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NCEP40T20ALL
NCE N-Channel Super Trench Power MOSFET
Description
The series of devices uses Super Trench technology that is
uniquely optimized to provide the most efficient high frequency
switching performance. Both conduction and switching power
losses are minimized due to an extremely low combination of
RDS(ON) and Qg. This device is ideal for high-frequency switching
and synchronous rectification.
Application
● DC/DC Converter
●Ideal for high-frequency
switching
and
General Features
● VDS =40V,ID =250A
RDS(ON)=1.2mΩ , typical @ VGS=10V
● Excellent gate charge x RDS(on) product(FOM)
● Very low on-resistance RDS(on)
● 175 °C operating temperature
● Pb-free lead plating
100% UIS TESTED!
100% ∆Vds TESTED!
synchronous
rectification
TOLL
Schematic Diagram
Package Marking and Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
NCEP40T20ALL
NCEP40T20ALL
TO-LL
-
-
-
Absolute Maximum Ratings (TC=25℃unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
40
V
Gate-Source Voltage
VGS
±20
V
ID
250
A
Drain Current-Continuous
Drain Current-Continuous(TC=100℃)
ID (100℃)
175
A
(Note 1)
IDM
1000
A
Maximum Power Dissipation
PD
300
W
2.0
W/℃
EAS
1692
mJ
TJ,TSTG
-55 To 175
℃
RθJC
0.5
℃/W
Pulsed Drain Current
Derating factor
Single pulse avalanche energy
(Note 5)
Operating Junction and Storage Temperature Range
Thermal Characteristic
Thermal Resistance,Junction-to-Case(Note 2)
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NCEP40T20ALL
Electrical Characteristics (TC=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
40
Zero Gate Voltage Drain Current
IDSS
VDS=40V,VGS=0V
-
Gate-Body Leakage Current
IGSS
VGS=±20V,VDS=0V
Gate Threshold Voltage
VGS(th)
Drain-Source On-State Resistance
Typ
Max
Unit
-
V
-
1
μA
-
-
±100
nA
VDS=VGS,ID=250μA
2.0
3.0
3.8
V
RDS(ON)
VGS=10V, ID=100A
-
1.2
1.5
mΩ
gFS
VDS=5V,ID=100A
90
-
S
-
5834.6
-
PF
-
2320.5
-
PF
-
70
-
PF
-
14.5
-
nS
Off Characteristics
On Characteristics
(Note 3)
Forward Transconductance
Dynamic Characteristics
(Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Switching Characteristics
VDS=20V,VGS=0V,
F=1.0MHz
Crss
(Note 4)
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
VDD=20V,ID=100A
-
8
-
nS
td(off)
VGS=10V,RG=1.6Ω
-
58
-
nS
-
10
-
nS
-
91
-
nC
-
29.4
nC
-
19
nC
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=20V,ID=100A,
VGS=10V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
Diode Forward Current
(Note 2)
Reverse Recovery Time
Reverse Recovery Charge
VSD
VGS=0V,IS=100A
IS
trr
TJ = 25°C, IF = IS
di/dt = 100A/μs
Qrr
(Note3)
-
1.2
V
-
-
250
A
-
-
38
nS
-
-
125
nC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
5. EAS condition : Tj=25℃,VDD=20V,VG=10V,L=0.5mH,Rg=25Ω
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NCEP40T20ALL
ID- Drain Current (A)
Normalized On-Resistance
Typical Electrical and Thermal Characteristics
TJ-Junction Temperature(℃)
Vds Drain-Source Voltage (V)
Figure 4 Rdson-Junction Temperature
ID- Drain Current (A)
Vgs Gate-Source Voltage (V)
Figure 1 Output Characteristics
Vgs Gate-Source Voltage (V)
Qg Gate Charge (nC)
Figure 5 Gate Charge
Rdson On-Resistance(mΩ)
Is- Reverse Drain Current (A)
Figure 2 Transfer Characteristics
ID- Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson- Drain Current
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Figure 6 Source- Drain Diode Forward
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Capacitance (pF)
Power Dissipation (W)
NCEP40T20ALL
TJ-Junction Temperature(℃)
Figure 7 Capacitance vs Vds
Figure 9 Power De-rating
ID- Drain Current (A)
ID- Drain Current (A)
Vds Drain-Source Voltage (V)
TJ-Junction Temperature (℃)
Figure 8 Safe Operation Area
Figure 10 Current De-rating
r(t),Normalized Effective
Transient Thermal Impedance
Vds Drain-Source Voltage (V)
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
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NCEP40T20ALL
TOLL Package Information
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NCEP40T20ALL
Attention:
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Any and all NCE power products described or contained herein do not have specifications that can handle applications that
require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications
whose failure can be reasonably expected to result in serious physical and/or material damage. Consult
with your NCE power representative nearest you before using any NCE power products described or contained herein in
such applications.
NCE power assumes no responsibility for equipment failures that result from using products at values
that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters)
listed in products specifications of any and all NCE power products described or contained herein.
Specifications of any and all NCE power products described or contained herein stipulate the performance, characteristics,
and functions of the described products in the independent state, and are not guarantees of the performance, characteristics,
and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states
that cannot be evaluated in an independent device, the customer should always evaluate and test
devices mounted in the customer’s products or equipment.
NCE power Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could
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Any and all information described or contained herein are subject to change without notice due to
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This catalog provides information as of Sep.2010. Specifications and information herein are subject to change without notice.
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