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PS7200B-1A

PS7200B-1A

  • 厂商:

    NEC(日电电子)

  • 封装:

  • 描述:

    PS7200B-1A - 4-PIN SOP 1.0 W LOW ON-STATE RESISTANCE 1-ch Optical Coupled MOS FET - NEC

  • 数据手册
  • 价格&库存
PS7200B-1A 数据手册
DATA SHEET Solid State Relay OCMOS FET PS7200B-1A 4-PIN SOP 1.0 Ω LOW ON-STATE RESISTANCE 1-ch Optical Coupled MOS FET DESCRIPTION The PS7200B-1A is a low on-state resistance solid state relay containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. It is suitable for high-frequency signal control due to its low C × R, low on-state resistance, and low off-state leakage current. FEATURES • Low C × R (C × R = 32 pF • Ω) • Low on-state resistance (Ron = 1.0 Ω TYP.) • Low off-state leakage current (ILoff = 0.1 nA TYP.) • High-speed turn-on time (ton = 0.05 ms TYP.) • 1 channel type (1 a output) • Low LED operating current (IF = 2 mA) • Designed for AC/DC switching line changer • Small and thin package (4-pin SOP, Height = 2.1 mm) • Low offset voltage • Ordering number of taping product: PS7200B-1A-E3, E4, F3, F4 • UL approved: File No. E72422 (S) • BSI approved: No. 8241/8242 • CSA approved: No. CA 101391 APPLICATIONS • Measurement equipment The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P12637EJ4V0DS00 (4th edition) Date Published October 1999 NS CP (K) Printed in Japan The mark • shows major revised points. © 1997, 1999 PS7200B-1A PACKAGE DIMENSIONS in millimeters 4.0±0.5 TOP VIEW 4 3 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 1 2 7.0±0.3 4.4 2.05+0.08 –0.05 0.15+0.10 –0.05 0.05+0.08 –0.05 2.54 0.40+0.10 –0.05 0.25 M 0.5±0.3 2 Data Sheet P12637EJ4V0DS00 PS7200B-1A ORDERING INFORMATION Part Number PS7200B-1A PS7200B-1A-E3 PS7200B-1A-E4 PS7200B-1A-F3 PS7200B-1A-F4 Embossed Tape 3 500 pcs/reel Package 4-pin SOP Packing Style Magazine case 100 pcs Embossed Tape 900 pcs/reel Application Part Number PS7200B-1A *1 *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified) Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Peak Forward Current MOS FET Break Down Voltage Continuous Load Current Pulse Load Current (AC/DC Connection) Power Dissipation Isolation Voltage *3 *2 *1 Symbol IF VR PD IFP VL IL ILP PD BV PT TA Tstg Ratings 50 5.0 50 1 40 250 500 100 1 500 150 −40 to +80 −40 to +100 Unit mA V mW A V mA mA mW Vr.m.s. mW °C °C Total Power Dissipation Operating Ambient Temperature Storage Temperature *1 PW = 100 µs, Duty Cycle = 1 % *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output Data Sheet P12637EJ4V0DS00 3 PS7200B-1A RECOMMENDED OPERATING CONDITIONS (TA = 25 °C) Parameter LED Operating Current LED Off Voltage Symbol IF VF MIN. 2 0 TYP. 10 MAX. 20 0.5 Unit mA V ELECTRICAL CHARACTERISTICS (TA = 25 °C) Parameter Diode Forward Voltage Reverse Current MOS FET Off-state Leakage Current Output Capacitance Coupled LED On-state Current On-state Resistance Symbol VF IR ILoff Cout IFon Ron1 Ron2 Turn-on Time *1 Conditions IF = 10 mA VR = 5 V VD = 40 V VD = 0 V, f = 1 MHz IL = 250 mA IF = 10 mA, IL = 10 mA IF = 10 mA, IL = 250 mA, t ≤ 10 ms IF = 10 mA, VO = 5 V, PW ≥ 10 ms MIN. TYP. 1.2 MAX. 1.4 5.0 Unit V µA nA pF 0.1 32 100 2.0 1.0 1.5 mA Ω ton toff RI-O CI-O 0.05 0.02 1.0 0.2 ms Turn-off Time *1 Isolation Resistance Isolation Capacitance VI-O = 1.0 kVDC V = 0 V, f = 1 MHz 10 9 Ω 0.5 pF *1 Test Circuit for Switching Time IF Pulse Input VL Input 50 % 0 VO = 5 V Input monitor Rin RL VO monitor Output 90 % 10 % ton toff 4 Data Sheet P12637EJ4V0DS00 PS7200B-1A TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified) MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE 100 Maximum Forward Current IF (mA) Maximum Load Current IL (mA) MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE 300 250 200 150 100 50 0 –25 80 60 40 20 0 –25 0 25 50 7580 100 0 25 50 7580 100 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) FORWARD VOLTAGE vs. AMBIENT TEMPERATURE 1.6 Output Capacitance Cout (pF) OUTPUT CAPACITANCE vs. APPLIED VOLTAGE 50 f = 1 MHz Forward Voltage VF (V) 1.4 IF = 50 mA 1.2 30 mA 20 mA 10 mA 5 mA 1 mA 40 30 20 1.0 10 0.8 –25 0 25 50 75 100 0 5 10 15 20 25 30 Ambient Temperature TA (˚C) Applied Voltage VD (V) OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE 10–6 Off-state Leakage Current ILoff (A) LOAD CURRENT vs. LOAD VOLTAGE 200 IF = 10 mA 10 10 –7 Load Current IL (mA) TA = 80 ˚C –8 100 10–9 25 ˚C 10 –10 –1.0 –0.5 0 0.5 –100 1.0 10–11 –200 10–12 0 10 20 30 40 50 Load Voltage VL (V) Applied Voltage VD (V) Data Sheet P12637EJ4V0DS00 5 PS7200B-1A NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE 3.0 Normalized On-state Resistance Ron ON-STATE RESISTANCE DISTRIBUTION 30 n = 50 pcs, IF = 10 mA, IL = 10 mA 2.5 2.0 1.5 1.0 0.5 0.0 –25 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, IL = 10 mA Number (pcs) 25 20 15 10 5 0 0 25 50 75 100 0.8 0.9 1.0 1.1 1.2 Ambient Temperature TA (˚C) On-state Resistance Ron (Ω) TURN-ON TIME vs. FORWARD CURRENT 0.5 VO = 5 V Turn-on Time ton (ms) Turn-off Time toff (ms) TURN-OFF TIME vs. FORWARD CURRENT 0.5 VO = 5 V 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 0 5 10 15 20 25 30 0 5 10 15 20 25 30 Forward Current IF (mA) Forward Current IF (mA) TURN-ON TIME DISTRIBUTION 30 25 Number (pcs) TURN-OFF TIME DISTRIBUTION 30 n = 50 pcs, IF = 10 mA, VO = 5 V n = 50 pcs, IF = 10 mA, VO = 5 V Number (pcs) 25 20 15 10 5 0 20 15 10 5 0 0.04 0.05 0.06 0.07 0.08 0.02 0.04 Turn-on Time ton (ms) Turn-off Time toff (ms) 6 Data Sheet P12637EJ4V0DS00 PS7200B-1A NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE 3.0 Normalized Turn-on Time ton NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE 3.0 Normalized Turn-off Time toff 2.5 2.0 1.5 1.0 0.5 0.0 –25 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V 2.5 2.0 1.5 1.0 0.5 0.0 –25 Normalized to 1.0 at TA = 25 ˚C, IF = 10 mA, VO = 5 V 0 25 50 75 100 0 25 50 75 100 Ambient Temperature TA (˚C) Ambient Temperature TA (˚C) Remark The graphs indicate nominal characteristics. Data Sheet P12637EJ4V0DS00 7 PS7200B-1A TAPING SPECIFICATIONS (in millimeters) Outline and Dimensions (Tape) 2.0±0.1 4.0±0.1 1.75±0.1 1.55±0.1 2.4±0.1 12.0±0.2 5.5±0.1 1.55±0.1 8.0±0.1 4.6±0.1 0.3 Tape Direction PS7200B-1A-E3 PS7200B-1A-E4 Outline and Dimensions (Reel) 2.0 2.0±0.5 13.0±0.5 15˚ 15˚ 21.0±0.8 7.4±0.1 13.0±0.5 180 60 13.0±1.0 Packing: 900 pcs/reel 8 Data Sheet P12637EJ4V0DS00 PS7200B-1A Outline and Dimensions (Tape) 2.0±0.1 4.0±0.1 1.75±0.1 1.55±0.1 2.4±0.1 12.0±0.2 5.5±0.1 1.55±0.1 8.0±0.1 4.6±0.1 0.3 Tape Direction PS7200B-1A-F3 PS7200B-1A-F4 Outline and Dimensions (Reel) 1.5 φ 21.0±0.8 120 ˚ 7.4±0.1 1.5±0.5 60 ˚ 6.0±1 φ 330 2.0±0.5 φ 13.0±0.5 φ 80±5.0 12.4+2.0 –0.0 Packing: 3 500 pcs/reel Data Sheet P12637EJ4V0DS00 9 PS7200B-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature • Time of temperature higher than 210 °C • Number of reflows • Flux 235 °C (package surface temperature) 30 seconds or less Two Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) Recommended Temperature Profile of Infrared Reflow Package Surface Temperature T (˚C) (heating) to 10 s 235 ˚C (peak temperature) 210 ˚C to 30 s 100 to 160 ˚C 60 to 120 s (preheating) Time (s) (2) Dip soldering • Temperature • Time • Number of times • Flux 260 °C or below (molten solder temperature) 10 seconds or less One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 10 Data Sheet P12637EJ4V0DS00 PS7200B-1A [MEMO] Data Sheet P12637EJ4V0DS00 11 PS7200B-1A CAUTION Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8
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