UPC2748TB

DATA SHEET µPC2747TB, µPC2748TB 3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS BIPOLAR ANALOG INTEGRATED CIRCUITS DESCRIPTION The µPC2747TB, µPC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold. The µPC2747TB, µPC2748TB have compatible pin connections and performance to µPC2747T, µPC2748T of conventional minimold version. So, in the case of reducing your system size, µPC2747TB, µPC2748TB are suitable to replace from µPC2747T, µPC2748T. These ICs are manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability. FEATURES • High-density surface mounting • Supply voltage • Noise figure • Upper limit operating frequency : 6-pin super minimold package : VCC = 2.7 to 3.3 V : µPC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz : µPC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz : µPC2747TB ; fu = 1.8 GHz TYP. : µPC2748TB ; fu = 1.5 GHz TYP. APPLICATION • Buffer amplifiers for mobile telephones, etc. (PDC800M, GSM) ORDERING INFORMATION Part Number Package 6-pin super minimold Marking C1S C1T Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel. µPC2747TB-E3 µPC2748TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC2747TB, µPC2748TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13444EJ2V0DS00 (2nd edition) Date Published June 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1998, 1999 µPC2747TB, µPC2748TB PIN CONNECTIONS Pin No. Pin Name INPUT GND GND OUTPUT GND VCC (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 1 2 3 4 5 6 2 1 Marking is an example of µPC2747TB PRODUCT LINE-UP (TA = +25°C, VCC = 3.0 V, ZL = ZS = 50 Ω ) Part No. fu (GHz) 1.8 PO(sat) (dBm) –7.0 GP (dB) 12 NF (dB) 3.3 ICC (mA) 5.0 6-pin super minimold 6-pin minimold 0.2 to 1.5 –3.5 19 2.8 6.0 6-pin super minimold C1T Package 6-pin minimold C1S Marking µPC2747T µPC2747TB µPC2748T µPC2748TB Remark Notice Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. The package size distinguishes between minimold and super minimold. SYSTEM APPLICATION EXAMPLE EXAMPLE OF 900 MHz BAND DIGITAL CELLULER TELEPHONE Digtal Cellular System Block Diagram RX DEMO I Q C1S 3 PSC+PLL SW PLL I 0˚ TX PA φ 90˚ Q : µPC2747TB, µPC2748TB applicable 2 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB PIN EXPLANATION Applied Voltage (V)  0.80 Pin Voltage (V) Note Pin No. 1 Pin Name INPUT Function and Applications Internal Equivalent Circuit 0.80 4 OUTPUT  Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut. Signal output pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. Power supply pin. This pin should be externally equipped with bypass capacity to minimize ground impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 3 GND 2 GND 5 6 VCC 4 OUT 2.79 IN 1 * 2.72 6 VCC 2.7 to 3.3  2 3 5 GND 0  The above diagram is for the µPC2747TB. The resistor marked with an asterisk does not exist in the µPC2748TB. Note Pin voltage is measured at VCC = 3.0 V. Above: µPC2747TB, Below: µPC2748TB Data Sheet P13444EJ2V0DS00 3 µPC2747TB, µPC2748TB ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Circuit Current Power Dissipation Symbol VCC ICC PD TA = +25°C TA = +25°C Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) Conditions Ratings 4.0 15 200 −40 to +85 −55 to +150 TA = +25°C 0 Unit V mA mW Operating Ambient Temperature Storage Temperature Input Power Level TA Tstg Pin °C °C dBm RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 2.7 −40 TYP. 3.0 +25 MAX. 3.3 +85 Unit V °C ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 3.0 V, ZS = ZL = 50 Ω) µPC2747TB Parameter Circuit Current Power Gain Maximum Output Level Symbol ICC GP PO(sat) Test Conditions MIN. No Signal f = 900 MHz f = 900 MHz Pin = –8 dBm f = 900 MHz 3 dB down below from gain at f = 900 MHz 3 dB down below from gain at f = 900 MHz f = 900 MHz f = 900 MHz f = 900 MHz 3.8 9 –9.5 TYP. 5.0 12 –7.0 MAX. 7.0 14 – MIN. 4.5 16 –6.0 TYP. 6.0 19 –3.5 MAX. 8.0 21 – mA dB dBm µPC2748TB Unit Noise Figure Upper Limit Operating Frequency NF fu – 1.5 3.3 1.8 4.5 – – 1.2 2.8 1.5 4.0 – dB GHz Lower Limit Operating Frequency fL – – – – 0.2 0.4 GHz Isolation Input Return Loss Output Return Loss ISL RLin RLout 35 11 7 40 14 10 – – – 35 8.5 5.5 40 11.5 8.5 – – – dB dB dB 4 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 °C, ZL = ZS = 50 Ω ) Reference Parameter Circuit Current Symbol ICC Test Conditions VCC = 1.8 V, No signals VCC = 1.8 V, f = 900 MHz VCC = 1.8 V, f = 900MHz, Pin = −8 dBm VCC = 1.8 V, f = 900 MHz VCC = 1.8 V, 3 dB down below from gain at f = 900 MHz VCC = 1.8 V, 3 dB down below from gain at f = 900 MHz VCC = 1.8 V, f = 900MHz VCC = 1.8 V, f = 900MHz VCC = 1.8 V, f = 900MHz VCC = 3.0 V, Pout = −20 dBm, f1 = 900 MHz, f2 = 902 MHz VCC = 1.8 V, Pout = −20 dBm, f1 = 900 MHz, f2 = 902 MHz µPC2747TB 3.0 µPC2748B 3.5 Unit mA Power Gain GP 5.5 −13.7 11.5 −10.0 dB Maximum Output Level PO(sat) dBm Noise Figure NF 5.2 4.5 dB Upper Limit Operating Frequency fu 1.8 1.5 GHz Lower Limit Operating Frequency fL  0.2 GHz Isolation ISL 34 34 dB Input Return Loss RLin 11 10 dB Output Return Loss RLout 13 −34 12 −38 dB 3rd Order Intermodulation Distortion IM3 dBc −20 −28 Data Sheet P13444EJ2V0DS00 5 µPC2747TB, µPC2748TB TEST CIRCUIT VCC 1 000 pF C3 6 50 Ω IN 1 000 pF C1 1 4 C2 1 000 pF 50 Ω OUT 2, 3, 5 EXAMPLE OF APPLICATION CIRCUIT VCC 1 000 pF C3 6 50 Ω IN 1 000 pF C1 1 4 C4 1 000 pF C5 1 000 pF R1 50 to 200 Ω 2, 3, 5 To stabilize operation, please connect R1, C5 1 6 4 C2 1 000 pF 50 Ω OUT 1 000 pF C6 2, 3, 5 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Capacitors for VCC, input and output pins 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).] 6 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD AMP-2 Top View 3 IN C C 1S OUT 1 C 2 Mounting Direction (Marking is an example for µ PC2747TB) C 6 5 4 VCC COMPONENT LIST Value C 1 000 pF Notes 1. 30 × 30 × 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC (P11976E). Data Sheet P13444EJ2V0DS00 7 µPC2747TB, µPC2748TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C) − µPC2747TB − CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 10 No signal 8 8 No signal CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 Circuit Current ICC (mA) Circuit Current ICC (mA) VCC = 3.0 V 6 6 4 4 2 2 VCC = 1.8 V 0 0 1 2 3 4 Supply Voltage VCC (V) INSERTION POWER GAIN vs. FREQUENCY 20 VCC = 3.3 V 0 –60 –40 –20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (°C) INSERTION POWER GAIN vs. FREQUENCY 20 VCC = 3.0 V TA = –40 °C 15 TA = +25 °C Insertion Power Gain GP (dB) 15 VCC = 3.0 V Insertion Power Gain GP (dB) 10 VCC = 2.7 V 5 10 TA = +85 °C 5 VCC = 1.8 V 0 0.1 0.3 1.0 3.0 0 0.1 0.3 1.0 3.0 Frequency f (GHz) NOISE FIGURE vs. FREQUENCY 7 VCC = 1.8 V 6 Frequency f (GHz) Noise Figure NF (dB) 5 VCC = 3.0 V 4 VCC = 3.3 V 3 VCC = 2.7 V 2 0.1 0.3 1.0 3.0 Frequency f (GHz) 8 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB − µPC2747TB − INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 RLin (VCC = 1.8 V) Input Return Loss RLin (dB) Output Return Loss RLout (dB) ISOLATION vs. FREQUENCY 0 RLout (VCC = 3.0 V) –10 Isolation ISL (dB) –10 –20 VCC = 1.8 V –30 –20 RLin (VCC = 3.0 V) –30 RLout (VCC = 1.8 V) –40 VCC = 3.0 V –40 –50 0.1 0.3 1.0 3.0 –50 0.1 0.3 1.0 3.0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 0 f = 900 MHz VCC = 3.3 V –5 Output Power Pout (dBm) Output Power Pout (dBm) Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 0 f = 900 MHz VCC = 3.0 V –5 VCC = 3.0 V VCC = 2.7 V TA = –40 °C TA = +85 °C –10 –10 –15 –15 TA = –40 °C TA = +25 °C TA = +25 °C –20 –20 TA = +85 °C –25 –30 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY Third Order Intermodulation Distorition IM3 (dBc) –25 –30 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE –50 –45 –40 –35 –30 –25 –20 –15 –10 –5 0 –30 –28 –26 –24 –22 –20 –18 –16 –14 –12 –10 Output Power of Each Tone PO (each) (dBm) VCC = 1.8 V VCC = 2.7 V VCC = 3.3 V VCC = 3.0 V f1 = 900 MHz f2 = 902 MHz –5 0 –5 0 0 Saturared Output Power PO (sat) (dBm) VCC = 3.3 V –5 Pin = –8 dBm –10 VCC = 3.0 V VCC = 2.7 V –15 –20 –25 0.1 0.3 1.0 3.0 Frequency f (GHz) Data Sheet P13444EJ2V0DS00 9 µPC2747TB, µPC2748TB S-PARAMETER (TA = +25 °C, VCC = 3.0 V) − µPC2747TB − S11-FREQUENCY 1.0 G 3.0 G 2.0 G 0.1 G S22-FREQUENCY 0.1 G 1.0 G 2.0 G 3.0 G 10 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB TYPICAL S-PARAMETER VALUES (TA = +25 °C) µPC2747TB VCC = 3.0 V, ICC = 5.0 mA FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 S11 MAG. 0.091 0.105 0.136 0.165 0.179 0.185 0.189 0.189 0.182 0.180 0.174 0.160 0.148 0.134 0.124 0.110 0.099 0.089 0.084 0.085 0.087 0.092 0.102 0.114 0.126 0.136 0.154 0.168 0.180 0.196 0.208 ANG. −178.3 −161.2 −166.8 −172.9 177.8 170.1 162.5 155.1 148.8 142.6 137.1 131.5 127.4 124.4 121.0 121.0 122.9 126.8 134.8 141.7 148.1 152.1 156.6 158.7 161.4 160.6 161.3 160.4 157.9 155.2 152.5 MAG. 3.732 3.997 4.075 4.105 4.141 4.098 4.124 4.104 4.061 4.016 3.977 3.948 3.799 3.736 3.582 3.506 3.317 3.190 3.040 2.901 2.736 2.645 2.507 2.395 2.312 2.218 2.136 2.036 1.952 1.847 1.757 S21 ANG. −3.9 −13.3 −23.4 −32.9 −41.2 −49.5 −57.9 −66.3 −74.5 −83.0 −91.8 −99.5 −108.4 −115.9 −124.0 −131.7 −138.8 −145.7 −152.8 −159.0 −164.8 −170.8 −176.3 177.8 172.9 168.1 162.1 157.8 151.6 147.6 141.6 MAG. 0.001 0.002 0.002 0.004 0.004 0.005 0.006 0.008 0.009 0.012 0.013 0.015 0.016 0.019 0.022 0.023 0.025 0.028 0.030 0.032 0.034 0.035 0.037 0.038 0.041 0.042 0.042 0.044 0.044 0.043 0.045 S12 ANG. 28.0 103.2 76.0 90.4 89.4 90.7 96.6 101.3 99.2 99.9 100.3 105.5 96.6 93.8 93.8 88.1 88.6 88.3 80.2 78.7 77.6 73.0 72.5 68.5 66.2 64.0 60.4 54.8 53.0 47.2 44.0 MAG. 0.290 0.294 0.292 0.286 0.298 0.302 0.307 0.309 0.313 0.316 0.318 0.318 0.318 0.313 0.311 0.312 0.308 0.305 0.305 0.303 0.299 0.304 0.304 0.305 0.317 0.319 0.323 0.331 0.330 0.332 0.331 S22 ANG. −3.7 −4.3 −3.9 −5.6 −6.9 −8.4 −10.2 −12.2 −14.4 −16.9 −19.7 −22.6 −24.9 −27.4 −30.1 −31.8 −33.3 −35.1 −37.2 −38.8 −40.9 −41.5 −42.2 −44.7 −45.8 −47.8 −50.8 −54.1 −57.5 −60.9 −65.5 98.96 64.71 46.80 29.99 25.94 20.69 17.38 12.59 12.26 9.45 8.22 7.49 7.42 6.36 5.83 5.55 5.37 5.05 4.98 4.97 4.99 4.97 4.93 5.01 4.76 4.78 4.88 4.88 5.07 5.45 5.49 K Data Sheet P13444EJ2V0DS00 11 µPC2747TB, µPC2748TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C) − µPC2748TB − CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 10 No signal 8 Circuit Current ICC (mA) Circuit Current ICC (mA) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 No signal 8 VCC = 3.0 V 6 6 4 4 2 2 VCC = 1.8 V 0 0 1 2 3 4 5 Supply Voltage VCC (V) INSERTION POWER GAIN vs. FREQUENCY 25 VCC = 3.3 V Insertion Power Gain GP (dB) 0 –60 –40 –20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (°C) INSERTION POWER GAIN vs. FREQUENCY 25 VCC = 3.0 V VCC = 3.0 V Insertion Power Gain GP (dB) TA = –40 °C 20 20 15 VCC = 2.7 V 10 VCC = 1.8 V 5 15 TA = +25 °C TA = +85 °C 10 5 0 0.1 0.3 1.0 3.0 0 0.1 0.3 1.0 3.0 Frequency f (GHz) NOISE FIGURE vs. FREQUENCY 7 Frequency f (GHz) 6 Noise Figure NF (dB) VCC = 1.8 V 5 4 VCC = 2.7 V 3 VCC = 3.0 V VCC = 3.3 V 2 0.1 0.3 1.0 3.0 Frequency f (GHz) 12 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB − µPC2748TB − INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 RLout (VCC = 3.0 V) RLout (VCC = 1.8 V) ISOLATION vs. FREQUENCY 0 Input Return Loss RLin (dB) Output Return Loss RLout (dB) –10 –10 Isolation ISL (dB) –20 –20 RLin (VCC = 1.8 V) –30 VCC = 1.8 V –40 VCC = 3.0 V –50 0.1 0.3 1.0 3.0 –30 RLin (VCC = 3.0 V) –40 –50 0.1 0.3 1.0 3.0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 0 VCC = 3.3 V –5 –5 VCC = 3.0 V –10 VCC = 2.7 V 0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER TA = +85 °C TA = –40 °C TA = –40 °C TA = +25 °C TA = +25 °C –15 TA = +85 °C Output Power Pout (dBm) Output Power Pout (dBm) –10 –15 –20 –20 –25 f = 900 MHz –30 –40 –35 –30 –25 –20 –15 – 10 –5 0 Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY Pin = –8 dBm –25 VCC = 3.0 V f = 900 MHz –30 –40 –35 –30 –25 –20 –15 –10 –5 0 Input Power Pin (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE Third Order Intermodulation Distortion IM3 (dBc) +5 –50 –45 –40 –35 –30 –25 –20 –15 –10 –5 f1 = 900 MHz f2 = 902 MHz 0 –30 –28 –26 –24 –22 –20 –18 –16 –14 –12 –10 Output Power of Each Tone PO (each) (dBm) VCC = 1.8 V VCC = 3.3 V VCC = 3.0 V VCC = 2.7 V Saturated Output Power PO (sat) (dBm) VCC = 3.3 V 0 –5 VCC = 3.0 V –10 VCC = 2.7 V –15 –20 0.1 0.3 1.0 3.0 Frequency f (GHz) Data Sheet P13444EJ2V0DS00 13 µPC2747TB, µPC2748TB S-PARAMETER (TA = +25 °C, VCC = 3.0 V) − µPC2748TB − S11-FREQUENCY 1.0 G 2.0 G 0.1 G S22-FREQUENCY 0.1 G 1.0 G 3.0 G 14 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB TYPICAL S-PARAMETER VALUES (TA = +25 °C) µPC2748TB VCC = 3.0 V, ICC = 6.0 mA FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 S11 MAG. 0.120 0.136 0.166 0.194 0.210 0.213 0.213 0.211 0.203 0.193 0.180 0.159 0.136 0.115 0.096 0.072 0.049 0.024 0.007 0.014 0.034 0.047 0.063 0.079 0.094 0.108 0.123 0.139 0.151 0.164 0.178 ANG. −177.2 −167.3 −174.2 179.6 169.6 160.0 150.2 140.8 131.1 121.1 110.8 100.6 90.6 79.2 70.4 60.9 47.5 36.5 −6.0 −126.0 −141.3 −147.7 −156.9 −161.1 −165.5 −169.0 −174.7 −178.9 175.9 170.5 166.0 MAG. 4.730 5.430 5.930 6.314 6.701 6.876 7.203 7.310 7.354 7.371 7.346 7.334 7.001 6.834 6.437 6.181 5.710 5.372 5.014 4.724 4.405 4.175 3.933 3.738 3.579 3.411 3.283 3.107 2.989 2.814 2.680 S21 ANG. 5.3 −0.2 −9.2 −18.8 −28.2 −38.8 −49.3 −60.6 −71.5 −81.9 −92.8 −102.4 −112.6 −121.3 −130.1 −138.2 −145.4 −152.5 −158.6 −164.1 −169.7 −174.7 −179.5 175.3 171.2 166.5 161.4 157.3 151.4 147.3 141.5 MAG. 0.000 0.001 0.001 0.003 0.004 0.005 0.006 0.009 0.010 0.012 0.014 0.015 0.016 0.018 0.019 0.020 0.020 0.021 0.021 0.024 0.024 0.026 0.026 0.028 0.030 0.030 0.032 0.031 0.032 0.033 0.034 S12 ANG. −30.4 19.3 97.8 125.4 108.7 107.4 98.7 114.1 107.6 98.3 99.1 97.5 91.4 84.1 84.8 82.4 78.9 73.5 74.1 74.9 71.5 73.6 71.2 69.1 63.8 64.7 64.6 58.9 53.2 51.6 47.3 MAG. 0.280 0.285 0.286 0.291 0.306 0.319 0.337 0.349 0.360 0.371 0.366 0.359 0.342 0.320 0.296 0.271 0.247 0.228 0.208 0.198 0.188 0.190 0.185 0.192 0.202 0.214 0.222 0.238 0.240 0.251 0.254 S22 ANG. −2.2 −2.4 −0.9 −2.7 −3.7 −5.4 −8.4 −12.3 −17.4 −22.7 −28.9 −35.3 −40.7 −46.0 −50.5 −53.0 −55.1 −55.7 −55.7 −52.8 −52.1 −47.8 −45.3 −44.7 −43.2 −43.6 −45.7 −47.6 −52.4 −55.8 −61.4 352.73 72.83 52.47 24.77 16.82 12.40 10.09 6.68 5.68 4.71 3.98 4.01 3.95 3.71 3.77 3.81 4.13 4.22 4.57 4.37 4.70 4.44 4.81 4.58 4.48 4.59 4.54 4.83 4.84 4.99 5.07 K Data Sheet P13444EJ2V0DS00 15 µPC2747TB, µPC2748TB PACAGE DIMENSIONS 6 pin super minimold (Unit: mm) 0.2 +0.1 –0 0.1 MIN. 0.15 +0.1 –0 1.25 ±0.1 2.1 ±0.1 0 to 0.1 0.65 1.3 0.65 0.7 0.9 ±0.1 2.0 ±0.2 16 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Note Count: 3, Exposure limit: None Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 °C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P13444EJ2V0DS00 17 µPC2747TB, µPC2748TB [MEMO] 18 Data Sheet P13444EJ2V0DS00 µPC2747TB, µPC2748TB [MEMO] Data Sheet P13444EJ2V0DS00 19 µPC2747TB, µPC2748TB NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8