915
FIBER
SENSORS
Wafer Mapping Sensor
M-DW1
Related Information
■■General terms and conditions.............. F-3
■■General precautions.................... P.1552~
■■Selection guide.............................. P.865~
LASER
SENSORS
PHOTOELECTRIC
SENSORS
Recognition
MICRO
PHOTOELECTRIC
SENSORS
AREA
SENSORS
SAFETY LIGHT
CURTAINS /
SAFETY COMPONENTS
PRESSURE /
FLOW
SENSORS
INDUCTIVE
PROXIMITY
SENSORS
PARTICULAR
USE SENSORS
SENSOR
OPTIONS
SIMPLE
WIRE-SAVING
UNITS
WIRE-SAVING
SYSTEMS
MEASUREMENT
SENSORS
STATIC
CONTROL
DEVICES
LASER
MARKERS
PLC
HUMAN MACHINE
INTERFACES
ENERGY
MANAGEMENT
SOLUTIONS
FA COMPONENTS
MACHINE VISION
SYSTEMS
UV CURING
SYSTEMS
panasonic.net/id/pidsx/global
The safe LED beam reflective type
wafer mapping sensor
Safe LEDs adopted
Sensing of nitride-coated wafers possible
Conventional laser mapping sensor that adopts laser
beam has been dangerous because an operator is
exposed directly to laser beam, which comes out of
the load port through FOUP. We have succeeded in
developing LED to adopt as light source for M-DW1.
Therefore an operator’s safety is ensured.
Nitride-coated wafers absorb light at certain wavelengths
depending on the coating thickness. If the sensor uses
the laser beam having a single wavelength, the beam
may be absorbed completely, resulting in wafer detection
error. The M-DW1 uses a LED light source with a wide
wavelength band that allows to detect nitride-coated
wafers successfully.
LED beam
Laser beam
High-speed response time: 0.5 ms
Selection
Guide
Liquid Leak
Detection
Liquid Level
Detection
Water
Detection
Color Mark
Detection
Wafer
Detection
Ultrasonic
Small / Slim
Object Detection
Obstacle
Detection
M-DW1
HD-T1
The sensor responds in 0.5 ms, meeting the requirements
of both high speed and high accuracy in wafer detection.
Glass wafers are also detectable
LED beam mapping sensor
Laser beam mapping sensor
Precise position detection by 2-segment receiving element
Wafer detection by the amount of reflected light may sometimes
fail depending on the wafer edge shape. The M-DW1 uses
2-segment receiving element in the beam-receiving part, and
detects wafers by the reflected light position instead of the
amount of reflected light. Thus, the sensor is less affected by
wafer thickness or the amount of reflected light.
The M-DW1, which detects wafers not by the light
amount but by the light position, can detect the glass
wafers regardless of the light amount.
Glass wafer
Penetrated
light
Light emission
Reflected light
Compact and lightweight design with built-in amplifier
The sensor measures W80.6 mm × H18.3 mm × D50 mm
W3.173 in × H0.720 in × D1.969 in, and weights only 75 g
approx.
■2-segment receiving
element
Reflected light
50 mm 1.969 in
Element A
Element B
18.3 mm 0.720 in
80.6 mm
3.173 in
Wafer Mapping Sensor
M-DW1
916
ORDER GUIDE
FIBER
SENSORS
Appearance
Center sensing
distance
Sensing object
45 mm 1.772 in
3 inch or larger
semiconductor wafer
Model No.
M-DW1
Output
NPN output / PNP output
selectable by switch
Type
Model No.
CE marking directive compliance
Center sensing distance
Sensing object
Detectable surface
Sensing angle
Wafer pitch
LED beam reflective type
M-DW1
EMC Directive, RoHS Directive
45 mm 1.772 in
3 inch or larger semiconductor wafer (Note 2)
Surface having a side edge which reflects light in the light receiving direction (Note 3)
12.5 ± 5° (Note 4)
Separate sensing is possible at normal sensitivity for 3 mm 0.118 in pitch or more (Note 5)
Suitable cassette
SEMI standard FOUP cassette / open cassette
Supply voltage
12 to 24 V DC ±10 % Ripple P-P 10 % or less
Current consumption
Output
Utilization category
Output operation
Short-circuit protection
Response time
Operation indicator
Stability indicator
Timer function
65 mA or less
NPN output / PNP output, selectable with output selection switch
NPN open-collector transistor
PNP open-collector transistor
• Maximum sink current: 100 mA
• Maximum source current: 100 mA
• Applied voltage: 30 V DC or less (between output and 0 V)
• Applied voltage: 30 V DC or less (between output and +V)
• Residual voltage: 1 V or less (at 100 mA sink current)
• Residual voltage: 1 V or less (at 100 mA source current)
0.4 V or less (at 16 mA sink current)
0.4 V or less (at 16 mA source current)
DC-12 or DC-13
Light-ON/Dark-ON, selectable by switch
Incorporated (restored automatically)
500 µs or less
Orange LED (lights up when the output is ON)
Green LED (lights up under stable light received condition or stable dark condition)
Approx. 2 ms fixed OFF-delay timer, switchable either effective or ineffective
Test input (emission halt input)
Signal condition
• Emission Halt: Open, or 4 to 8 V
• Emission: 0 to 3 V, or 9 V to +V (26.4 V max.)
Sensitivity selection input
Signal condition
• Input OFF: Open, or 4 to 8 V
• Input ON: 0 to 3 V, or 9 V to +V (26.4 V max.)
MICRO
PHOTOELECTRIC
SENSORS
SAFETY LIGHT
CURTAINS /
SAFETY
COMPONENTS
PRESSURE /
FLOW
SENSORS
INDUCTIVE
PROXIMITY
SENSORS
PARTICULAR
USE
SENSORS
SENSOR
OPTIONS
SIMPLE
WIRE-SAVING
UNITS
WIRE-SAVING
SYSTEMS
MEASUREMENT
SENSORS
STATIC
CONTROL
DEVICES
LASER
MARKERS
PLC
HUMAN
MACHINE
INTERFACES
ENERGY
MANAGEMENT
SOLUTIONS
FA
COMPONENTS
MACHINE
VISION
SYSTEMS
UV
CURING
SYSTEMS
Back surface teaching: effectuated with sensor’s sensitivity setting button
Detection sensitivity selection: 4 levels with sensor’s 2 bit switch or 2 levels with external input selectable
Selection
Guide
3 (Industrial environment)
Liquid Leak
Detection
IP20 (IEC)
Liquid Level
Detection
0 to +55 °C +32 to +131 °F (No dew condensation), Storage: –10 to +70 °C +14 to +158 °F
Water
Detection
35 to 85 % RH, Storage: 35 to 85 % RH
Color Mark
Detection
Incandescent light: 3,000 ℓx or less at the light-receiving face, Fluorescent light: 1,500 ℓx or less at the light-receiving face
Wafer
Detection
1,000 V AC for one min. between all supply terminals connected together and enclosure
Ultrasonic
Insulation resistance
20 MΩ, or more, with 250 V DC megger between all supply terminals connected together and enclosure
Small / Slim
Object Detection
Vibration resistance
10 to 500 Hz frequency, 3 mm 0.118 in double amplitude in X, Y and Z directions for two hours each
Obstacle
Detection
Sensitivity setting
Pollution degree
Environmental resistance
PHOTOELECTRIC
SENSORS
AREA
SENSORS
SPECIFICATIONS
Item
LASER
SENSORS
Protection
Ambient temperature
Ambient humidity
Ambient illuminance
Voltage withstandability
Shock resistance
Emitting element
Material
Cable
Cable extension
Weight
98 m/s2 acceleration (10 G approx) in X, Y and Z directions five times each
LED (modulated)
Enclosure: ABS and Stainless steel (SUS301), Lens: Acrylic
0.15 mm2 5-core cabtyre cable, 300 mm 11.811 in long
Extension up to total 10 m 32.808 ft is possible with 0.15 mm2, or more, cable.
Net weight: 75 g approx.
Notes: 1) Where measurement conditions have not been specified precisely, the conditions used were an ambient temperature of +20 °C +68 °F.
2) In case of 8 inch or less wafers, the wafer pitch, the orientation flat or surface condition may affect the sensing.
3) Polished wafers, etc., which have a sharp edge cannot be detected since they do not reflect the light in the light receiving direction.
4) Since the position of the orientation flat may vary by ±20° due to its rotation, refer to “Detecting wafer having orientation flat” (p.918) for detection of a
wafer having an orientation flat.
5) This is the pitch of an 8 inch wafer near its center region when it is inserted in an inclined fashion. When detecting a wafer having an orientation flat, the
wafer pitch becomes still smaller when sensing at positions which avoid the orientation flat. In this case, the sensing signal cannot be resolved and it
becomes a continuous, broad signal. For details, refer to “Sensing signal” (p.919~).
M-DW1
HD-T1
917
Wafer Mapping Sensor
I/O CIRCUIT DIAGRAMS
FIBER
SENSORS
LASER
SENSORS
PHOTOELECTRIC
SENSORS
NPN output
I/O circuit diagram
D
INDUCTIVE
PROXIMITY
SENSORS
PARTICULAR
USE
SENSORS
SENSOR
OPTIONS
SIMPLE
WIRE-SAVING
UNITS
Sensor circuit
AREA
SENSORS
PRESSURE /
FLOW
SENSORS
Wiring diagram
Color code
MICRO
PHOTOELECTRIC
SENSORS
SAFETY LIGHT
CURTAINS /
SAFETY
COMPONENTS
M-DW1
Tr2
Tr1
Color code
(Brown) +V
ZD2
(Black) Output
Brown
Load
100 mA max.
ZD1
+
(Pink) Ext. test input (emission halt input)
-
(Violet) Ext. sensitivity selection input
12 to 24 V DC
±10 %
+
Pink
-
Violet
*1
12 to 24 V DC
±10 %
*1
(Blue) 0 V
Internal circuit
Load
Black
Blue
Users’ circuit
* 1
Symbols … D: Reverse supply polarity protection diode
ZD1, ZD2: Surge absorption zener diode
Tr1: NPN output transistor
Tr2: PNP output transistor
Non-voltage contact or NPN open-collector transistor
or
WIRE-SAVING
SYSTEMS
• External test input (emission halt input)
0 to 3 V, or 9 V to +V (26.4 V max.): Emission halt
Open, or 4 to 8 V: Emission
• External sensitivity selection input
0 to 3 V, or 9 V to +V (26.4 V max.): Input ON
Open, or 4 to 8 V: Input OFF
MEASUREMENT
SENSORS
STATIC
CONTROL
DEVICES
LASER
MARKERS
PLC
HUMAN
MACHINE
INTERFACES
PNP output
I/O circuit diagram
Color code
ENERGY
MANAGEMENT
SOLUTIONS
D
Sensor circuit
UV
CURING
SYSTEMS
Tr2
ZD2
Liquid Level
Detection
Water
Detection
Color Mark
Detection
Wafer
Detection
Ultrasonic
Small / Slim
Object Detection
Obstacle
Detection
M-DW1
HD-T1
*1
*1
Pink
(Violet) Ext. sensitivity selection input
+
100 mA max.
-
(Black) Output
Tr1
ZD1
Internal circuit
Liquid Leak
Detection
Brown
(Pink) Ext. test input
(emission halt input)
(Blue) 0 V
Selection
Guide
Color code
(Brown) +V
FA
COMPONENTS
MACHINE
VISION
SYSTEMS
Wiring diagram
Symbols … D: Reverse supply polarity protection diode
ZD1, ZD2: Surge absorption zener diode
Tr1: NPN output transistor
Tr2: PNP output transistor
-
Black
Load
Users’ circuit
+
Violet
12 to 24 V DC
±10 %
12 to 24 V DC
±10 %
Load
Blue
* 1
Non-voltage contact or PNP open-collector transistor
or
• External test input (emission halt input)
0 to 3 V, or 9 V to +V (26.4 V max.): Emission halt
Open, or 4 to 8 V: Emission
• External sensitivity selection input
0 to 3 V, or 9 V to +V (26.4 V max.): Input ON
Open, or 4 to 8 V: Input OFF
Wafer Mapping Sensor
PRECAUTIONS FOR PROPER USE
• Never use this product as a sensing device
for personnel protection.
• In case of using sensing devices for
personnel protection, use products which
meet laws and standards, such as OSHA,
ANSI or IEC etc., for personnel protection
applicable in each region or country.
M-DW1
918
Refer to p.1552~ for general precautions.
LASER
SENSORS
Detecting wafer having orientation flat
• When detecting a wafer having an orientation flat, mount
the sensor so that a portion other than the orientation flat
is detected. Further, arrange to detect the wafer from two
different angles by moving the robot arm, etc., and OR
the signal so obtained.
PHOTOELECTRIC
SENSORS
Cassette
SAFETY LIGHT
CURTAINS /
SAFETY
COMPONENTS
Mounting
Sensor
• Set the distance between the sensor detection surface and the wafer edge to
be 45 mm 1.772 in and mount the sensor so that sensing is done at an angle
of 12.5° with respect to the wafer. Mount using M4 (length 16 mm 0.630 in)
screws. The tightening torque should be 1.2 N·m or less. Further, although
the sensing distance may change due to variation in the wafer position
(wafer protrusion, orientation flat position, etc.), if it is within 5 mm 0.197 in,
stable sensing is possible.
Robot arm
Top-view
m
45 m in
1.772
Top-view
Stability indicator
(Green)
Spot position
SENSOR
OPTIONS
Detection 1
Orientation flat
SIMPLE
WIRE-SAVING
UNITS
Detection 2
WIRE-SAVING
SYSTEMS
Output setting switch
Operation indicator (Orange)
Switch
LASER
MARKERS
PLC
HUMAN
MACHINE
INTERFACES
Wiring
• Do not use during the initial transient time (0.5 sec.) after the
power supply is switched on.
• Take care that the sensor is not directly exposed to fluorescent
lamp from a rapid-starter lamp, a high frequency lighting device
or sunlight etc., as it may affect the sensing performance.
• Avoid dust, dirt, and steam.
• Take care that the product does not come in contact with water,
oil, grease or organic solvents, such as, thinner, etc.
• Do not allow any water, oil, fingerprints, etc., which may refract
light, or dust, dirt, etc., which may block light, to stick to the
sensing surfaces of the sensor. In case they are present, wipe
them with a clean, dust-free soft cloth or lens paper.
MEASUREMENT
SENSORS
STATIC
CONTROL
DEVICES
Note: If the wafer center axis and the sensor axis lie along a straight line
(0°), detection is not possible. Always mount the sensor at an angle to
the wafer.
Others
PRESSURE /
FLOW
SENSORS
12.5°
Part description
Wafer center axis
• Make sure that the power supply is off while wiring.
• Take care that wrong wiring will damage the product.
• Verify that the supply voltage variation is within the rating.
• If power is supplied from a commercial switching regulator,ensure
that the frame ground (F.G.) terminal of the power supply is
connected to an actual ground.
• In case noise generating equipment (switching regulator, inverter
motor, etc.) is used in the vicinity of this product, connect the frame
ground (F.G.) terminal of the equipment to an actual ground.
• Extension up to total 10 m 32.808 ft, or less, is possible with
0.15 mm2, or more, cable. However, in order to reduce noise, make
the wiring as short as possible.
• Do not run the wires together with high-voltage lines or power lines
or put them in the same raceway. This can cause malfunction due
to induction.
• Make sure to use an isolation transformer for the DC power supply.
If an autotransformer (single winding transformer) is used, this
product or the power supply may get damaged.
• In case a surge is generated in the used power supply, connect a
surge absorber to the supply and absorb the surge.
AREA
SENSORS
PARTICULAR
USE
SENSORS
12.5°
Mounting angle
12.5°
Sensor axis
MICRO
PHOTOELECTRIC
SENSORS
INDUCTIVE
PROXIMITY
SENSORS
M4 (length 16 mm 0.630 in) screw
(Purchase separately)
45 mm
1.772 in
FIBER
SENSORS
Switch
Sensitivity setting button
Sensitivity
selection
switch
Timer operation
mode switch
Output operation
mode switch
• Sensitivity can be selected from four levels by appropriate
setting of the sensitivity selection switch (2 bits).
Sensitivity selection switch
1 2 3 4
H
L
1 2 3 4
H
L
1 2 3 4
H
L
1 2 3 4
UV
CURING
SYSTEMS
Selection
Guide
Liquid Leak
Detection
Sensitivity
selection switch
L
FA
COMPONENTS
MACHINE
VISION
SYSTEMS
Sensitivity selection setting
H
ENERGY
MANAGEMENT
SOLUTIONS
Sensitivity
Maximum
sensitivity
(MAX)
High
sensitivity
(HIGH)
Medium
sensitivity
(MID)
Low
sensitivity
(LOW)
Used for low reflectivity wafers with nitride
or oxide film processing,or for thin wafers
(0.3 to 0.4 mm 0.012 to 0.016 in)
Liquid Level
Detection
Water
Detection
Color Mark
Detection
Wafer
Detection
Sensitivity between maximum
sensitivity and medium sensitivity
Ultrasonic
Used for high reflectivity polished
wafers, etc., or for 3 mm 0.118 in
wafer pitch
Obstacle
Detection
Lowest possible sensitivity setting
HD-T1
Notes: 1) In case of 8 inch or less wafers, the wafer pitch, orientation
flat or the surface condition may affect the sensing.
2) Polished wafers, etc., which have a sharp edge cannot be
detected since they do not reflect the light in the light
receiving direction.
Small / Slim
Object Detection
M-DW1
919
FIBER
SENSORS
LASER
SENSORS
PHOTOELECTRIC
SENSORS
MICRO
PHOTOELECTRIC
SENSORS
AREA
SENSORS
SAFETY LIGHT
CURTAINS /
SAFETY
COMPONENTS
PRESSURE /
FLOW
SENSORS
INDUCTIVE
PROXIMITY
SENSORS
PARTICULAR
USE
SENSORS
Wafer Mapping Sensor
M-DW1
PRECAUTIONS FOR PROPER USE
External sensitivity selection input
Timer function
• The external sensitivity selection input (violet) becomes
ON when it is connected to 0 to 3 V, or 9 V to +V (26.4 V
max.), and becomes OFF when it is kept open or
connected to 4 to 8 V.
If the sensitivity is selected with the external sensitivity
selection input, set the sensitivity selection switch as
shown in the table below.
Sensitivity
selection switch
L
1 2 3 4
WIRE-SAVING
SYSTEMS
MEASUREMENT
SENSORS
STATIC
CONTROL
DEVICES
LASER
MARKERS
PLC
HUMAN
MACHINE
INTERFACES
ENERGY
MANAGEMENT
SOLUTIONS
FA
COMPONENTS
MACHINE
VISION
SYSTEMS
UV
CURING
SYSTEMS
H
L
1 2 3 4
: Approx. 2 ms
OFF-delay
timer
Maximum
sensitivity
(MAX)
Open, or 4 to 8 V
OFF
Medium
sensitivity
(MID)
0 to 3 V or 9 V to +V
(26.4 V max.)
ON
High
sensitivity
(HIGH)
Open, or 4 to 8 V
OFF
Low
sensitivity
(LOW)
Time chart
Sensing
condition
Liquid Level
Detection
Water
Detection
Color Mark
Detection
Wafer
Detection
Ultrasonic
Small / Slim
Object Detection
Obstacle
Detection
M-DW1
HD-T1
Not
sensing
ON
Normal
OFF
With timer
ON
T
Sensitivity setting
T
T
OFF
Timer period: T = Approx. 2 ms
• Although this sensor has an optical system which makes
it difficult for the background to affect the detection,
the background may have an effect when detecting
small diameter wafers. Hence, if the background gets
detected, or the stability indicator (green) lights off when
the cassette has no wafers, sensitivity setting should be
done so that the background does not have an effect.
However, the sensitivity reduces when sensitivity setting
is done.
• Since the sensitivity is stored in an EEPROM when the
sensitivity setting button is pressed, the setting need
not be repeated when the power is switched on again.
However, note that the EEPROM has a lifetime and its
guaranteed life is 100,000 write operation cycles.
Sensing signal
Sensing signal width
• The sensing signal which is output from the sensor is as follows:
The sensing signal has a width larger than the thickness of the wafer.
2 The signal width also varies with the reflectivity of the sensing edge.
High reflectivity (polish, aluminum evaporated, etc.): Large signal width
1
Example: Wafer thickness
t = 0.6 mm 0.024 in
Signal width
1.5 mm 0.059 in approx.
Low reflectivity (nitride or oxide film processed): Small signal width
Example: Wafer thickness
t = 0.6 mm 0.024 in
3
Selection
Guide
Sensing
Operation
Note: F
or details of sensitivity, refer to “Sensitivity selection setting”
(p.918).
Light emission control function
Liquid Leak
Detection
: Without timer
Sensitivity
ON
SENSOR
OPTIONS
SIMPLE
WIRE-SAVING
UNITS
• Using the timer operation mode switch, it is possible to
select an approx. 2 ms fixed OFF-delay timer. Since the
output is extended by a fixed period, it is useful when the
connected device has a slow response time.
Timer operation mode switch
Ext. sensitivity selection input
0 to 3 V, or 9 V to +V
(26.4 V max.)
H
Refer to p.1552~ for general precautions.
Signal width
1.1 mm 0.043 in approx.
The signal width also changes with the sensing distance or the sensing
angle.
Sensing signal width (Example)
1.5 mm 0.059 in
ON OFF
approx.
• Light emission is halted when the external light emission
control input (pink) is connected to 0 to 3 V, or 9 V to +V
(26.4 V max.). In this case, the output turns to the dark
state.
Wafer thickness
t = 0.6 mm 0.024 in
High reflectivity
wafer
Time chart
External light ON
emission
control input OFF
Low reflectivity
wafer
T1
Output
In case of
Light-ON
(
)
T2
ON
OFF
T1 = 5 ms, T2 = Max. 20 ms
Wafer thickness
t = 0.6 mm 0.024 in
Sensing signal width (Example)
1.1 mm 0.043 in
approx.
• From the above, for determining the position of the wafer from
the sensing signal, calculate the center position of the signal’s
ON region, while taking into consideration the response time.
Wafer Mapping Sensor
PRECAUTIONS FOR PROPER USE
Narrow pitch sensing signal width
• In case of “Detecting wafer having orientation flat”
(p.918), when the sensor is mounted at positions which
avoid the wafer orientation flat, the pitch of a crosscondition wafer changes as shown in the figure below.
Normal sensing
position
1st cross pitch
(narrow)
Cross-condition wafer
Normal wafer
2nd cross pitch
(wide)
Orientation flat length
• The calculated pitch based on the wafer size is given in
the table below.
Wafer size
Cross pitch Cross pitch
Normal Orientation Wafer
flat length thickness (narrow) (wide)
pitch
M-DW1
920
Refer to p.1552~ for general precautions.
FIBER
SENSORS
• From the above, it is seen that, since the pitch of the
cross-condition wafer reduces, the pitch resolution
required for high reflectivity wafers becomes more
stringent than the specified resolution of 3 mm 0.118 in.
Hence, the sensing signal from two wafers may not be
resolved and may become a continuous signal.
Further, the sensing signal may also change due to the
sensitivity setting, the reflectivity of the wafer, and the
sensing conditions (sensing distance or sensing angle).
For the above reasons, in case of wafers which have
been cross-inserted, since the small cross-pitch side
is similar to overlapping wafers, the sensing signal of
two wafers may become a continuous signal or may get
resolved.
• If the orientation flat happens to get in the position of
sensing, sensing is not possible in one of the two sensing
positions. Therefore, if the wafer is cross-inserted,
a resolved signal may not be output, and in this case,
the information on the wafer position calculated from the
sensing signal will be erroneous.
LASER
SENSORS
PHOTOELECTRIC
SENSORS
MICRO
PHOTOELECTRIC
SENSORS
AREA
SENSORS
SAFETY LIGHT
CURTAINS /
SAFETY
COMPONENTS
PRESSURE /
FLOW
SENSORS
INDUCTIVE
PROXIMITY
SENSORS
PARTICULAR
USE
SENSORS
SENSOR
OPTIONS
3 inch
(75 mm)
4.75 mm
0.187 in
22.2 mm
0.874 in
0.380 mm 1.58 mm
0.015 in
0.062 in
3.17 mm
0.125 in
4 inch
(100 mm)
4.75 mm
0.187 in
32.5 mm
1.280 in
0.625 mm 1.54 mm
0.025 in
0.061 in
3.21 mm
0.126 in
WIRE-SAVING
SYSTEMS
5 inch
(125 mm)
4.75 mm
0.187 in
42.5 mm
1.673 in
0.625 mm 1.52 mm
0.025 in
0.060 in
3.23 mm
0.127 in
MEASUREMENT
SENSORS
6 inch
(150 mm)
4.75 mm
0.187 in
57.5 mm
2.264 in
0.675 mm 1.43 mm
0.027 in
0.056 in
3.33 mm
0.131 in
STATIC
CONTROL
DEVICES
8 inch
(200 mm)
6.35 mm
0.250 in
59.3 mm
2.335 in
0.725 mm 2.19 mm
0.029 in
0.086 in
4.16 mm
0.164 in
LASER
MARKERS
SIMPLE
WIRE-SAVING
UNITS
PLC
DIMENSIONS (Unit: mm in)
80.6 3.173
70 2.756
The CAD data can be downloaded from our website.
HUMAN
MACHINE
INTERFACES
ENERGY
MANAGEMENT
SOLUTIONS
2-ø4.5 ø0.177 mounting holes
FA
COMPONENTS
MACHINE
VISION
SYSTEMS
50
34 1.969
1.339
UV
CURING
SYSTEMS
18.3
0.720
Beamreceiving
part
Beam- Beamemitting receiving
part
part
ø4.2 ø0.165 cable,
300 mm 11.811 in long
12
0.472
Selection
Guide
Liquid Leak
Detection
Liquid Level
Detection
Water
Detection
Color Mark
Detection
Wafer
Detection
Ultrasonic
Small / Slim
Object Detection
Obstacle
Detection
M-DW1
HD-T1
