MALM062H0L

MALM062H0L

  • 厂商:

    NAIS(松下)

  • 封装:

    SOT-665

  • 描述:

    MALM062H0L

  • 数据手册
  • 价格&库存
MALM062H0L 数据手册
This product complies with the RoHS Directive (EU 2002/95/EC). Zener Diodes MALM062H Silicon planar type Unit: mm 1.60±0.05 1.00±0.05 Unit PD 150 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Electrostatic discharge *2 ESD ±30 kV 1 1.20±0.05 Rating 5° Symbol Total power dissipation *1 2 3 0.10±0.03 0.20±0.05 di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. Note) *1 : PD = 150 mW achieved with a printed circuit board. *2 : Test method: IEC61000-4-2 5° 0 ∼ 0.01 Parameter 4 1.20±0.05 M Di ain sc te on na tin nc ue e/ d  Absolute Maximum Ratings Ta = 25°C 1.60±0.05 5 1: Cathode 1 2: Anode 1, 2, 3, 4 3: Cathode 2 4: Cathode 3 5: Cathode 4 (C = 150 pF, R = 330 Ω, Contact discharge: 10 times) 1.60±0.05  Electrostatic discharge ESD: ±30 kV  Four elements anode-common type +0.05 0.6 −0.03 (0.15) For ESD protection  Features SSMini5-F1 Package Marking Symbol: 6.2E Internal Connection 1 4 2 3 on tin ue  Electrical Characteristics Ta = 25°C±3°C 5 Parameter Symbol VBR isc Breakdown voltage * ce /D Reverse current an Terminal capacitance IR Ct Conditions IR = 1 mA Min Typ Max Unit 5.8 6.2 6.6 V 1.0 µA VR = 4.0 V VR = 0 V, f = 1 MHz 55 pF Ma int en Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. The temperature must be controlled 25°C for VBR mesurement. VBR value measured at other temperature must be adjusted to VBR (25°C) 3. *: VBR guaranted 20 ms after current flow. Publication date: September 2005 SKE00025AED 1 This product complies with the RoHS Directive (EU 2002/95/EC). MALM062H MALM062H_IF-VF 102 MALM062H_IZ-VZ MALM062H_IR-VR IF  VF IR  VR 10−3 Ta = 25°C IZ  VZ 102 Ta = 25°C Ta = 25°C f = 1 MHz 1 Zener current IZ (mA) Reverse current IR (nA) 10 10 1 10−1 10−1 10 1 M Di ain sc te on na tin nc ue e/ d Forward current IF (mA) 10−2 10−2 0.6 0.8 Forward voltage VF (V) Zener operating resistance RZ (Ω) Terminal capacitance Ct (pF) 102 10 1 2 3 4 4 5 6 Ta = 25°C 10 1 10−1 10−1 1 10 Zener current IZ (mA) on tin isc ce /D an en int Ma (V) 102 ue Reverse voltage VR (V) 2 6 RZ  IZ 103 Ta = 25°C f = 1 MHz 0 2 MALM062H_RZ-IZ Ct  VR 1 0 Reverse voltage VR MALM062H_Ct-VR 103 10−3 1.0 10−1 0 2 4 6 SKE00025AED 102 8 Zener voltage VZ (V) di p Pl lan nclu ea e se pla m d m des ne ain ain foll htt visit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. 10−2 0.4 10 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. d pla inc ne lud se pla m d m es v ne ain ain foll htt isit d te t o p:/ fo /w llo dis disc nan enan wing ww wi co on ce c fo .se ng ntin tin ty e ty ur mi UR ue ued pe pe Pro co L a d t ty du n.p bo yp pe ct life an ut e d as lat cy on es cle ic. t in sta co fo ge .jp rm . /en at i o / n. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl ea Ma int en an ce /D isc on tin ue (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
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