MN13822RP

Microcomputer Peripheral LSIs MN1380 Series CMOS LSIs for Voltage Detection Overview Pin Assignment 23 MN1380 - R M Di ain sc te on na tin nc ue e/ d The MN1380 series are elements that monitor the power supply voltage supplied to microcomputers and other LSI systems and issue reset signals for initializing the system after the power is first applied or for preventing runaway operation when the supply voltage fluctuates. There is a choice of three output types: CMOS output, N-channel open drain output, and inverted CMOS output. There are also three package types: M, TO-92, and a mini type for surface mounting. Choose the ideal element for your application from the series' wide selection of detection ranks (17 ranks between 2.0 and 4.9 volts), output types, and package types. 1 M type package tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f or m Features Three-pin element requiring no adjustment Wide selection of detection ranks (17 ranks between 2.0 and 4.9 volts) Highly precise detection voltage Detection voltage with hysteresis characteristic ∆VD = 50 mV for ranks C to K ∆VD = 100 mV for ranks L to U Low current consumption: IDD = 1µA (typ.) for VDD =5V Low fluctuation in detection voltage with temperature (typ. 1 mV/˚C) Wide selection of output types: CMOS output, Nchannel open drain output, and inverted CMOS output Wide selection of package types: M, TO-92, and a mini type for surface mounting. at io n. 2 3 1 2 3 TO-92 type package 2 si LCR e vi Applications ea s Battery checkers 1 3 Pl Power outage detectors Level discriminators 1381 23R Memory backup systems Mini type package 1=OUT 2=VDD 3=VSS Microcomputer reset circuits Reset circuits for other electronic circuits SAG00003CEM 1 MN1380 Series Microcomputer Peripheral LSIs MN1380 Series Naming Conventions The MN1380 series offers a wide selection of detection ranks, output types, package types, and packaging. All combinations use the following naming conventions. When ordering, be sure to give the correct part number using these naming conventions. MN13801–R (TA) M Di ain sc te on na tin nc ue e/ d Winding direction for tape packaging (TA) ...... Tape packaging for TO-92 type package (TX) ...... Embossed tape packing for mini type package (TW) ..... Embossed tape packing for mini type package For further details, see the package specifications. Detection voltage rank (C to U) tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f Package: 0 ················ M type package 1 ················ TO-92 type package 2 ················ Mini type package or m at io n. Output type: Blank ········ CMOS output 1 ················ N-channel open drain output 2 ················ inverted CMOS output Matsushita Electronics Corporation MN1380 series of voltage detection CMOS LSIs with low current consumptions (Example) MN13821–R (TW) R rank (detection voltage of 4.0 to 4.3 V) Pl ea s e vi si Embossed tape packaging N-channel open drain output Mini type package MN1380 series of voltage detection CMOS LSIs with low current consumption Minimum Packaging Unit Bulk (M and TO-92 types) ·············· 1,000 Magazine (Mini type) ······················ 50 Taping (Mini and TO-92 types) ······· 3,000 2 Microcomputer Peripheral LSIs MN1380 Series Series Lineup Package Output CMOS output M type Package MN1380 TO-92 type Package MN1381 Mini type Package MN1382 N-channel open drain output MN13801 MN13811 MN13821 Inverted CMOS output MN13802 MN13812 MN13822 Detection Ranks (on Voltage) Rank min 2.0 max 2.2 Unit Detection Voltage Hysteresis Width (∆VD) min max M Di ain sc te on na tin nc ue e/ d C Detection Voltage for Drop in Power Supply Voltage (VDL) 2.4 F 2.3 2.5 G 2.4 2.6 H 2.5 2.7 J 2.6 2.9 K 2.8 3.1 L 3.0 3.3 M 3.2 3.5 N 3.4 3.7 V 50 300 mV V 50 300 mV 3.6 3.9 3.8 4.1 R 4.0 4.3 S 4.2 4.5 T 4.4 4.7 U 4.6 4.9 V 100 300 mV Pl ea s e vi si P Q at io n. 2.3 2.2 or m 2.1 E tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f D Unit 3 MN1380 Series Microcomputer Peripheral LSIs Block Diagram 2 Voltage Reference 1 VDD + Comparator – *1 Output Circuit Level Converter 1 OUT M Di ain sc te on na tin nc ue e/ d + Comparator Voltage Reference 2 – 3 VSS Pin Descriptions Symbol OUT Function Description Reset signal output pin 2 VDD Power supply pin 3 VSS Ground pin Pl ea s e vi si tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f Pin No. 1 4 or m at io n. Note *1: Circuits vary slightly depending on the output type (CMOS output, N-channel open drain output, or inverted CMOS output) Microcomputer Peripheral LSIs Absolute Maximum Ratings MN1380 Series VSS=0V, Ta=25˚C Parameter Power supply voltage Symbol VDD Rating 7.0 Output voltage VO – 0.3 to VDD +0.3 V Operating ambient temperature Ta –20 to +70 ˚C Storage temperature Tstg –55 to +125 ˚C Recommended Operating Conditions Symbol VDD VSS=0V, Ta=25˚C Conditions See Figures 1 and 4. min 1.5 typ max 6.0 M Di ain sc te on na tin nc ue e/ d Parameter Unit V Power supply voltage Unit V Electrical Characteristics 1) DC Characteristics VSS=0V, Ta=–20˚C to +70˚C min Load resistance = 10 kW VDL in power supply voltage *2 Detection voltage hysteresis width *2 "H" level output voltage ∆VD See Figures 1 and 4. VOH CMOS output IOH=– 40µA VDD=1.8V CMOS output IOH=– 0.5mA VOL Unit 1 5 µA *2 V *2 Ta=25˚C Inverted "L" level output voltage max *2 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f Detection voltage for drop typ at io n. Symbol Conditions IDD VDD = 5 V *1 or m Parameter Power supply current N-channel open VDD=1.8V drain output IOL=0.7mA Inverted VDD=6.0V 0.8VDD 0.8 *2 mV VDD VDD V –1.5 VSS 0.4 VSS 0.6 V CMOS output IOH=0.3mA Pl ea s e vi si Notes *1: This includes the output pin's leakage current. *2: For particulars, see the detection voltage rank table. 5 MN1380 Series Microcomputer Peripheral LSIs Electrical Characteristics (continued) 2) AC Characteristics Parameter VSS=0V, Ta=25˚C Symbol Conditions Rank C MN1380 MN1381 MN1382 Allowable Value (typ) MN13801 MN13802 MN13811 MN13812 MN13821 MN13822 Unit D E 3.0 2.5 230.0 M Di ain sc te on na tin nc ue e/ d F G Reset release time tOH See H Figures J 2 and 3. K 3.0 3.0 100.0 2.0 4.0 30.0 µs L M at io n. N tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f R or m P Q S T C D E 250.0 160.0 3.0 115.0 100.0 3.0 15.0 35.0 3.0 F G See Reset time tOL H Figures J 2 and 3. K L M vi si N Pl ea s e P Q R S T 6 µs Microcomputer Peripheral LSIs MN1380 Series Description of Operation VDD VDH VDL M Di ain sc te on na tin nc ue e/ d 1.5V 0V t tOH tOL VOUT tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f 0V tOL at io n. tOH or m VOUT MN1380/1381/1382 MN13801/13811/13821 CMOS output, N-channel open drain output Inverted CMOS output Figure t MN13802/13812/13822 tOL tOL tOH 0V tOH t e vi si Figure 1. Description of Operation Pl ea s Notes 1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range. 2: VDL: Detection voltage for drop in power supply voltage VDH: Detection voltage for rise in power supply voltage tOL : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the output pin (OUT) goes to "L" level. tOH : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the output pin (OUT) goes to "H" level. 3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD pins. 7 MN1380 Series Microcomputer Peripheral LSIs Description for Measuring the Output Characteristics VDD M Di ain sc te on na tin nc ue e/ d 6.0V 1.6V 0V 6.0V t CMOS output, N-channel open drain output at io n. MN1380/1381/1382 MN13801/13811/13821 tOL tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f 1.0V 0V t MN13802/13812/13822 Inverted CMOS output 6.0V 1.6V 1.5V 1.0V or m tOH 1.5V tOH tOH t vi si 0V Pl ea s e Figure 2. Description chart of Measuring the Output Characteristics 100kΩ VDD Switch: Connect when measuring N-channel open drain output (MN13801/MN13811/MN13821) MN1380 Series 100pF VOUT Figure 3. Circuit for Measuring the Output Characteristics 8 Microcomputer Peripheral LSIs MN1380 Series Description for Measuring the I/O Characteristics VOUT CMOS output, N-channel open drain output M Di ain sc te on na tin nc ue e/ d MN1380/1381/1382 MN13801/13811/13821 at io n. ∆VD or m Operation indeterminate 0 1.5V tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f 0 VDL VOUT Inverted CMOS output MN13802/13812/13822 VDD VDH 1.5V Pl 0 ea s Operation indeterminate 0 e vi si ∆VD VDD VDL VDH Figure 4. Description chart for Measuring the I/O Characteristics Notes 1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range. 2: VDL: Detection voltage for drop in power supply voltage VDH: Detection voltage for rise in power supply voltage 3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD pins. 9 MN1380 Series Microcomputer Peripheral LSIs Application Circuit Example Connect resistors, capacitors, and the like only to the output pin on the MN1380 series element. Note that connecting them to the Power source pins changes VDH, VDL, and ∆VD. Sample Circuit 1 M Di ain sc te on na tin nc ue e/ d Sample Circuit 2 VDD VDD R OUT MN1380 Series C tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f or m at io n. C Pl ea s e vi si Select the values of R and C to match the application. 10 OUT MN1380 Series Microcomputer Peripheral LSIs MN1380 Series Package Dimensions (Unit: mm) M type package 6.9 2.5 1.5 1.0 4.5 0.4 M Di ain sc te on na tin nc ue e/ d 1.0 1.5 0.55±0.1 0.45±0.1 or m 0.85 at io n. 4.1 0.7R tf o 1.25 1.25 ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f 1.25 2.5±0.5 2.5±0.5 2 3 vi si 1 Pl ea s e Note) The package will be changed to lead-free type (M3A). See the new package dimensions section later of this datasheet. 11 MN1380 Series Microcomputer Peripheral LSIs Package Dimensions (Unit: mm)(continued) TO-92 type package 4.0±0.2 +0.2 0.45 -0.1 2.54±0.15 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f or m at io n. 13.5±0.5 M Di ain sc te on na tin nc ue e/ d 5.1±0.2 5.0±0.2 2.3±0.2 vi si 1 2 3 Pl ea s e Note) The package will be changed to lead-free type (SSIP003-P-0000S). See the new package dimensions section later of this datasheet. 12 Microcomputer Peripheral LSIs MN1380 Series Package Dimensions (Unit: mm)(continued) Mini type package +0.2 2.8 -0.3 +0.25 0.65±0.15 0.65±0.15 +0.2 2.9 -0.05 +0.1 0.4 -0.05 at io n. 1.45 0.95 0.95 0.16 +0.2 -0.1 tf o ht llow tp in :// g pa U na RL so a ni bo 0.8 c. 0 to 0.1u 1.1 ne t l t/s ate c/ st en in f +0.1 -0.05 or m 0.5 1.9±0.2 M Di ain sc te on na tin nc ue e/ d 0.5 1.5 -0.05 0.1 to 0.3 vi si 0.4±0.2 Pl ea s e Note) The package will be changed to lead-free type (MINI-3DC). See the new package dimensions section later of this datasheet. 13 MN1380 Series Microcomputer Peripheral LSIs Reference Characteristics The following characteristics curves represent results from a specific sample therefore they do not guarantee the characteristics for the final product. 1.4 1.2 1.0 VSS IDD(µA ) M Di ain sc te on na tin nc ue e/ d OUT 0.8 VDD A 0.6 0.4 at io n. V 0 1.0 2.0 5.0 3.0 4.0 VDD(V) 6.0 Figure 5.a. IDD vs. VDD Characteristic (Rank Q) 2.0 Figure 5.b. Measurement Circuit VSS e ea s A Pl 1.0 –20 0 20 OUT VDD vi IDD(µA ) si 1.5 0.5 –40 7.0 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f 0 or m 0.2 5V 40 60 80 Ambient temperature, Ta (˚C) Figure 6.a. IDD Temperature Characteristic (Rank Q) 14 Figure 6.b. Measurement Circuit Microcomputer Peripheral LSIs MN1380 Series Reference Characteristics (continued) 4.8 4.6 4.4 VSS 4.2 VDL,VDH(V) M Di ain sc te on na tin nc ue e/ d VDH OUT V VDD 4.0 VDL 3.8 V 3.6 –40 –20 0 20 40 60 at io n. 3.4 80 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f or m Temperature Ta(˚C) Figure 7.a. VDL/VDH Temperature Characteristic (Rank Q) 0.3 0.25 Figure 7.b. Measurement Circuit VSS V si vi 0.1 ea s V Pl 0.05 OUT VDD 0.15 e ∆VD(V) 0.2 0 –40 –20 0 20 40 60 80 Ambient temperature, Ta (˚C) Figure 8.a. ∆VD Temperature Characteristic (Rank Q) Figure 8.b. Measurement Circuit 15 MN1380 Series Microcomputer Peripheral LSIs Reference Characteristics (continued) 3 –30˚C Room temperature 80˚C VSS OUT M Di ain sc te on na tin nc ue e/ d 2 IOL(mA) VDD A 1 1.8V 0 0.5 1.0 1.5 2.0 2.5 3.0 or m 0 at io n. V tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f VOL(V) Figure 9.a. IOL vs. VOL Characteristic 20 –30˚C Room temperature 15 VSS 80˚C OUT VDD vi si 10 e A 5V ea s | IOH | (mA) Figure 9.b. Measurement Circuit V Pl 5 0 0 1 2 3 VOL(V) 4 Figure 10.a. IOH vs. VOH Characteristic 16 5 Figure 10.b. Measurement Circuit Microcomputer Peripheral LSIs MN1380 Series Reference Characteristics (continued) 2.5 2.0 VSS M Di ain sc te on na tin nc ue e/ d OUT IOL(mA) 1.5 VDD A 1.0 1.8V V 0 20 40 60 Ambient temperature, Ta (˚C) 80 or m –20 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f 0 –40 at io n. 0.5 Figure 11.a. IOL vs. Temperature Characteristic 7.0 6.5 Figure 11.b. Measurement Circuit 6.0 OUT si VDD vi A e 5.5 ea s 5V 5.0 V Pl | IOH | (mA) VSS 4.5 –40 –20 0 20 40 60 80 Ambient temperature, Ta (˚C) Figure 12.a. IOH vs. Temperature Characteristic Figure 12.b. Measurement Circuit 17 MN1380 Series Microcomputer Peripheral LSIs TO-92 Type Package Taping-Specifications (MN1381/MN13811/MN13812) ∆h1 A1 P ∆h2 W W0 t2 t1 M Di ain sc te on na tin nc ue e/ d H0 l1 H1 W2 H A P1 0 T d F1 F2 or m Figure 13. TO-92 Type Package Taping-Dimensions (Ammunition pack) TO-92 Type Package Taping Dimensions (Ammunition pack) Name Product height* Symbol A Length (mm) 5.3 max Product width* A1 Product thickness* T Lead width* d Taped lead length l1 2.0 max Product pitch P at io n. øD0 P0 Drawing direction Symbol W0 5.2 max Feed hole position W1 9.0±0.5 4.2 max Adhesive tape position W2 0.5 max Distance to top of product H 25.0 max 12.7±1.0 Distance to bottom of product H0 19.0±0.5 16.0±0.5 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f Name Adhesive tape width 0.45 +0.15 – 0.1 Length (mm) 6.0±0.5 Feed hole pitch P0 12.7±0.3 Lead clinch height H1 Feed hole position P1 6.35±0.5 Feed hole diameter D0 4.0±0.2 Lead spacing F1, F2 Tape thickness t1 0.7±0.2 Product deflection angle ∆h1, ∆h2 Total tape thickness t2 1.5 max Tape width W 2.5 +0.5 – 0.2 2.0 max Note*1: For further details, see the specifications issued separately. vi si 18.0 +1.0 – 0.5 Unit: mm Leave the space for at least three elements B D 41 E H 250 H W 330 Pl ea s e 25 elements (example) W Figure 14. Box Dimensions for TO-92 Type Packages with Ammunition pack 18 D Microcomputer Peripheral LSIs MN1380 Series Embossed Taping Specifications for Mini Type Package (MN1382/MN13821/MN13822) There is a choice of two orientations, TW and TX, for the product relative to the tape. TW TX Tape feed hole Tape feed hole Drawing direction M Di ain sc te on na tin nc ue e/ d Drawing direction (Marking surface on top) (Marking surface on top) Figure 16. TX Orientation tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate s c/ 3.3±0.1 en t in 1.75±0.1 fo rm at io n. 1.75±0.1 Figure 15. TW Orientation Unit: mm ø1.5 +0.1 -0 4.0±0.1 3.5±0.05 A B 3.2±0.1 4.0±0.1 Product orientation A is labeled TW; orientation B, TX. Figure 17. Embossed Taping Dimensions for Mini Type Package Unit: mm ø178±2.0 0.5 2± ø80±1.0 ø13±0.5 ea s e vi si ø21±0.8 Pl 8.0±0.3 t+0.3±0.1 2±0.5 10±1.5 3,000 packages per reel Figure 18. Embossed Taping Reel Dimensions for Mini Type Package 19 MN1380 Series Microcomputer Peripheral LSIs Reliability Testing Results for MN1380 Series (1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812) Test Subjects Test Conditions Operating lifetime test Results VDD=5.5V, Ta=125˚C, t=1000hrs 0/15 High-temperature storage test Ta=150˚C, t=1000hrs 0/15 Low-temperature storage test Ta=–65˚C, t=1000hrs 0/15 High-temperature, Ta=85˚C, RH=85%, t=1000hrs 0/15 VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs 0/15 high-humidity storage test M Di ain sc te on na tin nc ue e/ d High-temperature, high-humidity bias test Thermal shock test Ta=150˚C and –65˚C. 0/15 Five minutes at each temperature for ten cycles Temperature cycle test Ta=150˚C and –65˚C. 0/15 Thirty minutes at each temperature for ten cycles Two atmospheres for 50 hours at ambient temperature (Ta) of 121˚C 0/15 Soldering test Ambient temperature (Ta) of 230˚C for five seconds 0/15 Solder heat resistance test Ambient temperature (Ta) of 270˚C for ten seconds Test Conditions VDD=5.5V, Ta=125˚C, t=1000hrs High-temperature storage test Ta=150˚C, t=1000hrs tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f Test Subjects Operating lifetime test or m (2) Mini type package (MN1382/MN13821/MN13822) at io n. Pressure cooker test 0/15 Results 0/15 0/15 Low-temperature storage test Ta=–65˚C, t=1000hrs 0/15 High-temperature, Ta=85˚C, RH=85%, t=1000hrs 0/15 VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs 0/15 Thermal shock test Ta=150˚C and –65˚C. 0/15 Temperature cycle test Ta=150˚C and –65˚C. high-humidity storage test High-temperature, high-humidity bias test Five minutes at each temperature for ten cycles 0/15 Thirty minutes at each temperature for ten cycles Two atmospheres for 24 hours at ambient temperature (Ta) of 121˚C 0/15 Soldering test Ambient temperature (Ta) of 230˚C for five seconds 0/15 Solder heat resistance test *1 Ambient temperature (Ta) of 260˚C for five seconds 0/15 ea s e vi si Pressure cooker test *1 Pl Note*1: Note that the testing conditions for the mini package differ from those for the other two packages. 20 Microcomputer Peripheral LSIs MN1380 Series New Package Dimensions (Unit: mm) • M3A (Lead-free package) 6.90±0.10 2.50±0.10 (1.50) (1.00) (1.50) 4.50±0.10 (1.00) 3.50±0.10 0.40+0.10 -0.05 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f (0.85) at io n. 3 or m 1 4.10±0.20 2−R0.70 2.25±0.20 2.85±0.20 (0.40) 1.00±0.10 M Di ain sc te on na tin nc ue e/ d R0.90 0.55±0.10 2.50 Pl ea s e vi si 2.50 21 MN1380 Series Microcomputer Peripheral LSIs New Package Dimensions (Unit: mm)(continued) • SSIP003-P-0000S (Lead-free package) 4.00±0.20 0.60±0.15 tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f or m 13.30±0.50 0.40±0.10 2.30±0.20 0.40+0.10 -0.05 at io n. (1.00) M Di ain sc te on na tin nc ue e/ d (1.00) 5.00±0.20 5.00±0.20 1 3 1.27 Pl ea s e vi si 1.27 22 Microcomputer Peripheral LSIs MN1380 Series New Package Dimensions (Unit: mm)(continued) • MINI-3DC (Lead-free package) (1.45) (0.65) 0.40+0.10 -0.05 1 2.80+0.20 -0.30 +0.25 (0.65)1.50-0.05 M Di ain sc te on na tin nc ue e/ d 2 0.95 at io n. 3 0.95 or m 1.90+0.20 +0.10 -0.06 +0.30 -0.10 +0.20 -0.10 tf o 0 to 0.10 1.10 ht llow tp in 1.20 :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f 0.16 2.90+0.20 -0.05 Seating plane 0.10 to 0.30 Pl ea s e vi si 0.40±0.20 23 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. M Di ain sc te on na tin nc ue e/ d (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. or m at io n. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. tf o ht llow tp in :// g pa U na RL so a ni bo c. u ne t l t/s ate c/ st en in f (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. Pl ea s e vi si (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.