UPC1909

DATA SHEET Bipolar Analog Integrated Circuit µPC1909 SWITCHING REGULATOR CONTROL IC The µPC1909 is a switching regulator control IC ideal for primary side control of active-clamp type Note DC/DC converters. This IC has 2 outputs employing a totem-pole circuit with peak output current 1.2 A, and is capable of directly driving a power MOS-FET. As a result, it has been possible to realize primary side control of an active-clamp type converter on a single chip. Note It is necessary to obtain license from Vicor Corporation before using the µPC1909 in an active-clamp type circuit. FEATURES • 2 on-chip outputs; for Q and Q • Capable of directly driving a power MOS-FET • Drive supply voltage range: 7 V to 24 V • On-chip remote control circuit • On-chip pulse-by-pulse overcurrent protection circuit • On-chip overvoltage latch circuit ORDERING INFORMATION Part Number Package 16-pin plastic DIP (300 mils) 16-pin plastic SOP (300 mils) µPC1909CX µPC1909GS The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G14309EJ1V0DS00 (1st edition) Date Published July 1999 N CP(K) Printed in Japan © 1999 µPC1909 BLOCK DIAGRAM CT 16 RT 15 VREF 14 DTC1 13 FB 12 PWM comparator 1 – + + OUT1 11 EMI1 10 VCC 9 Oscillator Reference power supply OLS ON/OFF control Overvoltage protection Overcurrent protection + – – PWM comparator 2 1 OV 2 CT2 3 GND 4 OC 5 DTC2 6 OUT2 7 ON/OFF 8 EMI2 2 Data Sheet G14309EJ1V0DS00 µPC1909 PIN CONFIGURATION (TOP VIEW) 16-pin plastic DIP (300 mils) µPC1909CX 16-pin plastic SOP (300 mils) µPC1909GS OV CT2 GND OC DTC2 OUT2 ON/OFF EMI2 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CT RT VREF DTC1 FB OUT1 EMI1 VCC PIN FUNCTION LIST Pin Number 1 2 3 4 5 6 7 8 Pin Name OV CT2 GND OC DTC2 OUT2 ON/OFF EMI2 Function Overvoltage protection OLS shift setting Ground Overcurrent protection OUT2 dead-time setting OUT2 output ON/OFF control OUT2 emitter Pin Number 9 10 11 12 13 14 15 16 Pin Name VCC EMI1 OUT1 FB DTC1 VREF RT CT Function Power supply OUT1 emitter OUT1 output Feedback input OUT1 dead-time setting Reference voltage output Timing resistance Timing capacitance Data Sheet G14309EJ1V0DS00 3 µPC1909 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (Unless otherwise specified, TA = 25°C) Parameter Supply Voltage Output Current (DC, per output) Output Current (peak, per output) Total Power Dissipation Operating Ambient Temperature Operating Junction Temperature Storage Temperature Symbol VCC IC (DC) IC (peak) PT TA TJ Tstg 1000 −20 to +85 −20 to +150 −55 to +150 µPC1909CX 26 100 1.2 µPC1909GS Unit V mA A 694 mW °C °C °C Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Recommended Operating Conditions Parameter Supply Voltage Oscillation Frequency Output Load Capacitance Output Load Resistance Operating Junction Temperature Symbol VCC fOSC CL RL TJ 10 −20 +100 MIN. 7 50 TYP. 10 200 2200 MAX. 24 500 3000 Unit V kHz pF kΩ °C 4 Data Sheet G14309EJ1V0DS00 µPC1909 Electrical Characteristics (Unless otherwise specified, TA = 25°C, VCC = 10 V, RT = 10 kΩ , fosc = 200 kHz) Block Total Parameter Standby Current Circuit Current UnderVoltage Lockout Circuit Reference Voltage Start-Up Threshold Voltage Operating Voltage Hysteresis Width Output Voltage Line Regulation Symbol ICC (SB) ICC VCC (L to H) VH Conditions VCC = 7 V Without load 6 8 3 MIN. TYP. 0.1 12 9 4 18 10 5 MAX. Unit mA mA V V VREF REGIN IREF = 0 A 8 V ≤ VCC ≤ 15 V, IREF = 0 A 1 mA ≤ IREF ≤ 4 mA −10°C ≤ TA ≤ +85°C, IREF = 0 A IREF = 0 A 4.7 4.9 1 5.1 10 V mV Load Regulation Output Voltage Temperature Coefficient Short Circuit Current Oscillation Oscillation Frequency Frequency Line Regulation Frequency Temperature Coefficient PWM Comparator Input Bias Current REGL 6 400 12 (700) mV ∆VREF/∆T IO short fOSC µV/°C mA 15 180 200 1 2 (5) 220 kHz % % ∆f/∆V ∆f/∆T IB (COMP1) IB (COMP2) 8 V ≤ VCC ≤ 15 V −10°C ≤ TA ≤ +85°C VCOMP1 = VREF VCOMP2 = VREF 1.5 3.5 −10°C ≤ TA ≤ +85°C, VD = 0.46 VREF ISINK = 3 mA ISOURCE = 30 mA RL = 15 Ω, CL = 2200 pF RL = 15 Ω, CL = 2200 pF 2.4 2.2 0.1 190 VCC = 0 V VCC − 1.6 60 40 2.6 2.4 0.2 210 200 150 2 VOV = VREF 2 750 2.4 3 10 10 µA µA V V % Low-level Threshold Voltage High-level Threshold Voltage Dead-time Temperature Coeficient Output Low-level Output Voltage High-level Output Voltage Rise Time Fall Time Remote Control Input Voltage at Output ON Input Voltage at Output OFF Hysteresis Width Overcurrent Latch Overcurrent Threshold Voltage Input Bias Current Delay to Output Overvoltage Latch Overvoltage Threshold Voltage Input Bias Current OVL Reset Voltage Delay to Output VTH (L) VTH (H) ∆DT/∆T VOL VOH tr tf VIN (ON) VIN (OFF) VH VTH (OC) IB (OC) td (OC) VTH (OV) IB (OV) VR (OV) td (OV) 0.5 V V ns ns 2.8 2.6 0.3 230 V V V mV µA ns 2.8 4 V µA V ns Remark Values in parentheses ( ) represent reference values. Data Sheet G14309EJ1V0DS00 5 µPC1909 TYPICAL CHARACTERISTICS CURVES (UNLESS OTHERWISE SPECIFIED, TA = 25°C, VCC = 10 V, REFERENCE VALUES) PT vs. TA 1.2 µ PC1909CX Under-Voltage Lockout Circuit 15 PT - Total Power Dissipation - W 1.0 125 °C/W 0.8 µ PC1909GS 12.5 VOUT1 - Output voltage - V 10 0.6 180 °C/W 0.4 7.5 5 0.2 2.5 VCC (H to L) VH VCC (L to H) 0 25 50 75 100 125 TA - Ambient Temperature - °C ICC vs. VCC 150 0 2.5 5 7.5 10 12.5 VCC - Supply Voltage - V 15 ICC vs. VCC (During OVL Operation) 18 16 ICC - Circuit Current - mA 18 16 ICC - Circuit Current - mA 14 12 10 14 12 10 VH VH 0.8 0.4 ICC (S B) 0.8 0.4 ICC ( SB) fOSC = 200 kHz Without load 5 10 15 20 VCC - Supply Voltage - V ICC(SB) vs. TA 25 fOSC = 200 kHz 5 10 15 20 VCC - Supply Voltage - V VOUT1 vs. VIN 25 0 0 250 20 ICC(SB) - Standby Current - µA 200 VOUT1 - Output Voltage - V 15 150 10 100 5 VIN (OFF) VIN (ON) 50 0 −25 0 25 50 75 TA - Ambient Temperature - °C 100 0 1 2 3 4 5 VIN - Remote Control Voltage - V 6 6 Data Sheet G14309EJ1V0DS00 µPC1909 ∆VREF vs. TA 30 1000 500 fosc vs. RT, CT ∆VREF - Reference Voltage Deviation - mV 20 10 fosc - Oscillation Frequency - kHz CT = 220 pF 100 50 CT = 1000 pF CT = 470 pF 0 −10 −20 −30 −25 0 25 50 75 TA - Ambient Temperature - °C fosc vs. TA 100 10 50 RT - Timing Resistance - kΩ VOH, VOL vs. TA 100 220 fosc - Oscillation Frequency - kHz 215 210 205 200 195 190 185 180 175 −25 0 25 50 75 TA - Ambient Temperature - °C tf, tr vs. TA (OUT1) 100 fOSC = 555 kHz tr - OUT1 Output Rise Time - ns tr - OUT1 Output Fall Time - ns 80 tr 60 tf 40 100 VOH - High-Level Output Voltage - V VOL - Low-Level Output Voltage - V 225 VCC −1 VCC − 1.5 VCC −2 1.53 1.49 1.45 –25 0 25 50 75 TA - Ambient Temperature - °C tf, tr vs. TA (OUT2) 100 100 fOSC = 555 kHz tr - OUT2 Output Rise Time - ns tr - OUT2 Output Fall Time - ns 80 tr 60 40 tf 20 20 0 −25 0 25 50 75 TA - Ambient Temperature - °C 100 0 −25 0 25 50 75 TA - Ambient Temperature - °C 100 Data Sheet G14309EJ1V0DS00 7 µPC1909 Duty vs. TA 45 44 43 Duty-ON Duty - % 42 41 40 39 38 37 36 35 −25 0 25 50 75 TA - Ambient Temperature - °C 100 8 Data Sheet G14309EJ1V0DS00 µPC1909 TIMING CHART Oscillation waveform CT Oscillation waveform CT’ Feedback input FB Vd tqc OUT1 output waveform tqd OUT2 output waveform (1) Oscillation waveform (CT) This waveform is determined by the external capacitor connected to the CT pin (pin 16) and the external resistor connected to the RT pin (pin 15). It is usually a 1.5-V to 3.5-V triangle waveform (the rise and fall times are the same). (2) Output waveform (OUT1) Whichever is the lower of the DTC1 pin (pin 13) and FB pin (pin 12) voltages is compared with the triangle wave of the CT pin (pin 16). The OUT1 pin (pin 11) is high level while the triangle wave is low. (3) Output waveform (OUT2) Whichever is the higher of the DTC2 pin (pin 5) and FB pin (pin 12) voltages is compared with the level-shifted triangle wave (CT’). The OUT2 pin (pin 6) is high level while the level-shifted triangle wave is high. (4) Triangle wave level shift The triangle wave that controls OUT2 is the original triangle wave of the CT pin (pin 16) shifted to a lower potential via the level shift circuit (OLS). The amount of shift (Vd) can be adjusted using the resistor (RCT2) connected between the CT2 pin (pin 2) and the VREF pin. The relationship between the shift amount (Vd) and the resistance value (kΩ) of the resistor RCT2 connected to the CT2 pin (pin 2) is as follows. Vd = 4.3 × 2 [V] RCT2[kΩ] + 10 (5) Dead-time (tqc, tqd) adjustment The dead time between the fall of OUT1 and the rise of OUT2 (tqc) and the dead time between the fall of OUT2 and the rise of OUT1 (tqd) is determined by the oscillation frequency and the amount of level shift of the triangle wave. Although usually tqc = tqd, if setting these independently, connect a suitable resistor between the CT pin and the VREF pin, as well as between the CT pin and GND, and adjust the dead time by making the oscillation waveform asymmetrical. Data Sheet G14309EJ1V0DS00 9 µPC1909 PACKAGE DRAWINGS 16 PIN PLASTIC DIP (300 mil) 16 9 1 A 8 K P L I J G H F C D N M B M R NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel. ITEM A B C D F G H I J K L M N P R MILLIMETERS 20.32 MAX. 1.27 MAX. 2.54 (T.P.) 0.50 ± 0.10 1.1 MIN. 3.5 ± 0.3 0.51 MIN. 4.31 MAX. 5.08 MAX. 7.62 (T.P.) 6.5 0.25 +0.10 –0.05 0.25 1.1 MIN. 0 ∼ 15 ° INCHES 0.800 MAX. 0.050 MAX. 0.100 (T.P.) +0.004 0.020 –0.005 0.043 MIN. 0.138 ± 0.012 0.020 MIN. 0.170 MAX. 0.200 MAX. 0.300 (T.P.) 0.256 0.010 +0.004 –0.003 0.01 0.043 MIN. 0 ∼ 15 ° P16C-100-300B-1 10 Data Sheet G14309EJ1V0DS00 µPC1909 16 PIN PLASTIC SOP (300 mil) 16 9 detail of lead end P 1 A 8 F G S B N C D E M M H I J L K S NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM A B C D E F G H I J K L M N P MILLIMETERS 10.2 ± 0.2 0.78 MAX. 1.27 (T.P.) 0.42 + 0.08 − 0.07 0.1 ± 0.1 1.65 ± 0.15 1.55 7.7 ± 0.3 5.6 ± 0.2 1.1 ± 0.2 0.22 + 0.08 − 0.07 0.6 ± 0.2 0.12 0.10 +7° 3° −3° P16GM-50-300B-5 Data Sheet G14309EJ1V0DS00 11 µPC1909 RECOMMENDED SOLDERING CONDITIONS The µPC1909 should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Insertion Type µPC1909CX: 16-pin plastic DIP (300 mils) Soldering Method Wave soldering (pins only) Partial heating Soldering Conditions Solder bath temperature: 260°C Max., Time: 10 seconds max. Pin temperature: 300°C max., Time: 3 seconds max. (per pin) Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with the package. Surface Mounting Type µPC1909GS: 16-pin plastic SOP (300 mils) Recommended Condition symbol IR35-00-2 Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), Count: Twice or less Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), Count: Twice or less Soldering bath temperature: 260°C or less, Time: 10 seconds max., Count: Once, Preheating temperature: 120°C MAX. (package surface temperature) VPS VP15-00-2 Wave soldering WS60-00-1 Caution Do not use different soldering methods together. 12 Data Sheet G14309EJ1V0DS00 µPC1909 [MEMO] Data Sheet G14309EJ1V0DS00 13 µPC1909 [MEMO] 14 Data Sheet G14309EJ1V0DS00 µPC1909 [MEMO] Data Sheet G14309EJ1V0DS00 15 µPC1909 • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. 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The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8