Light Emitting Diodes
LN365GPH
Square Type
□1.8 mm × 1.8 mm Series
Absolute Maximum Ratings Ta = 25°C
Parameter
Lighting Color / Lens Color
Symbol
Rating
Unit
PD
90
mW
Forward current
IF
30
mA
Pulse forward current *
IFP
150
mA
Reverse voltage
VR
4
V
Operating ambient temperature
Topr
Storage temperature
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Power dissipation
Green / Green Diffused
–25 to +85
°C
–30 to +100
°C
Note) *: The condition of IFP is duty 10%, Pulse width 1 msec.
Electro-Optical Characteristics Ta = 25°C
Parameter
Symbol
Luminous intensity
IO
Forward current
IF
Forward voltage
VF
Peak emission wavelength
λP
Spectral half band width
Δλ
Reverse current
IR
3
5
10
50
20
mA
30
nm
(%)
Relative Luminous Intensity
LN
465
YP
H
LN2
LN3 65RPH
65G
PH
5
1
100
1.6
1.8
2.0
2.2
40°
60
LN265RPH
60°
700
λP (nm)
Wavelength
Publication date: September 2007
800
90°
100
30°
40°
50°
50
30
0
70°
20°
80
60
40
20
0
80°
20
40
(%)
Relative Luminous Intensity
SHD00497AEK
20
40
60
80
100
IF Ta
60
80
50
40
30
L
L N N3 6
4 6 5G
5Y P H
LN
PH
26
5R
PH
20
60°
40°
80°
600
10° 20°
60°
70°
20
0°
80°
50°
40
0
500
30°
20° 10°
I F ( mA)
Forward Current
(%)
Relative Luminous Intensity
Directive Characteristics
80
LN365
GPH
LN
LN
2
LN 65R 465YPH
265 PH
RP
H
100
LN465YPH
IO Ta
Ta (˚C )
Ambient Temperature
Relative Luminous Intensity
Wavelength Characteristics
LN365GPH
µA
300
10
−20
2.4
V
500
VF (V)
Forward Voltage
IF (mA)
Forward Current
100
2.8
10
IF VF
3
30
mcd
IF = 20 mA
on
tin
0.1
1
3.0
nm
10
int
0.3
IF (mA)
Forward Current
an
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0.5
Unit
565
30
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LN
36
5G
LN
PH
46
5Y
PH
RPH
265
LN
1.00
VR = 4 V
Ma
IO (mcd)
Luminous Intensity
1
Max
IF = 20 mA
50
3
Typ
2.2
100
5
Min
IF = 20 mA
ue
IO IF
10
Conditions
90°
100
10
0
0
20
40
60
80
Ta (°C )
Ambient Temperature
100
1
2
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2.0 Max. NOT SOLDERED
R0.3
5.0 ± 0.2
2 − 0.8 Max
2 − 0.6 ± 0.1
1
Pin name
1: Anode
2: Cathode
2
4.0
6.0
10.0 ± 0.2
C0.1
di
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Pl
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1.51.5 2.35
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5.85 ± 0.3
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5
2
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LN365GPH
Package (Unit: mm)
4.6 ± 0.2
1.8 ± 0.2
2.0 ± 0.2
2.54
SHD00497AEK
2.5 ± 0.2
1.8 ± 0.2
2.0 ± 0.2
3.0 ± 0.2
0.6 ± 0.1
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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