Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
http://www.semicon.panasonic.co.jp/en/
10 A Synchronous DC-DC Step down Regulator
with low quiescent power mode
(VIN = 4.5 V to 24 V, VOUT = 0.75 V to 3.6 V)
FEATURES
DESCRIPTION
High-Speed Response DC-DC Step Down Regulator
Circuit that employs Hysteretic Control System
Hi-side 20 m (Typ), Low-side 6 m (Typ) MOSFETs
for High efficiency at 10 A
Low Power Mode (discontinuous) for Light Load Efficiency
Maximum Output Current : 10 A
Input Voltage Range : AVIN = 4.5 V to 24 V,
PVIN = 4.5 V to 24 V,
V5 = 4.5 V to 5.5 V
Output Voltage Range : 0.75 V to 3.6 V
Selectable Switching Frequency 430 kHz / 630 kHz
Built-in Feed Back Resistors for 1.2 V / 1.05 V Output
Voltage (Also configurable using External Resistors)
Adjustable Soft Start
Selectable Low Operating and Standby Quiescent
Current to achieve light load efficiency
Open Drain Power Good Indication for Output Over /
Under Voltage
Built-in Under Voltage Lockout (UVLO),
Thermal Shut Down (TSD), Under Voltage Detection (UVD),
Over Voltage Detection (OVD), Short Circuit Protection (SCP)
Over Current Protection (OCP),
24 pin Plastic Quad Flat Non-leaded Package Heat
Slug Down (QFN Type)
(Size : 4 mm 4 mm 0.7 mm, 0.5 mm pitch)
SIMPLIFIED APPLICATION
22 µF
0.1 µF
PVIN
NN30332A is a synchronous DC-DC Step down
Regulator (1-ch) comprising of a Controller IC and two
power MOSFETs and employs the hysteretic control
system.
By this system, when load current changes suddenly,
it responds at high speed and minimizes the changes
of output voltage.
Since it is possible to use capacitors with small
capacitance and it is unnecessary to add external
parts for system phase compensation, this IC realizes
downsizing of set and reducing in the number of
external parts. Output voltage is adjustable by user.
Maximum current is 10 A.
APPLICATIONS
High Current Distributed Power Systems such as
・PCs
・HDDs (Hard Disk Drives)
・SSDs (Solid State Drives)
・Game consoles
・Servers
・Security Cameras
・Network TVs
・Home Appliances
・OA Equipment etc.
V5
EN
PVIN
100 k
PGOOD
VOUT
BST
1 µF
0.1 µF
AVIN
AVIN
NN30332A
0.1 µF
1 µH
VOUT = 1.05 V
LX
27 k
SS
AGND
V5
PGND
3.3 nF
22 µF 4
10 µF
VFB
V5
0.1 µF
36 k
Note : The application circuit is an example. The operation of
the mass production set is not guaranteed. Sufficient
evaluation and verification is required in the design of
the mass production set. The Customer is fully
responsible for the incorporation of the above
illustrated application circuit in the design of the
equipment.
Condition :
VIN = 12 V, VOUT Setting = 1.05 V,
Switching Frequency = 430 kHz, Low Power Mode / Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4) #Including V5 current
Page 1 of 42
Established : 2013-07-29
Revised : 2018-01-16
Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
ORDERING INFORMATION
Order Number
Feature
Package
Output Supply
NN30332A-VB1
Maximum Output Current : 10 A
24 pin HQFN
Emboss Taping
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
Notes
Supply voltage 1
VIN
30
V
*1
Supply voltage 2
V5
6
V
*1
Operating free-air temperature
Topr
– 40 to + 85
C
*2
Operating junction temperature
Tj
– 40 to + 150
C
*2
Tstg
– 55 to + 150
C
*2
VLP, VFSEL, VOUT, VFB
– 0.3 to (V5 + 0.3)
V
*1
*3
VEN
– 0.3 to 6.0
V
*1
VPGOOD
– 0.3 to (V5 + 0.3)
V
*1
*3
VLX
– 0.3 to (VIN + 0.3)
V
*1
*4
HBM
2
kV
—
Storage temperature
Input Voltage Range
Output Voltage Range
ESD
Notes : This product may sustain permanent damage if subjected to conditions higher than the above stated absolute
maximum rating. This rating is the maximum rating and device operating at this range is not guaranteed as it
is higher than our stated recommended operating range.
When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected.
VIN is voltage for AVIN, PVIN. VIN = AVIN = PVIN.
Do not apply external currents and voltages to any pin not specifically mentioned.
*1 : The values under the condition not exceeding the above absolute maximum ratings and
the power dissipation.
*2 : Except for the power dissipation, operating ambient temperature, and storage temperature,
all ratings are for Ta = 25 C.
*3 :(V5 + 0.3) V must not exceed 6 V.
*4 : (VIN + 0.3) V must not exceed 30 V.
Page 2 of 42
Established : 2013-07-29
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Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
POWER DISSIPATION RATING
Package
24 pin Plastic Quad Flat Non-leaded
Package Heat Slug Down (QFN Type)
j-a
j-C
PD
(Ta = 25 C)
PD
(Ta = 85 C)
Notes
50.4 C / W
4.5 C / W
2.480 W
1.290 W
*1
33.3 C / W
3.6 C / W
3.754 W
1.858 W
*2
Notes : For the actual usage, please follow the power supply voltage, load and ambient temperature conditions to ensure that there is
enough margin and the thermal design does not exceed the allowable value.
*1:Glass Epoxy Substrate (4 Layers) [50 50 0.8 t (mm)]
*2:Glass Epoxy Substrate (4 Layers) [50 50 1.57 t (mm)]
CAUTION
Although this IC has built-in ESD protection circuit, it may still sustain permanent damage if not handled
properly. Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS
gates.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply voltage range
Input Voltage Range
Output Voltage Range
Symbol
Min
Typ
Max
Unit
Notes
AVIN
4.5
12.0
24.0
V
—
PVIN
4.5
12.0
24.0
V
—
V5
4.5
5.0
5.5
V
—
VLP
– 0.3
—
V5 + 0.3
V
*1
VFSEL
– 0.3
—
V5 + 0.3
V
*1
VEN
– 0.3
—
5.0
V
—
VPGOOD
– 0.3
—
V5 + 0.3
V
*1
VLX
– 0.3
—
VIN + 0.3
V
*2
Notes : Voltage values, unless otherwise specified, are with respect to GND.
GND is voltage for AGND, PGND. AGND = PGND
VIN is voltage for AVIN, PVIN. VIN = AVIN = PVIN.
Do not apply external currents or voltages to any pin not specifically mentioned.
*1 : (V5 + 0.3) V must not exceed 6 V.
*2 : (VIN + 0.3) V must not exceed 30 V.
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Established : 2013-07-29
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Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
ELECRTRICAL CHARACTERISTICS
CO = 22 µF 4, LO = 1 µH, VOUT Setting = 1.05 V, VIN = AVIN = PVIN = 12 V, V5 = 5 V,
Switching Frequency = 430 kHz, VLP = 1 V (Normal Mode),
Ta = 25 C 2 C unless otherwise noted.
Parameter
Symbol
Condition
Limits
Unit Note
Min
Typ
Max
IVDDACTN
VEN = 5 V, IOUT = 0 A
RFB1 = 27 k
RFB2 = 36 k
VLP = 1 V , VFB = 0.62 V
—
450
900
µA
—
IVDDACTL
VEN = 5 V, IOUT = 0 A
RFB1 = 27 k
RFB2 = 36 k
VLP = 0 V, VFB = 0.62 V
—
80
130
µA
—
Current Consumption
Consumption current at active
(Normal Mode)
Consumption current at active
(Low Power Mode)
V5 Consumption current at standby
IV5STB
V5 = 5 V, VEN = 0 V
—
2
4
µA
—
AVIN/PVIN Consumption current at
standby
IVINSTB
AVIN = PVIN = 7.4 V
VEN = 0 V
—
1
2
µA
—
Logic Pin Characteristics
EN pin Low-level input voltage
VENL
—
—
—
0.3
V
—
EN pin High-level input voltage
VENH
—
1.5
—
5.0
V
—
—
3
7
µA
—
EN pin leakage current
ILEAKEN
VEN = 5 V
LP pin Low-level input voltage
VLPL
—
—
—
0.49
V
—
LP pin High-level input voltage
VLPH
—
0.72
—
V5
V
—
—
2
4
µA
—
LP pin leakage current
ILEAKLP
VLP = 1 V
FSEL pin Low-level input voltage
VFSELL
—
—
—
0.3
V
—
FSEL pin High-level input voltage
VFSELH
—
V5
0.7
—
V5
V
—
FSEL pin leakage current
ILEAKFS
—
5
10
µA
—
VFSEL = 5 V
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Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
ELECRTRICAL CHARACTERISTICS (Continued)
CO = 22 µF 4, LO = 1 µH, VOUT Setting = 1.05 V, VIN = AVIN = PVIN = 12 V, V5 = 5 V,
Switching Frequency = 430 kHz, VLP = 1 V (Normal Mode),
Ta = 25 C 2 C unless otherwise noted.
Parameter
Symbol
Condition
VFB comparator threshold
VFBTH
—
VFB pin leakage current 1
ILEAKFB1
VFB pin leakage current 2
Limits
Unit Note
Min
Typ
Max
0.594
0.600
0.606
V
—
VFB = 0 V
–1
—
1
µA
—
ILEAKFB2
VFB = 6 V
–1
—
1
µA
—
UVLO shutdown voltage
VUVLODE
V5 = 5 V to 0 V
4.15
4.20
4.25
V
—
UVLO wakeup voltage
VUVLORE
V5 = 0 V to 5 V
4.35
4.40
4.45
V
—
UVLO hysteresis
VUVLO
—
150
200
250
mV
—
VFB Characteristics
Under Voltage Lock Out
PGOOD
PGOOD Threshold 1
(VFB ratio for UVD detect)
PGOOD Hysteresis 1
(VFB ratio for UVD release)
PGOOD Threshold 2
(VFB ratio for OVD detect)
PGOOD Hysteresis 2
(VFB ratio for OVD release)
VPGUV
PGOOD : High to Low
77
85
93
%
—
VPGUV
PGOOD : Low to High
3.5
5.0
6.5
%
—
VPGOV
PGOOD : High to Low
107
115
123
%
—
VPGOV
PGOOD : Low to High
3.5
5.0
6.5
%
—
PGOOD start up delay time
(After reached VFB = 0.6 V)
VPDT
—
0.4
1.0
1.6
ms
—
PGOOD ON resistance
RPG
—
—
10
15
—
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Revision. 4
Product Standards
NN30332A
ELECRTRICAL CHARACTERISTICS (Continued)
CO = 22 µF 4, LO = 1 µH, VOUT Setting = 1.05 V, VIN = AVIN = PVIN = 12 V, V5 = 5 V,
Switching Frequency = 430 kHz, VLP = 1 V (Normal Mode),
Ta = 25 C 2 C unless otherwise noted.
Parameter
Symbol
Condition
Limits
Min
Typ
Max
Unit Note
DC-DC Characteristics
Output voltage 1
Vo1
RFB1 = 27 k
RFB2 = 36 k
IOUT = 5 A
1.035
1.050
1.065
V
—
Output voltage 2
Vo2
RFB1 = 30 k
RFB2 = 30 k
IOUT = 5 A
1.182
1.200
1.218
V
—
Output voltage 3
Vo1
VFB = float,
before VEN = 0 V to 1.5 V
IOUT = 5 A
1.035
1.050
1.065
V
—
Output voltage 4
Vo2
VFB = V5,
before VEN = 0 V to 1.5 V
IOUT = 5 A
1.182
1.200
1.218
V
—
Line regulation 1
VLIN1
PVIN = 6 V to 24 V
IOUT = 150 mA, VLP = 0 V
—
0.25
0.75
%/V
—
Line regulation 2
VLIN2
PVIN = 6 V to 24 V
IOUT = 0.5 A
—
0.25
0.75
%/V
—
Load regulation 1
VLOA1
IOUT = 10 mA to 150 mA
VLP = 0V
—
1.5
—
%
*1
Load regulation 2
VLOA2
IOUT = 10 mA to 10 A
—
2.0
—
%
*1
Output ripple voltage 1
VRL1
IOUT = 10 mA
VLP = 0 V or 1 V
—
40
—
mV
[p-p]
*1
Output ripple voltage 2
VRL2
IOUT = 4 A
—
15
—
mV
[p-p]
*1
Load transient response 1
VTR1
IOUT = 100 mA to 4 A
t = 0.5 A / µs
—
20
—
mV
*1
Load transient response 2
VTR2
IOUT = 4 A to 100 mA
t = 0.5 A / µs
—
20
—
mV
*1
High Side Power MOSFET
ON resistance
RONH
VGS = 5.0 V
—
20
40
m
—
Low Side Power MOSFET
ON resistance
RONL
VGS = 5.0 V
—
6
10
m
—
Min Input and output voltage
difference
Vdiff
Vdiff = VIN – VOUT
—
2.5
—
V
*1
Note :
*1 : Typical design value
Page 6 of 42
Established : 2013-07-29
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Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
ELECRTRICAL CHARACTERISTICS (Continued)
CO = 22 µF 4, LO = 1 µH, VOUT Setting = 1.05 V, VIN = AVIN = PVIN = 12 V, V5 = 5 V,
Switching Frequency = 430 kHz, VLP = 1 V (Normal Mode),
Ta = 25 C 2 C unless otherwise noted.
Parameter
Symbol
Condition
DC-DC Over Current
Protection Limit
ILMT
—
DC-DC Short Circuit
Protection Threshold
Ishort
Limits
Unit Note
Min
Typ
Max
—
12
—
A
*1
50
60
70
%
—
PROTECTION
VFB = 0.6 V to 0.0 V
Thermal Shut Down (TSD)
Threshold
TTSDTH
—
—
130
—
C
*1
Thermal Shut Down (TSD)
Hysteresis
TTSDHYS
—
—
30
—
C
*1
Soft-Start Timing
SS Charge Current
ISSCHG
VSS = 0.3 V
1
2
4
µA
—
SS Discharge Resistance (Shut-down)
RSSDIS
VEN = 0 V
—
5
10
k
—
Switching Frequency
DC-DC Switching Frequency 1
DDFSW1
IOUT = 3 A, VFSEL = 0 V
—
430
—
kHz
*1
DC-DC Switching Frequency 2
DDFSW2
IOUT = 3 A, VFSEL = V5
—
630
—
kHz
*1
Note :
*1 : Typical design value
Page 7 of 42
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Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
FSEL
EN
V5
VFB
Top View
VOUT
SS
PIN CONFIGURATION
18 17 16 15 14 13
PGOOD
AGND
BST
PVIN
19
20
12 AVIN
25
AGND
11 AGND
21
22
23
10 LP
27
LX
26
PVIN
24
9
8
PGND
7
1
2
3 4
5 6
LX
PIN FUNCTIONS
Pin No.
Pin name
Type
1
Description
LX
Output
Power MOSFET output pin
An inductor is connected and switching operation is carried out
between VIN and GND.
Due to high current and large amplitude at this terminal,
the parasitic inductance and impedance of the routing path
can cause an increase in noise and a degradation in the efficiency.
Routing path should be kept as short as possible.
PGND
Ground
Ground pin for Power MOSFET
LP
Input
AGND
Ground
12
AVIN
Input
Power supply voltage sense pin
Recommended rise time ( time to reach 90 % of set value ) setting is
greater than or equal to 10 µs and less than or equal to 1 s.
13
FSEL
Input
Frequency selection pin
This is set to 430 kHz at Low level input, 630 kHz at High level input
14
EN
Input
ON / OFF control pin
DC-DC is stopped at Low level input, and it is started at High level input.
15
V5
Power
supply
2
3
4
5
6
7
8
9
10
11
20
Low Power Mode / Normal Mode selection pin
Low Power Mode is set at Low level input, Normal Mode is set at High level
input.
Ground pin
5 V input pin (Power supply for internal control circuit)
Note : Detailed pin descriptions are provided in the OPERATION and APPLICATION INFORMATION section.
Page 8 of 42
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Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
PIN FUNCTIONS (Continued)
Pin No.
Pin name
Type
Description
16
VFB
Input
Comparator negative input pin and 1.05 V / 1.2 V output voltage selection pin
VFB terminal voltage is regulated to REF output (internal reference voltage).
Since VFB is a high impedance terminal, it should not be routed near
other noisy path (LX, BST, etc.) or an inductor
Routing path should be kept as short as possible.
17
VOUT
Input
Output voltage sense pin
Switching frequency is controlled by monitoring output voltage.
18
SS
Output
Soft start capacitor connect pin
The output voltage at a start up is smoothly controlled
by adjusting Soft Start time.
Please connect capacitor between SS and GND.
19
PGOOD
Output
Power good open drain pin
A pull up resistor between PGOOD and V5 terminal is necessary.
Output is low during Over or Under Voltage Detection conditions.
BST
Output
High side Power MOSFET gate driver pin
Bootstrap operation is carried out in order to drive the gate voltage of High
side Power MOSFET. Please connect a capacitor between BST and LX.
Routing path should be kept as short as possible to minimize noise.
PVIN
Power
supply
Power supply pin for Power MOSFET
Recommended rise time ( time to reach 90 % of set value ) setting is
greater than or equal to 10 µs and less than or equal to 1 s.
25
AGND
Ground
Ground pin for heat radiation
26
PVIN
Power
supply
Power supply pin for heat radiation
27
LX
Output
Power MOSFET output pin for heat radiation
21
22
23
24
Note : Detailed pin descriptions are provided in the OPERATION and APPLICATION INFORMATION section.
Page 9 of 42
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Revision. 4
Product Standards
NN30332A
FUNCTIONAL BLOCK DIAGRAM
AVIN
SS
18
12
Soft-Start
SS
EN
14
19
PGOOD
21
BST
Ton / Toff timer
0.6 V + 15 %
V5
15
BGR
V5
0.6 V – 15 %
VREF
Internal circuit
VOUT
17
UVLO
OCP
SCP
TSD
22,23,24,26
PVIN
1.2 V / 1.05 V
Divider/Selector
Fault
HGATE
HPD
16
1,2,3,
4,5,6,
27
VFB
Soft-Start
Aux VREF
Timer
FSEL
13
AVIN
REF
Ton
Timer + Comp
HGO
Toff
Timer + Comp
Control
Logic
ON
CMP
10
LGATE
LPD
Coast
LP
LX
0.6 V
PGND
LGO
7,8,9
Low Power
/ Normal
11,20,25
AGND
Note : This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified.
Page 10 of 42
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Revision. 4
Product Standards
NN30332A
OPERATION
1. Protection
(1) Over Current Protection (OCP) and
Short Circuit Protection (SCP)
1) The Over Current Protection is activated at about 12 A
(Typ). This device uses pulse – by – pulse valley
current protection method. When the low side power
MOSFET is turned on, the voltage across the drain
and source is monitored which is proportional to the
inductor current. The high side power MOSFET is only
allowed to turn on when the current flowing in the low
side power MOSFET falls below the OCP level.
Hence, during the OCP, the output voltage continues
to drop at the specified current. OCP is a non – latch
type protection.
2) The Short Circuit Protection function is implemented
when the output voltage decreases and the VFB pin
reaches to 60 % of the set voltage (0.6 V).
If the VFB voltage stays below 70 % of the set
voltage over 250 µs after SCP triggers, both
high side and low side power MOSFET will be latched
off and the output will be discharged by internal
MOSFET. Power reset or EN pin reset is necessary to
activate the device again.
Output Voltage [V]
Over Current Protection ( typ : 12 A )
10.5 A to 14 A
1)
2)
(Ground short
protection Detection
60% of Vout )
(2) Over Voltage Detection (OVD)
If the VFB pin voltage exceeds 115 % of the set
voltage (0.6 V) and lasts more than 10 ns, Over
Voltage Detection will be triggered and PGOOD pin will
be pulled down. Furthermore, in an over voltage
condition, high side power MOSFET is turned off to
stop PWM operation, and low side power MOSFET is
turned on and held on until the inductor current starts
to flow back to the device. If the VFB pin voltage drops
below 110 % of the set voltage within 2.2 ms after Over
Voltage Detection triggers, PGOOD pin will be pulled
up again and PWM operation will resume. Otherwise,
both high side and low side MOSFET will be latched off
and the output will be discharged by internal MOSFET.
Power reset or EN pin reset is necessary to activate
the device again.
115 %
110 %
VFB
90 %
85 %
0.6 V
0.6 V
< 2.2 ms
1 ms
> 2.2 ms
PGOOD
Note: PGOOD pin is pulled up to V5 pin
Figure : OVD Operation
(3) Output discharging function
Output current [A]
Figure : OCP and SCP Operation
When EN is low, the output is discharged by an
internal MOSFET that is connected to VOUT pin.
When EN is high, if the controller is turned off by
Under Voltage Lock Out, or the controller is latched off
by Over Voltage Detection or Short Circuit Protection,
the output is discharged by the above said internal
MOSFET.
The ON resistance of the internal MOSFET is 50 .
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Product Standards
NN30332A
OPERATION (Continued)
1. Protection (Continued)
2. Pin Setting
(4) Under Voltage Detection (UVD)
(1) Operating LP Setting
During the operation, if the output voltage drops and
VFB pin voltage reaches 85 % of the set
voltage (0.6 V), the MOSFET, the drain of which is
connected to PGOOD pin, will turn on and pull the
voltage of PGOOD to be low.
If the output voltage continues to drop and VFB pin
voltage reaches 60 % of the set voltage (0.6 V),
Short Circuit Protection (SCP) will be triggered.
If the output voltage returns to 90 % of the set
voltage (0.6 V) before triggering Short Circuit
Protection, the MOSFET that is connected to PGOOD
pin will turn off after 1 ms and PGOOD voltage will
become logic high.
The IC can operate at two different modes :
Low Power Mode and Normal Mode.
In Low Power Mode, the IC is working under low
current consumption to achieve light load efficiency
(IOUT < 150 mA). In Normal Mode, the IC is working
at high current ability up to 10 A.
The Operating Mode can be set by LP pin as follows.
LP pin
Mode
Low
Low Power Mode
High
Normal Mode
(2) Switching Frequency Setting
0.6 V
VFB
90 %
85 %
60 %
1 ms
The IC can operate at two different frequency :
430 kHz and 630 kHz.
The Switching Frequency can be set by FSEL pin
as follows.
PGOOD
Note: PGOOD Pin is pulled up to V5 pin
FSEL pin
Frequency [kHz]
Low
430
High
630
Figure : UVD Operation
(5) Thermal Shut Down (TSD)
When the IC internal temperature becomes more
than about 130C, TSD operates and DC-DC turns off.
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Product Standards
NN30332A
OPERATION (Continued)
3. Output Voltage Setting
4. Soft Start Setting
The Output Voltage can be set by external resistance
of VFB pin, and its calculation is as follows.
VOUT
VOUT = (1 +
RFB1
RFB2
) 0.6
RFB1
VFB (0.6 V)
RFB2
Soft Start function maintains the smooth control of the
output voltage during start up by adjusting soft start
time. When the EN pin becomes High, the current
(2 µA) begin to charge toward the external capacitor
(CSS) of SS pin, and the voltage of SS pin increases
straightly.
Because the voltage of VFB pin is controlled by the
voltage of SS pin during start up, the voltage of VFB
increase straightly to the regulation voltage (0.6 V)
together with the voltage of SS pin and keep the
regulation voltage after that. On the other hand, the
voltage of SS pin increase to about 2.8 V and keep the
voltage. The calculation of Soft Start Time is as follows.
Below resistors are recommended for following popular
output voltage.
VOUT [V]
RFB1 []
RFB2 []
3.3
54 k
12 k
1.8
36 k
18 k
1.35
30 k
24 k
1.2
30 k
30 k
1.05
27 k
36 k
VFB comparator threshold is adjusted to 1 %, but
the actual output voltage accuracy becomes more
than 1 % due to the influence from the circuits other
than VFB comparator.
In the case of VOUT setting = 1.05 V, the actual output
voltage accuracy becomes 1.5 %.
(VIN = 12 V, IOUT = 4 A, Switching Frequency =
430 kHz)
Soft Start Setting [s] =
0.6
2µ
CSS
CSS : External capacitor value of SS pin
EN
4.4 V
VREG
UVLO
Soft Start Time [s]
SS
0.6 V
VFB
VOUT
Figure : Soft Start Operation
Page 13 of 42
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Product Standards
NN30332A
OPERATION (Continued)
5. Built-in Feed Back Resistors for 1.05 V / 1.2 V
NN30332A has built-in feedback resistors for 1.05 V
and 1.2 V output voltage.
At the timing of EN pin going from Low to High,
depending on the state of VFB pin, the output voltage
can be set as follows :
V5
VFB [V]
VOUT [V]
V5
1.2 V
FLOAT
1.05 V
Resistor divider
Adjustable between
0.75 V to 3.6 V
4.4 V
EN
UVLO
V5
FLOAT
0.6V
VFB
1.2V
1.05V
0.75V to 3.6V using External Resistors
VOUT
Figure : Timing chart of output voltage setting
Page 14 of 42
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Product Standards
NN30332A
OPERATION (Continued)
6. Inductor and Output Capacitor Setting
IL
Highest efficiency operation is obtained at low
frequency with small ripple current. However,
achieving this requires a large inductor. There is a
trade off among component size, efficiency and
operating frequency. A reasonable starting point is to
choose a ripple current that is about 40 % of
IO (Max). The largest ripple current occurs at the
highest Ei. To guarantee that ripple current does not
exceed a specified maximum, the inductance should
be chosen according to:
IO
0
IL / 2
0
IC
IL / 2
VO
EO
VRPL
Lo
Eo Ei Eo
2 Ei Iox f
@ Ei Ei_max
And its maximum current rating is
Ton
IL_max Io_max
T=1/f
VO(EO)
Q1
IL
LO
IC
IO
Ei
Q2
CO
RC
Given the desired input and output voltages,
the inductor value and operating frequency determine
the ripple current.
IL
Eo Ei Eo
Ei Lo f
Iox
IL
2
@ Ei Ei_max
The selection of CO is primarily determined by the
ESR (RC) required to minimize voltage ripple and load
transients. The output ripple VRPL is approximately
bounded by:
Co Rc 2
IL
Vrpl Vop Vob Ei
2 Lo
8Co f
Co Rc 2
Eo Ei Eo
Ei
2 Lo
8Ei Lo Co f 2
From the above equation, to achieve desired output
ripple, low ESR ceramic capacitors are recommended,
and its required RMS current rating is:
Ic(rms)_max
IL
2 3
@ Ei Ei_max
IL
2
Page 15 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES
1. Output Ripple Voltage
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)
IOUT = 0 A
IOUT = 1 A
VOUT (50mV/div)
VOUT (50mV/div)
LX (5V/div)
LX (5V/div)
TIME (20ms/div)
TIME (2us/div)
IOUT = 3 A
IOUT = 10 A
VOUT (50mV/div)
VOUT (50mV/div)
LX (5V/div)
LX (5V/div)
TIME (2us/div)
TIME (2us/div)
Page 16 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
1. Output Ripple Voltage (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Low Power Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)
IOUT = 0 A
IOUT = 10 mA
VOUT (50mV/div)
VOUT (50mV/div)
LX (5V/div)
LX (5V/div)
TIME (200us/div)
TIME (20ms/div)
IOUT = 50 mA
IOUT = 150 mA
VOUT (50mV/div)
VOUT (50mV/div)
LX (5V/div)
LX (5V/div)
TIME (50us/div)
TIME (10us/div)
Page 17 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
1. Output Ripple Voltage (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)
IOUT = 1 A
IOUT = 0 A
VOUT (20mV/div)
VOUT (20mV/div)
LX (5V/div)
LX (5V/div)
TIME (20ms/div)
TIME (1us/div)
IOUT = 3 A
IOUT = 10 A
VOUT (20mV/div)
VOUT (20mV/div)
LX (5V/div)
LX (5V/div)
TIME (1us/div)
TIME (1us/div)
Page 18 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
1. Output Ripple Voltage (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Low Power Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)
IOUT = 0 A
IOUT = 10 mA
VOUT (20mV/div)
VOUT (20mV/div)
LX (5V/div)
LX (5V/div)
TIME (100us/div)
TIME (20ms/div)
IOUT = 50 mA
IOUT = 150 mA
VOUT (20mV/div)
VOUT (20mV/div)
LX (5V/div)
LX (5V/div)
TIME (20us/div)
TIME (5us/div)
Page 19 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
2. Load transient response
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)
IOUT = 10 mA to 10 A (0.5A / µs)
50mV
VOUT (50mV/div)
IOUT (5A/div)
PGOOD (10V/div)
TIME (500us/div)
IOUT = 10 mA to 10 A (0.15A / µs)
50mV
VOUT (50mV/div)
IOUT (5A/div)
PGOOD (10V/div)
TIME (500us/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Low Power Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)
IOUT = 10 mA to 150mA (0.5A / µs)
VOUT (50mV/div)
IOUT (0.1A/div)
PGOOD (10V/div)
TIME (500us/div)
IOUT = 10 mA to 150mA (0.15A / µs)
VOUT (50mV/div)
IOUT (0.1A/div)
PGOOD (10V/div)
TIME (500us/div)
Page 20 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
2. Load transient response (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)
IOUT = 10 mA to 10 A (0.5A / µs)
40mV
VOUT (50mV/div)
IOUT (5A/div)
PGOOD (10V/div)
TIME (500us/div)
IOUT = 10 mA to 10 A (0.15A / µs)
40mV
VOUT (50mV/div)
IOUT (5A/div)
PGOOD (10V/div)
TIME (500us/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Low Power Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)
IOUT = 10 mA to 150mA (0.5A / µs)
VOUT (50mV/div)
IOUT (0.1A/div)
PGOOD (10V/div)
TIME (500µs/div)
IOUT = 10 mA to 150mA (0.15A / µs)
VOUT (50mV/div)
IOUT (0.1A/div)
PGOOD (10V/div)
TIME (500µs/div)
Page 21 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
3. Efficiency
Condition : VIN = 7.4 V / 12 V / 19 V, V5 = 5 V, Switching Frequency = 430 kHz, Normal Mode,
CO = 88 µF (22 µF x 4) #Including V5 current
VOUT = 1.05 V, Lo = 1 µH
VOUT = 1.2 V, Lo = 1 µH
VOUT = 1.8 V, Lo = 1 µH
VOUT = 3.3 V, Lo = 3.3 µH
Page 22 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
3. Efficiency (Continued)
Condition : VIN = 7.4 V / 12 V / 19 V, V5 = 5 V, Switching Frequency = 430 kHz, Low Power Mode,
CO = 88 µF (22 µF x 4) #Including V5 current
VOUT = 1.05 V, Lo = 1 µH
VOUT = 1.8 V, Lo = 1 µH
VOUT = 1.2 V, Lo = 1 µH
VOUT = 3.3 V, Lo = 3.3 µH
Page 23 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
3. Efficiency (Continued)
Condition : VIN = 7.4 V / 12 V / 19 V, V5 = 5 V, Switching Frequency = 630 kHz, Normal Mode,
CO = 88 µF (22 µF x 4) #Including V5 current
VOUT = 1.05 V, Lo = 1 µH
VOUT = 1.2 V, Lo = 1 µH
VOUT = 1.8 V, Lo = 1 µH
VOUT = 3.3 V, Lo = 3.3 µH
Page 24 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
3. Efficiency (Continued)
Condition : VIN = 7.4 V / 12 V / 19 V, V5 = 5 V, Switching Frequency = 630 kHz, Low Power Mode,
CO = 88 µF (22 µF x 4) #Including V5 current
VOUT = 1.05 V, Lo = 1 µH
VOUT = 1.8 V, Lo = 1 µH
VOUT = 1.2 V, Lo = 1 µH
VOUT = 3.3 V, Lo = 3.3 µH
Page 25 of 42
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Revision. 4
Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
4. Load Regulation
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Normal Mode, LO = 1 µH, CO = 88 µF (22 µF x 4)
Frequency = 430 kHz
Frequency = 630 kHz
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Low Power Mode, LO = 1 µH, CO = 88 µF (22 µF x 4)
Frequency = 430 kHz
Frequency = 630 kHz
Page 26 of 42
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Revision. 4
Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
5. Line Regulation
Condition : V5 = 5 V, VOUT Setting = 1.05 V, Normal Mode, IOUT = 5 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
Frequency = 430 kHz
Frequency = 630 kHz
Condition : V5 = 5 V, VOUT Setting = 1.05 V, Low Power Mode, IOUT = 150 mA, LO = 1 µH, CO = 88 µF (22 µF x 4)
Frequency = 430 kHz
Frequency = 630 kHz
Page 27 of 42
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Revision. 4
Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
6. Start / Shut Down
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Normal Mode,
IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
TIME (10ms/div)
TIME (10ms/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Low Power Mode,
IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
TIME (10ms/div)
TIME (10ms/div)
Page 28 of 42
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Revision. 4
Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
6. Start / Shut Down (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Normal Mode,
IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
Time (10ms/div)
Time (10ms/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Low Power Mode,
IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
Time (10ms/div)
Time (10ms/div)
Page 29 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
6. Start / Shut Down (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V (Built-in Feed Back Resistors),
Switching Frequency = 430 kHz, Normal Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
TIME (10ms/div)
TIME (10ms/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V (Built-in Feed Back Resistors),
Switching Frequency = 430 kHz, Low Power Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
TIME (10ms/div)
TIME (10ms/div)
Page 30 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
6. Start / Shut Down (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V (Built-in Feed Back Resistors),
Switching Frequency = 630 kHz, Normal Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
Time (10ms/div)
Time (10ms/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V (Built-in Feed Back Resistors),
Switching Frequency = 630 kHz, Low Power Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
Time (10ms/div)
VOUT (0.5V/div)
Time (10ms/div)
Page 31 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
6. Start / Shut Down (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.2 V (Built-in Feed Back Resistors),
Switching Frequency = 430 kHz, Normal Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
TIME (10ms/div)
TIME (10ms/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.2 V (Built-in Feed Back Resistors),
Switching Frequency = 430 kHz, Low Power Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
TIME (10ms/div)
TIME (10ms/div)
Page 32 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
6. Start / Shut Down (Continued)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.2 V (Built-in Feed Back Resistors),
Switching Frequency = 630 kHz, Normal Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
VOUT (0.5V/div)
Time (10ms/div)
Time (10ms/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.2 V (Built-in Feed Back Resistors),
Switching Frequency = 630 kHz, Low Power Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
EN (2V/div)
EN (2V/div)
SS (2V/div)
SS (2V/div)
VOUT (0.5V/div)
Time (10ms/div)
VOUT (0.5V/div)
Time (10ms/div)
Page 33 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
7. Short Circuit Protection
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz,
LO = 1 µH, CO = 88 µF (22 µF x 4)
Normal Mode
Low Power Mode
LX (10V/div)
LX (10V/div)
SS (2V/div)
SS (2V/div)
VOUT (2V/div)
VOUT (2V/div)
IOUT (10A/div)
IOUT (1A/div)
TIME (1ms/div)
TIME (500us/div)
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz,
LO = 1 µH, CO = 88 µF (22 µF x 4)
Normal Mode
Low Power Mode
LX (10V/div)
LX (10V/div)
SS (2V/div)
SS (2V/div)
VOUT (2V/div)
VOUT (2V/div)
IOUT (10A/div)
IOUT (1A/div)
TIME (1ms/div)
TIME (500us/div)
Page 34 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
8. Switching Frequency
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, IOUT = 10 mA to 10 A,
LO = 1 µH, CO = 88 µF (22 µF x 4)
Frequency = 430 kHz
Frequency = 630 kHz
Condition : V5 = 5 V, VOUT Setting = 1.05 V, IOUT = 10 A, VIN = 4.5 V to 24 V,
LO = 1 µH, CO = 88 µF (22 µF x 4)
Frequency = 630 kHz
Frequency = 430 kHz
LX Average Frequency (MHz) Skip Mode (Freq=630kHz)
0.90
0.50
0.80
LX Average Freqency (MHz)
LX Average Frequency (MHz)
LX Average Frequency (MHz) Skip Mode (Freq=430kHz)
0.60
0.40
0.30
0.20
0.10
0.70
0.60
0.50
0.40
0.00
0.30
4
6
8
10
12
14
VIN(V)
16
18
20
22
24
4
6
8
10
12
14
VIN(V)
16
18
20
22
24
Page 35 of 42
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Product Standards
NN30332A
TYPICAL CHARACTERISTICS CURVES (Continued)
9. Thermal Performance
Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Normal Mode,
IOUT = 10 A, LO = 1 µH, CO = 88 µF (22 µF x 4)
Page 36 of 42
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Product Standards
NN30332A
APPLICATIONS INFORMATION
1. Evaluation Board Information
Condition : VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Low Power Mode
PGOOD
AGND
C-PVIN3
SS
C-BST
22
23
24
R-FB4 R-FB3 R-FB2 R-FB1
17
2
6
13
5
14
FSEL
12
C-AVIN1
C-AVIN2
C-PVIN1
VOUT
L-LX
SS
R-FB
VFB
LX
C-V5
C-V52
R-FB
C-DCDCOUT1
C-DCDCOUT2
V5
C-AVIN1
AVIN
C-AVIN2
DCDCOUT
L-LX
PGND
C-DCDCOUT1
C-DCDCOUT2
11
EN
AVIN
10
AGND
9
LP
8
C-V5
4
15
3
16
VFB
V5
VOUT
C-PVIN2
VOUT
VOUT
7
C-DCDCOUT3
C-DCDCOUT4
SS
C-SS
21
18
20
1
LX
BST
PVIN
R-PG
PVIN
19
C-BST
C-PVIN5
C-PVIN6
PVIN
Figure : layout
Figure : Application circuit
Figure : Top Layer with silk screen
(Top View) with Evaluation board
Figure : Bottom Layer with silk screen
(Bottom View) with Evaluation board
Notes) This application circuit and layout is an example. The operation of mass production set is not guaranteed. You should perform
enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the
above application circuit and information in the design of your equipment.
Page 37 of 42
Established : 2013-07-29
Revised : 2018-01-16
Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
APPLICATIONS INFORMATION (Continued)
2. Layout Recommendations
Board layout considerations are necessary for stable
operation of the DC-DC regulator. The following
precautions must be used when designing the board
layout.
AVIN
(a) The Input capacitor CIN must be placed in such a way
that the distance between PVIN and PGND is
minimum, in order to suppress the switching noise.
Stray inductance and impedance should be reduced
as indicated by loop (1) in the figure below.
(b) A single point ground connection (2) must be used to
connect PGND and AGND to improve operation
stability.
(c) Output current line IOUT and the output sense line
VOUT must have small common impedance to
reduce output load variations. Output sense line
VOUT must be close to the output condenser CO as
indicated by (3) below.
(d) Power Loss and output ripple voltage can be reduced
by placing the inductor LO and output capacitor CO
such that the stray inductance and the impedance of
loop (4) is minimum. This is realized by :
i) Minimizing distance between inductor L O and LX
pin.
ii) Reducing distance between output capacitor C O
and (2) / (3)
(e) Thick lines in the application circuit example
represent lines with large current flow. These lines
should be designed as thick as possible.
(f) VFB / SS / V5 lines should be placed far away
from LX line, BST line and inductor LO to reduce the
effects of switching noise. These lines should be
designed as short as possible. This is especially true
for the VFB line, which is a high impedance line.
(g) RFB1 / RFB2 should also be placed as far away as
possible from LX line, BST line and inductor L O to
minimize the effects of switching noise. RFB1 / RFB2
should be placed close to the VFB pin.
(h) LX / BST lines are noisy lines. They should be
designed as short as possible.
(1)
PVIN
VOUT
(3)
BST
RFB1
LO
VFB
IOUT
LX
RFB2
V5
SS
AGND PGND
CIN
CO
(4)
(2)
Figure : Application circuit diagram
Note : The application circuit diagram and layout diagram
explained in this section, should be used as reference
examples. The operation of the mass production set is
not guaranteed. Sufficient evaluation and verification is
required in the design of the mass production set. The
Customer is fully responsible for the incorporation of
the above illustrated application circuit and the
information attached with it, in the design of the
equipment.
Page 38 of 42
Established : 2013-07-29
Revised : 2018-01-16
Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
APPLICATIONS INFORMATION (Continued)
3. Recommended component
Reference Designator
QTY
Value
Manufacturer
Part Number
Note
C-AVIN1
1
0.1 µF
Murata
GRM188R72A104KA35L
—
C-AVIN2
1
1 µF
Murata
GRM21BR71H105KA12L
—
C-BST
1
0.1 µF
Murata
GRM188R72A104KA35L
—
C-DCDCOUT1
C-DCDCOUT2
C-DCDCOUT3
C-DCDCOUT4
4
22 µF
Murata
GRM31CR70J226KE19L
—
C-PVIN1
1
0.1 µF
Murata
GRM188R72A104KA35L
—
C-PVIN2, 3
2
10 µF
TAIYO
YUDEN
UMK325AB7106MM-T
—
C-SS
1
3.3 nF
Murata
GRM188R72A332KA01L
—
C-V5
1
0.1 µF
Murata
GRM188R72A104KA35L
—
C-V52
1
4.7 µF
Murata
GRM21BR71A475KA73
—
L-LX
1
1 µH
ALPS GREEN
DEVICE
GLMC1R003A
—
R-FB1
1
0
Panasonic
ERJ3GEY0R00V
—
R-FB2
1
27 k
Panasonic
ERJ3EKF2702V
—
R-RB3
1
36 k
Panasonic
ERJ3EKF3602V
—
R-FB4
1
0
Panasonic
ERJ3GEY0R00V
—
R-PG
1
100 k
Panasonic
ERJ3EKF1003V
—
Page 39 of 42
Established : 2013-07-29
Revised : 2018-01-16
Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
APPLICATIONS INFORMATION (Continued)
4. Special attention and precaution in using
This IC is intended to be used for general electronic
equipment. Ensure that the IC is used within the
recommended safe operating region illustrated by the
reference graph below. Do take note that thermal
performance may varies with PCB design and PCB
materials. You are encourage to use the graph only as
a reference for your design and discuss further with
our application engineer.
It is to be understood that our company shall not be
held responsible for any damage incurred as a result
of application beyond the recommended safe
operating region.
PKG surface Temp (Ave) = 80 deg
24
22
Vout=1.05V、fsw=430kHz
Vout=1.05V、fsw=630kHz
20
Vout=3.3V、fsw=430kHz
VIN（V）
18
Vout=3.3V、fsw=630kHz
16
14
12
10
8
6
7
7.5
8
8.5
9
9.5
10
IOUT（A）
10.5
11
11.5
12
12.5
11
11.5
12
12.5
PKG surface Temp (Ave) = 90 deg
24
22
Vout=1.05V、fsw=430kHz
Vout=1.05V、fsw=630kHz
20
Vout=3.3V、fsw=430kHz
VIN（V）
18
Vout=3.3V、fsw=630kHz
16
14
12
10
8
6
7
7.5
8
8.5
9
9.5
10
IOUT（A）
10.5
Page 40 of 42
Established : 2013-07-29
Revised : 2018-01-16
Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
PACKAGE INFORMATION
Outline Drawing
Unit : mm
Body Material
: Br / Sb Free Epoxy Resin
Lead Material
: Cu Alloy
Lead Finish Method : Pd Plating
Page 41 of 42
Established : 2013-07-29
Revised : 2018-01-16
Doc No. TA4-EA-06197
Revision. 4
Product Standards
NN30332A
IMPORTANT NOTICE
1. When using the IC for new models, verify the safety including the long-term reliability for each product.
2. When the application system is designed by using this IC, please confirm the notes in this book.
Please read the notes to descriptions and the usage notes in the book.
3. This IC is intended to be used for general electronic equipment.
Consult our sales staff in advance for information on the following applications: Special applications in which exceptional
quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body.
Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automotive, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
Our company shall not be held responsible for any damage incurred as a result of or in connection with the IC being used for
any special application, unless our company agrees to the use of such special application.
However, for the IC which we designate as products for automotive use, it is possible to be used for automotive.
4. This IC is neither designed nor intended for use in automotive applications or environments unless the IC is designated by our
company to be used in automotive applications.
Our company shall not be held responsible for any damage incurred by customers or any third party as a result of or in
connection with the IC being used in automotive application, unless our company agrees to such application in this book.
5. Please use this IC in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled
substances, including without limitation, the EU RoHS Directive. Our company shall not be held responsible for any damage
incurred as a result of our IC being used by our customers, not complying with the applicable laws and regulations.
6. Pay attention to the direction of the IC. When mounting it in the wrong direction onto the PCB (printed-circuit-board),
it might be damaged.
7. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins.
In addition, refer to the Pin Description for the pin configuration.
8. Perform visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as
solder-bridge between the pins of the IC. Also, perform full technical verification on the assembly quality, because the same
damage possibly can happen due to conductive substances, such as solder ball, that adhere to the IC during transportation.
9. Take notice in the use of this IC that it might be damaged when an abnormal state occurs such as output pin-VCC short
(Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short). Safety measures such as
installation of fuses are recommended because the extent of the above-mentioned damage will depend on the current
capability of the power supply.
10. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work
during normal operation.
Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily
exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the IC might be
damaged before the thermal protection circuit could operate.
11. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the
pins because the IC might be damaged, which could happen due to negative voltage or excessive voltage generated during
the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven.
12. Product which has specified ASO (Area of Safe Operation) should be operated in ASO
13. Verify the risks which might be caused by the malfunctions of external components.
14. Connect the metallic plates (fins) on the back side of the IC with their respective potentials (AGND, PVIN, LX). The thermal
resistance and the electrical characteristics are guaranteed only when the metallic plates (fins) are connected with their
respective potentials.
Page 42 of 42
Established : 2013-07-29
Revised : 2018-01-16
Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit
examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic
Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon
any such right owned by any other company which may arise as a result of the use of technical information de-scribed in
this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications, moreover please exchange
documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,
automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize
life or harm the human body.
Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book for
any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or
improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date
Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD,
EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do not
guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
time since first opening the packages.
(7) When reselling products described in this book to other companies without our permission and receiving any claim of
request from the resale destination, please understand that customers will bear the burden.
(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
company.
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