MA2S077G0L

This product complies with the RoHS Directive (EU 2002/95/EC). Band Switching Diodes MA2S077G Silicon epitaxial planar type For band switching ■ Package M Di ain sc te on na tin nc ue e/ d ■ Features ■ Absolute Maximum Ratings Ta = 25°C Parameter Symbol Reverse voltage VR Forward current IF Operating ambient temperature * Topr Storage temperature Tstg • Code SSMini2-F4 • Pin Name 1: Anode 2: Cathode di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. • Low forward dynamic resistance rf • Less voltage dependence of diode capacitance CD • SS-Mini type package, allowing downsizing of equipment and automatic insertion through the taping package Rating Unit 35 V 100 mA −25 to +85 °C −55 to +150 °C ■ Marking Symbol: S Note) *: Maximum ambient temperature during operation. Parameter Symbol Typ Max Unit IF = 100 mA 0.92 1.00 V IR VR = 33 V 0.01 100.00 nA VR = 6 V, f = 1 MHz 0.9 1.2 pF IF = 2 mA, f = 100 MHz 0.65 0.85 Ω VF ce /D isc on tin Forward voltage ue ■ Electrical Characteristics Ta = 25°C ± 3°C Reverse current Diode capacitance CD Forward dynamic resistance * rf Conditions Min Ma int en an Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. Absolute frequency of input and output is 100 MHz. 3. *: Measuring instrument; YHP MODEL 4191A RF IMPEDANCE ANALYZER Publication date: October 2007 SKG00018AED 1 10 −1 2 0.8 0.6 0.4 0.2 0 2 10 1 Diode capacitance CD (pF) 10 0 1 0.2 0.4 0.6 1.0 0.8 10 Forward current IF (mA) 1.0 10 −1 Forward voltage VF (V) Reverse voltage VR (V) rf  I F f = 100 MHz Ta = 25°C 102 1.0 rf  f di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. Forward dynamic resistance rf (Ω) Forward current IF (mA) Ta = 25°C 10 1 Reverse current IR (nA) 103 ue ce /D isc on tin an en int Ma Forward dynamic resistance rf (Ω) M Di ain sc te on na tin nc ue e/ d MA2S077G This product complies with the RoHS Directive (EU 2002/95/EC). IF  V F 102 CD  VR f = 1 MHz Ta = 25°C 0 0 10 8 16 24 SKG00018AED 32 Frequency f (MHz) 102 40 IF = 2 mA Ta = 25°C 0.8 0.6 0.4 0.2 103 103 IR  T a 10 −1 VR = 33 V 102 10 1 0 Ambient temperature Ta (°C) 40 80 120 160 0 to 0.05 0.30 ±0.05 5° +0.05 0.60 −0.03 +0.05 SKG00018AED ±0.05 0.80 −0.03 +0.05 −0.03 SSMini2-F4 ±0.05 di p Pl lan nclu ea e se pla m d m des 5° ne ain ain foll htt visit d d te te ow p:/ fo /w llo dis isc nan nan ing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d (0.15) as lat cy on es cle 1.20 ic. t in 0.20 sta co fo ge 1.60 .jp rm . /en at i o / n. 1 ue ce /D isc on tin an en int Ma M Di ain sc te on na tin nc ue e/ d This product complies with the RoHS Directive (EU 2002/95/EC). MA2S077G Unit: mm 0.13 −0.02 +0.05 2 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. d pla inc ne lud se pla m d m es v ne ain ain foll htt isit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl ea Ma int en an ce /D isc on tin ue (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.