DATA SHEET
NPN SILICON GERMANIUM RF TRANSISTOR
NESG240034
NPN SiGe RF TRANSISTOR FOR UHF-BAND, LOW NOISE, LOW DISTORTION AMPLIFICATION 3-PIN POWER MINIMOLD (34 PKG)
FEATURES
• The device is an ideal choice for low noise, low distortion amplification. NF = 0.7 dB TYP. @ VCE = 5 V, IC = 15 mA, f = 1 GHz • PO (1 dB) = 24 dBm TYP. @ VCE = 5 V, IC (set) = 40 mA, f = 1 GHz • OIP3 = 35.5 dBm TYP. @ VCE = 5 V, IC (set) = 40 mA, f = 1 GHz • Maximum stable power gain: MSG =11.5 dB TYP. @ VCE = 5 V, IC = 40 mA, f = 1 GHz • SiGe HBT technology (UHS2) : fT = 10.0 GHz • This product is improvement of ESD of NESG2xxx series. • 3-pin power minimold (34 PKG)
ORDERING INFORMATION
Part Number NESG240034 Order Number NESG240034-A Package 3-pin power minimold (34 PKG) (Pb-Free) NESG240034-T1 NESG240034-T1-A Quantity 25 pcs (Non reel) 1 kpcs/reel • 12 mm wide embossed taping • Pin 2 (Collector) face the perforation side of the tape • Magazine case Supplying Form
Remark To order evaluation samples, please contact your nearby sales office. Unit sample quantity is 25 pcs.
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
Document No. PU10769EJ02V0DS (2nd edition) Date Published November 2009 NS Printed in Japan
The mark shows major revised points.
2009
The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field.
NESG240034
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Parameter Collector to Base Voltage Collector to Emitter Voltage Collector to Emitter Voltage Base Current
Note 1
Symbol VCBO VCES VCEO IB IC Ptot
Note 2
Ratings 5.5 13 5.5 36 400 886 150 −65 to +150
Unit V V V mA mA mW °C °C
Collector Current
Total Power Dissipation Junction Temperature Storage Temperature
Tj Tstg
Notes 1. Depend on the ESD protect device. 2. Mounted on 3.8 cm × 9.0 cm × 0.8 mm (t) glass epoxy PWB
THERMAL RESISTANCE (TA = +25°C)
Parameter Symbol Rthj-a Ratings 141 Unit °C/W
Termal Resistance from Junction to Note Ambient
Note Mounted on 3.8 cm × 9.0 cm × 0.8 mm (t) glass epoxy PWB
RECOMMENDED OPERATING RANGE (TA = +25°C)
Parameter Symbol IC MIN. − TYP. 40 MAX. − Unit mA
Collector Current
2
Data Sheet PU10769EJ02V0DS
NESG240034
ELECTRICAL CHARACTERISTICS (TA = +25°C)
Parameter DC Characteristics Collector Cut-off Current Emitter Cut-off Current DC Current Gain RF Characteristics Gain Bandwidth Product Insertion Power Gain Noise Figure (1) Noise Figure (2) Associated Gain (1) Associated Gain (2) Reverse Transfer Capacitance Maximum Stable Power Gain Gain 1 dB Compression Output Power Output 3rd Order Intercept Point fT ⏐S21e⏐ NF1 NF2 Ga1 Ga2 Cre
Note 2 2
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
ICBO IEBO hFE
Note 1
VCB = 5 V, IE = 0 mA VEB = 0.4 V, IC = 0 mA VCE = 5 V, IC = 15 mA
− − 140
− − 180
100 100 260
nA nA −
VCE = 5 V, IC = 40 mA, f = 1 GHz VCE = 5 V, IC = 40 mA, f = 1 GHz VCE = 5 V, IC = 15 mA, f = 1 GHz, ZS = ZSopt, ZL = 50Ω VCE = 5 V, IC = 40 mA, f = 1 GHz, ZS = ZSopt, ZL = ZLopt VCE = 5 V, IC = 15 mA, f = 1 GHz, ZS = ZSopt, ZL = 50Ω VCE = 5 V, IC = 40 mA, f = 1 GHz, ZS = ZSopt, ZL = ZLopt VCB = 5 V, IE = 0 mA, f = 1 MHz VCE = 5 V, IC = 40 mA, f = 1 GHz VCE = 5 V, IC (set) = 40 mA, f = 1 GHz, ZS = ZSopt, ZL = ZLopt VCE = 5 V, IC (set) = 40 mA, f = 1 GHz,
− 8.5 − − 8.0 − − 9.5 − −
10.0 10.5 0.7 0.9 10.0 11.0 1.1 11.5 24 35.5
− − 1.1 − − − 1.3 − − −
GHz dB dB dB dB dB pF dB dBm dBm
MSG
Note 3
PO (1 dB) OIP3
Δf = 1 MHz, ZS = ZSopt, ZL = ZLopt
Notes 1. Pulse measurement: PW ≤ 350 μs, Duty Cycle ≤ 2% 2. Collector to base capacitance when the emitter grounded. 3. MSG = S21 S12
hFE CLASSIFICATION
Rank Marking hFE Value FB SR 140 to 260
Data Sheet PU10769EJ02V0DS
3
NESG240034
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE
Total Power Dissipation Ptot (mW)
886
REVERSE TRANSFER CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE
Reverse Transfer Capacitance Cre (pF)
1 000
1.5 1.4 1.3 1.2 1.1 1.0 0.9 0
3.8 cm × 9.0 cm × 0.8 mm (t), FR–4
500
0
0
25
50
75
100
125
150
1
2
3
4
5
Ambient Temperature TA (°C)
Collector to Base Voltage VCB (V)
COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE
100 VCE = 3 V
Collector Current IC (mA) Collector Current IC (mA)
COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE
100 VCE = 5 V 10 1 0.1 0.01 0.001
10 1 0.1 0.01 0.001
0.0001 0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0001 0.4
0.5
0.6
0.7
0.8
0.9
1.0
Base to Emitter Voltage VBE (V)
Base to Emitter Voltage VBE (V)
COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE
400 4.0 mA 3.6 mA 3.2 mA 2.8 mA 2.4 mA 2.0 mA 1.6 mA 1.2 mA 0.8 mA 100 IB = 0.4 mA 0 0
Collector Current IC (mA)
300
200
1
2
3
4
5
Collector to Emitter Voltage VCE (V)
Remark The graphs indicate nominal characteristics.
4
Data Sheet PU10769EJ02V0DS
NESG240034
DC CURRENT GAIN vs. COLLECTOR CURRENT
1 000 VCE = 3 V 1 000 VCE = 5V
DC CURRENT GAIN vs. COLLECTOR CURRENT
DC Current Gain hFE
100
DC Current Gain hFE
0.01 0.1 1
100
10
10
1 0.001
1 0.001
0.01
0.1
1
Collector Current IC (A)
Collector Current IC (A)
GAIN BANDWIDTH PRODUCT vs. COLLECTOR CURRENT
20 20
GAIN BANDWIDTH PRODUCT vs. COLLECTOR CURRENT
Gain Bandwidth Product fT (GHz)
VCE = 5 V, f = 1 GHz 15
Gain Bandwidth Product fT (GHz)
VCE = 3 V, f = 1 GHz 15
10
10
5
5
0 1
10 Collector Current IC (mA)
100
0 1
10 Collector Current IC (mA)
100
Remark The graphs indicate nominal characteristics.
Data Sheet PU10769EJ02V0DS
5
NESG240034
INSERTION POWER GAIN, MAG, MSG vs. FREQUENCY
Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB)
35 30 25 20 15 |S21e| 10 5 0 0.1 1 Frequency f (GHz) 10
2
INSERTION POWER GAIN, MAG, MSG vs. FREQUENCY
Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB)
35 30 25 20 15 |S21e|2 10 5 0 0.1 1 Frequency f (GHz) 10 MSG VCE = 5 V, IC = 40 mA
VCE = 3 V, IC = 40 mA
MSG
MAG
MAG MAG MSG
MAG MSG
INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT
Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB) Insertion Power Gain |S21e|2 (dB) Maximum Available Power Gain MAG (dB) Maximum Stable Power Gain MSG (dB)
20 VCE = 3 V, f = 1 GHz 15 MSG MAG
INSERTION POWER GAIN, MAG, MSG vs. COLLECTOR CURRENT
20 VCE = 5 V, f = 1 GHz 15 MSG MAG
10 |S21e|2 5
10 |S21e|2 5
0
0 1
10 Collector Current IC (mA)
100
–5 1
10 Collector Current IC (mA)
100
Remark The graphs indicate nominal characteristics.
6
Data Sheet PU10769EJ02V0DS
NESG240034
NOISE FIGURE, ASSOCIATED GAIN vs. COLLECTOR CURRENT
Output 3rd Order Intercept Point OIP3 (dBm)
4 VCE = 5 V, f = 1 GHz, ZS = ZSopt, ZL = 50 Ω Ga 10 2 8 6 1 NF 4 2 0 1 10 Collector Current IC (mA) 0 100 16 14
OUTPUT 3RD ORDER INTERCEPT POINT vs. COLLECTOR CURRENT
40 VCE = 5 V, f1 = 1.000 GHz, f2 = 1.001 GHz 30
Noise Figure NF (dB)
3
12
Associated Gain Ga (dB)
20
10
0
1
10 Collector Current IC (mA)
100
35 30 VCE = 5 V, IC (set) = 40 mA, f = 1 GHz Pout
450 400 350 300 250
Each Output Power Pout (each) (dBm) 3rd Order Intermodulation Distortion IM3 (dB)
OUTPUT POWER, LINEAR GAIN, COLLECTOR CURRENT vs. INPUT POWER
EACH OUTPUT POWER, IM3 vs. EACH INPUT POWER
40 30 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 –20
Output Power Pout (dBm) Linear Gain GL (dB)
25 20 15 10 5 0 –5 –10 –20
Collector Current IC (mA)
Pout
GL
200 150 IC 100 50
IM3
VCE = 5 V, IC (set) = 40 mA, f1 = 1.000 GHz, f2 = 1.001 GHz 0 10 20 30
–10
0
10
20
0 30
–10
Input Power Pin (dBm)
Each Input Power Pin (each) (dBm)
Remark The graphs indicate nominal characteristics.
S-PARAMETERS
S-parameters and noise parameters are provided on our Web site in a format (S2P) that enables the direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. Click here to download S-parameters. [RF and Microwave] → [Device Parameters] URL http://www.necel.com/microwave/en/
Data Sheet PU10769EJ02V0DS
7
NESG240034
PACKAGE DIMENSIONS 3-PIN POWER MINIMOLD (34 PKG) (UNIT: mm)
4.5±0.1 1.6±0.2 1.5±0.1
2
0.8 MIN.
1
3
4.0±0.25
2.5±0.1
0.42±0.06 0.47±0.06 1.5 3.0
0.42±0.06
0.41+0.03 –0.06
PIN CONNECTIONS
1. Emitter 2. Collector 3. Base
8
Data Sheet PU10769EJ02V0DS
NESG240034
• T he information in this document is current as of November, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC Electronics products are not taken measures to prevent radioactive rays in the product design. When customers use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of NEC Electronics products. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
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