2SD560

2SD560

  • 厂商:

    NEC(日电电子)

  • 封装:

  • 描述:

    2SD560 - NPN SILICON EPITAXIAL TRANSISTOR (DARLINGTON CONNECTION) FOR LOW-FREQUENCY POWER AMPLIFIERS...

  • 详情介绍
  • 数据手册
  • 价格&库存
2SD560 数据手册
DATA SHEET SILICON POWER TRANSISTOR 2SD560 NPN SILICON EPITAXIAL TRANSISTOR (DARLINGTON CONNECTION) FOR LOW-FREQUENCY POWER AMPLIFIERS AND LOW-SPEED SWITCHING The 2SD560 is a mold power transistor developed for lowfrequency power amplifiers and low-speed switching. This transistor is ideal for direct driving from the IC output of devices such as pulse motor drivers and relay drivers, and PC terminals. ORDERING INFORMATION Ordering Name 2SD560 Package TO-220AB FEATURES • C-to-E reverse diode inserted • Low collector saturation voltage (TO-220AB) ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current (DC) Collector current (pulse) Base current (DC) Total power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC(DC) IC(pulse) IB(DC) PT Tj Tstg TC = 25°C TA = 25°C PW ≤ 10 ms, duty cycle ≤ 50% Conditions Ratings 150 100 7.0 ±5.0 ±8.0 0.5 30 1.5 150 −55 to +150 Unit V V V A A A W W °C °C INTERNAL EQUIVALENT CIRCUIT 1. Base 2. Collector 3. Emitter The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. D14863EJ3V0DS00 (3rd edition) Date Published April 2002 N CP(K) Printed in Japan © 2002 1998 2SD560 ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Collector cutoff current DC current gain Symbol ICBO hFE1 hFE2 Collector saturation voltage Base saturation voltage Turn-on time Storage time Fall time VCE(sat) VBE(sat) ton tstg tf Conditions VCB = 100 V, IE = 0 A VCE = 2.0 V, IC = 3.0 A VCE = 2.0 V, IC = 5.0 A IC = 3.0 A, IB = 3.0 mA Note MIN. TYP. MAX. 1.0 Unit µA 2,000 500 6,000 15,000 Note Note 0.9 1.6 1.0 3.5 1.2 1.5 2.0 V V IC = 3.0 A, IB = 3.0 mANote IC = 3.0 A, RL = 16.7 Ω, IB1 = −IB2 = 3.0 mA, VCC ≅ 50 V Refer to the test circuit. µs µs µs Note Pulse test PW ≤ 350 µs, duty cycle ≤ 2% hFE CLASSIFICATION Marking hFE1 MB 2,000 to 5,000 LB 3,000 to 7,000 KB 5,000 to 15,000 SWITCHING TIME (ton, tstg, tf) TEST CIRCUIT Base current waveform Collector current waveform 2 Data Sheet D14863EJ3V0DS 2SD560 TYPICAL CHARACTERISTICS (TA = 25°C) Total Power Dissipation PT (W) With infinite heatsink (Tc = 25°C) Without heatsink Collector Current IC (A) Heatsink’: 2.0 mm Aluminum, bpard No insulating boad Silicon brease coating Horizontal level Single pulse Temperature T (°C) Collector to Emitter Voltage VCE (V) Pulse test Collector Current IC (A) DC Current Gain hFE Collector Current IC (A) Collector to Emitter Voltage VCE (V) Base Saturation Voltage VBE(sat) (V) Collector Saturation Voltage VCE(sat) (V) Pulse test Collector Current IC (A) Data Sheet D14863EJ3V0DS 3 2SD560 PACKAGE DRAWING (UNIT: mm) 1. Base 2. Collector 3. Emitter 4. Fin (collector) 4 Data Sheet D14863EJ3V0DS 2SD560 [MEMO] Data Sheet D14863EJ3V0DS 5 2SD560 • The information in this document is current as of July, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4
2SD560
物料型号: - 型号:2SD560 - 封装:TO-220AB

器件简介: 2SD560是一款由NEC公司开发的NPN硅外延晶体管(达林顿连接),适用于低频功率放大器和低速开关应用。这款晶体管非常适合直接从脉冲电机驱动器、继电器驱动器和PC终端等设备的IC输出驱动。

引脚分配: - 1. 基极(Base) - 2. 集电极(Collector) - 3. 发射极(Emitter)

参数特性: - 集电极到基极电压(Vcbo):150V - 集电极到发射极电压(Vceo):100V - 发射极到基极电压(Vebo):7.0V - 集电极电流(DC):±5.0A - 集电极电流(脉冲):+8.0A(脉宽≤10ms,占空比≤50%) - 基极电流(DC):0.5A - 总功耗:30W(Tc=25°C),1.5W(TA=25°C) - 结温:150°C - 存储温度:-55至+150°C

功能详解: 2SD560具有内置的C到E反向二极管和低集电极饱和电压的特点。其电气特性包括集电极截止电流(IcBo)、直流电流增益(hFE1和hFE2)、集电极饱和电压(Vce(sat))、基极饱和电压(Vbe(sat))、开通时间(ton)、存储时间(tstg)和下降时间(tfall)。

应用信息: 2SD560适用于计算机、办公设备、通信设备、测试和测量设备、音视频设备、家用电器、机床、个人电子设备和工业机器人等“标准”质量等级的应用。

封装信息: 该型号采用TO-220AB(MP-25)封装。
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