NX5032GA-8.000M-STD-CSU-1

Document No. EXS10B-19134 1/9 SPECIFICATION Customer: Receipt Item: Crystal Unit Type: NX5032GA Frequency 8.000 MHz Customer’s Spec. No.: NDK Spec. No.: STD-CSU-1 Charge: Sales 1st Eng. Dept. K.Nakashima Engineer Tel. (81)-4-2900-6631 Approved H.Kobayashi Checked --- Drawn K.Nakashima Revision Record Rev. Rev. Date Items Contents Remarks --- 16. Apr. 2013 Issue --- --- NIHON DEMPA KOGYO CO., LTD. Form P-1B Document No. EXS10B-19134 2/9 1.Customer specifications number 2.NDK specification number 3.Type 4.Electrical characteristics 4.1 Nominal frequency 4.2 Overtone order 4.3 Frequency tolerance 4.4 Frequency versus temperature characteristics 4.5 Equivalent resistance 4.6 Maximum level of drive 4.7 Insulation resistance 5. Measurement circuit 5.1 Frequency measurement *Measuring instrument * Load capacitance(CL) *Level of drive 5.2 Equivalent resistance measurement * Measuring instrument * Load capacitance(CL) *Level of drive 6. Other performances 6.1 Storage temperature range 6.2 Air-tightness : : STD-CSU-1 : NX5032GA : 8.000 MHz : Fundamental : 5010-6max. (+25 C) : 15010-6max. (-40~+150 C) The reference temperature shall be 25C : 300max. : 500Wmax. : Terminal to terminal insulation resistance also terminal to cover insulation resistance must be 500M (min) when DC100V 15V is applied. : -Network : 8pF : 10W : -Network : Series : 10W : -40~+150C : Less than 310-9Pa m3/s (Helium leak detector) 7. Examination results document Since a performance is guaranteed, an examination results document does not submit. 8. Application drawing 8.1 External dimension 8.2 Taping and reel figure 8.3 Holder marking 8.4 Reliability assurance Item 8.5 Recommendation reflow profile : EXD14B-00016 : EXK17B-00027 : EXH11B-00142 : EXS30B-00396 : EXS30B-00344 NIHON DEMPA KOGYO CO., LTD. Form P-3B Document No. EXS10B-19134 3/9 9. Notice 9.1. Order items are manufactured according to specification. As to conditions, which are not indicated in this specification and unpredictable such as applied condition and oscillation margin, please check them beforehand. 9.2. Crystal units will be damaged by ultrasonic welding process due to resonance of crystal wafer itself. NDK does not recommend using ultrasonic welding. If Ultra Sonic welding used, NDK strongly recommend verifying crystal unit damage by ultrasonic weld. 9.3.Unless we receive request for modification within 3 weeks from the issue date of this NDK specification sheet, we will supply products according to this specification. Also, if you’d like to modify specification of order, which has been placed with delivery request within 3 weeks from the issue data of this specification sheet, we would like to discuss with you separately. 9.4. In no event shall the company be liable for any product failure resulting from an inappropriate handling or operation of the product beyond the scope of its guarantee. 9.5. Where any change to the process condition is made due to the change(s) in the production line, inform personnel of the specifications. 9.6. Should this specification data give rise to any disputes relating to any intellectual property rights or any other rights of a third person, the company shall not indemnify anyone for any damage. Their disclosure must not be construed as the grant of a license to use any of the intellectual property rights owned by the company. 9.7. If you intend to use products listed on this specification for applications that may result in loss of life or assets (controls relating to safety, medical equipment, aeronautical equipment, space equipment, etc.), please do not fail to advise us of your intention beforehand. 9.8. In the company’s production process whatever amount of ozone depleting substances (ODS) as specified in the Montreal protocol is not used. 9.9. Information contained in this specification must not be quoted, reproduced or used for other purposes including processing either in part or in full without obtaining prior approval from the company. 9.10. The appearance color has a different case by purchasing it more than 2 suppliers of the component, but characteristic and reliability are guaranteed. 10. Prohibited items Be sure to use the product under the following conditions. Otherwise, the characteristics deterioration or destruction of the product may result. (1)Reflow soldering heat resistance Peak temperature: 265C, 10 sec Heating: 230C or higher, 40 sec Preheating: 150C to 180C, 120 sec Reflow passage times: twice (2)Manual soldering heat resistance Pressing a soldering iron of 400C on the terminal electrode for four seconds (twice). When using a soldering iron, press its tip on the part below the sealed part, avoiding the glass-sealed part (otherwise, the glass will melt and air-tightness may be lost). NIHON DEMPA KOGYO CO., LTD. Form P-3B Document No. EXS10B-19134 4/9 0.2 0.2 3.2 0.2 5.0 1.3 Cover Alumina Ceramics Base 1.0 0.2 2.0 0.2 Alumina Ceramics Terminal 1.3 0.2 1.3 0.2 4-(R0.2) Tungsten Metalize (Au plating on Ni pre plating) Au plating(0.3 1.0 m), Ni pre plating(1 9 m) PIN CONNECTION [TOP VIEW] 2.4 REFERRENCE LAND PATTERN (TYPICAL) 2.0 E Date of Revise 15.Sep.2006 2.0 Charge N.Yamamoto Date Name Drawn 19.Mar.1999 Designed Checked 19.Mar.1999 Approved 19.Mar.1999 Y.Morizumi Y.Morizumi M.Miura M.Okamoto 19.Mar.1999 2.0 Approved Reason K.Kubota Change reference land pattern size Third Angle Projection Tolerance Dimension:mm Title NX5032GA External Dimension Drawing No. EXD14B-00016 Scale / Rev. E NIHON DEMPA KOGYO CO., LTD. Form M-1 Document No. EXS10B-19134 5/9 4.0 1.75 0.1 +0.1 1.5 -0 40.0 0.15 0.1 (ACCUMULATION TOLERANCE 4.0 10POINT) 2.0 +0.1 1.5 -0 0.1 0.1 0.2 0.2 9.1 12.0 0.1 5.4 (5.5) 3.5 0.05 0.1 0.1 5.5 8.0 0.3 1.4 0.1 NX5032GA,GB,GC HOLDER (3.6) TAPING 2.0 0.2 0.2 +1 60 -0 180 -3 +0 10.5 0.4 13.0 LABEL REEL QTY. 13.0 0.3 15.4 1.0 1000 PCS C Date of Revise 19.Dec.2008 Charge K.Oguri Date Name Drawn 13.Jul.1999 Y.Morizumi Designed Checked 13.Jul.1999 Y.Morizumi ---------- ---------- Approved 13.Jul.1999 M.Okamoto Approved Reason K.Miyashita Addition of NX5032GB, GC Third Angle Projection Tolerance Dimension:mm Title Crystal Holder Packing Drawing No. EXK17B-00027 Scale / Rev. C NIHON DEMPA KOGYO CO., LTD. Form M-1 Document No. EXS10B-19134 6/9 Month Code (SEE NOTE 2) Year Code (Last One Digit) Holder Administrative Symbol(SEE NOTE 3) Manufacture's Symbol Frequency Code (SEE NOTE 1) NOTE 1. Frequency Code Marking Frequency is consist of five digits, first five digits of Nominal Frequency Example Nominal Frequency 28.636363 MHz 28.636 Frequency Code 2. Month Code Table 1 Month 2 3 4 5 6 Jan. Feb. Mar. Apr. May. Jun. Month Code 1 2 3 4 5 6 7 Jul. 7 8 9 10 Aug. Sep. Oct. 8 9 11 12 Nov. Dec. X Y Z 3. Marking contents Administrative symbol S *Marking digits are not include a decimal point and dot mark. B Date of Revise 20.Sep.2005 Charge N.Fukurai Date Name Drawn 16.Jul.2002 Designed Checked 16.Jul.2002 Approved 16.Jul.2002 Y.Sakurai Y.Sakurai M.Miura T.Ishii 16.Jul.2002 Approved Reason K.Kubota Change Representation Third Angle Projection Tolerance Dimension:mm Title Crystal Holder Marking Drawing No. EXH11B-00142 Scale / Rev. B NIHON DEMPA KOGYO CO., LTD. Form M-1 Document No. EXS10B-19134 7/9 Reliability assurance item No. Test item Test methods Devices are dropped from the height 75 cm onto iron plate. Execution 3 times random drops. Acceleration: 49000 m/s2 Duration: 0.15 ms Half-Sine pulse 1 Shocks in 6 mutually perpendicular planes, Total 6 shocks Frequency range: 10 to 2000 Hz 1 Drop 2 Shock 3 Vibration 4 Electrode adherent strength Amplitude or Acceleration: 1.52 mm or 196 m/s2 (page: 1/2) Spec. code A A Sweep time: 20 min Test time: 4 h×3 A See remark (1) B Pre-heat temperature Pre-heat Time Peak temperature 215 °C Over time Pre-heat temperature Pre-heat time Test temperature Test time : 150 °C : 60 ~ 120 s : 240 ± 5 °C : 10 ~ 30 s : 150 C : 60  120 s : 260  5 C : 10  1 s 5 Solderability 6 Resistance to soldering heat 7 Resistance to cold Leave at -40±2 °C for 1000 h A 8 Resistance heat A 9 Humidity to Leave at +150±2 °C for 1000 h Device are left in temperature at +85±2 °C with relative humidity of 80~85 % for 1000 h Device are left into the following temperature cycle as shown in (Figure1) for 1000 consecutive cycle. C A,B A,D 1cycle 150±5 °C 10 Thermal shock 25 °C A,B -40±5 °C 30 min 30 min (Figure1) Reliability assurance item: EXS30B-00396 E NIHON DEMPA KOGYO CO., LTD. Form M-3 Document No. EXS10B-19134 8/9 Reliability assurance item (page: 2/2) Spec. code A B C D Specification Frequency tolerance and series resistance should be cleared. After testing unless cracking of materials view of eyes and unless break of seal. The leads shall acquire a new solder coat cover at 90 % of immersed area. Insulation resistance shall be greater than 500 MΩ Remark (1) Electrode adherent strength. 1) Test method condition Using the solder, soldering Iron or reflow soldering bath shall be used for soldering on test fixture (Glass fiber epoxy laminate : Thickness 1.6mm+/-0.2mm) shown below. Crystai units Pressure 5N 10 1second Ditch Glass fiber epoxy laminate 2) Specified value No peel of electrode, no crack, no other abnormality Reliability assurance item: EXS30B-00396 E NIHON DEMPA KOGYO CO., LTD. Form M-3 Document No. EXS10B-19134 9/9 Recommendation reflow condition 1.IR reflow condition 2605 250 M A.X 10s Over 230 200 TEMP . 150 180 150 100 60s120s 3010 s 50 0 TIM E s) ( Reliability assurance item: EXS30B-00344 B NIHON DEMPA KOGYO CO., LTD. Form M-3