This product complies with the RoHS Directive (EU 2002/95/EC).
Composite Transistors
UP0121M
Silicon NPN epitaxial planar type
For switching circuits
For digital circuits
Unit: mm
+0.05
0.20 –0.02
(0.30)
(0.20)
5°
1
1.20±0.05
M
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Two elements incorporated into one package
(Emitter-coupled transistors with built-in resistor)
SSMini type package, reduction of the mounting area and assembly cost
2
3
(0.50) (0.50)
(0.20)
Features
0.10±0.02
4
1.60±0.05
5
1.00±0.05
1.60±0.05
Basic Part Number
Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
Collector-emitter voltage (Base open)
VCEO
IC
Total power dissipation
PT
Junction temperature
Tj
Storage temperature
Tstg
Unit
50
V
50
V
100
mA
125
mW
125
°C
–55 to +125
°C
1: Base (Tr1)
2: Emitter
3: Base (Tr2)
Internal Connection
on
tin
isc
Electrical Characteristics Ta = 25°C±3°C
ce
/D
Parameter
Conditions
(C1)
5
(C2)
4
Tr1
Tr2
R2
R2
47 kΩ 47 kΩ
R1
R1
2.2 kΩ 2.2 kΩ
1
2
3
(B1) (E) (B2)
Min
Typ
Max
Unit
VCBO
IC = 10 µA, IE = 0
50
V
Collector-emitter voltage (Base open)
VCEO
IC = 2 mA, IB = 0
50
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 50 V, IE = 0
0.1
µA
VCE = 50 V, IB = 0
0.5
µA
VEB = 6 V, IC = 0
0.2
mA
Ma
int
en
an
Collector-base voltage (Emitter open)
Symbol
4: Collector (Tr2)
5: Collector (Tr1)
SSMini5-F2 Package
Marking Symbol: EM
ue
Collector current
Rating
0 to 0.02
5°
0.10 max
0.55±0.05
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Display at No.1 lead
UNR221M × 2
Collector-emitter cutoff current (Base open)
ICEO
Emitter-base cutoff current (Collector open)
IEBO
Forward current transfer ratio
hFE
Collector-emitter saturation voltage
VCE(sat)
VCE = 10 V, IC = 5 mA
IC = 10 mA, IB = 0.3 mA
Output voltage high-level
VOH
VCC = 5 V, VB = 0.5 V, RL = 1 kkΩ
Ω
Output voltage low-level
VOL
VCC = 5 V, VB = 2.5 V, RL = 1 kkΩ
Ω
Input resistance
R1
Resistance ratio
R1 / R2
Transition frequency
fT
80
0.25
4.9
−30%
VCB = 10 V, IE = —2 mA, f = 200 MHz
V
V
2.2
0.2
V
+30%
k
kΩ
0.047
150
MHz
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: June 2005
SJJ00330AED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
UP0121M
UP0121M_VCE(sat)-IC
UP0121M_IC-VCE
UP0121M_PT-Ta
IC VCE
VCE(sat) IC
Collector current IC (mA)
120
80
40
IB = 1.0 mA
200
0.9 mA
0.8 mA
0.7 mA
0.6 mA
100
0.5 mA
0.4 mA
10
IC /IB = 30
1
Ta = 85°C
10−1
M
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Total power dissipation PT (mW)
Ta = 25°C
Collector-emitter saturation voltage VCE(sat) (V)
PT Ta
0.3 mA
40
80
0
120
Ambient temperature Ta (°C)
UP0121M_ hFE-IC
Forward current transfer ratio hFE
VCE = 10 V
200
Ta = 85°C
25°C
100
0
10−1
−25°C
1
10
102
103
en
int
Ma
Input voltage VIN (V)
an
ce
/D
isc
VIN IO
1
10−1
10
1
102
10
102
103
UP0121M_IO-VIN
10
102
f = 1 MHz
Ta = 25°C
IO VIN
VO = 5 V
Ta = 25°C
10
1
10−1
1
0
10
20
30
Collector-base voltage VCB (V)
103
Output current IO (mA)
2
10−2
UP0121M_Cob-VCB
VO = 0.2 V
Ta = 25°C
1
12
Collector current IC (mA)
on
tin
UP0121M_VIN-IO
10−1
8
Collector-emitter voltage VCE (V)
ue
Collector current IC (mA)
10
4
Cob VCB
Collector output capacitance
(Common base, input open circuited) Cob (pF)
hFE IC
0.2 mA
0
O
0
−25°C
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0
25°C
SJJ00330AED
40
10−1
0
1
2
Input voltage VIN (V)
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
M
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
Pl
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
