This product complies with the RoHS Directive (EU 2002/95/EC).
Infrared Light Emitting Diodes
LNA2W01L (LN57)
GaAs Infrared Light Emitting Diode
For optical control systems
Features
Absolute Maximum Ratings Ta = 25°C
Parameter
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High-power output, high-efficiency: PO = 4.5 mW (typ.)
Emitted light spectrum suited for silicon photodetectors
Infrared light emission close to monochromatic light: λP = 950 nm (typ.)
Wide directivity: θ = 18° (typ.)
Ultra-miniature double ended package
Symbol
Rating
Unit
Power dissipation
PD
75
mW
Forward current
IF
50
mA
Pulse forward current *
IFP
1
A
Reverse voltage
VR
3
V
Operating ambient temperature
Topr
–25 to +85
°C
Storage temperature
Tstg
–30 to +100
°C
Note) *: f = 100 Hz, Duty cycle = 0.1%
Electrical-Optical Characteristics Ta = 25°C±3°C
Symbol
PO
Reverse current
IR
Forward voltage
VF
Conditions
IF = 50 mA
Ct
isc
Terminal capacitance
ce
/D
Peak emission wavelength
an
Spectral half band width
en
Half-power angle
λP
Δλ
θ
Min
Typ
3.0
4.5
VR = 3 V
IF = 50 mA
on
tin
Radiant power *
ue
Parameter
1.25
Max
Unit
mW
10
µA
1.50
V
VR = 0 V, f = 1 MHz
35
pF
IF = 50 mA
950
nm
IF = 50 mA
50
nm
The angle when the radiant power is halved.
18
°
int
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
Ma
2. Cutoff frequency: 1 MHz
PO at f = fC
fC : 10 × log
= −3
PO at f = 50 kHz
3. *: A light detection element uses a silicon diode have proofread a load with a standard device.
Note) The part number in the parenthesis shows conventional part number.
Publication date: October 2008
SHC00034CED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
LNA2W01L
IF Ta
60
IFP Duty cycle
102
IF VF
80
Ta = 25°C
Ta = 25°C
30
10
Forward current IF (mA)
Pulse forward current IFP (A)
40
1
10 −1
20
60
40
20
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Forward current IF (mA)
50
10 −2
10
20
40
60
80
10 −3 −2
10
100
IFP VF
102
10
1
0
0.4
0.8
1.2
1.6
Forward voltage VF (V)
∆PO IFP
103
Ta = 25°C
tW = 10 µs
(1) f = 100 Hz
(2) f = 21 kHz
(3) f = 42 kHz
(4) f = 60 kHz
Ta = 25°C
80
60
40
102
(1)
10
(2)
(4) (3)
1
20
1
2
3
0
5
4
ue
Ma
0.4
0
40
30
40
50
60
10 −1
10
80
Ambient temperature Ta (°C)
120
1 000
IF = 50 mA
102
10
1
−40
0
40
80
Ambient temperature Ta (°C)
SHC00034CED
102
104
103
Pulse forward current IFP (mA)
∆PO Ta
on
tin
int
1 mA
Relative radiant power ∆PO
isc
ce
/D
an
en
10 mA
0
−40
20
103
IF = 50 mA
0.8
10
Forward current IF (mA)
VF Ta
1.2
0
Peak emission wavelength λP (nm)
0
1.6
Forward voltage VF (V)
0
102
100
Relative radiant power ∆PO
Pulse forward current IFP (mA)
tW = 10 µs
Duty cycle = 0.1%
Ta = 25°C
Forward voltage VF (V)
2
10
∆PO IF
120
103
10 −1
1
Duty cycle (%)
Ambient temperature Ta (°C)
104
10 −1
Relative radiant power ∆PO
0
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0
−25
120
λP Ta
IF = 50 mA
980
960
940
920
900
−40
0
40
80
Ambient temperature Ta (°C)
120
an
en
ue
on
tin
isc
ce
/D
IF = 50 mA
Ta = 25°C
900
940
980
Wavelength λ (nm)
0°
100
Directive characteristics
90
80
70
80
60
60
50
40
40
30
20
20
1 020 1 060 1 100
SHC00034CED
10°
40°
50°
60°
70°
Modulation output
Relative radiant intensity λ
Relative radiant intensity (%)
100
Frequency f (kHz)
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0
860
Ma
Relative radiant intensity (%)
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This product complies with the RoHS Directive (EU 2002/95/EC).
LNA2W01L
20°
102
Modulation output f
30°
10 −2
Ta = 25°C
10
1
80°
10 −1
90°
1
10
102
103
3
4
an
en
ue
on
tin
isc
ce
/D
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Pin name
1: Anode
2: Cathode
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This product complies with the RoHS Directive (EU 2002/95/EC).
LNA2W01L
Package (Unit: mm)
LETLTN2S0001
SHC00034CED
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
Pl
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20080805
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