MAZM068H0L

This product complies with the RoHS Directive (EU 2002/95/EC). ESD Diodes MAZMxxxH Series Silicon planar type Unit: mm 1.60±0.05 0.55±0.05 1.00±0.05 M Di ain sc te on na tin nc ue e/ d 5° 1.20±0.05 1.60±0.05 • Four elements anode-common type • Power dissipation PD : 150 mW 4 1.20±0.05 5 ■ Features 1.60±0.05 For surge absorption circuit 1 2 3 0.10±0.03 0.20±0.05 Symbol Rating Unit PD 150 mW Junction temperature Tj 150 °C Storage temperature Tstg −55 to +150 °C 1 : Cathode 1 4 : Cathode 3 2 : Anode 1, 2, 3, 4 5 : Cathode 4 3 : Cathode 2 SSMini5-F1 Package or m Note) *: PD = 150 mW achieved with a printed circuit board. at io n. Power dissipation * 0 ∼ 0.01 Parameter (0.15) 5° ■ Absolute Maximum Ratings Ta = 25°C tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f Internally connected circuit 5 1 2 4 3 ■ Common Electrical Characteristics Ta = 25°C ± 3°C Parameter Symbol VZ Zener rise operating resistance RZK Zener operating resistance RZ Reverse current IR IZ Specified value IZ Specified value IZ Specified value Specified value vi Zener voltage Conditions si * VR Min Typ Max Unit Refer to the list of the electrical characteristics within part numbers V Ω Ω µA Pl ea s e Note) 1. Measuring methods are based JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. Electrostatic breakdown voltage is ±10 kV Test method: IEC1000-4-2 (C = 150 pF, R = 330 Ω, Contact discharge: 10 times)   3. *: The temperature must be controlled 25°C for VZ mesurement. VZ value measured at other temperature must be adjusted to VZ (25°C) VZ guaranted 20 ms after current flow. Publication date: November 2004 SKE00021AED 1 This product complies with the RoHS Directive (EU 2002/95/EC). MAZMxxxH Series ■ Electrical characteristics within part numbers Ta = 25°C ± 3°C Zener Zener rise Reverse current operating operating (DC) resistance resistance IR (µA) RZ (Ω) RZK (Ω) VR IZ = 5 mA IZ = 0.5 mA Max (V) Max Max Zener voltage Part number VZ (V) Marking symbol Min Nom Max IZ (mA) MAZM062H 5.8 6.2 6.6 5 0.2 4 50 100 6.2Z MAZM068H 6.4 6.8 7.2 5 0.1 4 30 60 6.8Z MAZM082H 7.7 8.2 8.7 5 0.1 5 30 60 8.2Z 10.6 5 0.05 7 30 60 10Z 9.4 10.0 M Di ain sc te on na tin nc ue e/ d MAZM100H 11.4 12.0 12.7 5 0.05 150 200 Ambient temperature Ta (°C) 6 8 MAZM120H MAZM100H 10 12 14 or m 0 0.4 MAZM082H 30 Ta = 25°C to 150°C si 102 1.2 Ct  VR MAZM120H Ta = 25°C 10 vi MAZM068H 10 12 0.8 Forward voltage VF (V) e MAZM100H Zener current IZ (mA) 2 Temperature coefficient of zener voltage SZ (mV / °C) ea s MAZM120H 10 Pl Zener operating resistance RZ (Ω) Ta = 25°C 1 4 SZ  IZ MAZM062H 10−1 10−1 Zener voltage VZ (V) RZ  IZ 102 1 1 10−2 10−3 250 Terminal capacitance Ct (pF) 100 MAZM068H 10−1 10−2 50 Forward current IF (mA) 1 MAZM062H 100 10 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f 150 50 Ta = 25°C 10 Zener current IZ (mA) Power dissipation PD (mW) 0.8 mm Cu foil t = 0.035 mm 0 12Z IF  VF 102 Ta = 25°C 10 mm 10 mm 0 80 IZ  VZ 102 250 200 30 at io n. PD  Ta 9 MAZM082H MAZM120H 8 MAZM100H 6 MAZM082H 4 MAZM068H 2 20 MAZM068H MAZM062H MAZM082H 10 MAZM100H MAZM062H MAZM120H 0 0 10 20 30 40 50 Zener current IZ (mA) SKE00021AED 60 0 0 4 8 Reverse voltage VR (V) 12 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. or m at io n. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl ea s e vi si (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.