LNJ318C8TRA

Light Emitting Diodes LNJ318C8TRA Surface Mounting Chip LED Dome-Lens Type  Absolute Maximum Ratings Ta = 25°C Parameter  Lighting Color Symbol Rating Unit Power dissipation PD 60 mW Forward current IF 20 mA Pulse forward current * IFP 60 mA Reverse voltage VR 4 V Operating ambient temperature Topr –30 to +85 °C Storage temperature Tstg –40 to +100 °C  Yellow Green Note) *: The condition of IFP is duty 10%, Pulse width 1 msec.  Electro-Optical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ 10 25 Max Unit Luminous intensity * IO IF = 10 mA mcd Reverse current IR VR = 4 V Forward voltage VF IF = 10 mA 2.03 Peak emission wavelength λP IF = 10 mA 565 nm Spectral half band width Δλ IF = 10 mA 30 nm 10 µA 2.60 V Note) *: Measurement tolerance: ±20% IO  IF 10 5 3 1 0.5 0.3 1 3 5 10 30 50 1 000 Relative luminous intensity (%) 50 30 0.1 IF  VF 100 Forward current IF (mA) Luminous intensity IO (mcd) 100 50 30 10 5 3 1 100 1.6 Forward current IF (mA) 1.8 2.0 2.2 500 300 100 50 30 10 2.4 −20 Forward voltage VF (V) 0 20 40 60 80 100 Ambient temperature Ta (°C) Relative luminous intensity  λP IF  Ta 30 100 Directive characteristics 80 30° 60 20° 10° 40° 0 550 600 650 Peak emission wavelength λP (nm) Publication date: January 2009 50° 60° 70° 20° 80° 500 40° 40° 70° 90° 100 30° 60° 60° 20 10° 20° 80° 50° 40 0° 80 60 40 20 0 Forward current IF (mA) Relative luminous intensity (%) Relative luminous intensity  Ta 20 10 80° 20 40 60 Relative luminous intensity (%) SHD00648BEK 80 90° 100 0 0 20 40 60 80 100 Ambient temperature Ta (°C) 1 LNJ318C8TRA  Package (Unit: mm) KLTLTN2K1800  Pin name 1: Anode 2: Cathode 2 SHD00648BEK Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805