UPC2749TB

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC2749TB 3 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The µPC2749TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC is packaged in super minimold package which is smaller than conventional minimold. The µPC2749TB has compatible pin connections and performance to µPC2749T of conventional minimold version. So, in the case of reducing your system size, µPC2749TB is suitable to replace from µPC2749T. This IC is manufactured using NEC’s 20 GHz fT NESATTM lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES • • • • High-density surface mounting Supply voltage Noise figure Upper limit operating frequency : 6-pin super minimold package : VCC = 2.7 to 3.3 V : NF = 4.0 dB TYP. @ f = 1.9 GHz : fu = 2.9 GHz TYP. @ 3 dB down below from gain at f = 0.9 GHz APPLICATION • GPS receiver • Wireless LAN ORDERING INFORMATION Part Number Package 6-pin super minimold Marking C1U Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel. µPC2749TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC2749TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13489EJ2V0DS00 (2nd edition) Date Published May 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1998, 1999 µPC2749TB PIN CONNECTIONS Pin No. Pin Name INPUT GND GND OUTPUT GND VCC (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 1 2 3 4 5 6 2 1 PRODUCT LINE-UP (TA = +25°C, VCC = 3.0 V, ZL = ZS = 50 Ω) fu (GHz) 2.9 PO(sat) (dBm) –6.0 GP (dB) 16 NF (dB) 4.0 ICC (mA) 6.0 6-pin super minimold C1U 3 Part No. Package 6-pin minimold Marking µPC2749T µPC2749TB C1U Remark Notice Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. The package size distinguishes between minimold and super minimold. SYSTEM APPLICATION EXAMPLE EXAMPLE OF GPS RECEIVER Pre Amp. Unit RF Unit RF Amp. B.P.F. LNA µ PC2749T/TB µ PC2749T/TB Mixer IF Amp. B.P.F. IF Filter PLL VCO Loop Filter To know the associated products, please refer to each latest data sheet. 2 Data Sheet P13489EJ2V0DS00 µPC2749TB PIN EXPLANATION Pin Voltage (V) Note Pin No. 1 Pin Name Applied Voltage (V) – Function and Applications Internal Equivalent Circuit INPUT 0.82 Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut. Signal output pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. Power supply pin. This pin should be externally equipped with bypass capacity to minimize ground impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 3 GND 2 GND 5 6 VCC 4 OUTPUT – 2.87 4 OUT IN 1 6 VCC 2.7 to 3.3 – 2 3 5 GND 0 – Note Pin voltage is measured at VCC = 3.0 V. Data Sheet P13489EJ2V0DS00 3 µPC2749TB ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Total Circuit Current Power Dissipation Symbol VCC ICC PD TA = +25 °C TA = +25 °C Mounted on doublesided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) Conditions Ratings 4.0 15 200 −40 to +85 −55 to +150 TA = +25 °C 0 Unit V mA mW Operating Ambient Temperature Storage Temperature Input Power TA Tstg Pin °C °C dBm RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 2.7 −40 TYP. 3.0 +25 MAX. 3.3 +85 Unit V °C ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = 3.0 V, ZS = ZL = 50 Ω) Parameter Circuit Current Power Gain Maximum Output Level Noise Figure Upper Limit Operating Frequency Symbol ICC GP PO(sat) NF fu No Signal f = 1.9 GHz f = 1.9 GHz, Pin = –6 dBm f = 1.9 GHz 3 dB down below flat gain at f = 0.9 GHz f = 1.9 GHz f = 1.9 GHz f = 1.9 GHz Test Conditions MIN. 4.0 13.0 –9.0 – 2.5 TYP. 6.0 16.0 –6.0 4.0 2.9 MAX. 8.0 18.5 – 5.5 – Unit mA dB dBm dB GHz Isolation Input Return Loss Output Return Loss ISL RLin RLout 25 7 9.5 30 10 12.5 – – – dB dB dB STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 °C, VCC = 3.0 V, ZS = ZL = 50 Ω) Parameter Power Gain Noise Figure 3rd Order Intermodulation Distortion Symbol GP NF IM3 Test Conditions f = 0.9 GHz f = 0.9 GHz Pout = –20 dBm f1 = 1.900 GHz, f2 = 1.902 GHz f = 1.9 GHz Reference Value 14.5 3.2 –33 Unit dB dB dBc Gain 1 dB Compression Output Level PO(1 dB) –12.5 dBm 4 Data Sheet P13489EJ2V0DS00 µPC2749TB TEST CIRCUIT VCC 1 000 pF C3 6 50Ω IN 1 000 pF C1 1 4 C2 1 000 pF 50Ω OUT 2, 3, 5 EXAMPLE OF APPLICATION CIRCUIT VCC 1 000 pF C3 6 50Ω IN 1 000 pF C1 1 4 C4 1 000 pF 1 6 4 C2 1 000 pF 50Ω OUT 1 000 pF C5 2, 3, 5 2, 3, 5 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get a flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 πfZs).] Data Sheet P13489EJ2V0DS00 5 µPC2749TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD AMP-2 Top View 3 1 IN C 5 4 OUT C 2 Mounting Direction VCC C 6 C 1U COMPONENT LIST Value C 1 000 pF Notes 1. 30 × 30 × 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC (P11976E). 6 Data Sheet P13489EJ2V0DS00 µPC2749TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 No signal 8 Circuit Current ICC (mA) Circuit Current ICC (mA) 8 10 No signal VCC = 3.0 V CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 6 6 4 4 2 2 0 0 1 2 3 4 Supply Voltage VCC (V) INSERTION POWER GAIN vs. FREQUENCY 25 0 –60 –40 –20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (°C) INSERTION POWER GAIN vs. FREQUENCY 25 VCC = 3.0 V Insertion Power Gain GP (dB) VCC = 3.3 V VCC = 3.0 V Insertion Power Gain GP (dB) 20 20 TA = –40 °C TA = +25 °C 15 15 10 VCC = 2.7 V 10 TA = +85 °C 5 5 0 0.1 0.3 1.0 3.0 0 0.1 0.3 1.0 3.0 Frequency f (GHz) NOISE FIGURE vs. FREQUENCY 6 VCC = 2.7 V 5 Noise Figure NF (dB) VCC = 3.0 V 4 Frequency f (GHz) 3 VCC = 3.3 V 2 1 0.1 0.3 1.0 3.0 Frequency f (GHz) Data Sheet P13489EJ2V0DS00 7 µPC2749TB ISOLATION vs. FREQUENCY 0 VCC = 3.0 V RLout 0 VCC = 3.0 V INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY Input Return Loss RLin (dB) Output Return Loss RLout (dB) –10 –10 Isolation ISL (dB) –20 –20 RLin –30 –30 –40 –40 –50 0.1 0.3 1.0 3.0 –50 0.1 0.3 1.0 3.0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 0 f = 1.9 GHz –5 VCC = 3.0 V VCC = 3.3 V –5 0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER VCC = 3.0 V f = 1.9 GHz TA = –40 °C –10 TA = –40 °C TA = +25 °C TA = +25 °C –20 TA = +85 °C –25 –30 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE TA = +85 °C Output Power Pout (dBm) –10 VCC = 2.7 V –15 Output Power Pout (dBm) –15 –20 –25 –30 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY –5 0 –5 0 Third Order Intermodulation Distortion IM3 (dBc) 0 –50 –45 –40 –35 –30 –25 VCC = 3.0 V –20 –15 –10 –5 VCC = 2.7 V Saturated Output Power PO (sat) (dBm) VCC = 3.3 V –5 VCC = 3.0 V Pin = –6 dBm f1 = 1.900 GHz f2 = 1.902 GHz VCC = 3.3 V –10 VCC = 2.7 V –15 –20 –25 0.1 0.3 1.0 3.0 0 –30 –28 –26 –24 –22 –20 –18 –16 –14 –12 –10 Output Power of Each Tone PO (each) (dBm) Frequency f (GHz) 8 Data Sheet P13489EJ2V0DS00 µPC2749TB S-PARAMETER (TA = +25 °C, VCC = 3.0 V) S11-FREQUENCY 1.0 G 2.0 G 3.0 G 0.1 G S22-FREQUENCY 1.0 G 0.1 G 3.0 G 2.0 G Data Sheet P13489EJ2V0DS00 9 µPC2749TB TYPICAL S-PARAMETER VALUES (TA = +25 °C) µPC2749TB VCC = 3.0 V, ICC = 6.5 mA FREQUENCY MHz MAG S11 ANG MAG S21 ANG MAG S12 ANG MAG S22 ANG K 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 0.021 0.038 0.034 0.052 0.062 0.079 0.097 0.116 0.134 0.156 0.178 0.195 0.214 0.229 0.249 0.259 0.264 0.259 0.248 0.238 0.218 0.204 0.183 0.156 0.140 0.119 0.095 0.078 0.066 0.070 0.082 13.0 –30.5 –71.8 –120.5 –149.9 –169.7 173.6 160.5 149.3 138.8 128.5 118.7 108.7 99.5 89.4 79.9 69.8 60.3 50.9 43.6 35.9 30.1 25.3 21.2 18.8 18.7 21.2 30.0 44.5 66.0 78.1 4.096 4.216 4.282 4.403 4.390 4.399 4.566 4.667 4.843 5.016 5.305 5.660 5.835 6.148 6.364 6.611 6.577 6.549 6.407 6.321 6.046 5.862 5.696 5.430 5.282 5.013 4.849 4.596 4.446 4.163 3.966 –1.9 –7.8 –15.5 –21.0 –26.6 –31.6 –36.7 –41.3 –46.8 –52.6 –60.3 –67.1 –76.2 –84.5 –93.8 –103.6 –113.5 –123.4 –132.9 –140.8 –148.8 –156.5 –163.2 –170.5 –176.3 177.2 170.9 164.9 158.1 152.3 145.3 0.002 0.001 0.001 0.002 0.002 0.003 0.005 0.007 0.008 0.009 0.014 0.016 0.020 0.022 0.025 0.028 0.032 0.034 0.036 0.037 0.038 0.039 0.040 0.041 0.042 0.040 0.042 0.042 0.042 0.044 0.042 –1.1 75.4 141.5 129.9 134.1 128.3 132.9 131.5 129.3 124.6 131.4 122.5 118.6 114.4 107.7 104.3 96.8 91.8 83.3 78.5 75.1 70.4 68.3 60.7 61.6 58.1 55.1 51.9 44.7 41.9 37.1 0.024 0.033 0.064 0.080 0.103 0.127 0.151 0.174 0.197 0.220 0.240 0.262 0.279 0.287 0.294 0.294 0.283 0.272 0.256 0.234 0.213 0.193 0.174 0.164 0.152 0.142 0.146 0.149 0.154 0.171 0.181 165.8 113.6 96.1 87.9 76.9 68.6 60.6 53.7 44.9 36.1 28.0 17.3 8.6 –2.0 –13.5 –23.6 –33.8 –44.1 –53.8 –61.4 –69.5 –73.8 –79.5 –84.1 –82.1 –84.5 –85.5 –83.9 –91.8 –92.8 –99.6 66.82 129.26 90.16 45.30 57.58 34.08 22.08 14.70 12.29 10.00 6.15 5.13 3.80 3.23 2.72 2.35 2.09 1.99 1.97 1.99 2.04 2.08 2.15 2.25 2.25 2.53 2.46 2.62 2.70 2.73 2.97 10 Data Sheet P13489EJ2V0DS00 µPC2749TB PACAGE DIMENSIONS 6 pin super minimold (Unit: mm) 0.2 +0.1 –0 0.1 MIN. 0.15 +0.1 –0 1.25 ±0.1 2.1 ±0.1 0 to 0.1 0.65 1.3 0.65 0.7 0.9 ±0.1 2.0 ±0.2 Data Sheet P13489EJ2V0DS00 11 µPC2749TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Note Count: 3, Exposure limit: None Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 °C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 12 Data Sheet P13489EJ2V0DS00 µPC2749TB [MEMO] Data Sheet P13489EJ2V0DS00 13 µPC2749TB [MEMO] 14 Data Sheet P13489EJ2V0DS00 µPC2749TB [MEMO] Data Sheet P13489EJ2V0DS00 15 µPC2749TB NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8