Regulations
No.
KG3F6692/K
Total pages
Page
13
1
Product Specification
3528 Package Size Type Chip LED
Type Number：LNJ324C43RA
Panasonic Unified Parts Number：LNJ324C43RA
Semiconductor Company,
Panasonic Corporation
Established
by
Applied
by
Checked
by
Prepared
by
Y.Matsuyama
T.Kitazono
A.Nakano
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
2
Table of contents
1.
Product Summary ････････････････････････････････････････････････････････････ 3
2.
Absolute Maximum Ratings ･･･････････････････････････････････････････････････ 3
3.
Electrical-Optical Characteristics ･････････････････････････････････････････････ 3 ～ 4
4.
Typical characteristic(Reference) ･････････････････････････････････････････････ 5 ～ 6
5.
Outline ･･･････････････････････････････････････････････････････････････････････ 7
6.
Recommended Land Layout ･･････････････････････････････････････････････････ 7
7.
Recommended Soldering Conditions ･････････････････････････････････････････ 8 ～ 9
8.
Precautions for Application Design ･･･････････････････････････････････････････ 10
9.
Handling Instructions ･････････････････････････････････････････････････････････ 11 ～ 12
10.
Thermal Stress to Optical Device ･････････････････････････････････････････････ 13
11.
Guarantee ･･･････････････････････････････････････････････････････････････････ 13
12.
Others ･･･････････････････････････････････････････････････････････････････････ 13
《Attached paper》
1.
Packing Specification ････････････････････････････････････････････････････････ 1 ～ 5
2.
Reliability Test Result ････････････････････････････････････････････････････････ 1
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
3
■ Product Summary
Type
Yellow-Green Light Emitting Diode (3528 Package size Type Chip LED)
Application
Indicators
Material
InGaAlP
■ Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Power dissipation
PD
80
mW
Forward current
IF
30
mA
Pulse forward current
(Note1)
I FP
90
mA
Reverse voltage
VR
4
V
Operating ambient
temperature
Topr
-40 ～ +100
℃
Storage temperature
Tstg
-40 ～ +100
℃
Remarks
(Note1) The condition of I FP is duty 10 %, pulse width 1 ms
Please contact us for further information regarding special operating conditions such as
I F ：less than DC =1 mA
I FP ：less than pulse width =1 ms, duty=10 %
■ Electrical-Optical Characteristics (Ta=25 ℃±3 ℃)
Item
Symbol
Luminous intensity
Condition
Min.
Typ.
Max.
Unit
IO
I F =20 mA DC
40
70
130
mcd
Reverse current
IR
V R =4 V
－
－
100
μA
Forward voltage
VF
I F =20 mA DC
－
2.1
2.5
V
Dominant emission
wavelength
(Note3)
λd
I F =20 mA DC
565
572
577
nm
Peak emission wavelength
λp
I F =20 mA DC
－
571
－
nm
Spectral half band width
⊿λ
I F =20 mA DC
－
20
－
nm
(Note2)
(Note2) Rank classification of luminous intensity. (Condition：I F =20 mA DC)
Rank
Luminous intensity
Unit
1
40
～
60
2
60
～
90
mcd
90 ～ 130
3
･Measurement tolerance is ±15 %.
･Luminous intensity standard is equal to NIST.
(Note3) Rank classification of dominant emission wavelength. (Condition：I F =20 mA DC)
Rank
Dominant emission wavelength
Unit
565
L
～
571
571 ～ 577
H
･Measurement tolerance is ±2 nm.
nm
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
4
(Note4) Be careful about the product destruction by static electricity.
(Note5) Precautions for circuit design of LED operation.
(B)
(A)
The brightness difference is thought by the influence of VF about the circuit of (A) and avoids
using, please. Recommend the use of the circuit of (B).
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
LNJ324C43RA
Product Specification
Total pages
Page
13
5
■ Typical characteristic(Reference)
Relative Luminous Intensity vs. Ambient Temperature
Forward Current vs. Forward Voltage
100
Relative Luminous Intensity : Io (%)
50
Forward Current : I F (mA)
1000
T a =25 ℃
30
10
5
3
I F =20 mA
100
10
1
1.0
1.5
2.0
2.5
3.0
-40 -20
3.5
20
40
60
80
100
Ambient Temperature : T a (℃)
Forward Voltage : V F (V)
Forward Current vs. Ambient Temperature
Luminous Intensity vs. Forward Current
10000
0
40
T a =25 ℃
1000
Forward Current : I F (mA)
Luminous Intensity : I O (mcd)
35
100
10
30
25
20
15
10
5
1
10
1
Forward Current : I F (mA)
100
0
0
20
40
60
80
100
120
Ambient Temperature : T a (℃)
※The description data of this page is a typical value.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
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6
Relative Luminous Intensity － Wavelength Characteristics
Relative Luminous Intensity (%)
120
100
80
60
40
20
0
350
400
450
500
550
600
650
700
750
Wavelength (nm)
Directive Characteristics
Relative Luminous Intensity
I O (%)
※The description data of this page is a typical value.
2011-04-05
Established
Revised
Panasonic Semiconductor Opto Devices Co., Ltd.
Product Specification
■ Outline
LNJ324C43RA
Total pages
Page
13
7
Polarity
Unit:mm
2
Cathode
1
Anode
Marking Position
3.5±0.2
3.2
φ2.4
1
2
C0.8
0.85
1.8±0.2
Max 0.1
Max 0.00
Amount of resin
0.5
Marking Specification
1 4 0 5 A
1
2.8±0.2
2.2
１
2
４
０５
Ａ □
Reserve
Day Lot No. (A･B･C･･･)
Day (01･02･03･･･)
Month(1～9,O,N,D)
0.8±0.2
0.8±0.2
Year (0～9)
Recommended Land Layout
4.5
(1.5)
1.5
(1.5)
2.6
1. Anode
2. Cathode
(Note1) Tolerance unless specified:±0.1 mm.
(Note2) (
) A size is a reference.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
8
■ Recommended Soldering Conditions
1. The reflow soldering
1) The first time reflow soldering
Pleasa use it on condition that the folloeing.
Max. 260 ℃
250 ℃
Rate：1 ℃/s ～ 5 ℃/s
150 ℃～ 180 ℃
200 ℃
Preheating
Max.10 s
40 ℃
30 s
Max 70 s
120 s
＊This should be a profile on the print wiring board and FPC surface.
2) The second time reflow soldering (Up to the 2nd time)
In case of the second time reflow, please store the product 10 ℃～30 ℃，60 %RH and proceed
the reflow soldering within 3 days after the first time reflow.
Follow the same condition as the first reflow.
2. Hand soldering
1) Basically keep the temperature on the edge of iron at 350 ℃ and apply within 3 s.
If the temperature is higher than the condition above, apply in a shorter time (1 s per 10 ℃).
2) The iron equipped with temperature control circuit should be used.
3) Do not give a stress to lead or resin on soldering.
Especially do not let iron contact with them.
A LED chip will be damaged and broken by extreme stress.
4) Do not also give a stress to the device and bend of PC board adjusted right after manual
soldering iron.
5) The LED which was removed from PC board should not be used again.
6) Please do not solder excluding the reflow soldering or the manual soldering Iron.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
9
3. Automatic Mounting
These products are available for automatic mounting machines.
However, concerning demand on structure and performance of these devices, you should pay
attentions to the followings below.
1) Though we’ve performed anti-static operation on these devices, static electricity can be
frequently occurred in dry atmosphere and cause products to stick on the cover tapes.
Please study to control humidity and to perform anti-static measure.
2) If a successful mounting is not secured on your systems, you may study the following subjects.
Inside diameter of tool
Especially for a round shaped tool, please choose the one not
sticking out from the LED’s lens area.
Shape of tool
For a particular tool (“asterisk” type etc.), which intends to
incline due to its shape.
Please study the location and the size of it.
Height of tool
Please set the height of the tool a little lower from top of the
face of tape guide.
Position in absorption
Please adjust the absorb position as a center of device as
possible.
Vibration in mounting
Pin push up system
To reduce the vibration on mounting, please discuss taking
necessary measures against optimization of mounting speed
and tensions in winding and feeding tapes.
Mind the pin position of the products prepared a pin-hole
(byφ0.5 mm) on the bottom of the embossed tape.
“Pin push up system” is suitable only for products with a
pin-hole but not for others.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
10
■ Precautions for Application Design
1. Connect the current control resistor in the circuit and operate products within rated range of use.
2. Avoid instant reverse voltage (over current) when turning ON/OFF the circuit.
3. Check a pattern dimension well before use.
4. Avoid using under environments as shown in the following.
・A place where dust or corrosive gas is generated.
・A place where dew drop is generated on the product surface (LED).
5. Avoid circuit design that the product (LED) can be heated by adjacent high power electrical heating
element such as high power resistor or by high component density.
6. Mount the chip at right angles to the longitudinal direction of the PC board so that the stress on the
product should be decreased.
(Notes)
We recommend the LED be placed on the PC board as shown in diagram A.
If the LED must be placed on the PC board as shown in diagram B, special care should be taken to
insure that the LED is not affected by bend of the PC board after the soldering process.
(LED arrangement on PC board)
(A)
(B)
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
11
■ Handling Instructions
1. Storage
In order to avoid absorption of moisture during conveyance and storage of products, we are
applying moisture-proof packaging by means of aluminum-laminated bags containing silica gel.
Then, when absorption of moisture proceeds, the color of indicators in the silica gel changes, to
which must be paid much attention.
After the aluminum-laminated bag is opened, absorption of moisture of the products proceeds
quickly, which is likely to cause characteristic defects due to thermal stress generated during the
re-flowing process in the worst case.
Therefore when these products are used, be sure to open the bags one by one to complete
re-flowing quickly.
LED terminals, as being treated with Ag plating, may be changed in the surface quality and
degraded in solderability when exposed to the following conditions.
Therefore, pay enough attention to the storage condition.
2. Conditions and Terms of Storage of Products
Please store products according to the following product conditions depending on the conditions of
the products.
Conditions of Storage
Conditions of Product
Ambient
Temperature
Term
Temperature
humidity
When aluminum-laminated
10 ℃ ～ 30 ℃
60 % or under
Within one year
bag is not opened yet
When aluminum-laminated
10 ℃ ～ 30 ℃
60 % or under
Within 3 days
bag is opened
Up to the second time after
10 ℃ ～ 30 ℃
60 % or under
Within 3 days
the first reflowing
If the above-mentioned treatment was not made (including a case of discoloration of the silica gel
indicator in the bag or similar), remove moisture by means of baking treatment or the like before
use.
《Recommended Baking Conditions》
In a reel condition (as taken out of the aluminum-laminate bag)
Temperature:60 ℃. Time: More than 12 h and up to 24 h.
(However, the baking treatment is limited to one time only.)
(Note)
・The poor characteristic may generate on the products when a great deal of neglect time
after the opening in your process.
Also under the products with taping, there is a possibility that the strength of cover tape
peeling fluctuates and the mounting error occurs after baking.
Therefore, please take sufficient advance checks and control in your process.
Meanwhile, please note that we are not responsible for the problem occurred except in the
condition above.
3. Washing
1) Do not wash the products in principle.
2) If washing is required by a reason of the set, be sure to make it after the products are mounted
(after reflowing) according to the following conditions.
･Alcohol is recommended for cleaning.
Do not use a chlorine solvent, which may cause damage to the epoxy and product and
deterioration of the products.
･As for ultrasonic cleaning, it may differently affect each of the mounting board, such as resonance.
Sufficient checks on the ultrasonic cleaning is required for actual use.
･Avoid the use of brushing because it sometime damages light-emitting surfaces.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
12
4. Product strength
Resin is used as sealing material for light emitting diode on this product.
The molding resin may be peeled off with strong direct shocks in the resin part by reducing
strength of the resin after heating.
So you should pay attention to keep products from shocking on resin side, especially during
soldering process and using soldering irons.
And after soldering process, please avoid shocking directly on resin side, such as in the following
cases, handling PCB’s, piling them up and putting them in magazines.
Especially small type chip LEDs should be carefully handled.
5. Static electricity
This LED is sensitive to static electricity and care should be fully taken in handing it.
In the event that the voltage greater than absolute maximum rating is applied, which will damage
LEDs.
Please take necessary measures against Static electricity and serge in building LED assembly line
and in handling LED in mid-flow of the process.
＊Please take the following measures such that the voltage and surge voltage more than an
element resisting pressure level will not be applied.
1) Check the entire drive circuit including the power source.
As a check example, a surge current generated at power-on/off should be checked not to
exceed the absolute maximum ratings of the LED.
Please also insert an appropriate protective circuit into the LED driver circuit.
･As shown in the figure, in order to protect LED, it is
recommended to use a Zener diode.
2) Beware of destruction by static electricity in handling LEDs.
As proactive measures against static electricity, it is effective to earth your body (via 1 MΩ),
spread conductive mat on the floor, wear semi conductive work uniform and shoes and use
semi conductive containers.
Also, be sure to earth the nose of a soldering iron.
It is recommended to use an ionizor in the facility or the environment where static electricity
may be generated easily.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
LNJ324C43RA
Total pages
Page
13
13
■ Thermal Stress to Optical Device
Since light transmissivity is important for the package resin of optical devices (LED’s, photodiodes,
photo ICs, Photosensors, photocouplers), it is necessary for resin to contain additives in it.
For this reason, it has a lower thermal deformation temperature, compared with the package resin for
ICs, LSI’s and so on and is in the vicinity of the maximum storage temperature.
Unless it is designed under the operating conditions, taking into an operating current and ambient
conditions into account, the optical devices may be destroyed due to thermal stress caused to the
operating optical devices and this may cause lower light output and disconnection.
■ Guarantee
The warranty will be valid only within the reliability test results or the items and terms of the reliability
assurance standard.
It is also limited to that of the delivered product itself and we are not responsible for the labor cost for
replacement work, compensation for loss and the like.
The following cases are onerous since they are out of our guarantee even during the guarantee
period:
･Troubles resulting from careless handling or erroneous use.
･Troubles resulting from unreasonable repair or improvement.
･Troubles resulting from irresistible force such as natural disasters.
Should there be any doubt, we will verify it to clarify the cause in the presence of both parties in
principle and take a proper action.
■ Others
1) For matters on quality agreed between you and as those mentioned in these delivery specifications
only are valid basically and matters decided between you and us before the receipt of these
specifications become invalid unless they are mentioned in these specifications.
But, if any inadequacy is present, we are ready for a discussion with you to settle the matter.
In case any modification is required after the receipt of those specifications, only matters agreed
by you and us are valid.
2) For a special application or question, contact us before the fact and without delay.
3) Though we will deliver the products for which we guarantee the matters on quality mentioned in
these specifications, please investigate on your side the incorporation into actual sets, duration
under actual working conditions and other matters on quality of the products sufficiently.
4) If these delivery specifications are not returned to us within two weeks after the issue, we regard
them as received, which please understand.
5) For the doubts or necessity of change in this specification, mutual discussion will be made for the
solution
6) The specifications will be changed after prior discussion.
7) UL Standard
UL standard is not acquired since optical characteristics of sillicon resin is superior.
8) This product is RoHS-free supported.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Packing Specification
LNJ324C43RA
Total pages
Page
5
1
■ Embossed taping specifications
Unit:mm
4.0±0.1
2.0±0.05
1.75± 0.1
.1
φ1.5 +0
-0
0. 3±0.05
4.0±0.1
φ1.05±0.05
3.75±0.1
3.9±0.1
8. 0 -0.1
+0.3
(2.75)
3.5±0.05
0.2
2.2±0.1
2.95±0. 1
0.2
3.05±0. 1
(Note1) Unless specified R of the corner is Max. 0.3 mm.
(Note2) Allowance of accumulated pitch of feeding holes is ±0.2 mm per 10 pitches.
(Note3) Tolerance unless specified is ±0.1 mm.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Packing Specification
LNJ324C43RA
Total pages
Page
5
2
■ Reel Specification
Unit:mm
+0
φ 180.0 -3.0
2.0±0.2
Ａ－Ａ’SECT
+1. 0
φ60.0 -0
11.4±1.0
9.0±0.3
φ13.0±0.2
(Note1) This part is the application of JEITA ETX-7001.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Packing Specification
LNJ324C43RA
Total pages
Page
5
3
■ Taping specifications
Blank (Trailer part)
Blank (start)
Product (LED enclosure part)
Min. 40 mm
Min. 40 mm
Mounting part
Leader
Min. 200 mm
Pulling direction
Pin-feed hole side
Outline
Polarity mark
EIAJ C3 label
1. Pin-feed holes should be on the left side on the tape in the pulling direction.
2. Chip LED taping direction.
Refer to the above Figure.
3. The leader part is saved as cover tape, which should be 200 mm or longer.
4. Keep more than 10 emboss blanks both at front and end of the taping.
■ Mechanical strength and treatment
F
Cover tape
10 °
Carrier tape
Tape feeding direction
1. Exfoliation strength of the cover tape should be 0.2 N ～ 0.7 N.
2. Tape bending strength
Tape should not be deformed by bending with a radius of 15 mm.
3. Percentage defective of enclosed
The product which was enclosed in reverse direction or with back side up should be counted as
0 piece/reel.
The number of dropped parts should be 0.1 % of entire number of parts or 1 piece, whichever larger.
There should be no continuous dropping however total number has to remain intact.
4. There should be no tape joint.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Packing Specification
LNJ324C43RA
Total pages
Page
5
4
■ Packing form
1. A reel of 2 000 LED’s is a basic unit.
2. A reel and silica gel are put into an aluminum lamination bag.
Reel packing
Aluminum lamination bag packing
Notice label (Printing) back
Reel
EIAJ C3 label
※Rank can not be mixed within a reel.
Aluminum lamination bag
Packing case (Inner)
Silica gel
Packing case (Outer)
Notice label
EIAJ C3 label
※Rank can be mixed within a packing (inner box and outer box).
EIAJ C3 label
※Fractional packing, I,e, tape ＆ reel and inner or outer carton, can be happened.
(Note)
Please refer the product traceability with date code on the packing label.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Packing Specification
LNJ324C43RA
Total pages
Page
5
5
■ Internal use Label Items
1. Packing Classification
1) Reel
2) Packing (Inner)
3) Packing (outer)
2. Label
： 2 000 pcs
： 6 000 pcs
： 12 000 pcs
1) EIAJ C3 labeling
F
A
H
B
I
C
D
G
E
A
B
C
D
:
:
:
:
Customer code
Internal packing code
Rank
Date code Example of date code
(Reference) 14 ⇒ April, 2011
January
February
…………………
1
2
…………………
October
November December
O
N
D
（October
November December）
＊Only on the packing case tight number can be contained.
E : Date of label printing
F : Quantity
G : Product number
H : Bar code symbol
I : Pb free
※ Product name indication (Example) LNJ324C43 RA
Taping specification
Chip LED product №
2) Indication method (Notice label)
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
LNJ324C43RA
Reliability Test Result
Total pages
Page
1
1
Reaffirmed
by
Issued by
Product Name : LNJ324C43RA
Panasonic Semiconductor Opto Devices Co., Ltd.
Quality control group
◆Reliability Assurance Criterion（MIL-STD-19500H LTPD 15 %）
Test items
Test conditions
Test results
Judgment
criteria
Consecutive operating
life test
I FDC Max., Ta=25 ℃, t=1 000 h
0/15
B
High temperature
storage test
Tstg Max., t=1 000 h
0/15
A
Low temperature
storage test
Tstg Min., t=1 000 h
0/15
A
High temperature
humidity storage test
Ta=60 ℃, RH≧90 %, t=1 000 h
0/15
A
0/15
A
0/15
A
0/15
A
0/15
A
Soldering heat test
Temperature cycle test
(gaseous phase)
Thermal shock test
(liquid phase)
Fall test
Temperature：Ta=250 ℃, t=10 s Max.,
Max. 260 ℃ Reflow soldering
Refer to attached paper product specification Sheet
No.13/7.
Temperature：
【Tstg Min.～25 ℃～Tstg Max.～25 ℃】
Time： (30 min
5 min
30 min
5 min)
× 20 cycles
Temperature：【Tstg Max. ～ 0 ℃】
Time
： (5 min
5 min)
× 10 cycles
Drop distance : 1 m
Drop the device 3 times on a maple board of 3 cm or
more in thickness.
◆Judgment Criteria A
Item
Symbol
Measurement condition
Limit
Unit
Forward Voltage
VF
Same as the Product Standards
Upper Limit×1.2
V
Reverse Leakage
Current
IR
Same as the Product Standards
Upper Limit×2.0
μA
⊿I O
Same as the Product Standards
Lower Limit×0.7
%
Limit
Unit
Luminous Intensity
◆Judgment Criteria B
Item
Symbol
Measurement condition
Forward Voltage
VF
Same as the Product Standards
Upper Limit×1.2
V
Reverse Leakage
Current
IR
Same as the Product Standards
Upper Limit×2.0
μA
⊿I O
Same as the Product Standards
Lower Limit×0.5
%
Luminous Intensity
(Notes)
If you have any special requirement, please inquire for us.
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
Product Specification
Standard Revision History
Date
2011-04-05
Page
Contents of revision
LNJ324C43RA
Total pages
Page
1
1
Revision reason
･Novel enactment
2011-04-05
Established
Revised
Semiconductor Company, Panasonic Corporation
