UPC2709TB

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS µPC2709TB 5 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The µPC2709TB is a silicon monolithic integrated circuits designed as 1st IF amplifier for DBS tuners. This IC is packaged in super minimold package which is smaller than conventional minimold. The µPC2709TB has compatible pin connections and performance to µPC2709T of conventional minimold version. So, in the case of reducing your system size, µPC2709TB is suitable to replace from µPC2709T. These IC is manufactured using NEC’s 20 GHz fT NESAT™III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES • High-density surface mounting : 6-pin super minimold package • Supply voltage • Wideband response • Medium output power • Power gain • Port impedance : VCC = 4.5 to 5.5 V : fu = 2.3 GHz TYP. @3 dB bandwidth : PO (sat) = +11.5 dBm@f = 1 GHz with external inductor : GP = 23 dB TYP. @f = 1 GHz : input/output 50 Ω APPLICATIONS • 1st IF amplifiers in DBS converters • RF stage buffer in DBS tuners, etc. ORDERING INFORMATION PART NUMBER PACKAGE 6-pin super minimold MARKING C1E SUPPLYING FORM Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. µPC2709TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC2709TB) Caution: Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P12653EJ2V1DS00 (2nd edition) Date Published May 2000 N CP(K) Printed in Japan © 1997, 2000 µPC2709TB PIN CONNECTIONS Pin NO. (Top View) (Bottom View) Pin name INPUT GND GND OUTPUT GND VCC 1 C1E 3 4 4 3 2 3 2 5 5 2 4 5 6 1 6 6 1 PRODUCT LINE-UP OF µPC2709 (TA = +25°C, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω) fu (GHz) 2.3 PO (sat) (dBm) +11.5 GP (dB) 23 NF (dB) 5 ICC (mA) 25 6 pin super minimold PART NO. PACKAGE 6 pin minimold MARKING µPC2709T µPC2709TB C1E Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Caution The package size distinguishes between minimold and super minimold. 2 Data Sheet P12653EJ2V1DS00 µPC2709TB SYSTEM APPLICATION EXAMPLE EXAMPLE OF DBS CONVERTERS BS Antenna (DBS ODU) RF Amp. Parabola Antenna Mixer IF Amp. To IDU µ PC2709TB Oscillator EXAMPLE OF 900 MHz BAND, 1.5 GHz BAND DIGITAL CELLULAR TELEPHONE RX I Q DEMO PLL SW PLL I Driver TX PA F/F 0° ×2 µPC2709TB 90 ° Q To know the associated products, please refer to each latest data sheet. Data Sheet P12653EJ2V1DS00 3 µPC2709TB PIN EXPLANATION Applied voltage (V) − Pin voltage Note (V) 1.05 Pin NO. 1 Pin Name INPUT Function and applications Internal equivalent circuit Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. 4 OUTPUT Voltage as same as VCC through external inductor 4.5 to 5.5 − 6 VCC 4 OUT IN 1 6 VCC − Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance defference. 3 GND 25 GND 2 3 5 GND 0 − Note Pin voltage is measured at VCC = 5.0 V 4 Data Sheet P12653EJ2V1DS00 µPC2709TB ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage Total Circuit Current Power Dissipation SYMBOL VCC ICC PD RATINGS 6 60 200 −40 to +85 −55 to +150 +10 UNIT V mA mW CONDITIONS TA = +25°C, Pin 4 and 6 TA = +25°C Mounted on double copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) Operating Ambient Temperature Storage Temperature Input Power TA Tstg Pin °C °C dBm RECOMMENDED OPERATING CONDITIONS PARAMETER Supply Voltage SYMBOL VCC MIN. 4.5 −40 TYP. 5.0 MAX. 5.5 UNIT V NOTICE The same voltage should be applied to pin 4 and 6. Operating Ambient Temperature TA +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω) PARAMETER Circuit Current Power Gain Maximum Output Level Noise Figure Upper Limit Operating Frequency Isolation Input Return Loss Output Return Loss Gain Flatness SYMBOL ICC GP PO (sat) NF fu ISL RLin RLout ∆GP MIN. 19 21.0 +9.0 − 2.0 26 7 7 − TYP. 25 23.0 +11.5 5.0 2.3 31 10 10 ±1.0 MAX. 32 26.5 − 6.5 − − − − − UNIT mA dB dBm dB GHz dB dB dB dB No Signal f = 1 GHz f = 1 GHz, Pin = 0 dBm f = 1 GHz 3 dB down below flat gain at f = 0.1 GHz f = 1 GHz f = 1 GHz f = 1 GHz f = 0.1 to 1.8 GHz TEST CONDITIONS Data Sheet P12653EJ2V1DS00 5 µPC2709TB TEST CIRCUIT VCC 1 000 pF C3 L 6 50 Ω IN 1 000 pF C1 1 4 C2 1 000 pF 50 Ω OUT 2, 3, 5 Components of test circuit for measuring electrical characteristics TYPE C3 L C1 to C2 Capacitor Bias Tee Bias Tee VALUE 1 000 pF 1 000 nH 1 000 pF C1 to C3 L Example of actural application components TYPE Chip capacitor Chip inductor VALUE 1 000 pF 300 nH 100 nH 10 nH OPERATING FREQUENCY 100 MHz or higher 10 MHz or higher 100 MHz or higher 1.0 GHz or higher INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 πRfc). 6 Data Sheet P12653EJ2V1DS00 µPC2709TB Illustration of the test circuit assembled on evaluation board AMP-2 Top View 3 2 1 IN C 5 4 L OUT C C 1E 6 Mounting direction VCC C Component List Value C L 1 000 pF 300 nH Notes 1. 30 × 30 × 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes Data Sheet P12653EJ2V1DS00 7 µPC2709TB TYPICAL CHARACTERISTICS (TA = +25°C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 40 35 ICC - Circuit Current - mA CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 40 VCC = 5.0 V 35 ICC - Circuit Current - mA 30 25 20 15 10 5 0 1 2 3 4 5 6 30 25 20 15 10 5 0 –60 –40 –20 0 +20 +40 +60 +80 +100 VCC - Supply Voltage - V NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY 8 GP - Insertion Power Gain - dB TA - Operating Ambient Temperature - °C INSERTION POWER GAIN vs. FREQUENCY 30 VCC = 5.0 V –40°C TA = +25°C +85°C GP - Insertion Power Gain - dB 30 VCC = 5.5 V 25 GP 5.0 V 4.5 V NF - Noise Figure - dB 7 25 6 20 VCC = 5.0 V NF 15 5.5 V 20 5 15 4 10 0.1 4.5 V 0.3 1.0 3.0 f - Frequency - GHz 10 0.1 0.3 1.0 3.0 f - Frequency - GHz INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 RLin - Input Return Loss - dB RLout - Output Return Loss - dB ISOLATION vs. FREQUENCY 0 VCC = 5.0 V VCC = 5.0 V –10 ISL - Isolation - dB –10 RLin RLout –20 –20 –30 –30 –40 –50 0.1 –40 –50 0.1 0.3 1.0 3.0 0.3 1.0 3.0 f - Frequency - GHz f - Frequency - GHz 8 Data Sheet P12653EJ2V1DS00 µPC2709TB OUTPUT POWER vs. INPUT POWER +15 f = 1.0 GHz +10 PO - Output Power - dBm OUTPUT POWER vs. INPUT POWER +15 VCC = 5.0 V f = 1.0 GHz +25°C TA = –40°C +85°C 5.5 V VCC = 5.0 V 4.5 V PO - Output Power - dBm +10 +5 0 –5 –10 –15 +5 0 –5 –10 –15 –20 –35 –30 –25 –20 –15 –10 –5 Pin - Input Power - dBm OUTPUT POWER vs. INPUT POWER +15 f = 2.0 GHz +10 PO - Output Power - dBm 0 +5 +10 –20 –35 –30 –25 –20 –15 –10 –5 Pin - Input Power - dBm OUTPUT POWER vs. INPUT POWER +15 VCC = 5.0 V +10 PO - Output Power - dBm 0 +5 +10 5.5 V +5 0 –5 –10 –15 –20 –35 –30 –25 –20 –15 –10 –5 Pin - Input Power - dBm SATURATED OUTPUT POWER vs. FREQUENCY 20 0 +5 +10 4.5 V VCC = 5.0 V +5 0 –5 –10 –15 f = 0.5 GHz f = 1.0 GHz f = 2.0 GHz –20 –35 –30 –25 –20 –15 –10 –5 Pin - Input Power - dBm 0 +5 +10 IM3 - 3rd Order Intermodulation Distortion - dBc THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE –60 f1 = 1.000 GHz f2 = 1.002 GHz –50 VCC = 5.0 V PO(sat) - Saturated Output Power - dBm 18 16 14 12 10 8 6 4 2 0 0.1 0.3 1.0 4.5 V VCC = 5.0 V Pin = 0 dB 5.5 V –40 –30 5.5 V –20 4.5 V –10 –10 –8 –6 –4 –2 0 +2 +4 +6 +8 +10 3.0 f - Frequency - GHz PO(each) - Output Power of Each Tone - dBm Data Sheet P12653EJ2V1DS00 9 µPC2709TB S-Parameter (VCC = 5.0 V) S11-FREQUENCY 0.1 G 1.0 G 3.0 G S22-FREQUENCY 3.0 G 0.1 G 2.0 G 1.0 G 10 Data Sheet P12653EJ2V1DS00 µPC2709TB Typical S-Parameter Values (TA = +25°C) µPC2709TB VCC = Vout = 5.0 V, ICC = 26 mA Frequency MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 S11 MAG .227 .239 .245 .244 .243 .247 .265 .284 .301 .305 .299 .300 .314 .328 .354 .359 .373 .371 .379 .386 .387 .374 .360 .339 .338 .334 .330 .311 .291 .258 .240 ANG 0.2 1.0 2.9 2.5 1.5 –1.5 –3.2 –3.6 –3.3 –2.4 –3.2 –6.3 –10.3 –14.4 –17.3 –19.5 –22.1 –26.8 –31.1 –36.0 –39.5 –43.8 –48.7 –55.4 –62.0 –66.0 –69.0 –69.9 –72.5 –76.5 –80.6 MAG 13.698 13.724 13.830 13.998 14.109 14.246 14.538 14.703 15.051 15.331 15.605 15.773 16.152 16.282 16.337 16.370 16.256 15.977 15.529 15.307 14.745 14.212 13.633 12.846 11.990 11.265 10.560 9.942 9.432 8.818 8.353 S21 ANG –4.5 –9.6 –14.5 –19.9 –25.0 –30.4 –35.5 –41.3 –47.0 –53.5 –60.0 –66.7 –74.0 –81.0 –89.3 –96.5 –104.5 –112.7 –120.5 –128.1 –135.9 –143.7 –151.3 –158.7 –165.5 –172.1 –177.8 176.2 171.3 166.5 161.9 MAG .027 .027 .026 .027 .026 .027 .028 .028 .028 .029 .029 .029 .030 .030 .032 .031 .033 .032 .033 .034 .033 .033 .033 .032 .033 .033 .033 .033 .035 .035 .035 S12 ANG –1.0 3.1 4.7 7.8 9.8 11.9 13.6 14.9 17.2 18.8 20.9 22.5 23.8 26.1 25.6 26.8 28.0 29.3 31.3 31.0 32.2 30.5 33.9 35.5 38.0 39.1 40.8 43.5 44.9 47.4 53.4 MAG .196 .207 .212 .223 .234 .252 .270 .287 .298 .309 .322 .336 .353 .353 .368 .370 .382 .381 .378 .373 .366 .363 .353 .331 .318 .304 .295 .282 .267 .246 .225 S22 ANG 0.9 2.2 4.1 3.4 2.1 –0.4 –2.3 –4.6 –7.4 –11.9 –17.1 –21.5 –24.8 –28.8 –35.5 –41.8 –46.9 –52.8 –57.8 –64.1 –70.8 –78.1 –83.0 –90.0 –95.6 –102.5 –108.3 –113.7 –118.6 –125.1 –131.2 1.37 1.36 1.38 1.32 1.33 1.26 1.20 1.15 1.10 1.05 1.04 1.01 0.95 0.93 0.86 0.86 0.81 0.83 0.83 0.82 0.85 0.90 0.94 1.06 1.11 1.20 1.25 1.36 1.40 1.55 1.64 K Data Sheet P12653EJ2V1DS00 11 µPC2709TB PACKAGE DIMENSIONS 6 pin super minimold (unit: mm) 0.2 +0.1 –0 0.1 MIN. 0.15 +0.1 –0 1.25 ±0.1 2.1 ±0.1 0 to 0.1 0.65 1.3 0.65 0.7 0.9 ±0.1 2.0 ±0.2 12 Data Sheet P12653EJ2V1DS00 µPC2709TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC pin. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P12653EJ2V1DS00 13 µPC2709TB [MEMO] 14 Data Sheet P12653EJ2V1DS00 µPC2709TB [MEMO] Data Sheet P12653EJ2V1DS00 15 µPC2709TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8