LNJ461C34RA

Ultra Hight Bright Surface Mounting Chip LED InGaAIP GW Type Unit: mm 2.2 ± 0.2 1.8Max 1.5 ± 0.2 (1.7) Conventional Part No. Global Prat No. Lighting Color C0 LNJ461C34RA ·········· LNJ461C34RA ········· Amber LNJ861C38RA ·········· LNJ861C38RA ········· Orange 0.65 ± 0.2 0.15 1 0.4 ± 0.1 .5 1 4.6 ± 0.3 ■ Adsolute Maximum Ratings (Ta = 25°C) (2.5) 3.0 ± 0.2 0∼0.15 Lighting Color PD(mW) IF(mA) IFP(mA)∗ VR(V) Topr(°C) Tstg(°C) Amber 50 20 60 4 −25 ∼ +80 −30 ∼ +85 Orange 50 20 60 4 −25 ∼ +80 −30 ∼ +85 2 0.5 ± 0.1 0.8Max 2 Pulse width 1 msec. The condition of IFP is duty 10%, Pulse width 1 msec 1: Anode 2: Cathode ■ Electro−Optical Characteristics (Ta = 25°C) Conventional Lighting Lens Color Part No. Color LNJ461C34RA Amber Clear LNJ861C38RA Orange Clear Unit − − Min 6.5 4.5 mcd ¾I IO IF 10 10 mA Typ 2.0 1.9 V Max 2.3 2.3 V ∆λ Typ 15 17 nm IR IF 10 10 mA ¾V IF F 30 λP Typ 595 620 nm VF IO Typ 18.0 11.5 mcd IO F Max 100 100 µA VR 4 4 V ¾T a 100 A A 3 6 C A R A 38 R C 34 61 C 61 5 L 1 10 J4 3 N N L 30 J8 J L 5 6 8 N N L 1 Forward Current Luminous Intensity 4 J 50 R 8 1 Relative Luminous Intensity R 4 3 C 10 0.5 3 0.3 0.1 1 1 3 5 10 30 50 100 500 300 LN J86 100 1C3 LN J46 8RA 1C 50 34R A 30 10 300 1.6 1.8 Forward Current 2.0 2.2 -20 2.4 0 20 40 60 80 100 Ambient Temperature Forward Voltage IF ¾T a Relative Luminous Intensity 25 Forward Current Relative Luminous Intensity Wavelength Characteristics LNJ461C34RA 100 Directive Characteristics LNJ861C38RA 80 ° ° ° 20 ° 10 ° 30 ° ° 40 ° 50 50 ° 60 ° ° ° 600 700 800 ° 90 100 ° 70 5 ° ° 20 80 Wavelength 15 10 ° 40 ° 0 20 60 70 20 98 ° 20 ° 80 60 40 500 ° 10 30 40 60 ° 0 80 ° 90 80 60 40 20 0 20 40 60 Relative Luminous Intensity 80 100 0 0 20 40 60 80 Ambient Temperature 100 Caution for Safety Gallium arsenide material (GaAs) is used in this product. DANGER Therefore, do not burn, destroy, cut, crush, or chemically decompose the product, since gallium arsenide material in powder or vapor form is harmful to human health. Observe the relevant laws and regulations when disposing of the products. Do not mix them with ordinary industrial waste or household refuse when disposing of GaAs-containing products. Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and afterunpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR