS
1.E‐02
4
Source Current IS ( A )
Source-source Voltage VSS ( V )
25 C
3
1.E‐04
※Pulse measurement
1.E‐05
Ta = 85 C
1.E‐06
25 C
1.E‐07
1.E‐08
-40 C
1.E‐09
1.E‐10
0
2
4
6
8
10
12
Gate-source Voltage VGS ( V )
Page 3 of 5
Established : 2016-11-09
Revised : ####-##-##
Doc No. TT4-ZZ-02012
Revision. 1
Product Standards
MOS FET
FC4B22270L1
Technical Data ( reference )
Zero Gate Voltage Drain Current ISS ( A )
ISS - VSS
Dynamic Input/Output Characteristics
6
Gate - source Voltage VGS ( V )
1.E‐03
1.E‐04
1.E‐05
1.E‐06
Ta = 85 C
1.E‐07
25 C
1.E‐08
-40 C
1.E‐09
1.E‐10
4
3
2
1
0
0
5
10
15
20
25
VDD = 10 V
IS = 2.0 A
5
30
0
5
10
15
Gate Charge ( nC )
Source‐source Voltage VSS ( V )
Rth - tsw
Safe Operating Area
1000
limited by
RSS(on) (VGS = 3.8 V)
Source Current IS ( A )
Thermal Resistance Rth ( C/W )
100
100
10
Ta = 25 C,
Mounted on FR4 board ( 25.4 mm ͯ 25.4 mm ͯ t1.0 mm )
using the minimum recommended pad size (36m Copper ).
1
0.001
0.01
0.1
1
10
100
1000
Normalized Effective Transient Thermal Impedance
Pulse Width tsw ( s )
Absolute Maximum
500 s
10
1 ms
10 ms
1
100 ms
1s
0.1
0.01
Ta = 25 C,
Mounted on FR4 board
( 25.4 mm ͯ 25.4 mm ͯ t1.0 mm )
using the minimum recommended
pad size (36m Copper ).
0.1
1
DC
10
100
Source-source Voltage VSS ( V )
Thermal Response
10
1
Ta = 25 C,
Mounted on FR4 board ( 25.4 mm ͯ 25.4 mm ͯ t1.0 mm )
using the minimum recommended pad size (36m Copper ).
Duty Cycle = 0.5
0.1
0.1 0.05
0.02
Single Pulse
0.01
0.0001
0.001
0.01
0.1
1
10
100
Square Wave Pulse Duration ( s )
Page 4 of 5
Established : 2016-11-09
Revised : ####-##-##
Doc No. TT4-ZZ-02012
Revision. 1
Product Standards
MOS FET
FC4B22270L1
Unit: mm
Outline (ULGA004-W-1313-RA)
1.29±0.04
3
1
2
+0.05
0.10
±0.02
-0.02
0.11
1.29±0.04
4
(0.395)
0.5
(0.395)
0.5
φ0.25±0.03
Unit: mm
Land Pattern (Reference)
0.5
φ0.25
0.5
Page 5 of 5
Established : 2016-11-09
Revised : ####-##-##
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in
advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or
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(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
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