LNJ03004BND1

LNJ03004BND1 Surface Mounting Chip LED 3230 Type  Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Power dissipation PD 430 mW Forward current*1 IF 120 mA Pulse forward current *2 IFP 200 mA Junction temperature Tj 110 °C Operating ambient temperature Topr –30 to +85 °C Storage temperature Tstg –40 to +100 °C  Lighting Color  White (5 000 [Kelvin]) Note) *1: IF is different by radiated factor of evaluation board. This value is mounted on evaluation board at Rthj-a = 25.0 °C/W. *2: The condition of pulse current IFP is 55 ms pulse width, 10 % duty.  Electro-Optical Characteristics Ta = 25°C±3°C Parameter Symbol Min Typ Max Unit IFP = 60 mA 2.7 2.95 3.2 V F IFP = 60 mA 22.0 26.5 30.0 lm x IFP = 60 mA 0.345 y IFP = 60 mA 0.355  Ra IFP = 60 mA 82  Forward voltage *1 VF Luminous flux *2 Chromaticity coordinates *3 Color Rendering Index Conditions  Note) *1: Complete Forward Voltage measurement within 0.1 seconds. Tolerance ±3% *2: Complete Luminous flux measurement within 0.1 seconds. Tolerance ±10% *3: Complete Chromaticity coordinates measurement within 0.1 seconds. Tolerance of chromaticity is ±0.01 F  IFP 100 100 40 30 20 10 0 50 100 Relative Luminous Flux  Ta 120 Relative Luminous Flux (%) 50 0 IFP  VF 150 Pulse forward current IFP (mA) Luminous Flux F (lm) 60 50 0 2.6 150 2.8 Pulse forward current IFP (mA) 3.0 3.2 80 60 40 20 0 −40 3.4 Forward voltage VF (V) −20 0 20 40 60 80 100 Ambient temperature Ta (°C) Relative Spectral Power  Wavelength IF  Ta 1.2 X Y 0.8 Directive characteristics 0° 1.0 0.6 0.4 0.8 80 0.6 60 0.4 0.2 0 350 650 Wavelength (nm) Publication date: June 2014 800 −90 30° 40° 50° 60° 70° 40 0.2 500 10° 20° −30 Radiation Angle (deg) 80 40 80° 20 −60 Forward current IF (mA) 120 X Relative luminous intensity (a.u.) Relative Spectral Power (a.u.) Y 1.0 0 0.2 0.4 0.6 0.8 90° 1.0 Relative luminous intensity (a.u.) Ver. CEK 0 0 20 40 60 80 100 Ambient temperature Ta (°C) 1 LNJ03004BND1  Package (Unit: mm) Ver. CEK 2 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. 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