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NX3215SA-32.768kHz-EXS00A-MU00202

NX3215SA-32.768kHz-EXS00A-MU00202

  • 厂商:

    NDK(日电)

  • 封装:

    SMD3215_2P

  • 描述:

    无源晶振 SMD3215_2P

  • 数据手册
  • 价格&库存
NX3215SA-32.768kHz-EXS00A-MU00202 数据手册
Document No. EXS10B-16050 1/11 SPECIFICATION Customer: Receipt Item: CRYSTAL UNIT Type: NX3215SA Nominal Frequency: 32.768kHz Customer’s Spec. No.: NDK Spec. No.: --EXS00A-MU00202 Charge: Sales NDK-TP:Lilian Chiu Engineer 1st Eng. Dept.: Hasuike Tel. 886-2-2555-0232 Tel. 81-(0)4-2900-6632 Approved H.Matsudo Checked --- Drawn Y.Hasuike Revision Record Rev. Rev. Date Items Contents Remarks --- 14.Nov.2011 Issued --- --- NIHON DEMPA KOGYO CO., LTD. Form P-1B Document No. EXS10B-16050 2/11 1. Customer specifications number : --- 2. NDK specification number : EXS00A-MU00202 3. Type : NX3215SA 4. Electrical characteristics 4.1. Nominal Frequency (F0) 4.2. Overtone Order 4.3. Adjustment tolerance(at +25°C) 4.4. Turning Point 4.5. Temperature coefficient 4.6. Equivalent Resistance (RR) 4.7. Shunt Capacitance (C0) 4.8. Motional Capacitance (C1) 4.9. Insulation Resistance 5. Measurement circuit 5.1. Frequency measurement ・Measuring instrument ・Load capacitance (CL) ・Level of drive 5.2. Equivalent resistance measurement ・Measuring instrument ・Load capacitance (CL) ・Level of drive 6. Other performances 6.1. Operating Temperature range 6.2. Storage Temperature range 6.3. Maximum drive level 6.4 Aging (at +25 C) : 32.768 kHz : Fundamental : 20 10-6 Max.(No include aging ) : +25C5C : -0.0410-6 / C2 Max. : 70 kΩ Max. : 1.0  0.5 pF : 4.0  2.0 fF :Terminal to terminal insulation resistance also terminal to cover insulation resistance must be 500M (Min.) when DC100V 15V is applied. : Network Analyzer (CNA-LF made in Transat corp.) : 7.0pF : 0.1 W : Network Analyzer (CNA-LF made in Transat corp.) : Series : 0.1 W : - 40 to + 85C : - 40 to + 125C : 0.5 W Max. : 3 ×10-6 Max. / 1 year 7. Examination results document Since a performance is guaranteed, an examination results document does not submit. 8. Storage conditions 8.1. It is not dropping a 2nd-packing box or not pushing and crushing in the case of storage. 8.2. Direct rays are avoided and they are room temperature and humidity (dehumidification environment is desirable if it can do). 8.3. A storage term should give half a year as a standard (even if it passes a storage term, there is no rapid degradation). NIHON DEMPA KOGYO CO., LTD. Form P-3B Document No. EXS10B-16050 3/11 9. Application drawing 9.1. Dimension drawing 9.2. Taping and reel figure 9.3. Holder marking 9.4. Reel Packing 9.5. Structural Drawing 9.6. Reliability assurance Item 9.7. Quality Control Process Flow Chart : EXD14B-00462 : EXK17B-00302 : EXH11B-00422 : EEK17B-00015 : EXD13B-00243 : EXS30B-00661 : EXQ11B-00387 10. Notice 10.1 Order items are manufactured according to specification. As to conditions, which are not indicated in t his specification and unpredictable such as applied condition and oscillation margin, please check them beforehand. 10.2 Unless we receive request for modification within 3 weeks from the issue date of this NDK specification sheet, we will supply products according to this specification. Also, if you’d like to modify specification of order, which has been placed with delivery request within 3 weeks from the issue data of this specification sheet, we would like to discuss with you separately. 10.3 In no event shall the company be liable for any product failure resulting from an inappropriate handling or operation of the product beyond the scope of its guarantee. 10.4 Where any change to the process condition is made due to the change(s) in the production line, inform personnel of the specifications. 10.5 Should this specification data give rise to any disputes relating to any intellectual property rights or any other rights of a third person, the company shall not indemnify anyone for any damage. Their disclosure must not be construed as the grant of a license to use any of the intellectual property rights owned by the company. 10.6 If you intend to use products listed on this specification for applications that may result in loss of life or assets (controls relating to safety, medical equipment, aeronautical equipment, space equipment, etc.), please do not fail to advise us of your intention beforehand. 10.7 In the company’s production process whatever amount of ozone depleting substances (ODS) as s pecified in the Montreal protocol is not used. 10.8 Information contained in this specification must not be quoted, reproduced or used for other purposes including processing either in part or in full without obtaining prior approval from the company. 11. Prohibited items Be sure to use the product under the following conditions. Otherwise, the characteristics deterioration or destruction of the product may result. (1)Reflow soldering heat resistance Peak temperature: 265C, 10 sec Heating: 230C or higher, 30 sec Preheating: 150C to 180C, 120 sec Reflow passage times: Two times (2)Manual soldering heat resistance Pressing a soldering iron of 400C on the terminal electrode for four seconds (twice). NIHON DEMPA KOGYO CO., LTD. Form P-3B Document No. EXS10B-16050 4/11 Cover:Metal Base:Ceramics INTERNAL CONNECTION (TOP VIEW) Recommended soldering pattern Date of Revise A 18.Dec.2009 Charge Miyahara Approved K.Ueki Reason Add bilingual Date Name Third Angle Projection Tolerance Drawn 30.Aug.2009 単位:mm ±0.2 Designed Checked 30.Aug.2009 Approved 30.Aug.2009 Miyahara Miyahara --K. Ueki --- Title Drawing No. NX3215SA EXD14B-00462 External Dimension NIHON DEMPA KOGYO CO., LTD. Scale 10 / 1 Rev. A Form M-1 Document No. EXS10B-16050 5/11 TOP TAPE material : polyethylene terephthalate 40.0 0.15(4×10P) 4.0 0.1 +0.1 1.5 0 2.0 0.1 1.7 0.1 1.0 0.1 4.0 0.1 1.0 0.1 3215 TYPE HOLDER DIRECTION OF UNIT TAPING material: Conductive PS NA NA NA 3 max 12.0 0.3 0.3 0.05 3.4 0.1 5.5 0.05 1.75 0.1 PULL DIRECTION 2.0 0.2 0.2 +1 60 -0 180 -3 +0 10.5 0.4 13.0 LABEL REEL QTY. 13.0 0.3 15.4 1.0 3,000 PCS Date of Revise Charge Date Name Drawn 23.Jun.2009 Miyahara Designed Checked 23.Jun.2009 --- Miyahara --- Approved 23.Jun.2009 K. Ueki Approved Reason Third Angle Projection Dimension:mm Title Tape and Reel Spec. Tolerance Drawing No. Scale / Rev. EXK17B-00302 NIHON DEMPA KOGYO CO., LTD. Form M -1 Document No. EXS10B-16050 6/11 Trace code(Product data and Line number) #2 #1 Month Code (See Table) Year Code (Last One Digit) Frequency Code Manufacture's Symbol #2 #1 NOTE 1. Month Code Month Month Code 1 Jan. 2 3 Feb. Mar. 1 2 3 4 Apr. 5 6 May June 4 5 6 7 July 7 8 9 Aug. Sep. 8 9 10 Oct. 11 12 Nov. Dec. X Y Z 2. Frequency Code A : 32.768kHz 3. Marking Method Marking Method is Laser Triming. Date of Revise Date Drawn 28.OCt.2009 Designed Checked 28.OCt.2009 Approved 28.OCt.2009 -- Charge Name Miyahara Miyahara -Ueki Approved Reason Third Angle Projection Dimension:mm Title Tolerance Drawing No. NX3215SA Marking Drawing Scale / Rev. EXH11B-00422 NIHON DEMPA KOGYO CO., LTD. Form M-1 Document No. EXS10B-16050 7/11 Spacer φ180 reel Pasteboard Shock pad 154 Outer box Label 21 0 B Date of Revise 19 May 2011 0 21 Charge H.Ohkubo Date Name Drawn 26 Feb. 2010 Designed Checked 26 Feb. 2010 26 Feb. 2010 H. Ohkubo K.Oguri K.Oguri Approved 26 Feb. 2010 J. Nakamura Approved Reason K.Oguri Correction of a clerical error. Third Angle Projection Tolerance Dimension:mm --------Title 180 dia. Reel package Drawing No. EEK17B-00015 Scale --------Rev. B NIHON DEMPA KOGYO CO., LTD. Form M-1 Document No. EXS10B-16050 8/11 Seal No. Seam weld Material Part 1 Lid 2 Base 3 Base 4 Blank Mass(Reference: Typ.) Part No. Kover Ni plating Ceramic / Al2O3 Kover ring kover Au plating Ni pre-plating Crystal (Si02) Date of Revise Charge Approved --- --- --- Terminal 6 Conductive adhesive 7 8 Electrode Silicon + Ag filer Au Cr Reason --- Name Third Angle Projection Drawn 14. Jul. 2011 mm Designed Checked Approved 14. Jul. 2011 Y.Hasuike Y.Hasuike --H.Matsudo 14. Jul. 2011 Tungsten Au plating (0.3 to 1.0μm) Ni pre-plating(1.27 to 8.89μm) 5 Date --- 0.0129g Material 名称/Title Tolerance ---Drawing No. NX3215SA Structural Drawing EXD13B-00243 Scale -/Rev. --- NIHON DEMPA KOGYO CO., LTD. Form M--1 Document No. EXS10B-16050 9/11 Reliability assurance item Test Methods (page: 1/2) Specification Code No. Test Item 1 AGING 1 year at 25 C +/- 3C a 2 HEAT RESISTANCE at +85 C for 500 hours. a 3 COLD RESISTANCE at –40 C for 500 hours. a 4 HUMIDITY at +85 C with 80 to 85 % RH for 500 hours. a Temperature cycle as shown in (Fig.1) for 100 cycle. 30 minutes 5 THERMAL SHOCK +85 C +/- 3 C a 30 minutes -40 C +/- 3 C 6 VIBRATION 7 SHOCK 1 8 SHOCK 2 9 SOLDERABILITY 10 REFLOW RESISTANCE ONE CYCLE (Fig.1) Frequency Range : 10 to 2000Hz Amplitude or Acceleration : 1.52 mm or 196m/s2 1 cycle : 20 minutes Test time : Three mutually perpendicular axes each 12 times. Shock : 3000 Gs 0.3 msec. Test time : Six mutually perpendicular axes each 1 times. Shock : Device are put on the weight of 200 g and dropped on concrete board. Height : 1.5 m Drop times : Six mutually perpendicular axes each 10 times. Residual heat temperature 150 C Residual heat time 60 to 120 sec Peak temperature 240C (more than 215 C 10 to 30 sec) Temperature cycle as shown in (Fig2.) for 3 cycle. Specification code a b c a a b c a Specification dF/F  +/- 5ppm dCI  +/- 5 kohm dF/F  +/- 15ppm dCI  +/- 5 kohm The electrodes shall acquire a new solder coat over at least 90 % of immersed area. Reliability assurance item: EXS30B-00661A NIHON DEMPA KOGYO CO., LTD. Form M-3 Document No. EXS10B-16050 10/11 (page: 2/2) C 260 C 230 C B 100 C A 0 50 100 150 200 SEC. Fig.2 REFLOW A: 150 to 180 C ( 60 to 120 sec. ) B: 230 C min. ( 30 sec. max. ) C: PEAK-TEMP. 260 C +/- 5 C ( 10sec. max. ) Reliability assurance item: EXS30B-00661A NIHON DEMPA KOGYO CO., LTD. Form M-3 Document No. EXS10B-16050 11/11 Date QA Dept Approved Checked EXQ11B-00387 Product Group: Crystal Unit Type:NX3215SA Factory: NDK Process Flow Chart Cover Base Wafer Process Name --- M.Morimoto Department N.Ohira Check Item Test Item Control Item Control Method --- --- --- --- Furukawa NDK Visual, Confirmation of the data Frequency, Dimension Base incoming Inspection (Check sampling) Ditto Visual, Confirmation of the data Dimension, Appearance Insulation Cover incoming Inspection (Check sampling) Ditto Visual, Confirmation of the data Dimension, Appearance Cover degassing Ditto Annealing Oven Temperature, Time Chip break Ditto Chip break jig Pressure Base cleaning Ditto Blow & Vacuum M/C Pressure Support & Bonding Ditto Support bonding M/C Curing and baking Ditto Tunnel type oven 9 Turn-over Ditto Turn-over M/C Pressure 10 Frequency adjustment Ditto Frequency adjustment M/C Vacuum rate Pressure 11 Frequency check & Turn-over Ditto Freq. check M/C Turn-over M/C 1st Sealing Ditto 2 3 4 5 6 7 8 12 K.Kubota Machine, Device Jig, Tools Wafer incoming Inspection (Check sampling) 1 3.Dec.2008 st 1 . Engineering Dept. Approved Checked Drawn Bonding position Bonding volume Belt speed Temperature O2 Density M.Sato Standards/ Specification --- Blank Incoming Once / lot Inspection Standards Components Incoming Once / lot Inspection Standards Components Incoming Once / lot Inspection Standards Every A,B time Once / A,B day Once / day A,B 100% A,B Once / day A,B Once / day Once / day 100% A,B,D Pressure Once / day A,B Current 100% A,B O2 Density, Dew point Once / day A,B Pressure Once / day A,B Current 100% A,B Vacuum rate Temperature Once / day A,B Unit loading Ditto Loading M/C 14 Annealing & 2nd Sealing Ditto Annealing & Sealing M/C 15 Reflow (100%) Ditto Reflow oven Belt speed Temperature Once / day A,B 16 He pressure (100%) Ditto He pressure tub Pressure Time Once / day A,B 100% A,B,D 100% Once / day A,B,D Auto inspection M/C Product inspection & Ditto Laser marking M/C Taping Taping M/C 18 19 20 Confirmation inspection (Sampling) Ditto Quality Guarantee inspection (Checking) Ditto Packing & Shipping Ditto Network analyzer TC measurement system Quality confirmation sheet Visual Quality confirmation sheet Visual Frequency, ESR, Insulation, C0 Content of marking Temperature Taping strength Working procedure B Process control tag C Design sheet D Individual specificati on sheet A,B,D 13 17 A A,B Frequency Sealing M/C Remarks A,B Frequency, ESR, C0, Temp. characteristics Once / QN A,B,D Dimension, Appearance, Frequency, ESR, C0, Temp. characteristics Once / QN A,B,D Packing appearance Quantity Contents of label 100% A,B,D NIHON DEMPA KOGYO CO.,LTD. Digital format:H-6A
NX3215SA-32.768kHz-EXS00A-MU00202 价格&库存

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NX3215SA-32.768kHz-EXS00A-MU00202
  •  国内价格
  • 1+2.35030
  • 10+1.66731
  • 30+1.30875
  • 100+1.11165
  • 500+1.01704
  • 1000+0.96185

库存:0

NX3215SA-32.768KHZ-EXS00A-MU00202
  •  国内价格
  • 1+2.02860

库存:0