LN242RPH

This product complies with the RoHS Directive (EU 2002/95/EC). Light Emitting Diodes LN242RPH Square Type  5.0 mm × 2.0 mm  Absolute Maximum Ratings Ta = 25°C Parameter  Lighting Color Symbol Rating Unit PD 70 mW Forward current IF 25 mA Pulse forward current * IFP 150 mA Reverse voltage VR 4 V Operating ambient temperature Topr Storage temperature Tstg di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d d te te ow p:/ fo d l /w low isc isc nan nan ing ww in on on ce ce fo .se g U tin tin typ ty ur ue e pe Pr mi intensity RL u(%) e Relative luminous od d co a ty d ty uc n.p bo pe pe t li d an ut fec as lat yc on es le ic. t in sta co fo ge .jp rm . /en ati on . M Di ain sc te on na tin nc ue e/ d Power dissipation  Red –25 to +85 °C –30 to +100 °C Note) *: The condition of IFP is duty 10%, Pulse width 1 msec.  Electro-Optical Characteristics Ta = 25°C Parameter Symbol Luminous intensity IO Reverse current IR Forward voltage VF Peak emission wavelength λP Spectral half band width Δλ IO  IF ce /D 1 an 0.5 0.1 1 int en 0.3 3 5 10 30 50 nm Relative luminous intensity  Ta 1000 500 30 300 10 100 5 50 3 30 1.6 1.8 2.0 2.2 10 −20 2.4 40° 30° 20° 10° 40 60 80 100 30° 40 30 40° 50° 70° 70° 20° 80 60 40 20 0 20 60° 40° 80° 90° 100 10° 20° 60° 60° 40 0° 80° 50° Publication date: November 2008 20 IF  Ta 60 Peak emission wavelength λP (nm) 0 Ambient temperature Ta (°C) 50 80 800 V 100 Directive characteristics 700 2.8 IF = 20 mA 50 100 600 µA nm Relative luminous intensity  λP 0 500 5 700 Forward voltage VF (V) 20 mcd Forward current IF (mA) Relative luminous intensity (%) Forward current IF (mA) 0.4 Unit IF = 20 mA IF  VF 1 100 0.15 Max 2.2 on tin Forward current IF (mA) isc 3 Typ IF = 20 mA ue 5 Min VR = 4 V 100 Ma Luminous intensity IO (mcd) 10 Conditions 80° 20 40 60 Relative luminous intensity (%) SHD00480BEK 80 90° 100 10 0 0 20 40 60 80 100 Ambient temperature Ta (°C) 1 an en ue on tin isc ce /D  Pin name 1: Anode 2: Cathode 2 7.5± 0.2 2.0 Max. NOT SOLDERED 0.6 2 − 0.8 Max 2 − 0.6 ± 0.1 1 2.54 di p Pl lan nclu ea 0.5 e se 1.51.5 3.7 pla m d m des v 4 . 2 ± 0.3 f ne ain ain oll htt isit 1 . 0 2 6 . 5 ± 1 . 5 d d te te ow p:/ fo d l /w low isc isc nan nan ing ww in on on ce ce fo .se g U tin tin typ ty ur mi RL ued ued e pe Pro co a ty ty du n.p bo pe pe ct life d an ut cy as lat cle on es ic. t in sta co fo ge .jp rm . /en ati on . int Ma M Di ain sc te on na tin nc ue e/ d This product complies with the RoHS Directive (EU 2002/95/EC). LN242RPH  Package (Unit: mm) LLXFTN2SF420 5.2 ± 0.2 5.0 ± 0.2 2.2 ± 0.2 2.0 ± 0.2 0.8 0.6 ± 0.1 2 SHD00480BEK Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. d pla inc ne lud se pla m d m es ne ain ain foll htt visit d d te te ow p:/ fo d /w llow isc isc nan nan ing ww in on on ce ce fo .se g U tin tin typ ty ur mi RL ued ued e pe Pro co a ty ty du n.p bo pe pe ct life d an ut l cy as at cle on es ic. t in sta co fo ge .jp rm . /en ati on . (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. Pl ea Ma int en an ce /D isc on tin ue 20080805