MA2SD2500L

This product complies with the RoHS Directive (EU 2002/95/EC). Schottky Barrier Diodes (SBD) MA2SD25 Silicon epitaxial planar type Unit: mm For super high speed switching 0.60+0.05 –0.03 0.12+0.05 –0.02 0.80+0.05 –0.03 IFM Forward current (Average) IF(AV) Non-repetitive peak forward surge current * IFSM Junction temperature Tj Storage temperature Tstg Unit 15 V 15 V 300 mA 200 mA 1 A 125 °C −55 to +125 °C (0.15) Peak forward current VRRM Rating 5˚ 0.01±0.01 VR Repetitive peak reverse voltage 5˚ (0.60) (0.80) Reverse voltage 0+0 –0.05 di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. Symbol 0.01±0.01 2 0.30±0.05 ■ Absolute Maximum Ratings Ta = 25°C Parameter 1.20+0.05 –0.03 (0.60) 0.80±0.05 M Di ain sc te on na tin nc ue e/ d • Forward current (Average) IF(AV) = 200 mA rectification is possible 1.60±0.05 1 ■ Features 1 : Anode 2 : Cathode EIAJ : SC-79 SSMini2-F1 Package Marking Symbol: 6L Note) *: The peak-to-peak value in one cycle of 50 Hz sine wave (non-repetitive) ■ Electrical Characteristics Ta = 25°C ± 3°C Parameter Symbol VF ue Forward voltage IR Terminal capacitance ce /D isc on tin Reverse current Ct Reverse recovery time * trr Conditions Min Typ IF = 200 mA VR = 6 V Max Unit 0.39 V 50 µA VR = 1 V, f = 1 MHz 20 pF IF = IR = 100 mA Irr = 10 mA, RL = 100 Ω 3 ns Ma int en an Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage of current from the operating equipment. 3. Absolute frequency of input and output is 250 MHz. 4. *: trr measurement circuit Bias Application Unit (N-50BU) Input Pulse tp tr 10% A 90% VR Pulse Generator (PG-10N) Rs = 50 Ω Publication date: April 2004 Wave Form Analyzer (SAS-8130) Ri = 50 Ω tp = 2 µs tr = 0.35 ns δ = 0.05 SKH00029BED Output Pulse t IF trr t Irr = 10 mA IF = 100 mA IR = 100 mA RL = 100 Ω 1 2 10 10−3 1 −20°C 10−1 0 0.2 0.4 Forward voltage VF (V) Reverse current IR (µA) 75°C 25°C 10−1 Reverse voltage VR (V) di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. ue ce /D isc on tin an en int Ma Forward current IF (mA) M Di ain sc te on na tin nc ue e/ d 103 IF  VF 105 102 103 Ta = 125°C 102 75°C 25°C 10 10−2 0 10 SKH00029BED Terminal capacitance Ct (pF) MA2SD25 This product complies with the RoHS Directive (EU 2002/95/EC). IR  VR 40 Ct  VR Ta = 125°C 104 20 0 Ta = 25°C 30 20 1 10 0 Reverse voltage VR (V) 10 20 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. d pla inc ne lud se pla m d m es v ne ain ain foll htt isit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl ea Ma int en an ce /D isc on tin ue (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.